HDSP-573x
Seven Segment Displays for High Light Ambient Conditions
Data Sheet
Features
x High light output
Typical intensities of up to 7.0 mcd/seg at 100 mA
pk 1 of 5 duty factor
x Capable of high current drive
Excellent for long digit string multiplexing
x Four character sizes
7.6 mm, 10.9 mm, 14.2 mm, and 20.3 mm
x Choice of two colors
High Eciency Red
Yellow
x Excellent character appearance
Evenly lighted segments
Wide viewing angle
Gray body for optimum contrast
x Categorized for luminous intensity;
Yellow categorized for color
Use of like categories yields a uniform display
x IC compatible
x Mechanically rugged
High Eciency Red: HDSP-3900 Series
Yellow: HDSP-4030/-4130/-5730/-4200 Series
Description
The HDSP-3900 and HDSP-4030/-4130/-5730/-4200 are
7.6 mm, 10.9 mm/14.2 mm/20.3 mm high eciency red
and yellow displays designed for use in high light ambient
condition. The four sizes of displays allow for viewing
distances at 3, 6, 7, and 10 meters. These seven segment
displays utilize large junction high eciency LED chips
made from GaAsP on a transparent GaP substrate. Due
to the large junction area, these displays can be driven at
high peak current levels needed for high ambient condi-
tions or many character multiplexed operation.
These displays have industry standard packages, and pin
congurations and ±1 overow display are available in
all four sizes. These numeric displays are ideal for appli-
cations such as Automotive and Avionic Instrumentation,
Point of Sale Terminals, and Gas Pump.
2
Devices
Part No.
HDSP- Color Description
Package
Drawing
4030 Yellow 7.6 mm Common Anode Left Hand Decimal A
4031 7.6 mm Common Anode Right Hand Decimal B
4033 7.6 mm Common Cathode Right Hand Decimal C
4036 7.6 mm Universal Overow ±1 Right Hand Decimal D
4130 Yellow 10.9 mm Common Anode Left Hand Decimal E
4131 10.9 mm Common Anode Right Hand Decimal F
4133 10.9 mm Common Cathode Right Hand Decimal G
4136 10.9 mm Universal Overow ±1 Right Hand Decimal H
5731 Yellow 14.2 mm Common Anode Right Hand Decimal I
5733 14.2 mm Common Cathode Right Hand Decimal J
5737 14.2 mm Overow ±1 Common Anode K
5738 14.1 mm Overow ±1 Common Cathode L
3900 High Eciency Red 20.3 mm Common Left Hand Decimal M
3901 20.3 mm Common Anode Right Hand Decimal N
3903 20.3 mm Common Cathode Right Hand Decimal O
3905 20.3 mm Common Cathode Left Hand Decimal P
3906 20.3 mm Universal Overow ±1 Right Hand Decimal Q
4200 Yellow 20.3 mm Common Left Hand Decimal M
4201 20.3 mm Common Anode Right Hand Decimal N
4203 20.3 mm Common Cathode Right Hand Decimal O
4206 20.3 mm Universal Overow ±1 Right Hand Decimal Q
Note:
Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams D and H.
Absolute Maximum Ratings (All Products)
Parameter Symbol Yellow/High Eciency Red Units
Average Power per Segment or DP (T
A = 25°C) 105 mW
Peak Forward Current per Segment or DP (T
A = 25°C) 135 (Pulse Width = 0.16 ms) mA
DC Forward Current per Segment[2] or DP (T
A = 25°C) 40 mW
Operating Temperature TO-40 to 85 °C
Storage Temperature TS-40 to 85 °C
Reverse Voltage per segment or DP VR5.0 V
Wavesolder Temperature (1.59mm [1/16 inch] below body) 250°C for 3 secs
Note:
