ADC0816CCN/NOPB - Texas Instruments High-Performance Analog

ADC0816, ADC0817

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ADC0816/ADC0817 8-Bit μP Compatible A/D Converters

with16-Channel Multiplexer

Check for Samples: ADC0816,ADC0817

1FEATURES

23• Easy interface to all microprocessors DESCRIPTION

The ADC0816, ADC0817 data acquisition component

• Operates ratiometrically or with 5 VDC or is a monolithic CMOS device with an 8-bit analog-to-

analog span adjusted voltage reference digital converter,16-channel multiplexer and

• 16-channel multiplexer with latched control microprocessor compatible control logic. The 8-bit

logic A/D converter uses successive approximation as the

• Outputs meet TTL voltage level specifications conversion technique. The converter features a high

impedance chopper stabilized comparator, a 256R

• 0V to 5V analog input voltage range with voltage divider with analog switch tree and a

single 5V supply successive approximation register. The 16-channel

• No zero or full-scale adjust required multiplexer can directly access any one of 16-single-

• Standard hermetic or molded 40-pin MDIP ended analog signals, and provides the logic for

package additional channel expansion. Signal conditioning of

any analog input signal is eased by direct access to

• Temperature range −40°C to +85°Cor −55°C to the multiplexer output, and to the input of the 8-bit

+125°C A/D converter.

• Latched TRI-STATE output The device eliminates the need for external zero and

• Direct access to “comparator in” and full-scale adjustments. Easy interfacing to

“multiplexer out” for signal conditioning microprocessors is provided by the latched and

• ADC0816 equivalent to MM74C948 decoded multiplexer address inputs and latched TTL

TRI-STATE®outputs.

• ADC0817 equivalent to MM74C948-1 The design of the ADC0816, ADC0817 has been

KEY SPECIFICATIONS optimized by incorporating the most desirable aspects

of several A/D conversion techniques. The

• Resolution ........................8 Bits ADC0816,ADC0817 offers high speed, high

• Total Unadjusted Error....±½ LSB and ±1 accuracy, minimal temperature dependence,

• Single Supply....................5 VDC excellent long-term accuracy and repeatability, and

consumes minima lpower. These features make this

• Low Power........................15 mW device ideally suited to applications from process and

• Conversion Time..............100 µs machine control to consumer and automotive

applications. For similar performance in an 8-channel,

28-pin, 8-bit A/D converter, see the ADC0808,

ADC0809 data sheet. (See AN-258 for more

information.)

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2TRI-STATE is a registered trademark of Texas Instruments.

3All other trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

ADC0816, ADC0817

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Block Diagram

Connection Diagram

Dual-In-Line Package

See Package Number NJF0040A

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Absolute Maximum Ratings (1) (2)

Supply Voltage (VCC)(3) 6.5V

Voltage at Any Pin −0.3V to (VCC+0.3V)

Except Control Inputs

Voltage at Control Inputs −0.3V to 15V

(START, OE, CLOCK, ALE, EXPANSION CONTROL,

ADD A, ADD B, ADD C, ADD D)

Storage Temperature Range −65°C to +150°C

Package Dissipation at TA= 25°C 875 mW

Lead Temp. (Soldering, 10 seconds)

Dual-In-Line Package (Plastic) 260°C

Molded Chip Carrier Package

Vapor Phase (60seconds) 215°C

Infrared (15 seconds) 220°C

ESD Susceptibility (4) 400V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not

apply when operating the device beyond its specified operating conditions.

(2) All voltages are measured with respect to GND, unless otherwise specified.

(3) A Zener diode exists, internally, from VCC to GND and has a typical breakdown voltage of 7 VDC.

(4) Human body model, 100 pF discharged through a 1.5 kΩresistor.

Operating Conditions (1)

Temperature Range (2) TMIN≤TA≤TMAX

ADC0816CCN, ADC0817CCN −40°C≤TA≤+85°C

Range of VCC(2) 4.5 VDC to 6.0VDC

Voltage at Any Pin 0V to VCC

Except Control Inputs

Voltage at Control Inputs 0V to 15V

(START,OE, CLOCK, ALE, EXPANSION CONTROL,

ADD A, ADD B, ADD C, ADDD)

(1) All voltages are measured with respect to GND, unless otherwise specified.

