DSPIC33FJ64GP204-I/PT - Microchip Technology

dsPIC33FJ32GP302/304,

dsPIC33FJ64GPX02/X04 and

dsPIC33FJ128GPX02/X04

The dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/

X04 and dsPIC33FJ128GPX02/X04 family devices that

you have received conform functionally to the current

Device Data Sheet (DS70292F), except for the

anomalies described in this document.

The silicon issues discussed in the following pages are

for silicon revisions with the Device and Revision IDs

listed in Table 1. The silicon issues are summarized in

Table 2.

The errat a described in this document will be addressed

in future revisions of the dsPIC33FJ32GP302/304,

dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/

X04 silicon.

Data Sheet clarifications and corrections start on page

11, following the discussion of si licon issues.

The silicon revision level can be identified using the

current version of MPLAB® IDE and Microchip’s

programmers, debuggers and emulation tools, which

are available at the Microchip corporate web site

(www.microchip.com).

For example, to identify the silicon revision level using

MPLAB IDE in conjunction with MPLAB ICD 3 or

PICkit™ 3:

1. Using the appropriate interface, connect the device

to the MPLAB ICD 3 programmer/debugger or

PICkit 3.

2. From the main menu in MPLAB IDE, select

Configure>Select Device, and then select the

target part number in the dialog box.

3. Select the MPLAB hardware tool

(Debugger>Select Tool).

4. Perform a “Connect” operation to the device

(Debugger>Connect). Depending on the devel-

opment tool used, the part number and Device

Revision ID value appear in the Output window .

The Device and Revision ID values for the various

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04

and dsPIC33FJ128GPX02/X04 silicon revisions are

shown in Table 1.

Note: This document summarizes all silicon

errata issues from all revisions of silicon,

previous as well as current. Only the

issues indicated in the last column of

Table 2 apply to the current silicon

revision (A5).

Note: If you are unable to extract the silicon

revision level, please contact your local

Microchip sales office for assistance.

TABLE 1: SILICON DEVREV VALUES

Part Number Device ID(1) Revision ID for Silicon Revision(2)

A1 A2 A3 A4 A5

dsPIC33FJ32GP302 0x0605

0x3001 0x3002 0x3002 0x3003 0x3004

dsPIC33FJ32GP304 0x0607

dsPIC33FJ64GP202 0x0615

dsPIC33FJ64GP204 0x0617

dsPIC33FJ64GP802 0x061D

dsPIC33FJ64GP804 0x061F

Note 1: The Device and Revision IDs (DEVID and DEVREV) are located at the last two implemented addresses in

program memory.

2: Refer to the “dsPIC33F/PIC24H Flash Programming Specification” (DS70152) for detailed information on

Device and Revision IDs for your specific device.

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and

dsPIC33FJ128GPX02/X04 Family

Silicon Errata and Data Sheet Clarification

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04

dsPIC33FJ128GP202 0x0625

0x3001 0x3002 0x3002 0x3003 0x3004

dsPIC33FJ128GP204 0x0627

dsPIC33FJ128GP802 0x062D

dsPIC33FJ128GP804 0x062F

TABLE 1: SILICON DEVREV VALUES (CONTINUED)

Part Number Device ID(1) Revision ID for Silicon Revision(2)

A1 A2 A3 A4 A5

Note 1: The Device and Revision IDs (DEVID and DEVREV) are located at the last two implemented addresses in

program memory.

2: Refer to the “dsPIC33F/PIC24H Flash Programming Specification” (DS70152) for detailed information on

Device and Revision IDs for your sp ecific device.

TABLE 2: SILICON ISSUE SUMMARY

Module Feature Item

Number Issue Summary

Affected

Revisions(1)

A1 A2 A3 A4 A5

UART IR Mode 1. The 16x baud clock signal on the BCLK pin is present

only when the module is transmitting. XXXXX

UART High-Speed

Mode 2. When the UART is in 4x mode (BRGH = 1) and using

two Stop bits (STSEL = 1), it may sample th e first

Stop bit instead of the second one.

