SE050
Plug & Trust Secure Element
Rev. 1.3 — 7 June 2019 Objective data sheet
504913
1 Introduction
The SE050 is a ready-to-use IoT secure element solution. It provides a root of trust at the
IC level and it gives an IoT system state-of-the-art, edge-to-cloud security capability right
out of the box.
SE050 allows for securely storing and provisioning credentials and performing
cryptographic operations for security critical communication and control functions. SE050
is versatile in IoT security use cases such as secure connection to public/private clouds,
device-to-device authentication or protection of sensor data.
SE050 has an independent Common Criteria EAL 6+ security certification up to OS level
and supports both RSA & ECC asymmetric cryptographic algorithms with high key length
and future proof ECC curves. The latest security measures protect the IC even against
sophisticated non-invasive and invasive attack scenarios.
The SE050 is a turnkey solution that comes with Java Card operating system and an
applet optimized for IoT security use cases pre-installed. This is complemented by a
comprehensive product support package, enabling fast time to market & easy design-
in with Plug & Trust middleware for host applications, easy to use development kits,
reference designs, and extensive documentation for product evaluation.
The SE050 is a product platform that comes in several pin-to-pin compatible product
variants, see [4].
Additional information on the integration can be found in several application notes on
www.nxp.com. Also see [3].
1.1 SE050 use cases
Secure connection to public/private clouds, edge computing platforms, infrastructure
Device-to-device authentication
Secure data protection
Secure commissioning support
Secure CL/MIFARE/Wi-Fi interactions
Device ID for blockchain
Secure key storage
Secure provisioning of credentials
Ecosystem protection
1.2 SE050 target applications
Smart Industry
Smart Home
Smart Cities
Smart Supply Chains
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Plug & Trust Secure Element
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aaa-032990
Host MCU/MPU
Plug & Trust MW
I2C
SDA SCL
NFC DEVICE
SENSOR
SDA SCL
CLK
IO:SDA
IO2: SCL
RST
LBLA
SDA
SCL
SE050
IoT APPLET
JCOP OS
14443
14443
7816
I2C slave
SW I2C master
I2C
Figure 1. SE050 solution block diagram
Note: SE050 is designed to be used as a part of an IoT system. It works as an auxiliary
security device attached to a host controller. The host controller communicates with
SE050 through an I²C interface (with the host controller being the master and the SE050
being the slave). Besides the mandatory connection to the host controller, the SE050
device can optionally be connected to a sensor node or similar element through a
separate I²C interface. In this case, the SE050 device is the master and the sensor node
the slave. Lastly, SE050 has a connection for a native contactless antenna, providing a
wireless interface to an external device like a smartphone.
1.3 SE050 naming convention
The following table explains the naming conventions of the commercial product name
of the SE050 platform. Every SE050 product gets assigned a commercial name, which
includes application specific data.
The SE050 commercial names have the following format.
Sx05yagddd/Zrrff
All letters are explained in Table 1 .
Table 1. SE050 commercial name format
Variable Meaning Values Description
x Interfaces E E=I2C Slave, Master,
y JCOP version 0
a Applet Config A
B
C
Configuration options with different key provisioning
options, see [4]
g Temperature range 1
2
standard operational ambient temperature
1 = -25 °C - 90 °C ,
2 = -40 °C - 105 °C
ddd Delivery Type HQ1 HX2QFN20
mrrff Letters and
numbers
NXP internal code to identify individual configurations
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Plug & Trust Secure Element
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2 Features and benefits
2.1 Key benefits
Plug & Trust for fast and easy design with complete product support package
Easy integration with different MCU & MPU platforms and OS´ (Linux, RTOS,
Windows, Android, etc.)
Turnkey solution ideal for system-level security without the need to write security code
Secure credential injection for root of trust at IC level
Secure, zero-touch connectivity to public & private clouds
Real end-to-end security, from sensor to cloud
Ready-to-use example code for each of the key use cases
2.2 Key features
The SE050 is based on NXP's Integral Security Architecture 3.0 providing a secure
and efficient protection against various security threats. The efficiency of the security
measures is proven by a Common Criteria EAL6+ certification.
The SE050 operates fully autonomously based on an integrated Javacard operating
system and applet. Direct memory access is possible by the fixed functionalities of the
applet only. With that, the content from the memory is fully isolated from the host system.
Built on NXP Integral Security Architecture 3.0
Uses advanced 40 nm silicon foundry technology
CC EAL 6+ certified HW and OS as environment to run NXP IoT applications,
supporting fully encrypted communications and secured lifecycle management
Effective protection against advanced attacks, including Power Analysis and Fault
Attacks of various kinds
Multiple logical and physical protection layers, including metal shielding, end-to-end
encryption, memory encryption, tamper detection
Support for RSA and ECC asymmetric cryptography algorithms, future proof curves
and high key length, e.g. Brainpool, Edwards and Montgomery curves
Support for AES and DES symmetric cryptographic algorithms for encryption and
decryption
HMAC, CMAC, SHA-1, SHA-224/256/384/512 operations
Various options for key derivation functions, including HKDF, MIFARE KDF, PRF (TLS-
PSK)
Optional extended temperature range for industrial applications (-40 °C to +105 °C)
Small footprint HX2QFN20 package (3x3 mm)
Standard physical interface I2C slave (High-speed mode, 3.4 Mbps), I2C master (Fast
mode, 400 kbps). Both can be active at the same time
Dedicated CL wireless interface for IoT use cases simplifying configuration set-up,
maintenance in the field and late stage configuration
Secured user flash memory up to 50 kB for secure data or key storage
Support for SCP03 protocol (bus encryption and encrypted credential injection) to
securely bind the host with the secure element
Support for applet level secure messaging channels to allow end-to-end encrypted
communication in multi-tenant ecosystems
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Plug & Trust Secure Element
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2.3 Features in detail
Table 2. Feature Overview
Categories Subcategory Value
Security certification CC EAL6+ (HW+JCOP)
JavaCard version 3.0.5
Standards
GlobalPlatform specification version GP 3.0
ECC ECDSA, ECDH, ECDHE, ECDAA,
EDDSA
Hash HMAC, secure HMAC, CMAC
SHA SHA-1, SHA-224, SHA-256, SHA-384,
SHA-512
Key derivation HKDF, PBKDF, Wi-Fi KDF,OPC_UA
KDF
PRF (TLS-PSK)
AES AES cipher for de-/encryption
Cryptography
RSA RSA cipher for de-/encryption (up to
4096 bit)
ECC NIST (192 to 521 bit)
Brainpool (160 to 512 bit)
Twisted Edwards Ed25519
Montgomery Curve25519
Koblitz (192 to 256 bit)
Crypto curves ECC
Barreto-Naehrig Curve 256 bit
User memory 50 kB
Memory reliability up to 100 Mio write cycles / 25 years
Interfaces I2C Slave High-speed mode (3.4 Mbps)
I2C Master Fast Mode (400 kbit/s)
Contactless ISO14443
Power saving modes Idle ~1.8 mA
Power-Down (with state retention) ~430 µA
Deep Power-Down (no state retention) <5 µA
Standard -25 - 85 °CTemperature
Extended -40 - +105 °C
Packaging Plastic QFN 3x3 mm (HX2QFN20)
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Plug & Trust Secure Element
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3 Functional description
3.1 Functional diagram
Figure 2. SE050 functional diagram - example Open SSL
The SE050 uses I2C as communication interface. Section 4 gives more details. The
SE050 commands are wrapped using the Smartcard T=1 over I²C (T=1o I2C) protocol.
