Motion-SPM FSBB20CH60CL TM Smart Power Module Features General Description * UL Certified No.E209204(SPM27-CB package) It is an advanced motion-smart power module (Motion-SPMTM) that Fairchild has newly developed and designed to provide very compact and high performance ac motor drives mainly targeting low-power inverter-driven application like air conditioner and washing machine. It combines optimized circuit protection and drive matched to low-loss IGBTs. System reliability is further enhanced by the integrated under-voltage lock-out and short-circuit protection. The high speed built-in HVIC provides opto-coupler-less single-supply IGBT gate driving capability that further reduce the overall size of the inverter system design. Each phase current of inverter can be monitored separately due to the divided negative dc terminals. * Very low thermal resistance due to using DBC * Easy PCB layout due to built in bootstrap diode * 600V-20A 3-phase IGBT inverter bridge including control ICs for gate driving and protection * Divided negative dc-link terminals for inverter current sensing applications * Single-grounded power supply due to built-in HVIC * Isolation rating of 2500Vrms/min. Applications * AC 100V ~ 253V three-phase inverter drive for small power ac motor drives * Home appliances applications like air conditioner and washing machine Top View Bottom View 44mm 26.8mm Figure 1. (c)2008 Fairchild Semiconductor Corporation FSBB20CH60CL Rev. D 1 www.fairchildsemi.com FSBB20CH60CL Smart Power Module August 2009 FSBB20CH60CL Smart Power Module Integrated Power Functions * 600V-20A IGBT inverter for three-phase DC/AC power conversion (Please refer to Figure 3) Integrated Drive, Protection and System Control Functions * For inverter high-side IGBTs: Gate drive circuit, High voltage isolated high-speed level shifting Control circuit under-voltage (UV) protection Note) Available bootstrap circuit example is given in Figures 12 and 13. * For inverter low-side IGBTs: Gate drive circuit, Short circuit protection (SC) Control supply circuit under-voltage (UV) protection * Fault signaling: Corresponding to UV (Low-side supply) and SC faults * Input interface: 3.3/5V CMOS/LSTTL compatible, Schmitt trigger input Pin Configuration Top View Figure 2. 2 FSBB20CH60CL Rev. D www.fairchildsemi.com FSBB20CH60CL Smart Power Module Pin Descriptions Pin Number Pin Name Pin Description 1 VCC(L) Low-side Common Bias Voltage for IC and IGBTs Driving 2 COM Common Supply Ground 3 IN(UL) Signal Input for Low-side U Phase 4 IN(VL) Signal Input for Low-side V Phase 5 IN(WL) Signal Input for Low-side W Phase 6 VFO 7 CFOD Fault Output Capacitor for Fault Output Duration Time Selection 8 CSC Capacitor (Low-pass Filter) for Short-Current Detection Input 9 IN(UH) Signal Input for High-side U Phase 10 VCC(H) High-side Common Bias Voltage for IC and IGBTs Driving 11 VB(U) High-side Bias Voltage for U Phase IGBT Driving 12 VS(U) High-side Bias Voltage Ground for U Phase IGBT Driving 13 IN(VH) Signal Input for High-side V Phase 14 VCC(H) High-side Common Bias Voltage for IC and IGBTs Driving 15 VB(V) High-side Bias Voltage for V Phase IGBT Driving 16 VS(V) High-side