1. See Figure 1 to establish pulsed operating conditions
2. Derate maximum DC current above TA = 25°C at 0.50 mA/°C per segment, see Figure 2.
3
FUNCTION
Pin
A
-4030
B
-4031
C
-4033
D
-4036
1
2
3
4
5
6
7
8
9
10
11
12
13
14
CATHODE-a
CATHODE-f
ANODE[3]
NO PIN
NO PIN
CATHODE-dp
CATHODE-e
CATHODE-d
NO CONN.[5]
CATHODE-c
CATHODE-g
NO PIN
CATHODE-b
ANODE[3]
CATHODE-a
CATHODE-f
ANODE[3]
NO PIN
NO PIN
NO CONN.[5]
CATHODE-e
CATHODE-d
CATHODE-dp
CATHODE-c
CATHODE-g
NO PIN
CATHODE-b
ANODE[3]
CATHODE[6]
ANODE-f
ANODE-g
ANODE-e
ANODE-d
CATHODE[6]
ANODE-dp
ANODE-c
ANODE-b
ANODE-a
ANODE-d
NO PIN
CATHODE-d
CATHODE-c
CATHODE-e
ANODE-e
ANODE-c
ANODE-dp
NO PIN
CATHODE-dp
CATHODE-b
CATHODE-a
ANODE-a
ANODE-b
Package Dimensions (HDSP-4030 Series)
Package Dimensions (HDSP-4130 Series)
FUNCTION
Pin
E
-4130
F
-4131
G
-4133
H
-4136
1
2
3
4
5
6
7
8
9
10
11
12
13
14
CATHODE-a
CATHODE-f
ANODE[3]
NO PIN
NO PIN
CATHODE-dp
CATHODE-e
CATHODE-d
NO CONN.[5]
CATHODE-c
CATHODE-g
NO PIN
CATHODE-b
ANODE[3]
CATHODE-a
CATHODE-f
ANODE[3]
NO PIN
NO PIN
NO CONN.[5]
CATHODE-e
CATHODE-d
CATHODE-dp
CATHODE-c
CATHODE-g
NO PIN
CATHODE-b
ANODE[3]
ANODE-a
ANODE-f
CATHODE[6]
NO PIN
NO PIN
NO CONN.[6]
ANODE-e
ANODE-d
ANODE-dp
ANODE-c
ANODE-g
NO PIN
ANODE-b
CATHODE[8]
CATHODE-d
ANODE-d
NO PIN
CATHODE-c
CATHODE-e
ANODE-e
ANODE-c
ANODE-dp
CATHODE-dp
CATHODE-b
CATHODE-a
NO PIN
ANODE-a
ANODE-b
4
FUNCTION
Pin
K
-5737
L
-5738
1
2
3
4
5
6
7
8
9
10
CATHODE-c
ANODE-c,d
CATHODE-b
ANODE-a,b, DP
CATHODE DP
CATHODE-a
ANODE-a,d, DP
ANODE-c,d
CATHODE-d
NO PIN[5]
ANODE-c
CATHODE-c,d
ANODE-b
CATHODE-a,b, DP
ANODE DP
ANODE-a
CATHODE-a,b, DP
CATHODE-c,d
ANODE-d
NO PIN[5]
Package Dimensions (HDSP-5730 Series)
Package Dimensions (-3900/-4200 Series)
FUNCTION
Pin
M
3900/4200
N
3901/4201
O
3903/4203
P
3905
Q
3906/4206
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
15
17
18
NO PIN
CATHODE-a
CATHODE-f
ANODE[3]
CATHODE-e
ANODE[3]
CATHODE-dp
NO PIN
NO PIN
NO PIN
CATHODE-d
ANODE[3]
CATHODE-c
CATHODE-g
CATHODE-b
NO PIN
ANODE[3]
NO PIN
NO PIN
CATHODE-a
CATHODE-f
ANODE[3]
CATHODE-e
ANODE[3]
NO CONN.
NO PIN
NO PIN
CATHODE-dp
CATHODE-d
ANODE[3]
CATHODE-c
CATHODE-g
CATHODE-b
NO PIN
ANODE[3]
NO PIN
NO PIN
ANODE-a
ANODE-f
CATHODE[6]
ANODE-e
CATHODE[6]
NO CONN.