(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not

apply when operating the device beyond its specified operating conditions.

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Electrical Characteristics

Converter Specifications: VCC = 5 VDC = VREF(+), VREF(−)= GND, VIN = VCOMPARATOR IN,TMIN ≤TMAX and fCLK = 640 kHz unless

otherwise stated.

Symbol Parameter Conditions Min Typ Max Units

ADC0816

Total Unadjusted Error 25°C ±½ LSB

See Note (1) TMIN to TMAX ±¾ LSB

ADC0817

Total Unadjusted Error 0°C to 70°C ±1 LSB

See Note (1) TMIN to TMAX ±1¼ LSB

Input Resistance From Ref(+)to Ref(−) 1.0 4.5 kΩ

Analog Input Voltage Range V(+) or V(−)(2) GND −0.1 VCC + 0.1 VDC

VREF(+) Voltage, Top of Ladder Measured at Ref(+) VCC VCC+0.1 V

Voltage, Center of Ladder VCC/2 −0.1 VCC/2 VCC/2 + 0.1

VREF(−)Voltage, Bottom of Ladder Measured at Ref(−)−0.1 0 V

Comparator Input Current fc= 640 kHz, (3) −2 ±0.5 2 µA

(1) Total unadjusted error includes offset, full-scale, and linearity errors. See Figure 3. None of these A/Ds requires a zero or full-scale

adjust. However, if an all zero code is desired for an analog input other than 0.0V,or if a narrow full-scale span exists (for example: 0.5V

to 4.5V full-scale)the reference voltages can be adjusted to achieve this. See Figure 13.

(2) Two on-chip diodes are tied to each analog input which will forward conduct for analog input voltages one diode drop below ground or

one diode drop greater than the VCCsupply. The spec allows 100 mV forward bias of either diode. This means that as long as the analog

VIN does not exceed the supply voltage by more than 100 mV, the output code will be correct. To achieve an absolute0 VDC to 5 VDC

input voltage range will therefore require a minimum supply voltage of 4.900 VDC over temperature variations, initial tolerance and

(3) Comparator input current is a bias current into or out of the chopper stabilized comparator. The bias current varies directly with clock

frequency and has little temperature dependence (Figure 6).

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Electrical Characteristics

Digital Levels and DC Specifications: ADC0816CCN, ADC0817CCN—4.75V ≤VCC ≤5.25V, −40°C ≤TA≤+85°C unless

otherwise noted.

Symbol Parameter Conditions Min Typ Max Units

ANALOG MULTIPLEXER

(Any Selected Channel)

TA= 25°C, RL= 10k 1.5 3 kΩ

RON Analog Multiplexer ON Resistance TA= 85°C 6 kΩ

TA= 125°C 9 kΩ

ΔON Resistance Between Any 2 (Any Selected Channel) 75 Ω

ΔRON Channels RL=10k

VCC= 5V, VIN= 5V,

IOFF+ OFF Channel Leakage Current TA= 25°C 10 200 nA

TMIN to TMAX 1.0 μA

VCC = 5V, VIN = 0,

IOFF(−)OFF Channel Leakage Current TA= 25°C −200 nA

TMIN to TMax −1.0 μA

CONTROL INPUTS

VIN(1) Logical “1”Input Voltage VCC −1.5 V

VIN(0) Logical “0”Input Voltage 1.5 V

Logical “1”Input Current

IIN(1) VIN = 15V 1.0 μA

(The Control Inputs)

IIN(0) Logical “0”Input Current VIN = 0 −1.0 μA

(The Control Inputs)

ICC Supply Current fCLK = 640 kHz 0.3 3.0 mA

DATA OUTPUTS AND EOC (INTERRUPT)

IO=−360 μA, TA= 85°C

VOUT(1) Logical “1”Output Voltage VCC −0.4 V

IO=−300 μA, TA= 125°C

VOUT(0) Logical “0”Output Voltage IO= 1.6 mA 0.45 V

VOUT(0) Logical “0”Output Voltage EOC IO= 1.2 mA 0.45 V

VO= VCC 3.0 μA

IOUT TRI-STATE Output Current VO= 0 −3.0 μA

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Electrical Characteristics

Timing Specifications:VCC = VREF(+) = 5V, VREF(−)= GND, tr= tf= 20 ns and TA= 25°C unless otherwise noted.

