PRODUCTPREVIEW
16-Bit
ADC
Gain
Local
Temperature
IR
Thermopile
Sensor Voltage
Reference
Digital
Control
and
Math Engine
I C and
SMBus
Compatible
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Interface
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TMP007
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TMP007
SBOS685 –APRIL 2014
TMP007 Infrared Thermopile Sensor with Integrated Math Engine
1 Features 3 Description
The TMP007 is an infrared thermopile sensor that
1• Thermopile and Local Die Temperture Sensor measures the temperature of an object without
– NETD: 90 mK contacting the object. The integrated thermopile
– Responsivity: 9 V/W absorbs the infrared energy emitted from the object in
the sensor field of view. The thermopile voltage is
– Sensor Noise: 300 nV digitized and provided as an input to the integrated
• Iintegrated Math Engine math engine, along with the die temperature (TDIE).
– 14-Bit (0.03125°C) Resolution The math engine then computes the corresponding
object temperature.
– Alert Pin: Interrupt and Comparator Modes
– Nonvolatile Memory Default calibration and thermal transient coefficients
are stored in the built-in nonvolatile EPROM memory.
– Programmable Conversion Rate Application specific values can be stored for improved
– Transient Correction accuracy. An alert function is available, and can be
• Low Quiescent Current: 270-µA Active, 2-µA programmed in either comparator or interrupt mode.
Shutdown The TMP007 is compatible with I2C and SMBus
• I2C™ and SMBus Compatible interfaces, and allows up to eight devices on one bus.
• 8-Ball DSBGA, 1.9 mm × 1.9 mm × 0.625 mm Low power consumption along with low operating
voltage is ideal for battery-powered applications.
package The TMP007 provides convenient, noncontact
2 Applications thermal solutions for measuring temperature with
factory-supplied calibration. This device is also
• Temperature Measurement suitable for industrial and consumer applications with
– Laptop and Tablet Cases a user-customized system calibration.
– Batteries Device Information
– Heat Sinks ORDER NUMBER PACKAGE BODY SIZE
– Skin TMP007YZF DSBGA (8) 1.9 mm × 1.9 mm
– Laser Printers
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of
development. Subject to change or discontinuance without notice.
PRODUCTPREVIEW
TMP007
SBOS685 –APRIL 2014
www.ti.com
4 Device and Documentation Support
4.1 Trademarks
I2C is a trademark of NXP Semiconductors.
All other trademarks are the property of their respective owners.
4.2 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
4.3 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
2Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: TMP007
PACKAGE OPTION ADDENDUM
www.ti.com 23-Apr-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TMP007AIYZFR PREVIEW DSBGA YZF 8 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-2-260C-1 YEAR -40 to 125
TMP007AIYZFT PREVIEW DSBGA YZF 8 250 Green (RoHS
& no Sb/Br) SNAGCU Level-2-260C-1 YEAR -40 to 125
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 23-Apr-2014
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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