No.
Item Performance Test method
1 Temperature rise Temperature rise shall not exceed 75℃. Apply rated current.
2 Current-carrying
capacity Shall not open within 1 hour. Apply rated current.
3 Clearing characteristics
Arc shall not be continued.
Marking shall be legible. Breaking voltage:24 V
Breaking current:50 A
4 Voltage drop Voltage drop is below the value specified in CATALOG
NUMBERS AND RATING. Apply rated current.
5 Fusing characteristics Fusing within 1 min. Apply 200% of rated current.
(Ambient temperature:10–30°C
6 Insulation resistance 1000 MΩ or more Insulation resistance between terminals and case
(alumina ceramic)
7 Electrode strength
(Bending) No mechanical damage.
Resistance change after the test shall be within ± 20%.
Board supporting width:90 mm
Bending speed:Approx. 0.5 mm/sec.
Duration:30 sec.
Bending:3 mm
8 Shear test No mechanical damage.
Resistance change after the test shall be within ± 20%.
Applied force:10 N (1.02 kgf)
Duration:10 sec.
Tool:R0.5
Direction of the press:side face
9 Substrate bending test No mechanical damage.
Resistance change after the test shall be within ± 20%.
Supporting dimension:0.5 mm
Applied force:5 N (0.51 kgf)
Tool:R0.5
Direction of the press:thickness direction of product.
10
Solderability
(Solder Wetting time) Solder Wetting time : within 3sec.
Solder : Sn–3Ag–0.5Cu
Temperature : 245 ± 3°C
meniscograph method
Solder : JISZ3282 H60A, H60S, H63A
Temperature : 230 ± 2°C
meniscograph method
11
Solderability
(new uniform coating of
solder)
The dipped surface of the terminals shall be covered
more than 95% with new solder.
Solder : Sn–3Ag–0.5Cu
Temperature : 245 ± 3°C
Dipping : 3 sec.
Solder : JISZ3282 H60A, H60S, H63A
Temperature : 230 ± 2°C
Dipping : 3 sec.
12
Resistance to soldering
heat
Marking shall be legible.
No mechanical damage.
Resistance change after the test shall be within ± 20%.
Dipping (1 cycle)
Preconditioning:100 to 150°C, 60 sec.
Temperature:265 ± 3°C /6–7 sec.
Reflow soldering (2 cycles)
Preconditioning:1–2 min, 180°C or less
Peak:250 ± 5°C, 5 sec.
Holding:230–250°C, 30–40 sec.
Cooling:more than 2 min.
Manual soldering
Temperature:350 ± 10°C
Duration:3–4 sec.
Measure after 1 hour left under room temp. and humidity.
13
Solvent resistance Marking shall be legible.
No mechanical damage.
Resistance change after the test shall be within ± 20%.
Dipping rinse
Solvent:Isopropyl alcohol
Duration:90 sec.
14
Ultrasonic Cleaning Marking shall be legible.
No mechanical damage.
Resistance change after the test shall be within ± 20%.
Ultrasonic : 20mW/cm
28kHz
Solvent:Isopropyl alcohol
Duration:60 sec.
15
Vibration No mechanical damage.
Resistance change after the test shall be within ± 20%.
Frequency range:10–55–10 Hz/min
Vibration amplitude:1.5 mm
Duration:2 hours in each of XYZ directions
(total:6 hours)
16
Shock No mechanical damage.
Resistance change after the test shall be within ± 20%.
Peak value:490 m/s
(50 G)
Duration:11 m sec.
6 aspects
3 times (total:18 times)
17
Thermal shock No mechanical damage.
Resistance change after the test shall be within ± 20%.
–55 ± 3°C : 30 min.
Room temperature:2–3 min or less 125 ± 2°C 30 min
Room temperature:2–3 min or less Repeat above step for
10 cycles.
18
Atomizing salt water No mechanical damage.
Resistance change after the test shall be within ± 20%.
Temperature : 35 ± 2°C
Concentration (weight ratio) : 5 ± 1%
Duration : 24 hours
19
Moisture resistance No mechanical damage.
Resistance change after the test shall be within ± 20%.
Temperature:85 ± 3°C
Humidity:85 ± 5% RH
Duration:1000 hours
20
Load life No mechanical damage.
Resistance change after the test shall be within ± 20%.
Temperature:85 ± 2°C
Applied current:Rated current ✕ 70%
Duration:1000 hours
21
Stability No mechanical damage.
Resistance change after the test shall be within ± 20%. Temperature:125 ± 2°C
Duration:1000 hours
22
Accelerated damp heat
steady state No mechanical damage.
Resistance change after the test shall be within ± 20%.
Temperature:85 ± 3°C
Humidity:85 ± 5% RH
Applied current : Rated current ✕ 70%
Duration:1000 hours