NO PIN
NO PIN
ANODE-dp
ANODE-d
CATHODE[6]
ANODE-c
ANODE-g
ANODE-b
NO PIN
CATHODE[6]
NO PIN
NO PIN
ANODE-a
ANODE-f
CATHODE[6]
ANODE-e
CATHODE[6]
ANODE-dp
NO PIN
NO PIN
NO PIN
ANODE-d
CATHODE[6]
ANODE-c
ANODE-g
ANODE-b
NO PIN
CATHODE[6]
NO PIN
NO PIN
CATHODE-a
ANODE-d
CATHODE-d
CATHODE-c
CATHODE-e
ANODE-e
CATHODE-dp
NO PIN
ANODE-dp
CATHODE-dp
CATHODE-b
ANODE-b
ANODE-c
ANODE-a
NO PIN
CATHODE-a
NO PIN
Notes:
1. Dimensions in millimeters and inches.
2. All untoleranced dimensions are for reference only.
3. Redundant anodes.
4. Unused dp position.
5. See Internal Circuit Diagram.
6. Redundant Cathodes.
7. For HDSP-4130/-5731/-4200 Series product only.
8. See part number table for LMDP and RMDP designation.
5
Internal Circuit Diagram (HDSP-4030 Series)
Internal Circuit Diagram (HDSP-4130 Series)
Internal Circuit Diagram (HDSP-5730 Series)
6
Internal Circuit Diagram (HDSP-3900/-4200 Series)
Electrical/Optical Characteristics at TA = 25°C
Parameter Sym.
Device
HDSP- Min. Typ. Max. Units Test Condition
Luminous Intensity/Segment [1, 2]
(Digit Average)
IV3900 2200 7000 Pcd 100 mA Pk
1 of 5 Duty Factor
3900 4800 Pcd 20 mA DC
4030
4130
5730
4200
1500
1500
2200
2200
4500
5000
7000
7000
Pcd 100 mA Pk;
1 of 5 Duty Factor
4030
4130
5730
4200
2200
2500
3400
3400
Pcd 20 mA DC
Peak Wavelength OPEAK 3900 635 nm
4030/4130/
5730/4200
583 nm
Dominant Wavelength [3,4]
(Digit Average)
Od3900 626 nm
4030/4130/
5730/4200
581.5 586 592.5 nm
Forward Voltage/Seg or D.P. VFAll Devices 2.6 3.5 V IF = 100 mA
Reverse Current/Seg or D.P. IRAll Devices 100 PAVR = 3.0 V
Temp. Coe. of VF/Seg or D.P. 'VF/°C All Devices –1.1 mV/°C IF = 100 mA
Thermal Resistance LED
Junction-to-Pin
RTJ-PIN 4030/4130 282 °C/W/Seg
5730 345 °C/W/Seg
3900/4200 375 °C/W/Seg
Notes:
1. Case temperature of the device immediately prior to the intensity measurement is 25°C.
2. The digits are categorized for luminous intensity with the intensity category designated by a letter on the side of the package.
3. The dominant wavelength, Od, is derived from the CIE chromaticity diagram and is that single wavelength which denes the color of the device.
4. The yellow displays are categorizes as to dominant wavelength with the category designated by a number adjacent to the intensity category
letter.
7
Figure 1. Maximum Allowed Peak Current vs. Pulse Duration.
Figure 5. Relative Luminous Intensity vs. DC Forward Current.Figure 4. Peak Forward Segment Current vs. Peak Forward Voltage.
Figure 2. Maximum Allowable DC Current per Segment vs.
Ambient Temperature.
Figure 3. Relative Eciency (Luminous Intensity per Unit Current) vs.
Peak Segment Current.
8
Electrical
These display devices are composed of eight light emitting
diodes, with light from each LED optically stretched to
form individual segments and a decimal point.
The devices utilize LED chips which are made from GaAsP
on a transparent GaP substrate.
These display devices are designed for strobed operation.