The detailed documentation of the SE050 commands (see [3]) and T=1 over I2C protocol
encapsulation is available in NXP DocStore.
In order to simplify the product usage a host library which abstracts for SE050 commands
and T=1 over I2C protocol encapsulation is provided. The host library supporting various
platforms is available for download including complete source code on the SE050
website.
SE050 IoT applet features a generic file system capable of securely storing secure
objects and associated privilege management. All objects can either be stored in
persistent memory or in RAM with the capability to securely export and import them to be
stored in an externally provided storage. All secure objects feature basic file operations
such as write, read, delete and update.
3.1.1 Supported secure object types
A secure object is an entry in the file system of SE050. Each secure object has certain
features and capabilities. The following secure object types are available:
Symmetric Key (AES, DES)
ECC Key
RSA Key
HMAC Key
Binary File
User ID
Counter
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Plug & Trust Secure Element
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Hash-Extend register
3.1.1.1 Symmetric Key
The Symmetric Key object can securely store symmetric keys of AES 128, 192 and
256 bit and DES keys with single DES, 2K3DES and 3K3DES. The following specific
operations are available on symmetric key objects:
Encrypt
Decrypt
Derive
CMAC
Secure Import
3.1.1.2 ECC Key
The ECC Key object has the ability to securely store ECC keys of the following curves
and key sizes:
ECC NIST curve: NIST P-192, NIST P-224, NIST P-256, NIST P-384, NIST P-521
ECC Brainpool curve: 160 bit, 192 bit, 224 bit, 256 bit, 320 bit, 384 bit, 512 bit
ECC Ed25519 curve: 256 bit
ECC Montgomery Curve25519: 256 bit
ECC Koblitz curves: secp160k1, secp192k1, secp224k1, secp256k1
ECC curves: secp192r1, secp224r1, secp256r1, secp384r1, secp521r1
ECC Barreto-Naehrig 256 bit curve
The following operations are available on ECC key objects (not all operations are
applicable to all curves):
ECDSA/EDDSA Sign
ECDSA/EDDSA Verify
ECDH Generate Shared Secret
ECDAA Sign
ECDAA Verify
Generate Key
Secure Import
3.1.1.3 RSA Key
The RSA Key object has the ability to securely store RSA Keys up to 4096 bit. The
following specific operations are available on RSA key objects:
RSA Sign
RSA Verify
RSA Encrypt
RSA Decrypt
Secure Import
3.1.1.4 HMAC Key object
An HMAC key object allows to securely store an HMAC key. The following operations are
supported on HMAC Key objects to compute an HMAC:
Init
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Plug & Trust Secure Element
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Update
Finalize
3.1.1.5 Binary file objects
Binary file objects are byte arrays of a generic type. As in a standard file system, the
values can be accessed using read/write operations.
3.1.1.6 Counter Objects
Counter objects are special kinds of binary file objects with specific functionality
interpreting the content of the file.
The supported operations for counters are:
Set
Get
Increment
3.1.1.7 Hash-Extend register
A hash-extend register secure object stores a hash over all data provided to that secure
object. It therefore contains the complete history of values provided to that register since
last reboot or since creation and can be used for attestation purposes.
3.1.1.8 User ID secure object
User ID secure objects can be used to create sessions based on the User ID in cases
where multi-tenant support without cryptographic credential usage is required.
3.1.2 Access control
Each secure object can be linked to object specific access control policies. An access
control policy associates a user identified by an authentication with a set of privileges
such as read, write, …
To scale the functionality into a broad range of ecosystems, a set of different
authentication options is provided:
User-ID based authentication
Symmetric key based authentication with and without secure messaging
Asymmetric key based authentication with and without secure messaging
At creation of a secure object, an optional set of policies is associated with that
secure object. Each policy assigns a set of allowed operations on that object to an
authentication object.
3.1.3 Sessions and multi-threading
The SE050 IoT applet is prepared for ecosystems where multi-threading and multi-
tenant use cases are needed on APDU level. To enable that, the applet supports 2
simultaneous sessions that can span full secure messaging sessions, self-authenticated
APDUs for tenants not requiring long-lasting sessions and on top one default session for
single tenant use cases .
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Plug & Trust Secure Element
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3.1.4 Attestation and trust provisioning
SE050 applet comes with a set of trust provisioned root credentials allowing the owner of
the device to securely attest all generated secure keys. Next to that, a customer has the
possibility to define own attestation keys.
3.1.5 Application support
For specific ecosystems, SE050 IoT applet has built-in crypto features to simplify the
deployment of specific use cases such as
MIFARE SAM functionality
Wifi password protection
ECC-Key and RSA-Key based cloud connectivity
Secure Sensor readout using I2C master
Remote attestation and trust provisioning
Platform Configuration Registers
3.2 Credential Storage & Memory
Within SE050, all credentials and secure objects are stored inside a dynamic file
structure. At creation, a user has to associate a file identifier with the object created. This
identifier is then used in subsequent operations to access the object. The number of
objects that can be allocated is only limited by the available memory in the system. After
usage, objects can be deleted and the associated memory is freed up again.
There is also the possibility to create transient objects. Transient objects have an object
descriptor stored in non-volatile memory, but the object content is stored in RAM.