Bias Voltage Ground for V Phase IGBT Driving 17 IN(WH) Signal Input for High-side W Phase 18 VCC(H) High-side Common Bias Voltage for IC and IGBTs Driving 19 VB(W) High-side Bias Voltage for W Phase IGBT Driving 20 VS(W) High-side Bias Voltage Ground for W Phase IGBT Driving 21 NU Negative DC-Link Input for U Phase 22 NV Negative DC-Link Input for V Phase 23 NW Negative DC-Link Input for W Phase 24 U Output for U Phase 25 V Output for V Phase 26 W Output for W Phase 27 P Positive DC-Link Input 3 FSBB20CH60CL Rev. D www.fairchildsemi.com FSBB20CH60CL Smart Power Module Internal Equivalent Circuit and Input/Output Pins (19) VB(W) (18) VCC(H) (17) IN(WH) (20) VS(W) (15) VB(V) (14) VCC(H) (13) IN(VH) (16) VS(V) (11) VB(U) (10) VCC(H) (9) IN(UH) (12) VS(U) (8) CSC (7) CFOD (6) VFO (5) IN(WL) (4) IN(VL) (3) IN(UL) P (27) VB VCC COM IN OUT VS W (26) VB VCC COM IN OUT VS V (25) VB VCC COM IN OUT VS U (24) C(SC) OUT(WL) C(FOD) NW (23) VFO IN(WL) OUT(VL) IN(VL) NV (22) IN(UL) (2) COM COM (1) VCC(L) VCC OUT(UL) VSL NU (21) Note: 1. Inverter low-side is composed of three IGBTs, freewheeling diodes for each IGBT and one control IC. It has gate drive and protection functions. 2. Inverter power side is composed of four inverter dc-link input terminals and three inverter output terminals. 3. Inverter high-side is composed of three IGBTs, freewheeling diodes and three drive ICs for each IGBT. Figure 3. 4 FSBB20CH60CL Rev. D www.fairchildsemi.com Unless Otherwise Specified) Inverter Part Symbol VPN VPN(Surge) VCES Parameter Conditions Rating Units Supply Voltage Applied between P- NU, NV, NW 450 V Supply Voltage (Surge) Applied between P- NU, NV, NW 500 V 600 V Collector-emitter Voltage IC Each IGBT Collector Current TC = 25C 20 A ICP Each IGBT Collector Current (Peak) TC = 25C, Under 1ms Pulse Width 40 A PC Collector Dissipation TC = 25C per One Chip TJ Operating Junction Temperature (Note 1) 62 W -40 ~ 150 C Rating Units Note: 1. The maximum junction temperature rating of the power chips integrated within the SPM is 150C(@TC 125C). Control Part Symbol Parameter Conditions VCC Control Supply Voltage Applied between VCC(H), VCC(L) - COM 20 V VBS High-side Control Bias Voltage Applied between VB(U) - VS(U), VB(V) - VS(V), VB(W) - VS(W) 20 V VIN Input Signal Voltage Applied between IN(UH), IN(VH), IN(WH), IN(UL), IN(VL), IN(WL) - COM -0.3~17 V VFO Fault Output Supply Voltage Applied between VFO - COM IFO Fault Output Current Sink Current at VFO Pin VSC Current Sensing Input Voltage Applied between CSC - COM -0.3~VCC+0.3 V 5 mA -0.3~VCC+0.3 V Rating Units 600 V 0.5 A 2 A -40 ~ 150 C Rating Units 400 V -40 ~ 125 C Bootstrap Diode Part Symbol VRRM Parameter Conditions Maximum Repetitive Reverse Voltage IF Forward Current TC = 25C IFP Forward Current (Peak) TC = 25C, Under 1ms Pulse Width TJ Operating Junction Temperature Total System Symbol VPN(PROT) TC Parameter Conditions Self Protection Supply Voltage Limit (Short Circuit Protection Capability) VCC = VBS = 13.5 ~ 16.5V TJ = 150C, Non-repetitive, less than 2s Module Case Operation Temperature -40C TJ 150C, See Figure 2 TSTG Storage Temperature VISO Isolation Voltage 60Hz, Sinusoidal, AC 1 minute, Connection Pins to heat sink plate -40 ~ 150 C 2500 Vrms Thermal Resistance Symbol Rth(j-c)Q Rth(j-c)F Parameter Junction to Case Thermal Resistance Conditions Min. Typ. Max. Units Inverter IGBT part (per 1/6 module) - - 2.0 C/W Inverter FWD part (per 1/6 module) - - 3.0 C/W Note: 2. For the measurement point of case temperature(TC), please refer to Figure 2. 