TOSHIBA TC203 Series CMOS ASIC Family 0.4m, Mixed 3.3/5.0V I/O The TC203 series is a high speed, high density 0.4m CMOS Family of ASICs for mixed 3/5V operation. Benefits Features - True, no compromise, mixed 3/5V operation - Achieved by technology, not by circuit compromise - Inexpensive extra technology step - No restrictions in 3V or 5V I/O buffer placement - True 3.3V, 0.4m CMOS technology - Process optimized for 3.3V operation - No external components required - Full performance core with full 3.3V and 5V drive I/O - Typical loaded gate delay = 230ps - 690K usable gates - Low power - 20% less than 0.5m ASICs - Advanced packaging - HQFP, BGA - High density pad option for pad limited designs * 62m inner lead TAB - New accurate delay model with commercial sign-off - A Toshiba System ASIC product - Macrocell libray contains both normal and low power basic macrocells ie: Cell Type Delay Power Low-power type* 290ps* 2.80W/MHz/gate Normal type 190ps* 3.55W/MHz/gate * 2-input NAND, fanout=2 plus typical interconnect load - Multilevel 5V/3V I/O buffers - Over 450 I/O cells including high drive (upto 24mA), slew rate control, and high speed output buffers - Compiled cells including asynchronous and synchronous RAM, single and dual port RAM and ROM - Hard macrocells including those for PCI bus interface are available. Some fast multipliers, adders, ALUs, UARTs timers and special I/O cells are in development. - Supports R3900 MIPS processor core ASIC Methodologies Support - Gate array: 14 master sizes - Embedded array and Standard cell: 30 master sizes Gate Array Master Lineup Usable Gates I/O Pads Reference Double Layer Metal Triple Layer Metal Wirebond Pads TAB 62m TAB 83m TC203G02/52 11K 20K 80 152 N/A TC203G04/54 20K 35K 104 200 N/A TC203G06.56 29K 50K 128 248 N/A TC203G08/58 37K 64K 144 288 N/A TC203G10/60 44K 77K 160 316 N/A TC203G12/62 54K 94K 176 348 N/A TC203G14/64 64K 112K 192 380 N/A TC203G16/66 78K 137K 208 420 N/A TC203G20/70 95K 165K 240 - N/A TC203G24/74 122K 211K 272 - N/A TC203G32/82 171K 300K 336 - N/A TC203G36/86 224K 390K 384 - N/A TC203G40/90 284K 494K 432 - N/A TC203G42/92 398K 694K 512 - N/A Note: DLM=Double Layer Metal, TLM=Triple Layer Metal Preliminary TOSHIBA AMERICA ELECTRONIC COMPONENTS, INC. 1 Applications - PC chipsets - PC graphics - Telecommunications - Notebooks/PDA - Multimedia (ie: Set Top Boxes) - 5V migrating to 3V memory - High gate count - therefore high power - 5V designs using 3V core for performance and power saving - Laser printers Accurate Models TC203 incorporates the new Toshiba highly accurate delay model which includes the following new features: - Pin to pin type - State Dependent Delay - Table Look Up Delay - Input Slew - Non-Linear Equation Verilog Sign-off TC203 is supported by Toshiba's Verilog Sign-off. This leads to the following benefits: - Sign-off convenience at designer's site - Shorter design cycle time - Higher design efficiency - Highly accurate simulation model - Faster time-to-market Design Kit Support The Toshiba Design Environment provides support for a wide range of EDA tools. Megacells TC203 supports a wide rande of megacells including the 3V, 5V and Universal PCI buffers and Analog Phase Lock Loops. Toshiba 0.4m ASIC family The Toshiba 0.4 ASIC family consists of the TC200 series for pure 3V applications and the TC203 series for mixed 3/5V applications. They both use a 0.36 drawn gate lengths and are available as Gate array, Embedded array and Standard cell (TC200G, TC200E, TC200C and TC203G, TC203E,TC203C). Technology Resource Centers provide technical support and design expertise Toshiba ASIC Technology Resource Centers are located throughout the U.S. and provide a high level of technical expertise for support before and during a customer ASIC design. This includes support issues dealing with EDA environments, design kits, design methodologies, packaging, technologies, and ASIC design implementation. They are also available for design consultation. The Technology Resource Centers also provide advanced application and development engineering support. They are supported by a U.S. engineering organization based in the Toshiba Semiconductor Engineering Center in San Jose, California. High quality, high volume manufacturing capability Toshiba's ASIC manufacturing plants are among the largest and most advanced in the world. They are all certified to ISO9000. Rigorous production quality control and monitoring coupled with a sophisticated batch tracking system provides Toshiba with the ability to meet the requirements of fast ramping, high volume markets. Toshiba's advanced ASIC prototype manufacturing facility located in Sunnyvale, CA offers the fastest turnaround ASIC prototypes in the industry. DFT Support DFT support is offered from Toshiba for full scan, partial scan, boundary scan and built-in self test (BIST). TOSHIBA MAS-3152/7-95 TAEC REGIONAL SALES OFFICES SOUTHWEST Irvine, CA TEL: (714) 453-0224 FAX: (714) 453-0125 NORTHWEST Portland, OR TEL: (503) 629-0818 FAX: (503) 629-0827 San Jose, CA TEL: (408) 456-8900 FAX: (408) 456-8910 CENTRAL Dallas, TX TEL: (214) 480-0470 FAX: (214) 235-4114 Chicago, IL TEL: (708) 945-1500 FAX: (708) 945-1044 NORTHEAST Edison, NJ TEL: (908) 248-8070 FAX: (908) 248-8030 Boston, MA TEL: (617) 224-0074 FAX: (617) 224-1096 SOUTHEAST Atlanta, GA TEL: (404) 368-0203 FAX: (404) 368-0075 1995 Toshiba America Electronic Components, Inc. Toshiba products described in this document are not authorized for use as critical components in life support systems without the written consent of the appropriate officer of Toshiba America, Inc. Life support systems are either systems intended for surgical implant in the body or systems which sustain life. A critical component is any component of a life support system whose failure to perform may cause a malfunction or failure of the life support system, or may affect its safety or effectiveness. Specifications and information herein are subject to change without notice. This technical data may be controlled under U.S. Export Administration Regulations and may be subject to the approval of the U.S. Department of Commerce prior to export. Any export or re-export, directly or indirectly, in contravention of the U.S. Export Administration Regulations is strictly prohibited. Brand names and product names mentioned herein may be trademarks or registered trademarks of their respective companies.