Together with the import/export functionality of SE050, transient objects can be used
securely store secret keys in a remote memory system.
3.3 Ease of use configuration
All SE050 variants are offered pre-configured for ease of use during development phase.
Therefore customers have all keys pre-injected in SE050 that are required for the main
use cases.
4 Communication interfaces
4.1 I2C Interfaces
The SE050 has one I2C interface supporting slave and one I2C interface supporting
master mode.
The I2C slave interface is the main communication interface of the device and is used by
the host controller to send arbitrary APDUs to the device. It supports clock frequencies
up to 3.4 MHz when operated in High-Speed Mode (HS). The I2C interface is using the
Smartcard T=1 over I2C protocol.
The default slave address of the SE050 is configured to 0x48.
The I2C master interface is supposed to be used with slave devices that need to be
securely written and read. This interface features a maximum SCL clock rate of 400 kHz.
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Plug & Trust Secure Element
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4.1.1 Supported I2C frequencies
The SE050 I2C slave interface supports the I2C high-speed mode with a maximum SCL
clock of up to 3.4 MHz when clock stretching is enabled.
In case clock stretching is disabled the maximum supported SCL clock frequency is
1.7 MHz.
Clock stretching is enabled by default. Clock stretching will occur for frequencies
higher than 600 kHz. In case clock stretching is not supported by the I2C master a
dedicated configuration with disabled clock stretching has to be used to ensure the above
mentioned maximum clock frequency.
The SE050 I2C master interface supports maximum 400 kHz SCL clock frequency.
4.2 ISO7816 and ISO14443 Interface
The SE050 supports in addition to the I2C interface ISO7816 and ISO14443 Smartcard
interfaces. For the ISO7816 interface SmartCard protocols T=0 and T=1 are supported.
For the ISO14443 interface protocol T=CL is used. The supported resonance input
capacitance is 56 pF. In addition one additional GPIO pad IO2 is supported.
The RST_N pin can only be used as external reset source if the ISO7816 interface is
enabled. If only the I2C interface is enabled the RST_N pad has no effect. If the SE050 is
kept in reset state the current consumption is as defined for idle, see Table 12.
5 Power-saving modes
The device provides two power-saving operation modes. The Power-down mode (with
state retention) and the Deep Power-down mode (no state retention). These modes are
activated via pad ENA (Deep Power-down mode) or by the SW (Power-down mode).
5.1 Power-down mode
The Power-down mode has the following properties:
All internal clocks are frozen
CPU enters power-saving mode with program execution being stopped
CPU registers keep their contents
RAM keeps its contents
The SE050 enters into Power-down mode by receiving "End of APDU session request"
via the T=1 over I2C protocol. In Power-down mode, all internal clocks are frozen. The
IOs hold the logical states they had at the time Power-down mode was activated.
There are two ways to exit from the Power-down mode:
A reset signal on RST_N (in case the ISO7816 interface is enabled). After wake-up
from Power-down mode via RST_N the device is in idle mode (see Table 12)
An external interrupt edge triggered by a falling edge on I2C_SDA
5.2 Deep Power-down mode
The SE050 provides a special power-saving mode offering maximum power saving. This
mode is activated by pulling enable PIN (ENA) to a logic zero level.
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While in Deep Power-down mode the internal power is switched off completely and only
the I2C pads stay supplied.
To leave the Deep Power-down mode pad ENA has to be pulled up to to a logic „1" level.
For usage of Deep Power-down mode the SE050 must be supplied via pad Vin and pad
Vout.
6 Ordering information
6.1 Ordering options
Table 3. SE050 Ordering information
12NC Type number SE050 Variant Orderable part number
9353 867 22472 SE050A1HQ1/Z01SG SE050A1 SE050A1HQ1/Z01SGZ
9353 869 84472 SE050A2HQ1/Z01SH SE050A2 SE050A2HQ1/Z01SHZ
9353 869 85472 SE050B1HQ1/Z01SE SE050B1 SE050B1HQ1/Z01SEZ
9353 869 86472 SE050B2HQ1/Z01SF SE050B2 SE050B2HQ1/Z01SFZ
9353 869 87472 SE050C1HQ1/Z01SC SE050C1 SE050C1HQ1/Z01SCZ
9353 869 88472 SE050C2HQ1/Z01SD SE050C2 SE050C2HQ1/Z01SDZ
Table 4. SE050 Ordering information for development kit
12NC Type number Description
9353 832 82598 OM-SE050ARD SE050 Arduino-compatible development kit ,
SE050C configuration
6.2 Ordering SE050 samples
Samples can be ordered from NXP Semiconductors via nxp.com using the "Buy Direct"
button on the product information page for SE050. Note that NXP Semiconductors
can provide up to five pieces free of charge. Larger quantities have to be ordered
commercially.
6.3 Configuration
Detailed information about the configuration and available variants of the SE050 are
available in a separate NXP Application Note, see [4]
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Plug & Trust Secure Element
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7 Pinning information
7.1 Pinning
7.1.1 Pinning HX2QFN20
aaa-031924
terminal 1
index area
Transparent top view
15
14
13
12
11
VOUT
ISO 7816 RST_N
ISO 7816 CLK
VIN
ENA
1
2
3
4
5
ISO 14443 LB
n.c.
ISO 7816 IO1
n.c.
n.c.
2
0
1
9
1
8
1
7
1
6
n.
c.
VS
S
VC
C
I
S
O
1
4
44
3
L
A
I
S
O
7
8
16
I
O
2
6
7
8
9
10
n.c.
n.c.
n.c.
l2C_SDA
l2C_SCL
SE050
Figure 3. Pin configuration for HX2QFN20 (SOT1969-1)
Table 5. Pin description HX2QFN20
Symbol Pin Description
ISO 14443 LB 1 ISO14443 Antenna Connection
n.c. 2 not connected
ISO 7816 IO1 3 ISO 7816 IO or GPIO or I2C master SDA
n.c. 4 not connected
n.c. 5 not connected
n.c. 6 not connected
n.c. 7 not connected
n.c. 8 not connected
I2C_SDA 9 I2C slave data
I2C_SCL 10 I2C slave clock
ENA 11 Deep Power-down mode enable
VIN 12 power supply voltage input for I2C pads and ISO 7816/14443 interface and
logic supply in case Deep Power-down mode is used
ISO 7816 CLK 13 ISO 7816 clock input
ISO 7816 RST_N 14 ISO 7816 reset input low active
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Symbol Pin Description
VOUT 15 supply voltage output to be connected with pad VCC on PCB level, if Deep
Power-down mode is used
ISO 7816 IO2 16 ISO7816 IO2 and GPIO pad or I2C master SCL
ISO 14443 LA 17 ISO14443 antenna connection
VCC 18 logic and ISO7816/ISO1443 interface power supply voltage input, to be
connected with pad Vout on PCB level, if Deep Power-down mode to be used
VSS 19 ground
n.c. 20 not connected
The center pad of the IC is not connected, although it is recommended to connect it to
ground for thermal reasons.