5 FSBB20CH60CL Rev. D www.fairchildsemi.com FSBB20CH60CL Smart Power Module Absolute Maximum Ratings (TJ = 25C, Inverter Part Symbol Parameter Min. Typ. Max. Units VCE(SAT) Collector-Emitter Saturation Voltage VCC = VBS = 15V VIN = 5V IC = 20A, TJ = 25C - - 2.0 V FWD Forward Voltage VIN = 0V IF = 20A, TJ = 25C - - 2.2 V Switching Times VPN = 300V, VCC = VBS = 15V IC = 20A VIN = 0V 5V, Inductive Load (Note 3) - 0.75 - s - 0.2 - s - 0.45 - s - 0.15 - s - 0.1 - s - 0.5 - s - 0.3 - s - 0.45 - s tC(OFF) - 0.15 - s trr - 0.1 - s - - 1 mA VF HS tON tC(ON) tOFF Conditions tC(OFF) trr LS tON VPN = 300V, VCC = VBS = 15V IC = 20A VIN = 0V 5V, Inductive Load (Note 3) tC(ON) tOFF ICES Collector-Emitter Leakage Current VCE = VCES Note: 3. tON and tOFF include the propagation delay time of the internal drive IC. tC(ON) and tC(OFF) are the switching time of IGBT itself under the given gate driving condition internally. For the detailed information, please see Figure 4. Control Part Symbol IQCCL Parameter Quiescent VCC Supply Current IQCCH Conditions Min. Typ. Max. Units VCC = 15V IN(UL, VL, WL) = 0V VCC(L) - COM - - 23 mA VCC = 15V IN(UH, VH, WH) = 0V VCC(H) - COM - - 600 A VB(U) - VS(U), VB(V) -VS(V), VB(W) - VS(W) - - 500 A IQBS Quiescent VBS Supply Current VBS = 15V IN(UH, VH, WH) = 0V VFOH Fault Output Voltage VSC = 0V, VFO Circuit: 4.7k to 5V Pull-up 4.5 - - V VSC = 1V, VFO Circuit: 4.7k to 5V Pull-up - - 0.8 V VFOL VSC(ref) Short Circuit Trip Level VCC = 15V (Note 4) 0.45 0.5 0.55 V UVCCD Supply Circuit UnderVoltage Protection Detection Level 10.7 11.9 13.0 V Reset Level 11.2 12.4 13.4 V 10 11 12 V UVCCR UVBSD Detection Level UVBSR Reset Level 10.5 11.5 12.5 V tFOD Fault-out Pulse Width CFOD = 33nF (Note 5) 1.0 1.8 - ms VIN(ON) ON Threshold Voltage - - V OFF Threshold Voltage Applied between IN(UH), IN(VH), IN(WH), IN(UL), IN(VL), IN(WL) - COM 2.8 VIN(OFF) - - 0.8 V Note: 4. Short-circuit current protection is functioning only at the low-sides. 5. The fault-out pulse width tFOD depends on the capacitance value of CFOD according to the following approximate equation : CFOD = 18.3 x 10-6 x tFOD[F] 6 FSBB20CH60CL Rev. D www.fairchildsemi.com FSBB20CH60CL Smart Power Module Electrical Characteristics (TJ = 25C, Unless Otherwise Specified) FSBB20CH60CL Smart Power Module 100% I C 100% I C trr V CE IC IC V CE V IN V IN 0 tON tOFF tC(ON) V IN(ON) tC(OFF) V IN(OFF) 10% IC 90% I C 10% V CE 10% V CE 10% I C (b) turn-off (a) turn-on Figure 4. Switching Time Definition Switching Loss (Typical) SWITCHING LOSS(ON) VS. COLLECTOR CURRENT SWITCHING LOSS(OFF) VS. COLLECTOR CURRENT 700 VCE=300V 1000 V =15V CC 900 VIN=5V TJ=25 800 TJ=150 SWITCHING LOSS, ESW(OFF) [uJ] SWITCHING LOSS, ESW(ON) [uJ] 1100 700 600 500 400 300 200 VCE=300V VCC=15V 600 VIN=5V TJ=25 500 TJ=150 400 300 200 100 