XXXXX

SPI Transmit

Operation 3. The SPI Transmit Buffer Full (SPITBF) flag does not

get set immediately after writing to the buffer. XXXXX

SPI Frame Mode 4. The SPI module wi ll genera te incorrect fram e

synchronization pu lses in Frame Master mo de if

FRMDLY = 1.

XXXXX

I2C™ SFR Writes 5. The BCL bit in I2CSTAT can only be cleared with

Word instructions, and can be corrupted with byte

instructions and bit operations.

XXXXX

I2C10-bit

Addressing 6. When the I2C module is configured for 10-bit

addressing using the same address bits (A10 and A9)

as other I2C devices, A10 and A9 bits may not work

as expected.

XXXXX

I2C10-bit

Addressing 7. When the I2C module is configured as a 10-bit slave

with an address of 0x02, the I2CxRCV register

content for the lower address byte is 0x01 rather than

0x02.

XXXXX

I2C—8. With the I2C module enabled, the PORT bits and

external Interrupt Input functions (if any) associated

with SCL and SDA pins will not reflect the actual

digital logic levels on the pins.

XXXXX

I2C10-bit

Addressing 9. The 10-bit slave does not set the RBF flag or load the

I2CxRCV register, on addre ss match if the Least

Significant bits (LSbs) of the address are the same as

the 7-bit reserved addresses.

XXXXX

I2C—10. After the ACKSTAT bit is set when receiving a NACK,

it may be cleared by the reception of a Start or Stop

bit.

XXXXX

Note 1: Only those issues indicated in the last column apply to the current silicon revision.

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04

UART Interrupts 11. The UART error interrupt may not occur , or may occur

at an incorrect time, if multiple errors occur during a

short period of time.

XXXXX

UART IR Mode 12. When the UART module is operating in 8-bit mode

(PDSEL = 0x) and using the IrDA® encoder/decoder

(IREN = 1), the module incorrectly transmits a data

payload of 80h as 00h.

XXXXX

Comparator Output Pin 13. When the CMCON<CxOUTEN> bit is set, the

Comparator output pin cannot be used as a general

purpose I/O pin even if the Comparator is disabled.

XXXXX

Internal

Voltage

Regulator

Sleep Mode 14. When the VREGS bit (RCON<8>) is set to a logic ‘0’

the device may reset and higher Sleep current may

be observed.

XXXXX

PSV

Operations —15. An address error trap occurs in certain addressing

modes when accessing the first four bytes of any PSV

page.

XXXXX

ECAN™ Sleep Mode 16. The WAKIF bit in the CxINTF register cannot be

cleared by software instruction after the device is

interrupted from Sleep due to activity on the CAN bus.

XXXXX

ECAN Receive

Operation 17. The ECAN module may not store the received data in

the correct location. XXX

CPU EXCH

Instruction 18. The EXCH instruction does not execute correctly. XXXXX

SPI Transmit

Operation 19. Writing to the SPIxBUF register as soon as TBF bit is

cleared will cause SPI module to ignore the written

data.

XXXXX

UART Break

Character

Generation

20. The UART module will not generate back-to-back

Break characters. XXXXX

Audio DAC Voltage

Specifications 21. The Audio DAC positive and negative output

differential voltages may not meet the specifications

listed in th e data she et.

XXX

ADC Current

Consumption

in Sleep

Mode

22. If the ADC module is in an enabled state when the

device enters Sleep mode, the power-down current

(IPD) of the device may exceed the device da ta sheet

specifications.

XXXXX

JTAG Boundary

Scan 23. On 28-pin devices, Boundary Scan does not function

correctly for pin 7. XXXXX

RTCC Operation

During Reset 24. The RTCC module gets reset on any device Reset,

instead of getting reset only on a POR or BOR. XXXXX

All 150ºC

Operation 25. These revisions of silicon only support 140ºC

operation instead of 150º C for Hi-Temp operating

temperature.