8 Package
SE050 is offered in HX2QFN20 package. The dimensions are 3 mm x 3 mm x 0,32 mm
with a 0,4 mm pitch.
Please refer to the package data sheet [2], SOT1969-1.
9 Marking
Table 6. Marking codes
Type number Marking code
Sx050... Line A: S50
Line B: ***** (***** = 5-digit Batch code)
Line C: nDyww
D: RHF-2006 indicator
n: Assembly Center
Y: Year
WW: Week
10 Packing information
10.1 Reel packing
The SE050 product is available in tape on reel.
Table 7. Reel packing options
Symbol Parameter Numbers of units per reel
HX2QFN20 7" tape on reel 3000
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11 Electrical and timing characteristics
The electrical interface characteristics of static (DC) and dynamic (AC) parameters for
pads and functions used for I2C are in accordance with the NXP I2C specification (see
[1]).
12 Limiting values
Table 8. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage -0.3 +6
[1]
V
VIinput voltage any signal pad -0.3 +6 V
IIinput current pad I2C_SDA, I2C_SCL - 10 mA
IOoutput current pad I2C_SDA, I2C_SCL - 10 mA
Ilu latch-up current VI < 0 V or VI > VDD - 100 mA
Vesd_hbm electrostatic discharge voltage
(Human Body Model)
pads VCC, VSS, RST_N,
I2C_SDA, I2C_SCL
[2] ± 2.0 kV
Vesd_cdm electrostatic discharge voltage
(Charge Device Model)
pads VCC, VSS, RST_N,
I2C_SDA, I2C_SCL
[3] ± 500 V
Ptot Total power dissipation [4] - 600 mW
Tstg Storage temperature -55 +125 °C
[1] Maximum supported supply voltage is 6 V. The SE050 is characterized for the specified operating supply voltage range of 1.62 V to 3.6 V.In case of
supply voltages above 3.6 V, Deep Power-down mode current <5 µA is not guaranteed.
[2] MIL Standard 883-D method 3015; human body model; C = 100 pF, R = 1.5 kΩ; Tamb = -40 °C to +105 °C.
[3] JESD22-C101, JEDEC Standard Field induced charge device model test method.
[4] Depending on appropriate thermal resistance of the package.
13 Recommended operating conditions
The SE050 is characterized by its specified operating supply voltage range of 1.62 V to
3.6 V.
Table 9. Recommended operating conditions
Symbol Parameter Conditions Min Typ Max Unit
VDD Supply voltage Nominal supply voltage 1.62 1.8 3.6
[1]
V
VIDC input voltage on digital inputs and
digital I/O pads
- -0.3 VDD
+0.3
V
H Field strength Contactless interface
operation
1.5 7.5 A/m
Tamb Operating ambient temperature[2] -40 +105 °C
[1] Maximum supported supply voltage is 6 V. In case of supply voltages above 3.6 V, Deep Power-down mode current <5 µA is not guaranteed.
[2] All product properties and values specified within this data sheet are only valid within the operating ambient temperature range.
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aaa-015200_
3.6 V1.62 V
Figure 4. Characteristic supply voltage operating range
1
14 Characteristics
14.1 DC characteristics
Measurement conventions
Testing measurements are performed at the contact pads of the device under test. All
voltages are defined with respect to the ground contact pad VSS. All currents flowing into
the device are considered positive.
14.1.1 General and General Purpose I/O interface
Table 10. Electrical DC characteristics of Input/Output: IO1/IO2. Conditions: VDD = 1.62 V to 3.6 V (see ; VSS = 0 V;
Tamb = -40 °C to + 105 °C, unless otherwise specified
Maximum supported supply voltage is 6 V. In case of supply voltages above 3.6 V, Deep Power-down mode current <5 µA
is not guaranteed.
Symbol Parameter Conditions Min Typ Max Unit
VIH HIGH level input voltage 0.7 VDD VDD + 0.3 V
VIL LOW level input voltage -0.3 0.25 VDD V
IIH HIGH level input current in
"weak pull-up" input mode
0.7 VDD ≤ VI ≤ VDD
Test conditions for the
maximum absolute
value: IIH(max):VI = 0.7
VDD, VDD=VDD(max)
-20 μA
IIL LOW level input current 0 V ≤ VI ≤ 0.3 VDD;
Test conditions for the
maximum
absolute value:
IIL(max):VI = 0 V, VDD =
VDD(max)
-50 μA
ITL HIGH-to-LOW transition
input current (only "quasi-
bidirectional" mode)
0.3 VDD < VI ≤ VDD;
Test conditions for the
maximum absolute
value: VI = 0.5 VDD, VDD
= VDD(max)
[1] -250 μA
1Maximum supported supply voltage is 6 V. In case of supply voltages above 3.6 V, Deep Power-down
mode current <5 µA is not guaranteed.