100 0 0 0 2 4 6 8 10 12 14 16 18 20 0 22 2 4 6 8 10 12 14 16 18 20 22 COLLECTOR CURRENT, Ic [AMPERES] COLLECTOR CURRENT, Ic [AMPERES] Figure 5. Switching Loss Characteristics 7 FSBB20CH60CL Rev. D www.fairchildsemi.com Symbol Parameter Conditions Min. Typ. Max. Units VF Forward Voltage IF = 0.1A, TC = 25C - 2.5 - V trr Reverse Recovery Time IF = 0.1A, TC = 25C - 80 - ns Built in Bootstrap Diode VF-IF Characteristic 1.0 0.9 0.8 0.7 IF [A] 0.6 0.5 0.4 0.3 0.2 0.1 TC=25 0.0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 VF [V] Note: 6. Built in bootstrap diode includes around 15 resistance characteristic. Figure 6. Built in Bootstrap Diode Characteristics Recommended Operating Conditions Symbol Parameter Conditions Value Min. Typ. Max. Units VPN Supply Voltage Applied between P - NU, NV, NW - 300 400 V VCC Control Supply Voltage Applied between VCC(H), VCC(L)- COM 13.5 15 16.5 V VBS High-side Bias Voltage Applied between VB(U) - VS(U), VB(V) - VS(V), VB(W) - VS(W) 13.0 15 18.5 V dVCC/dt, dVBS/dt Control supply variation -1 - 1 V/s tdead Blanking Time for Preventing For Each Input Signal Arm-short 2.0 - - s fPWM PWM Input Signal -40C TC 125C, -40C TJ 150C - - 20 kHz VSEN Voltage for Current Sensing Applied between NU, NV, NW - COM (Including surge voltage) -4 4 V 8 FSBB20CH60CL Rev. D www.fairchildsemi.com FSBB20CH60CL Smart Power Module Bootstrap Diode Part Parameter Mounting Torque Limits Conditions Mounting Screw: - M3 Device Flatness Units Min. Typ. Max. 0.51 0.62 0.80 N*m 0 - +120 m - 15.00 - g Recommended 0.62N*m Note Figure 5 Weight (+) (+) Figure 7. Flatness Measurement Position Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FSBB20CH60C FSBB20CH60C SPM27-CC - - 10 9 FSBB20CH60CL Rev. D www.fairchildsemi.com FSBB20CH60CL Smart Power Module Mechanical Characteristics and Ratings FSBB20CH60CL Smart Power Module Time Charts of SPMs Protective Function Input Signal Protection Circuit State RESET SET RESET UVCCR a1 Control Supply Voltage a6 UVCCD a3 a2 a7 a4 Output Current a5 Fault Output Signal a1 : Control supply voltage rises: After the voltage rises UVCCR, the circuits start to operate when next input is applied. a2 : Normal operation: IGBT ON and carrying current. a3 : Under voltage detection (UVCCD). a4 : IGBT OFF in spite of control input condition. a5 : Fault output operation starts. a6 : Under voltage reset (UVCCR). a7 : Normal operation: IGBT ON and carrying current. Figure 8. Under-Voltage Protection (Low-side) Input Signal Protection Circuit State RESET SET RESET UVBSR Control Supply Voltage b5 b1 UVBSD b3 b6 b2 b4 Output Current High-level (no fault output) Fault Output Signal b1 : Control supply voltage rises: After the voltage reaches UVBSR, the circuits start to operate when next input is applied. b2 : Normal operation: IGBT ON and carrying current. b3 : Under voltage detection (UVBSD). b4 : IGBT OFF in spite of control input condition, but there is no fault output signal. b5 : Under voltage reset (UVBSR) b6 : Normal operation: IGBT ON and carrying current Figure 9. Under-Voltage Protection (High-side) 10 FSBB20CH60CL Rev. D www.fairchildsemi.com c6 Protection circuit state SET Internal IGBT