XXX

I/O Port Data

Direction

Setting

26. When the RB8 pin is in open-d rain configuration, the

data direction depends upon the TRISB9 bit instead

of the TRISB8 bit.

XXXXX

TABLE 2: SILICON ISSUE SUMMARY (CONTINUED)

Module Feature Item

Number Issue Summary

Affected

Revisions(1)

A1 A2 A3 A4 A5

Note 1: Only those issues indicated in the last column apply to the current silicon revision.

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04

CPU Interrupt

Disable 27. When a previous DISI instruction is active (i.e., the

DISICNT register is non-zero), and the value of the

DISICNT register is updated manually, the DISICNT

XXXXX

CPU div.sd 28. When using the div.sd instruction, the overflow bit is

not getting set when an overflow occurs. XXXXX

UART TX Interrupt 29. A transmit (TX) Interrupt may occur before the data

transmission is complete. XXXXX

JTAG Flash

Programming 30. JTAG Flash programming is not supported. XXXXX

TABLE 2: SILICON ISSUE SUMMARY (CONTINUED)

Module Feature Item

Number Issue Summary

Affected

Revisions(1)

A1 A2 A3 A4 A5

Note 1: Only those issues indicated in the last column apply to the current silicon revision.

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04

Silicon Errata Issues

1. Module: UART

When the UART is configured for IR interface

operations (UxMODE<9:8> = 11), the 16x baud

clock signal on the BCLK pin is present only when

the module is transmitting. The pin is idle at all

other times.

Work around

Configure one of the output compare modules to

generate the require d baud clock signal when the

UART is receiving data or in an Idle state.

Affected Silicon Revisions

2. Module: UART

When the UART is in 4x mode (BRGH = 1) and

using two S top bits (STSEL = 1), it may sample the

first S t op bit instead of the second one.

This issue does not affect the other UART

configurations.

Work around

Use the 16x baud rate option (BRGH = 0) and

adjust the baud rate accordingly.

Affected Silicon Revisions

3. Module: SPI

The SPI Transmit Buffer Full (SPITBF) flag does

not get set immediately after writing to the buffer.

Work around

After a write to the SPI buffer, poll the SPITBF flag

until the flag gets set, indicating that the transmit

buffer is not full. Afterwards, poll the SPITBF flag

again until the flag gets cleared, indicating that the

transmit has started and that the transmit buffer is

empty and another write can occur.

Affected Silicon Revisions

4. Module: SPI

The SPI module will generate incorrect frame

synchronization pulses when configured in Fr ame

Master mode if the start of data is selected to

coincide with the start of the frame synchronization

pulse (FRMEN = 1, SPIFSD = 0, FRMDLY = 1).

However, the module functions correctly in Frame

Slave mode, and also in Frame Master mode if

FRMDLY = 0.

Work arou nd

If DMA is not being used, manually drive the SSx

pin (x = 1 or 2) high using the associated PORT

bit-time pulse width. This operation needs to be

performed when the transmit buffer is written.

If DMA is being used, and if no other peripheral

modules are using DMA transfers, use a timer

interrupt to periodically generate the frame

synchronization pulse (using the method

described above) after every 8 or 16-bit periods

(depending on the data word size, configured

using the MODE16 bit).

If FRMDLY = 0, no work around is needed.

Affected Silicon Revisions

5. Module: I2C™

The BCL bit in I2CSTAT ca n only be cleared with

Word instructions, and can be corrupted with byte

instructions and bit operations.

Work arou nd

Use Word instructions to clear BCL.

Affected Silicon Revisions

Note: This document summarizes all silicon

errata issues from all revisions of silicon,

previous as well as current. Only the

issues indicated by the shaded column in

the following tables apply to the current

silicon revision (A5).