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Symbol Parameter Conditions Min Typ Max Unit
IIInput current in "weak pull-up"
input mode
0 V VI VDD; Test
conditions for the
maximum absolute
value: II(max):VI = 0 V,
VDD = VDD(max)
0 -50 μA
IILIH Leakage input current at input
voltage beyond VDD in "weak
pull-up" input mode
VDD < VI ≤ VDD + 0.3 V;
-40 °C ≤
Tamb ≤ +105 °C;
Test conditions: VI = VDD
+ 0.3
V;
VDD = VDD(max)Tamb =
+105 °C
20 μA
-0.3 V ≤ VI < 0 V; -40 °C
≤ Tamb
+30 °C
Test conditions: VI = -0.3
V;
VDD= VDD(max)Tamb =
+30 °C
-50 μAIILIL Leakage input current at input
voltage below VSS in "weak
pull-up" input mode
-0.3 V ≤ VI < 0 V;+30 °C
≤ Tamb
+105 °C
Test conditions: VI = -0.3
V;
VDD= VDD(max)Tamb =
+105 °C
-1000 μA
IILIHQ Leakage input current at
input voltage beyond VDD
(only in "quasi-bidirectional"
mode)
VDD < VI ≤ VDD + 0.3 V;
-40 °C ≤
Tamb≤ +105 °C
Test conditions: VI = VDD
+
0.3 V;VDD = VDD(max);
Tamb = +105 °C
100 μA
-0.3 V ≤ VI < 0 V; -40 °C
≤ Tamb
+30 °C
Test conditions: VI = -0.3
V;
VDD = VDD(max)Tamb=
+30 °C
-120 μAIILILQ Leakage input current at input
voltage below VSS (only in
"quasi-bidirectional"
mode)
-0.3 V ≤ VI < 0 V;+30 °C
≤ Tamb
+105 °C
Test conditions: VI = -0.3
V;
VDD = VDD(max)Tamb=
+105 °C
-1000 μA
VOH HIGH level output voltage IOH = -20 μA; [2] 0.7 VDD V
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Symbol Parameter Conditions Min Typ Max Unit
VOL LOW level output voltage IOL = 1.0 mA
IOL = 0.5 mA
0.3
0.15 VDD
V
[1] IO1/IO2 source a transition current when being externally driven from HIGH to LOW. This transition current (ITL) reaches its maximum value when the
input voltage VI is approximately 0.5 VDD. Current IIL is tested at input voltage VI= 0.3 V. Figure 6 shows the input characteristic of this quasi-bidirectional
port mode.
[2] External pull-up resistor 20 kΩ to VDD assumed. The worst case test condition for parameter VOH is present at minimum VDD.
Figure 5. Input characteristic of RST_N
aaa-006774
ITLmax
IILILQmax
IIVI
VILmax 0.5 VDD VIHmin VDD
0
-0.3 V
IILmax
IILIHQ
VDD +0.3 V
0 V
Figure 6. Input characteristic of IO1/IO2 in "quasi-bidirectional" mode
aaa-007192
0 V VILmax VIHmin
lImax
lImin lIHmin
lIHmax
lILmax
lILIHmax
lILILmax
VDD
VDD +0.3 V
0
-0.3 V
Vl
ll
Figure 7. Input characteristic of IO1/IO2 in "weak pull-up" mode
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aaa-007191
IIVIIILIH1max
0
-0.3 V
IIL1min II1min
IlLlL1max
0 V
IIL1max II1max IIH1max
VIH1min
VDD
VDD +0.3 VVIL1max
Figure 8. Input characteristic of CLK when the IC is not in reset and of RST_N
aaa-007190
IIVIIlLIH2max
0
-0.3 V
IIL2max II2max
IILIL2max
0 V
IIH2min
II2min
IIH2max
VIH2min VDD
VDD +0.3 V
VIL2max
Figure 9. Input characteristic of CLK during IC reset
14.1.2 I2C Interface
Table 11. Electrical DC characteristics of I2C pads SDA, SCL. Conditions: VDD = 1.62 V to 3.6 V; VSS = 0 V; Tamb = -40
°C to + 105 °C, unless otherwise specified*
Maximum supported supply voltage is 6 V. In case of supply voltages above 3.6 V, Deep Power-down mode current <5 µA
is not guaranteed.
SCL, SDA pads either in open-drain or push-pull mode (I2C Master high-speed mode only).
Symbol Parameter Conditions Min Typ Max Unit
VIH HIGH level input voltage 0.7 VDD VDD + 0.3 V
VIL LOW level input voltage -0.3 0.25 VDD V
VOH(PP) HIGH level output voltage
(push-pull-mode)
IOH = 3 mA; 0.7 VDD V
VOL(PP) LOW level output voltage
(push-pull mode)
IOL = 3.0 mA 0.3 V
VHYS Input hysteresis voltage - 0.081 V V
VOL(OD) Low level output voltage
(open-drain mode)
IOL = 3.0 mA 0 0.4 V
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Symbol Parameter Conditions Min Typ Max Unit
IOL(OD) Low level output current
(open-drain mode)
VOL = 0.6 V 0.6 mA
IWPU weak pull-up current VIO = 0 V -265 -180 -70 µA
IWPD weak pull-down current VIO = VDD 105 200 -300 µA
IILIH Leakage input current high
level
VSDA = 3.6 V, VSCL = 3.6
V
0.27 15 µA
14.1.3 Power consumption
Table 12. Electrical characteristics of IC supply voltage VDD; VSS = 0 V; Tamb = -40 °C to +105 °C
Symbol Parameter Conditions Min Typ Max Unit
Supply
VDD supply voltage range VDD = 1.62 - 3.6 V 1.62 1.80 3.6 V
operating mode: Idle mode
supply current idle mode fCPU= 48 MHz, fMST = 96 MHz 1.8 2.9 mA
operating mode: typical CPU
no coprocessor active fCPU= 48 MHz, fMST = 96 MHz 4.4 5.1 mA
AES coprocessor active
(AES 48 MHz)
CPU in idle mode 6.5 7.5 mA
FAME coprocessor active
(FAME 48 MHz)
CPU in idle mode 14.4 16.1 mA
IDD
DES coprocessor active
(DES 96 MHz)
CPU in idle mode 6.5 7.6 mA
IDD(PD) supply current Power-down mode VDDmin ≤ VDD ≤ VDDmax; Clock to
input CLK stopped, Tamb= 25 °C
430 480 μA
IDDD (DPD) supply current Deep Power-down
mode
VDDmin ≤ VDD ≤ VDDmax; Clock to
input CLK stopped, Tamb= 25 °C
3 5 μA
14.2 AC characteristics
Table 13. Non-volatile memory timing characteristics
Conditions: VDD = 1.62 V to 5.5 V; VSS = 0 V; Tamb = -40 °C to +105 °C, unless otherwise specified.
Symbol Parameter Conditions Min Typ[1] Max Unit
tEEP FLASH erase + program time [2] 2.3 ms
tEEE FLASH erase time 0.9 ms
tEEW FLASH program time 1.4 ms
tEER FLASH data retention time Tamb = +55 °C 25 years
NEEC Intrinsic FLASH endurance[3]
(number of programming cycles)
1 × 1055 × 105cycles
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Symbol Parameter Conditions Min Typ[1] Max Unit
NEEC FLASH endurance (maximum
number of programming cycles
applied to the whole memory
block performed by NXP static
and dynamic wear leveling
algorithm)
20 × 106100 ×
106cycles
[1] Typical values are only referenced for information. They are subject to change without notice.