Gate-Emitter Voltage FSBB20CH60CL Smart Power Module Lower arms control input c7 RESET c4 c3 c2 SC c1 c8 Output Current SC Reference Voltage Sensing Voltage of the shunt resistance Fault Output Signal c5 CR circuit time constant delay (with the external shunt resistance and CR connection) c1 : Normal operation: IGBT ON and carrying current. c2 : Short circuit current detection (SC trigger). c3 : Hard IGBT gate interrupt. c4 : IGBT turns OFF. c5 : Fault output timer operation starts: The pulse width of the fault output signal is set by the external capacitor CFO. c6 : Input "L" : IGBT OFF state. c7 : Input "H": IGBT ON state, but during the active period of fault output the IGBT doesn't turn ON. c8 : IGBT OFF state Figure 10. Short-Circuit Current Protection (Low-side Operation only) 11 FSBB20CH60CL Rev. D www.fairchildsemi.com FSBB20CH60CL Smart Power Module 5V-Line SPM RPF=4.7 100 IN(UH) , IN(VH) , IN(WH) 100 CPU IN (UL) , IN (VL) , IN(WL) 100 1nF VFO 1nF CPF= 1nF 1nF COM Note: 1) RC coupling at each input might change depending on the PWM control scheme used in the application and the wiring impedance of the application's printed circuit board. The SPM input signal section integrates 5k (typ.) pull-down resistor. Therefore, when using an external filtering resistor, please pay attention to the signal voltage drop at input terminal. 2) The logic input is compatible with standard CMOS or LSTTL outputs. Figure 11. Recommended CPU I/O Interface Circuit These Values depend on PWM Control Algorithm One-Leg Diagram of SPM P 15V-Line 22uF 0.1uF Vcc VB IN HO COM VS Inverter Output Vcc 1000uF 1uF IN OUT COM VSL N Note: 1) The ceramic capacitor placed between VCC-COM should be over 1uF and mounted as close to the pins of the SPM as possible. Figure 12. Recommended Bootstrap Operation Circuit and Parameters 12 FSBB20CH60CL Rev. D www.fairchildsemi.com (19) V B(W ) (18) V CC(H) RS C BS Gating W H C BSC (17) IN (W H) (20) V S(W ) C PS (15) V B(V) (14) V CC(H) RS C BS Gating VH C BSC VCC OUT COM IN W (26) VS VB VCC OUT COM IN VS V (25) (16) V S(V) C PS C P U (13) IN (VH) P (27) VB (11) V B(U) RS C BS Gating UH C BSC C PS VB (10) V CC(H) VCC (9) IN (UH) COM IN (12) V S(U) M C DCS OUT VS Vdc U (24) RF R PF (8) C SC C SC (7) C FOD RS C FOD Fault RS (5) IN (W L) RS (4) IN (VL) RS (3) IN (UL) Gating W L Gating VL Gating UL (6) V FO C(SC) OUT(W L) C(FOD) N W (23) R SW VFO IN(W L) OUT(VL) IN(VL) N V (22) R SV IN(UL) (2) COM C BPF C PS C C PS PS COM C PF (1) V CC(L) C SP15 OUT(UL) VCC V SL N U (21) R SU C SPC15 Input Signal for Short-Circuit Protection R FW W-Phase Current V-Phase Current U-Phase Current R FV R FU C FW C FV C FU Note: 1) To avoid malfunction, the wiring of each input should be as short as possible. (less than 2-3cm) 2) By virtue of integrating an application specific type HVIC inside the SPM, direct coupling to CPU terminals without any opto-coupler or transformer isolation is possible. 3) VFO output is open collector type. This signal line should be pulled up to the positive side of the 5V power supply with approximately 4.7k resistance. Please refer to Figure11. 4) CSP15 of around 7 times larger than bootstrap capacitor CBS is recommended. 