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04

6. Module: I2C

If there are two I2C devices on the bus, one of

them is acting as the Master receiver and the other

as the Slave transmitter. If both devices are

configured for 10-bit Addressing mode, and have

the same value in the A10 and A9 bits of their

addresses, then when th e Slav e sel ect add re ss is

sent from the Master, both the Master and Slave

acknowledge it. When the Master sends out the

read operation, both the Master and the Slave

enter into Read mode and both of them transmit

the data. The resultant data will be the ANDing of

the two transmissions.

Work around

In all I2C devices, the addresses as well as bits

A10 and A9 should be different.

Affected Silicon Revisions

7. Module: I2C

When the I2C module is configured as a 10-bit

slave with and address of 0x02, the I2CxRCV

rather than 0x02; however, the module

acknowledges both address bytes.

Work around

None.

Affected Silicon Revisions

8. Module: I2C

With the I2C module enabled, the PORT bits and

external interrupt input functions (if any)

associated with the SCL and SDA pins do not

reflect the actual digital logic levels on the pins.

Work around

If the SDA and/or SCL pins need to be polled,

these pins should be con nected to other port pi ns

in order to be read correctly. This issue does not

affect the operation of the I2C module.

Affected Silicon Revisions

9. Module: I2C

In 10-bit Addressing mode, some address

matches do not set the RBF flag or load the

receive register I2CxRCV, if the lower address

byte matches the reserved addresses. In

particular, these include all addresses with the

form XX0000XXXX and XX1111XXXX, with the

following exceptions:

• 001111000X

• 011111001X

• 101111010X

• 111111011X

Work aro und

Ensure that the lower address byte in 10-bit

Addressing mode does not match any 7-bit

reserved addresses.

Affected Silicon Revisions

10. Module: I2C

When the I2C module is operating in either Master

or Slave mode, after the AC KSTAT bit is set when

receiving a NACK, it may be cleared by the

reception of a Start or Stop bit.

Work aro und

Store the value of the ACKSTAT bit immediately

after receiving a NACK from the master.

Affected Silicon Revisions

11. Module: UART

The UART error interrupt may not occur, or may

occur at an incorre ct time, if multiple e rrors occur

during a short period of time.

Work aro und

Read the error flags in the UxSTA register

whenever a byte is received to verify the error

status. In most cases, these bits will be correct,

even if the UART error interrupt fails to occur .

Affected Silicon Revisions

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04

12. Module: UART

When the UART is operating in 8-bit mode

(PDSEL = 0x) and using the IrDA encoder/decoder

(IREN = 1), the module incorrectly transmits a dat a

payload of 80h as 00h.

Work around

None.

Affected Silicon Revisions

13. Module: Comparator

If CMCON<CxOUTEN> bit is set and the

comparator module CMCON<CxEN> bit is

disabled, the remappable comparator output pins,

C1OUT and C2OUT, cannot be used as general

purpose I/O pins.

Work around

When the comparator module is disabled the

CMCON<CxOUTEN> bit should be reset so that

the remappable comparator output pins C1OUT

and C2OUT are not driven onto the output pad.

Affected Silicon Revisions

14. Module: Internal Voltage Regulator

When the VREGS bit (RCON<8>) is set to a logic

‘0’, the device may reset and a higher Sleep

current may be observed.

Work around

Ensure VREGS bit (RCON<8>) is set to a logic ‘1’

for device Sleep mode operation.

Affected Silicon Revisions

15. Module: PSV Operations

An address error trap occurs in certain addressing

modes when accessing the first four bytes of an

PSV page. This only occurs when using the

following addressing modes:

•MOV.D

• Register Indirect Addressing (Word or Byte

mode) with pre/post-decrement

Work arou nd

Do not perform PSV accesses to any of the first

four bytes using the above addressing modes. For

applications using the C language, MPLAB C30

version 3.11 or higher, provides the following

command-line switch that implements a work

around for the erratum.

-merrata=psv_trap

Refer to the readme.txt file in the MPLAB C30

v3.11 tool suite for further details.