[2] Given value specifies physical access times of FLASH memory only.
[3] Usage of NXP wear leveling algorithm mandatory.
Table 14. Electrical AC characteristics of I2C_SDA, I2C_SCL, and RST_N[1]; VDD = 1.8 V ± 10% or 3 V ± 10% V; VSS =
0 V; Tamb = -40 °C to +105 °C°C
Symbol Parameter Conditions Min Typ Max Unit
Input/Output: I2C_SDA, I2C_SCL in open-drain mode
trIO I/O Input rise time Input/reception mode [2] 1 μs
tfIO I/O Input fall time Input/reception mode [2] 1 μs
tfOIO I/O Output fall time Output/transmission mode; CL
= 30 pF
[2] 0.3 μs
fCLK External clock frequency in I2C
applications
tCLKW, Tamb and VDD in their
specified imits
- 400 kHz
tCLKW Clock pulse width i.r.t. clock
period (positive pulse duty
cycle of CLK)
[3] 40 60 %
Input/Output: I2C_SDA, I2C_SCL in push-pull mode (I2C master in high-speed mode)
trIO I/O Input rise time Input/reception mode 0.25 μs
tfIO I/O Input fall time Input/reception mode 0.25 μs
tfOIO I/O Output fall time Output/transmission mode 0.1 μs
fCLK External clock frequency in I2C
applications
Input/reception mode - 3.4 MHz
tCLKW Clock pulse width i.r.t. clock
period (positive pulse duty
cycle of CLK)
2.1 %
Inputs: RST_N
tRW Reset pulse width (RST_N low)
without entering Deep Power-
down mode
40 400 μs
tRDSLP Reset pulse width (RST_N low)
to enter Deep Power-down
mode
500 μs
tWKP Wake-up time from Power-
down mode
fCLKmin < fCLK < fCLKmax - 8 10 μs
level triggered ext.int. - 8 10 μstWKPIO Pad LOW time for wake-up
from Power-down mode edge triggered ext.int. - 8 10 μs
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Symbol Parameter Conditions Min Typ Max Unit
tWKPRST RST_N LOW time for wake-up
from Power-down mode
40 - μs
tWKWT Time from Power-down mode
wake/up event to I2C_SDA
valid
50 100 ns
CPIN Pin capacitances RST_N,
I2C_SDA, /I2C_SCL
Test frequency = 1 MHz; Tamb
= 25 °C
- 10 pF
[1] All appropriately marked values are typical values and only referenced for information. They are subject to change without notice.
[2] tr is defined as rise time between 30% and 70% of the signal amplitude.
tf is defined as fall time between 70% and 30% of the signal amplitude.
[3] During AC testing the inputs RST_N, I2C_SDA, I2C_SCL are driven at 0 V to +0.3 V for a LOW input level and at VDD -0.3 V to VDD for a HIGH input level.
Clock period and signal pulse (duty cycle) timing is measured at 50% of VDD.
Figure 10. External clock drive and AC test timing reference points of I2C_SDA, I2C_SCL,
and RST_N (see 2and 3) in open-drain mode
Table 15. Electrical AC characteristics of IO1, IO2, CLK and RST_N
Conditions: VDD = 1.8 V ± 10 % or 3 V ± 10 % V; VSS = 0 V; Tamb = -40 °C to +105 °C, unless otherwise specified. Typical
values are only referenced for information. They are subject to change without notice.
Symbol Parameter Conditions Min Typ Max Unit
Input/Output: IO1/IO2
[1]
[2] 1 μstrIO I/O Input rise time Input/reception mode
[3]
[2] 0.25 x
tIOWx_min
μs
tfIO I/O Input fall time Input/reception mode [1]
[2] 1 μs
[3]
[2] 0.25 x
tIOWx_min
μs
trOIO I/O Output rise time Output/transmission mode; CL
= 30 pF
[2] 0.1 μs
tfOIO I/O Output fall time Output/transmission mode; CL
= 30 pF
[2] 0.1 μs
Inputs: CLK and RST_N
2During AC testing the inputs RST_N, I2C_SDA, I2C_SCL are driven at 0 V to +0.3 V for a LOW input
level and at VDD -0.3 V to VDD for a HIGH input level. Clock period and signal pulse (duty cycle)
timing is measured at 50% of VDD.
3tr is defined as rise time between 30% and 70% of the signal amplitude. tf is defined as fall time
between 70% and 30% of the signal amplitude.
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Symbol Parameter Conditions Min Typ Max Unit
fCLK External clock frequency
in ISO/IEC 7816 UART
applications
tCLKW, tamb and VDD in their
specified limits
[4] 0.85 11.5 MHz
tCLKW Clock pulse width i.r.t. clock
period (positive pulse duty
cycle of CLK)
40 60 %
trCLK CLK input rise time [5] [6]
tfCLK CLK input fall time [2]
[6] [6]
trRST RST_N input rise time [2] 400 μs
tfRST RST_N input fall time [2]
[7] 400 μs
tRW Reset pulse width (RST_N low) 40 μs
tWKP Wake-up time from Power-Down
mode
fCLKmin ≤ fCLK ≤ fCLKmax 17 20 μs
level triggered ext.int. 20 μstWKPIO I/Ox LOW time for wake-up from
Power-down mode edge triggered ext.int. 20
tWKPRST RST_N LOW time for wake-up
from Power-down mode
v
Inputs: CLK, RST_N, IO1, IO2
CPIN Pin capacitances CLK, RST_
N, IO1, IO2
Test frequency = 1 MHz;
tamb = 25 °C
20 pF
[1] At minimum IO1 input signal HIGH or LOW level voltage pulse width of 3.2 μs. This timing specification applies to ISO7816 configurations down to a
minimum etu duration of 16 CLK cycles at a maximum CLK frequency of 5 MHz (TA1=0x96, (Fi/Di)=(512/32)), for example.
[2] tr is defined as rise time between 10% and 90% of the signal amplitude.