5) VFO output pulse width should be determined by connecting an external capacitor(CFOD) between CFOD(pin7) and COM(pin2). (Example : if CFOD = 33 nF, then tFO = 1.8ms (typ.)) Please refer to the note 5 for calculation method. 6) Input signal is High-Active type. There is a 5k resistor inside the IC to pull down each input signal line to GND. RC coupling circuits should be adopted for the prevention of input signal oscillation. RSCPS time constant should be selected in the range 50~150ns. CPS should not be less than 1nF.(Recommended RS=100 , CPS=1nF) 7) To prevent errors of the protection function, the wiring around RF and CSC should be as short as possible. 8) In the short-circuit protection circuit, please select the RFCSC time constant in the range 1.5~2s. 9) Each capacitor should be mounted as close to the pins of the SPM as possible. 10) To prevent surge destruction, the wiring between the smoothing capacitor and the P&GND pins should be as short as possible. The use of a high frequency non-inductive capacitor of around 0.1~0.22F between the P&GND pins is recommended. 11) Relays are used at almost every systems of electrical equipments of home appliances. In these cases, there should be sufficient distance between the CPU and the relays. 12) CSPC15 should be over 1F and mounted as close to the pins of the SPM as possible. Figure 13. Typical Application Circuit 13 FSBB20CH60CL Rev. D www.fairchildsemi.com FSBB20CH60CL Smart Power Module 5V line 15V line FSBB20CH60CL Smart Power Module Detailed Package Outline Drawings 14 FSBB20CH60CL Rev. D www.fairchildsemi.com FSBB20CH60CL Smart Power Module Detailed Package Outline Drawings (Continued) 15 FSBB20CH60CL Rev. D www.fairchildsemi.com FSBB20CH60CL Smart Power Module Detailed Package Outline Drawings (Continued) 16 FSBB20CH60CL Rev. D www.fairchildsemi.com TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. AccuPowerTM Auto-SPMTM Build it NowTM CorePLUSTM CorePOWERTM CROSSVOLTTM CTLTM Current Transfer LogicTM EcoSPARK(R) EfficentMaxTM EZSWITCHTM* TM* (R) Fairchild(R) Fairchild Semiconductor(R) FACT Quiet SeriesTM FACT(R) FAST(R) FastvCoreTM FETBenchTM FlashWriter(R)* FPSTM F-PFSTM FRFET(R) SM Global Power Resource Green FPSTM Green FPSTM e-SeriesTM GmaxTM GTOTM IntelliMAXTM ISOPLANARTM MegaBuckTM MICROCOUPLERTM MicroFETTM MicroPakTM MillerDriveTM MotionMaxTM Motion-SPMTM OPTOLOGIC(R) OPTOPLANAR(R) (R) PDP SPMTM Power-SPMTM PowerTrench(R) PowerXSTM Programmable Active DroopTM QFET(R) QSTM Quiet SeriesTM RapidConfigureTM TM Saving our world, 1mW/W/kW at a timeTM SmartMaxTM SMART STARTTM SPM(R) STEALTHTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SupreMOSTM SyncFETTM Sync-LockTM (R) * (R) The Power Franchise TinyBoostTM TinyBuckTM TinyCalcTM TinyLogic(R) TINYOPTOTM TinyPowerTM TinyPWMTM TinyWireTM TriFault DetectTM TRUECURRENTTM* SerDesTM UHC(R) Ultra FRFETTM UniFETTM VCXTM VisualMaxTM XSTM * Trademarks of System General Corporation, used under license by Fairchild Semiconductor. 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Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I41 (c) 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com