Affected Silicon Revisions

16. Module: ECAN™

The WAKIF bit in the CxINTF register cannot be

cleared by software instruction after the device is

interrupted from Sleep due to activity on the CAN

bus.

When the device wakes up from Sleep due to CAN

bus activity, the ECAN module is placed in

operational mode. The ECAN Event interrupt

occurs due to the WAKIF flag. Trying to clear the

flag in the Interrupt Service Routine (ISR) may not

clear the flag. The WAKIF bit being set will not

cause repetitive Interrupt Service Routine

execution.

Work arou nd

Although the WAKIF bit does not clear, the device

Sleep and ECAN Wake function continue to work

as expected. If the ECAN event is enabled, the

CPU will enter the Interrupt Service Routine due to

the WAKIF flag getting set. The application can

maintain a secondary flag, which tracks the device

Sleep and Wake events.

Affected Silicon Revisions

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04

17. Module: ECAN

The ECAN module may not store received data in

the correct location. When this occurs, the receive

buffers will become corrupted. In addition, it is also

possible for the transmit buffers to become

corrupted. This issue is more likely to occur as the

CAN bus speed approaches 1 Mbps.

Work around

Do not use the DMA with ECAN in Peripheral

Indirect mode. Use the DMA in Register Indirect

mode, Continuous mode enabled and Ping Pong

mode disabled. The receive DMA channel count

should be set to 8 words. The transmit DMA

channel count should be set for the actual

message size (maximum of 7 words for Extended

CAN messages and 6 words for Standard CAN

Messages). To simplify application error handling

while using this mode, only one TX buffer should

be used. While message filtering is not affected,

messages will not be stored at distinct RX buffers.

Instead all messages are stored contiguously in

memory. The start of this memory is pointed to by

the receive DMA channel. The application must

still clear RXFUL flags and other interrupt flags.

The application must manage the RX buffer

memory.

Affected Silicon Revisions

18. Module: CPU

The EXCH instruction does not execute correctly.

Work around

If writing source code in assembly, the

recommended work around is to replace:

EXCH Wsource, Wdestination

with:

PUSH Wdestination

MOV Wsource, Wdestination

POP Wsource

If using the MPLAB C30 C compiler, specify the

compiler option: -merrata=exch (Project > Build

Options > Projects > MPLAB C30 > Use Alternate

Settings).

Affected Silicon Revisions

19. Module: SPI

Writing to the SPIxBUF register as soon as the

TBF bit is cleared will cause the SPI module to

ignore the written data. Applications which use SPI

with DMA will not be affected by this erratum.

Work aro und

After the TBF bit is cleared, wait for a minimum

duration of one SPI Clock before writing to the

SPIxBuf register.

Alternatively, do one of the following:

• Poll the RBF bit and wait for it to get set before

writing to the SPIxBUF register

• Poll the SPI Interrupt flag and wait for it to get

set before writing to the SPIxBUF register

• Use an SPI Interrupt Service Routine

• Use DMA

Affected Silicon Revisions

20. Module: UART

The UART module will not generate consecutive

break characters. Trying to perform a back-to-back

Break character transmission will cause the UART

module to transmit the dummy character used to

generate the first Break character instead of

transmitting the second Break character. Break

characters are generated correctly if they are

followed by non-Break character tran smission.

Work aro und

None.

Affected Silicon Revisions

A1 A2 A3 A4 A5

XXX

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04

21. Module: Audio DAC

The Audio DAC positive differential output voltage

and negative differential output voltage

(parameters DA01 and DA02, respectively) may

not meet the specifications listed in the data sheet.

Work around

None.

Affected Silicon Revisions

22. Module: ADC

If the ADC module is in an enabled state when the

device enters Sleep mode as a result of executing

a PWRSAV #0 instruction, the devi ce power-do wn

current (IPD) may exceed the specifications listed

in the device da ta sheet. This may ha ppen even if

the ADC module is disabled by clearing the ADON

bit prior to entering Sleep mode.