[3] At minimum IO1 input signal HIGH or LOW level voltage pulse width of less than 3.2 μs. This timing specification applies to ISO7816 configurations
beyond the conditions listed in note [2], down to a minimum etu duration of 8 CLK cycles at a maximum CLK frequency of 5 MHz (TA1=0x97, (Fi/
Di)=(512/64)), for example. An 8 CLKs/etu @ fclk = 5 MHz configuration results in tIOWx_min = 1.6 μs, and in a time of 400 ns for trIO_max and tfIO_
max, matching the (Fi/Di)=(512/64) speed enhancement requirements of ETSI TS 102 221.
[4] ISO/IEC 7816 I/O applications have to supply a clock signal to input CLK in the frequency range of 1 MHz to 10 MHz nominal.A ± 15 % tolerance range
yields the allowed limits of 0.85 MHz and 11.5 MHz.
[5] During AC testing the inputs CLK, RST_N, and IO1 are driven at 0 V to +0.3 V for a LOW input level and at VDD − 0.3 V to VDD for a HIGH input level.
Clock period and signal pulse (duty cycle) timing is measured at 50% of VDD, see Figure 18.
[6] The maximum CLK rise and fall time is 10% of the CLK period 1/fCLK - with the following exception: In the CLK frequency range of 1 MHz to 5 MHz the
maximum allowed CLK rise and fall time is 50 ns, if 10% of the CLK period is shorter than 50 ns.
[7] The ETSI TS102 221/GSM 11.1x specifications specify a maximum reset signal (RST_N) rise time and fall time of 400,000 μs, respectively.
Table 16. Electrical AC characteristics of LA, LB; Conditions: Tamb = -40 °C to 105 °C, unless otherwise specified
Conditions: Tamb = -25 °C to +85 °C, unless otherwise specified.
Symbol Parameter Conditions Typ[1] Max Unit
Input/Output: LA, LB
CLALB
[2] Pin capacitance LA, LB
Bare die (SO 28, empty package
ground-off)
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Symbol Parameter Conditions Typ[1] Max Unit
Configured for antenna input with
56 pF capacitance
Test frequency = 13.56 MHz;
Tamb= 25 °C
VLA,LB = 2.1 V (rms)
VLA,LB = 0.3 V (rms)
[3] [4]
[4] 54.3
50.1
pF
RLALB
[2] Pin capacitance LA, LB
Bare die (SO 28, empty package
ground-off)
VLA,LB = 2.1 V (rms) [3] [4] 0.913Configured for antenna input
with 56 pF capacitance [5] Test
frequency = 13.56 MHz;
Tamb= 25 °C
VLA,LB = 0.3 V (rms) [4]
Wake-up time from Power-Down
mode
fCLKmin ≤ fCLK ≤ fCLKmax 17 20 μs
fLALB Operating frequency LA, LB level triggered ext.int. 13.56 MHZ
[1] Typical values (± 10%) are only referenced for information. They are subject to change without notice.
[2] The CLALB and RLALB values stated here assume a parallel RC equivalent circuit for the chip.
[3] The value stated here was measured at estimated start of chip operation and is comparable to the values stated in other SmartMX3 family member data
sheets.
[4] Measured with sine wave at LA, LB.
[5] 56 pF selection supports all data rates with ID1 antenna (Class 1), however, only 106 kbit/s with 1/2 ID1 antenna (Class 2).
14.3 EMC/EMI
EMC and EMI resistance according to IEC 61967-4.
Note: tf is defined as fall time between 90% and 10% of the signal amplitude.
15 Abbreviations
Table 17. Abbreviations
Acronym Description
AES Advanced Encryption Standard
APDU Application Protocol Data Unit
CL Contactless
CLK External clock signal input contact pad
CC Common Criteria
CMAC Cipher-based MAC
CRC Cyclic Redundancy Check
CRI Cryptography Research Incorporated
DES Digital Encryption Standard
DPA Differential Power Analysis
DSS Digital Signature Standard
EAL6 Evaluation Assurance Level
ECC Elliptic Curve Cryptography
EMC Electromagnetic compatibility
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Acronym Description
EMI Electro Magnetic Immunity
FM Fast-Mode
FM+ Fast-Mode+
GP Global Platform
GPIO General-purpose input/output
HS High-Speed-Mode
HKDF HMAC-based Extract-and-Expand Key Derivation Function
HMAC Keyed-Hash Message Authentication Code
HW Hardware
IC Integrated Circuit
I2C Inter-Integrated Circuit
I/O Input/Output
IoT Internet of Things
JCOP Java Card Open Platform
LA ISO 14443 Antenna Pad
LB ISO 14443 Antenna Pad
NFC Near Field Communication
MAC Message Authentication Code
MCU Microcontroller unit
MPU Microprocessor
MW Middleware
OS Operating System
NIST National Institute for Standards and Technology
PCB Protocol Control Byte
PKI Public Key Infrastructure
PRF Pseudo Random Function
RAM Random Access Memory
RSA Rivest-Shamir-Adleman
RST Reset
SAM Secure Access Module
SCL Serial clock
SDA Serial data
SPA Simple Power Analysis
SFI Single Fault Injection
SHA Secure Hash Algorithm
SW Software
TLS Transport Layer Security
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Acronym Description
VCC Supply Voltage Input
VIN Voltage Input
VOUT Voltage Output
VSS Ground
16 References
[1] NXP SE05x T=1 Over I2C Specificationl User Manual, Document Number
[2] SOT1969-1; HX2QFN20; Reel packing and package data sheet
[3] SE050 IoT Applet APDU Specification, document number AN 12413
[4] SE050 configurations Application Note, document number AN12436
17 Revision history
Table 18. Revision history
Document ID Release date Data sheet status Change notice Supersedes
504913 20190607 Objective data sheet 504912
Modifications: Changed data sheet status from COMPANY PROPRIETARY to PUBLIC
Updated Table 12
Updated Section 15
504912 20190510 Objective data sheet 504911
Modifications: Changed structure of document
Updated Section 1
Updated Section 2.3
Updated Use Cases and target applications
Updated Section 3.1
Added Section 3.3
Updated Section 3.1.2
Updated Section 3.1.5
Updated Section 3.2
Updated chapter Section 4
Updated and renamed chapter Section 5
Updated chapter Section 6
Updated Section 7.1.1
Updated Section 8
Updated Section 3.1.3
Updated Section 3.1.1
Updated Table 1
Updated Section 12
Updated Table 10
Updated Section 15
504911 20181122 Objective data sheet
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18 Legal information
18.1 Data sheet status
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product
development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
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No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or
the grant, conveyance or implication of any license under any copyrights,
patents or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of non-
automotive qualified products in automotive equipment or applications. In
the event that customer uses the product for design-in and use in automotive
applications to automotive specifications and standards, customer (a) shall
use the product without NXP Semiconductors’ warranty of the product for
such automotive applications, use and specifications, and (b) whenever
customer uses the product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at customer’s own
risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,
damages or failed product claims resulting from customer design and use
of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
18.4 Licenses
ICs with DPA Countermeasures functionality
NXP ICs containing functionality
implementing countermeasures to
Differential Power Analysis and Simple
Power Analysis are produced and sold
under applicable license from Cryptography
Research, Inc.