Symbol Parameter Conditions Min Typ Max Units

tWS Minimum Start Pulse Width (Figure 5)(1) 100 200 ns

tWALE Minimum ALE Pulse Width (Figure 5) 100 200 ns

tsMinimum Address Set-Up Time (Figure 5) 25 50 ns

THMinimum Address Hold Time (Figure 5) 25 50 ns

Analog MUX Delay Time

tDRS= OΩ(Figure 5) 1 2.5 μs

from ALE

tH1, tH0 OE Control to Q Logic State CL= 50 pF, RL= 10k (Figure 8) 125 250 ns

t1H, t0H OE Control to Hi-Z CL= 10 pF, RL= 10k (Figure 8) 125 250 ns

tCConversion Time fc=640 kHz, (Figure 5)(2) 90 100 116 μs

fcClock Frequency 10 640 1280 kHz

Clock

tEOC EOC Delay Time (Figure 5) 0 8 + 2μsPeriods

CIN Input Capacitance At Control Inputs 10 15 pF

TRI-STATE Output

COUT At TRI-STATE Outputs (2) 10 15 pF

Capacitance

(1) If start pulse is asynchronous with converter clock or if fc> 640 kHz, the minimum start pulse width is 8clock periods plus 2 μs. For

synchronous operation at fc≤640 kHz take start high within 100 ns of clock going low.

(2) The outputs of the data register are updated one clock cycle before the rising edge of EOC.

Functional Description

Multiplexer: The device contains a 16-channel single-ended analog signal multiplexer. A particular input channel

is selected by using the address decoder. Table 1 shows the input states for the address line and the expansion

control line to select any channel. The address is latched into the decoder on the low-to-high transition of the

address latch enable signal.

Table 1. Inputs States for the Address line

Selected Address Line(1) Expansion

AnalogChannel D C B A Control

IN0 L L L L H

IN1 L L L H H

IN2 L L H L H

IN3 L L H H H

IN4 L H L L H

IN5 L H L H H

IN6 L H H L H

IN7 L H H H H

IN8 H L L L H

IN9 H L L H H

IN10 H L H L H

IN11 H L H H H

IN12 H H L L H

IN13 H H L H H

IN14 H H H L H

IN15 H H H H H

All Channels OFF X X X X L

(1) X = don't care

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Additional single-ended analog signals can be multiplexed to the A/D converter by disabling all the multiplexer

inputs using the expansion control. The additional external signals are connected to the comparator input and the

device ground. Additional signal conditioning (i.e., prescaling, sample and hold, instrumentation amplification,

etc.) may also be added between the analog input signal and the comparator input.

CONVERTER CHARACTERISTICS

The Converter

The heart of this single chip data acquisition system is its8-bit analog-to-digital converter. The converter is

designed to give fast, accurate, and repeatable conversions over a wide range of temperatures. The converter is

partitioned into 3 major sections: the 256R ladder network, the successive approximation register, and the

comparator. The converter's digital outputs are positive true.

The 256R ladder network approach Figure 1 was chosen over the conventional R/2R ladder because of its

inherent monotonicity, which specifies no missing digital codes. Monotonicity is particularly important in closed

loop feedback control systems. A non-monotonic relationship can cause oscillations that will be catastrophic for

the system. Additionally, the 256R network does not cause load variations on the reference voltage.

The bottom resistor and the top resistor of the ladder networking Figure 1 are not the same value as the

remainder of the network. The difference in these resistors causes the output characteristic to be symmetrical

with the zero and full-scale points of the transfer curve. The first output transition occurs when the analog signal

has reached + ½ LSB and succeeding output transitions occur every 1 LSB later up to full-scale.

Figure 1. Resistor Ladder and Switch Tree

Figure 2. 3-Bit A/D Transfer Curve Figure 3. 3-Bit A/D Absolute Accuracy Curve

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Figure 4. Typical Error Curve

Timing Diagram

Figure 5.