Work around 1:

In order to remain within the IPD specifications

listed in the device data sheet, the user software

must completely disable the ADC module by

setting the ADC Module Disable bit in the

corresponding Peripheral Modul e Disable register

(PMDx), prior to executing a PWRSAV #0

instruction.

Work around 2:

If the ADC module was previously initialized and

enabled, before ente ring Sleep, execute the lines

of code provided in Example 1.

23. Module: JTAG

On 28-pin devices, JT AG Boundary Scan does not

function correctly for pin 7. Both pins 6 and 7

respond to stimulus applied to pin 7.

Work arou nd

Do not include pin 7 in the JTAG Boundary Scan

chain for 28-pin devices.

Affected Silicon Revisions

24. Module: RTCC

The RTCC module gets reset on any device

Reset, instead of getting reset only on a POR or

BOR.

Work arou nd

None.

Affected Silicon Revisions

25. Module: All

The affected silicon revisions li sted below are not

warranted for operation at 150ºC.

Work arou nd

Only use the affected revisions of silicon for Hi-Temp

operating range from -40ºC to +140ºC.

Affected Silicon Revisions

EXAMPLE 1:

Affected Silicon Revisions

A1 A2 A3 A4 A5

XXX

Note: The ADC modul e must be reinitialized by

the user application before resuming ADC

operation.

Note: Unlike Work around 1, the user

application does not need to reinitialize

the ADC module; however , it is necessary

to re-enable the ADC module by setting

the ADON bit after waking from Sleep.

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXX

AD1CON1bits.ADON = 0; //Disable the ADC module

__asm__ volatile ("REPEAT #50"); //Wait 50 Tcy

__asm__ volatile ("NOP"); //Repeat NOP 51 times

Sleep(); // Execute PWRSAV #0 and go to Sleep

A1 A2 A3 A4 A5

XXX

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04

26. Module: I/O Port

When the ODCB8 bit is set to ‘1’ (open-drain con-

figuration), the data direction on the RB8 pin is

controlled by the TRISB9 bit instead of the TRISB8

bit.

Work around

Do not use the RB8 pin in open-drain configuration

while simultaneously using the RB9 pin.

Affected Silicon Revisions

27. Module: CPU

When a previous DISI instruction is active (i.e.,

the DISICNT register is non-zero), and the value of

the DISICNT register is updated manually, the

DISICNT register freezes and disables interrupts

permanently.

Work around

Avoid updating the DISICNT register manually.

Instead, use the DISI #n instruction with the

required value for 'n'.

Affected Silicon Revisions

28. Module: CPU

When using the Signed 32-by-16-bit Division

instruction, div.sd, the overflow bit does not

always get set when an overflow occurs.

Work around

Test for and handle overflow conditions outside of

the div.sd instruction.

Affected Silicon Revisions

29. Module: UART

When using UTXISEL = 01 (Interrupt when last

character is shifted out of the Transmit Shift

out through the Transmit Shift Register, the

Transmit (TX) Interrupt may occur before the final

bit is shifted out.

Work aro und

If it is critical that the interrupt processing occur

only when all transmit operations are complete.

Hold off the interrupt routine processing by adding

a loop at the beginning of the routine that polls the

Transmit Shift Register Empty bit (TRMT) before

processing the rest of the interrupt.

Affected Silicon Revisions

30. Module: JTAG

JTAG Flash programming is not supported.

Work aro und

None.

Affected Silicon Revisions

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

A1 A2 A3 A4 A5

XXXXX

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04

Data Sheet Clarifications

The following typographic corrections and clarifications

are to be noted for the latest version of the device data

sheet (DS70292F):

No issues to report at this time.

Note: Corrections are shown in bold. Where

possible, the original bold text formatting

has been removed for clarity.

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04 and dsPIC33FJ128GPX02/X04

APPENDIX A: REVISION HISTORY

Rev A Document (3/2009)

Initial release of this document; issued for revision A1,

A2 and A3 silicon.