18.5 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
MIFARE — is a trademark of NXP B.V.
FabKey — is a trademark of NXP B.V.
NXP Semiconductors SE050
Plug & Trust Secure Element
SE050 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2019. All rights reserved.
Objective data sheet Rev. 1.3 — 7 June 2019
504913 27 / 28
Tables
Tab. 1. SE050 commercial name format ....................... 2
Tab. 2. Feature Overview ..............................................4
Tab. 3. SE050 Ordering information ............................10
Tab. 4. SE050 Ordering information for
development kit ............................................... 10
Tab. 5. Pin description HX2QFN20 ............................. 11
Tab. 6. Marking codes .................................................12
Tab. 7. Reel packing options .......................................12
Tab. 8. Limiting values ................................................ 13
Tab. 9. Recommended operating conditions ...............13
Tab. 10. Electrical DC characteristics of Input/Output:
IO1/IO2. Conditions: VDD = 1.62 V to 3.6 V
(see ; VSS = 0 V; Tamb = -40 °C to + 105
°C, unless otherwise specified ........................ 14
Tab. 11. Electrical DC characteristics of I2C pads
SDA, SCL. Conditions: VDD = 1.62 V to 3.6
V; VSS = 0 V; Tamb = -40 °C to + 105 °C,
unless otherwise specified* ............................. 17
Tab. 12. Electrical characteristics of IC supply
voltage VDD; VSS = 0 V; Tamb = -40 °C to
+105 °C ........................................................... 18
Tab. 13. Non-volatile memory timing characteristics ..... 18
Tab. 14. Electrical AC characteristics of I2C_SDA,
I2C_SCL, and RST_N; VDD = 1.8 V ± 10%
or 3 V ± 10% V; VSS = 0 V; Tamb = -40 °C
to +105 °C°C ...................................................19
Tab. 15. Electrical AC characteristics of IO1, IO2,
CLK and RST_N ............................................. 20
Tab. 16. Electrical AC characteristics of LA, LB;
Conditions: Tamb = -40 °C to 105 °C, unless
otherwise specified ..........................................21
Tab. 17. Abbreviations ...................................................22
Tab. 18. Revision history ...............................................24
Figures
Fig. 1. SE050 solution block diagram ...........................2
Fig. 2. SE050 functional diagram - example Open
SSL ....................................................................5
Fig. 3. Pin configuration for HX2QFN20
(SOT1969-1) ....................................................11
Fig. 4. Characteristic supply voltage operating
range ............................................................... 14
Fig. 5. Input characteristic of RST_N ......................... 16
Fig. 6. Input characteristic of IO1/IO2 in "quasi-
bidirectional" mode ..........................................16
Fig. 7. Input characteristic of IO1/IO2 in "weak pull-
up" mode .........................................................16
Fig. 8. Input characteristic of CLK when the IC is not
in reset and of RST_N .................................... 17
Fig. 9. Input characteristic of CLK during IC reset ...... 17
Fig. 10. External clock drive and AC test timing
reference points of I2C_SDA, I2C_SCL, and
RST_N (see and ) in open-drain mode ........... 20
NXP Semiconductors SE050
Plug & Trust Secure Element
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.
© NXP B.V. 2019. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 7 June 2019
Document number: 504913
Contents
1 Introduction ......................................................... 1
1.1 SE050 use cases .............................................. 1
1.2 SE050 target applications ..................................1
1.3 SE050 naming convention .................................2
2 Features and benefits .........................................3
2.1 Key benefits .......................................................3
2.2 Key features ...................................................... 3
2.3 Features in detail ...............................................4
3 Functional description ........................................5
3.1 Functional diagram ............................................ 5
3.1.1 Supported secure object types .......................... 5
3.1.1.1 Symmetric Key .................................................. 6
3.1.1.2 ECC Key ............................................................6
3.1.1.3 RSA Key ............................................................ 6
3.1.1.4 HMAC Key object .............................................. 6
3.1.1.5 Binary file objects .............................................. 7
3.1.1.6 Counter Objects .................................................7
3.1.1.7 Hash-Extend register ......................................... 7
3.1.1.8 User ID secure object ........................................7
3.1.2 Access control ................................................... 7
3.1.3 Sessions and multi-threading ............................ 7
3.1.4 Attestation and trust provisioning .......................8
3.1.5 Application support ............................................ 8
3.2 Credential Storage & Memory ........................... 8
3.3 Ease of use configuration ..................................8
4 Communication interfaces ................................. 8
4.1 I2C Interfaces .................................................... 8
4.1.1 Supported I2C frequencies ................................9
4.2 ISO7816 and ISO14443 Interface ..................... 9
5 Power-saving modes .......................................... 9
5.1 Power-down mode .............................................9
5.2 Deep Power-down mode ...................................9
6 Ordering information ........................................ 10
6.1 Ordering options .............................................. 10
6.2 Ordering SE050 samples ................................ 10
6.3 Configuration ....................................................10
7 Pinning information .......................................... 11
7.1 Pinning ............................................................. 11
7.1.1 Pinning HX2QFN20 ......................................... 11
8 Package ..............................................................12
9 Marking ...............................................................12
10 Packing information ..........................................12
10.1 Reel packing ....................................................12
11 Electrical and timing characteristics ...............13
12 Limiting values .................................................. 13
13 Recommended operating conditions .............. 13
14 Characteristics .................................................. 14
14.1 DC characteristics ............................................14
14.1.1 General and General Purpose I/O interface .....14
14.1.2 I2C Interface .................................................... 17
14.1.3 Power consumption ......................................... 18
14.2 AC characteristics ............................................18
14.3 EMC/EMI ..........................................................22
15 Abbreviations .................................................... 22
16 References ......................................................... 24
17 Revision history ................................................ 24
18 Legal information .............................................. 25