The successive approximation register (SAR) performs 8 iterations to approximate the input voltage. For any

SAR type converter, n-iterations are required for an n-bit converter. Figure 2 shows a typical example of a 3-bit

converter. In the ADC0816,ADC0817, the approximation technique is extended to 8 bits using the 256Rnetwork.

The A/D converter's successive approximation register (SAR)is reset on the positive edge of the start conversion

(SC) pulse. The conversion is begun on the falling edge of the start conversion pulse. A conversion in process

will be interrupted by receipt of a new start conversion pulse. Continuous conversion may be accomplished by

tying the end-of-conversion(EOC) output to the SC input. If used in this mode, an external start conversion pulse

should be applied after power up. End-of-conversion will go low between 0 and 8 clock pulses after the rising

edge of start conversion.

The most important section of the A/D converter is the comparator. It is this section which is responsible for the

ultimate accuracy of the entire converter. It is also the comparator drift which has the greatest influence on the

repeatability of the device. A chopper-stabilized comparator provides the most effective method of satisfying all

the converter requirements.

The chopper-stabilized comparator converts the DC input signal into an AC signal. This signal is then fed through

a high gain AC amplifier and has the DC level restored. This technique limits the drift component of the amplifier

since the drift is a DC component which is not passed by the AC amplifier. This makes the entire A/D converter

extremely insensitive to temperature, long term drift and input offset errors.

Figure 4 shows a typical error curve for the ADC0816 as measured using the procedures outlined in AN-179.

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Typical Performance Characteristics

Figure 6. Comparator IIN vs. VIN Figure 7. Multiplexer RON vs. VIN

(VCC = VREF = 5V) (VCC = VREF = 5V)

spacer TRI-STATE Test Circuits and Timing Diagrams

Figure 8.

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APPLICATION INFORMATION

OPERATION

Ratiometric Conversion

The ADC0816, ADC0817 is designed as a complete Data Acquisition System (DAS) for ratiometric conversion

systems. In ratiometric systems, the physical variable being measured is expressed as a percentage of full-scale

which is not necessarily related to an absolute standard. The voltage input to the ADC0816 is expressed by the

equation

(1)

Where:

VIN = Input voltage into the ADC0816

Vfs = Full-scale voltage

VZ= Zero voltage

DX= Data point being measured

DMAX = Maximum data limit

DMIN = Minimum data limit

A good example of a ratiometric transducer is a potentiometer used as a position sensor. The position of the

wiper is directly proportional to the output voltage which is a ratio of the full-scale voltage across it. Since the

data is represented as a proportion of full-scale, reference requirements are greatly reduced, eliminating a large

source of error and cost for many applications. A major advantage of the ADC0816, ADC0817 is that the input

voltage range is equal to the supply range so the transducers can be connected directly across the supply and

their outputs connected directly into the multiplexer inputs, (Figure 9).

Ratiometric transducers such as potentiometers, strain gauges, thermistor bridges, pressure transducers, etc.,

are suitable for measuring proportional relationships; however, many types of measurements must be referred to

an absolute standard such as voltage or current. This means a system reference must be used which relates the

full-scale voltage to the standard volt. For example, if VCC = VREF = 5.12V, then the full-scale range is divided into

256 standard steps. The smallest standard step is 1 LSB which is then 20 mV.

Resistor Ladder Limitations

The voltages from the resistor ladder are compared to the selected input 8 times in a conversion. These voltages

are coupled to the comparator via an analog switch tree which is referenced to the supply. The voltages at the

top, center and bottom of the ladder must be controlled to maintain proper operation.

The top of the ladder, Ref(+), should not be more positive than the supply, and the bottom of the ladder, Ref(−),

should not be more negative than ground. The center of the ladder voltage must also be near the center of the

supply because the analog switch tree changes from N-channel switches to P-channel switches. These

limitations are automatically satisfied in ratiometric systems and can be easily met in ground referenced systems.

Figure 10 shows a ground referenced system with a separate supply and reference. In this system, the supply

must be trimmed to match the reference voltage. For instance, if a5.12V reference is used, the supply should be

adjusted to the same voltage within 0.1V.