Includes silicon issues 1-2 (UART), 3-4 (SPI), 5-10

(I2C™), 11-12 (UART), 13 (Comparator), 14 (Internal

Voltage Regulator), 15 (PSV Operations), 16-17

(ECAN™), 18 (CPU) and 19 (SPI).

This document replaces the following errata document:

“dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04

and dsPIC33FJ128GPX02/X04 Re v. A1 /A2/A3 Silicon

Errata” ( DS80371)

Rev B Document (4/2009)

Corrected part numbers.

Rev C Document (8/2009)

Added silicon issue 20 (UART).

Added data sheet clarification 1 (Electrical

Characteristics).

Rev D Document (1/2010)

Added Rev. A4 silicon information.

Added silicon issue 21 (Audio DAC).

Rev E Document (6/2010)

Updated silicon issue 18 (CPU).

Added silicon issues 22 (ADC), 23 (JTAG) and 24

(RTCC), and data sheet clarification 2 (DC

Characteristics: I/O Pin Input Specifications).

Rev F Document (10/2010)

Updated the work around in silicon issue 22 (ADC).

Added silicon issue 25 (All).

Rev G Document (3/2011)

Removed dat a sheet clarification 1.

Updated the Affected Silicon Revisions for item 25 in

Table 2 and in silicon issue 25 (All).

Added silicon issue 26 (I/O Port).

Rev H Document (11/2011)

Updated the current Device Data Sheet re vision to “F”.

Added Rev. A5 silicon information.

Added silicon issues 27 (CPU), 28 (CPU), 29 (UART),

and 30 (JTAG).

Information contained in this publication regarding device

applications and the like is provided only for your convenience

and may be superseded by updates. It is your responsibility to

ensure that your application meets with your specifications.

MICROCHIP MAKES NO REPRESENTATIONS OR

WARRANTIES OF ANY KIND WHETHER EXPRESS OR

IMPLIED, WRITTEN OR ORAL, STATUTORY OR

OTHERWISE, RELATED TO THE INFORMATION,

INCLUDING BUT NOT LIMITED TO ITS CONDITION,

QUALITY, PERFORMANCE, MERCHANTABILITY OR

FITNESS FOR PURPOSE. Microchip disclaims all liability

arising from this information and its use. Use of Microchip

devices in life support and/or safety applications is entirely at

the buyer’s risk, and the buyer agrees to defen d, indemnify and

hold harmless Microchip from any and all damages, claims,

suits, or expenses resulting from such use. No licenses are

conveyed, implicitly or otherwise, under any Microchip

intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,

PIC32 logo, rfPIC and UNI/O are registered trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,

MXDEV, MXLAB, SEEVAL and The Embedded Control

Solutions Company are registered trademarks of Microchip

Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, chipKIT,

chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,

dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,

FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,

Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,

MPLINK, mTouch, Omniscient Code Generation, PICC,

PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,

rfLAB, Select Mode, Total Endurance, TSHARC,

UniWinDriver, WiperLock and ZENA are trademarks of

Microchip Technology Incorporated in the U.S.A. and other

countries.

SQTP is a service mark of Microchip T echnology Incorporated

in the U.S.A.

All other trademarks mentioned herein are property of their

respective companies.

Printed on recycled paper.

ISBN: 978-1-61341-825-3

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the

intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our

knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Dat a

Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not

mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection featur es of our

products. Attempts to break Microchip’ s code protection feature may be a violation of the Digit al Millennium Copyright Act. If such acts

allow unauthorized access to you r software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:200 9 certif ication for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and

Tempe, Arizona; Gresham, Oregon and design centers in California

and India. The Company’s quality system processes and procedures

are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping

devices, Serial EEPROMs, microperi pherals, nonvola tile memo ry and

analog product s. In addition, Microchip ’s quality system for th e design

and manufacture of development systems is ISO 9001:2000 certified.

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08/02/11