The typical forward voltage values, scaled from Figure 4,
should be used for calculating the current limiting resistor
value and typical power dissipation. Expected maximum
VF values, for the purpose of driver circuit design and
maximum power dissipation, may be calculated using the
following VF MAX models:
VF MAX = 2.15 V + IPEAK (13.5 :)
For: IF ≥ 30 mA
VF MAX = 1.9 V + IDC (21.8 :)
For: 10 mA ≤ IF ≤ 30 mA
Temperature derated strobed operating conditions are
obtained from Figures 1 and 2. Figure 1 relates pulse
duration (tp), refresh rate (f), and the ratio of maxi mum peak
current to maxi mum dc current (IPEAK MAX/IDC MAX). Figure
2 presents the maximum allowed dc current vs. ambient
temperature. Figure 1 is based on the principle that the peak
junc tion temperature for pulsed operation at a specied
peak current, pulse duration and refresh rate should be
the same as the junction temperature at maximum DC
operation. Refresh rates of 1 kHz or faster minimize the
pulsed junction heating eect of the device resulting in the
maximum possible time average luminous intensity.
The time average luminous inten sity can be calculated
knowing the average forward current and relative ef-
ciency characteristic, KPEAK, of Figure 3. Time average
luminous intensity for a device case temperature of 25°C,
IV (25°C), is calculated as follows:
I
AVG
IV (25°C) = [ ] [KPEAK] [IV DATA SHEET]
20 mA
Example: For HDSP-4030 series
KPEAK = 1.00 at IPEAK = 100 mA.
For DF = 1/5:
20 mA
IV (25°C) = [ ] [1.00] [4.5 mcd]
20 mA
= 4.5 mcd/segment
The time average luminous inten sity may be adjusted for
operat ing junction temperature by the following expo-
nential equation:
IV (TJ) = IV (25°C) e[k(TJ + 25°C)]
where TJ = T
A + PDt3ɁJ-A
Device K
-3900 -0.0131/°C
-4030/-4130/-5730/-4200 -0.0112/°C
Mechanical
These devices are constructed utilizing a lead frame in a
standard DIP package. The LED dice are attached directly
to the lead frame. Therefore, the cathode leads are the
direct thermal and mechanical stress paths to the LED
dice. The absolute maximum allowed junction tempera-
ture, TJ MAX, is 105°C. The maximum power ratings have
been established so that the worst case VF device does not
exceed this limit.
Worst case thermal resistance pin-to-ambient is 400°C/W/
Seg when these devices are soldered into minimum
trace width PC boards. When installed in a PC board that
provides RTPIN-A less than 400°C/W/Seg these displays
may be operated at higher average currents as shown in
Figure 2.
Optical
The radiation pattern for these devices is approximately
Lam bertian. The luminous sterance may be calculated
using one of the two following formulas.
I
v (cd)
LV (cd/m2) =
A (m2)
SIv (cd)
LV (footlamberts) =
A (ft2)
Device
Area/Seg.
mm2
Area/Seg.
in2
-4030 2.5 0.0039
-4130 4.4 0.0068
-5730 8.8 0.0137
-3900/-4200 14.9 0.0231
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Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved. Obsoletes 5988-1734EN
AV02-2552EN - June 28, 2010
Contrast Enhancement
The objective of contrast enhance ment is to optimize
dis play readability. Adequate contrast enhancement can
be achieved in indoor applications through luminous
contrast techniques. Luminous contrast is the observed
brightness of the illuminated segment compared to the
brightness of the surround. Appropriate wavelength lters
maximize luminous contrast by reducing the amount of
light reected from the area around the display while
transmitting most of the light emitted by the segment.
These lters are described further in Application Note
1015.
Chrominance contrast can further improve display read-
ability. Chrominance contrast refers to the color dierence
between the illuminated segment and the surrounding
area. These displays are assembled with a gray package
and untinted encapsulating epoxy in the segments to
improve chrominance contrast of the ON segments.
Additional contrast enhancement in bright ambients may
be achieved by using a neutral density gray lter such as
Panelgraphic Chromalter Gray 10, or 3M Light Control
Film (louvered lm).