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Figure 9. Ratiometric Conversion System

The ADC0816 needs less than a milliamp of supply current so developing the supply from the reference is

readily accomplished. In Figure 11 a ground references system is shown which generates the supply from the

reference. The buffer shown can be an op amp of sufficient drive to supply the milliamp of supply current and the

desired bus drive, or if a capacitive bus is driven by the outputs a large capacitor will supply the transient supply

current as seen in Figure 12. The LM301 is overcompensated to insure stability when loaded by the 10 μF output

capacitor.

The top and bottom ladder voltages cannot exceed VCCand ground, respectively, but they can be symmetrically

less than VCC and greater than ground. The center of the ladder voltage should always be near the center of the

supply. The sensitivity of the converter can be increased, (i.e., size of the LSB steps decreased) by using a

symmetrical reference system. In Figure 13, a2.5V reference is symmetrically centered about VCC/2 since the

same current flows in identical resistors. This system with a 2.5V reference allows the LSB to be half the size of

the LSB in a 5V reference system.

Figure 10. Ground Referenced Conversion System Using Trimmed Supply

Figure 11. Ground Referenced Conversion System with Reference Generating VCC Supply

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Figure 12. Typical Reference and Supply Circuit

Figure 13. Symmetrically Centered Reference

Converter Equations

The transition between adjacent codes N and N + 1 is given by:

(2)

The center of an output code N is given by:

(3)

The output code N for an arbitrary input are the integers within the range:

(4)

where: VIN = Voltage at comparator input

VREF = Voltage at Ref(+)

VREF = Voltage at Ref(−)

VTUE = Total unadjusted error voltage(typically

VREF(+) ÷512)

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Analog Comparator Inputs

The dynamic comparator input current is caused by the periodic switching of on-chip stray capacitances These

are connected alternately to the output of the resistor ladder/switch tree network and to the comparator input as

part of the operation of the chopper stabilized comparator.

The average value of the comparator input current varies directly with clock frequency and with VIN as shown in

Figure 6.

If no filter capacitors are used at the analog or comparator inputs and the signal source impedances are low, the

comparator input current should not introduce converter errors, as the transient created by the capacitance

discharge will die out before the comparator output is strobed.

If input filter capacitors are desired for noise reduction and signal conditioning they will tend to average out the

dynamic comparator input current. It will then take on the characteristics of a DC bias current whose effect can

be predicted conventionally. See AN-258 for further discussion.

Typical Application

*Address latches needed for 8085 and SC/MP interfacing theADC0816, 17 to a microprocessor

Microprocessor Interface Table

PROCESSOR READ WRITE INTERRUPT(COMMENT)

8080 MEMR MEMW INTR (Thru RST Circuit)

8085 RD WR INTR (Thru RST Circuit)

Z-80 RD WR INT (Thru RST Circuit, Mode 0)

SC/MP NRDS NWDS SA (Thru Sense A)

6800 VMA•φ2•R/W VMA•Q2•R/W IRQA or IRQB (Thru PIA)

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REVISION HISTORY

Changes from Revision B (March 2013) to Revision C Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 13

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PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

ADC0816CCN NRND PDIP NFJ 40 9 TBD Call TI Call TI -40 to 85 ADC0816CCN

ADC0816CCN/NOPB ACTIVE PDIP NFJ 40 9 Green (RoHS

& no Sb/Br) SN Level-1-NA-UNLIM -40 to 85 ADC0816CCN

ADC0817CCN NRND PDIP NFJ 40 9 TBD Call TI Call TI -40 to 85 ADC0817CCN

ADC0817CCN/NOPB ACTIVE PDIP NFJ 40 9 Green (RoHS

& no Sb/Br) SN Level-1-NA-UNLIM -40 to 85 ADC0817CCN

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

PACKAGE OPTION ADDENDUM

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Addendum-Page 2

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

MECHANICAL DATA

N0040A

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N40A (Rev E)

NFJ0040A

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military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications

Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive

Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications

Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers

DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps

DSP dsp.ti.com Energy and Lighting www.ti.com/energy

Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial

Interface interface.ti.com Medical www.ti.com/medical

Logic logic.ti.com Security www.ti.com/security

Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com

Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265