LM62
www.ti.com
SNIS105E –JUNE 1999–REVISED MARCH 2013
LM62 2.7V, 15.6 mV/°C SOT-23 Temperature Sensor
Check for Samples: LM62
1FEATURES DESCRIPTION
The LM62 is a precision integrated-circuit
2• Calibrated Linear Scale Factor of +15.6 mV/°C temperature sensor that can sense a 0°C to +90°C
• Rated for Full 0°C to +90°C Range with 3.0V temperature range while operating from a single
Supply +3.0V supply. The LM62's output voltage is linearly
• Suitable for Remote Applications proportional to Celsius (Centigrade) temperature
(+15.6 mV/°C) and has a DC offset of +480 mV. The
offset allows reading temperatures down to 0°C
APPLICATIONS without the need for a negative supply. The nominal
• Cellular Phones output voltage of the LM62 ranges from +480 mV to
• Computers +1884 mV for a 0°C to +90°C temperature range.
The LM62 is calibrated to provide accuracies of
• Power Supply Modules ±2.0°C at room temperature and +2.5°C/−2.0°C over
• Battery Management the full 0°C to +90°C temperature range.
• FAX Machines The LM62's linear output, +480 mV offset, and factory
• Printers calibration simplify external circuitry required in a
• HVAC single supply environment where reading
temperatures down to 0°C is required. Because the
• Disk Drives LM62's quiescent current is less than 130 μA, self-
• Appliances heating is limited to a very low 0.2°C in still air.
Shutdown capability for the LM62 is intrinsic because
KEY SPECIFICATIONS its inherent low power consumption allows it to be
powered directly from the output of many logic gates.
• Accuracy at 25°C ±2.0 or ±3.0°C (max)
• Temperature Slope +15.6 mV/°C
• Power Supply Voltage Range +2.7V to +10V
• Current Drain @ 25°C 130 μA (max)
• Nonlinearity ±0.8°C (max)
• Output Impedance 4.7 kΩ(max)
Typical Application
Connection Diagram
See Package Number DBZ
VO= (+15.6 mV/°C × T°C) + 480 mV
Figure 1. Full-Range Centigrade Temp. Sensor
(0°C to +90°C) Stabilizing a Crystal Oscillator
Temperature (T) Typical VO
+90°C +1884 mV
+70°C +1572 mV
+25°C 870 mV
0°C +480 mV
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1999–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM62
SNIS105E –JUNE 1999–REVISED MARCH 2013
www.ti.com
Absolute Maximum Ratings(1)
Supply Voltage +12V to −0.2V
Output Voltage (+VS+ 0.6V) to −0.6V
Output Current 10 mA
Input Current at any pin(2) 5 mA
Storage Temperature −65°C to +150°C
Junction Temperature, max (TJMAX) +125°C
ESD Susceptibility(3) Human Body Model 2500V
Machine Model 250V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) When the input voltage (VI) at any pin exceeds power supplies (VI< GND or VI> +VS), the current at that pin should be limited to 5 mA.
(3) The human body model is a 100 pF capacitor discharged through a 1.5 kΩresistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
Operating Ratings(1)
Specified Temperature Range TMIN ≤TA≤TMAX
LM62B, LM62C 0°C ≤TA≤+90°C
Supply Voltage Range (+VS) +2.7V to +10V
Thermal Resistance, θJA(2) 450°C/W
Soldering process must comply with Texas Instruments' Reflow Temperature Profile specifications.
Refer to http://www.ti.com/packaging(3)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) The junction to ambient thermal resistance (θJA) is specified without a heat sink in still air.
(3) Reflow temperature profiles are different for lead-free and non-lead-free packages.
2Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM62
LM62
www.ti.com
SNIS105E –JUNE 1999–REVISED MARCH 2013
Electrical Characteristics
Unless otherwise noted, these specifications apply for +VS= +3.0 VDC.Boldface limits apply for TA= TJ= TMIN to TMAX ; all
other limits TA= TJ= 25°C.
Parameter Conditions Typical(1) LM62B LM62C Units
(Limit)
Limits(2) Limits(2)
Accuracy(3) ±2.0 ±3.0 °C (max)
+2.5/−2.0 +4.0/−3.0 °C (max)
Output Voltage at 0°C +480 mV
Nonlinearity(4) ±0.8 ±1.0 °C (max)
Sensor Gain +16.1 +16.3 mV/°C (max)
+16
(Average Slope) +15.1 +14.9 mV/°C (min)
Output Impedance +3.0V ≤+VS≤+10V 4.7 4.7 kΩ(max)
0°C ≤TA≤+75°C, +VS= +2.7V 4.4 4.4 kΩ(max)
Line Regulation(5) +3.0V ≤+VS≤+10V ±1.13 ±1.13 mV/V (max)
+2.7V ≤+VS≤+3.3V, 0°C ≤TA≤+75°C ±9.7 ±9.7 mV (max)
Quiescent Current +2.7V ≤+VS≤+10V 130 130 μA (max)
82 165 165 μA (max)
Change of Quiescent Current +2.7V ≤+VS≤+10V ±5 μA
Temperature Coefficient of 0.2 μA/°C
Quiescent Current
Long Term Stability(6) TJ=TMAX=+100°C, ±0.2 °C
for 1000 hours
(1) Typicals are at TJ= TA= 25°C and represent most likely parametric norm.
(2) Limits are ensured to Texas Instruments' AOQL (Average Outgoing Quality Level).
(3) Accuracy is defined as the error between the output voltage and +15.6 mV/°C times the device's case temperature plus 480 mV, at
specified conditions of voltage, current, and temperature (expressed in °C).
(4) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's
rated temperature range.
(5) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating
effects can be computed by multiplying the internal dissipation by the thermal resistance.
(6) For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature
cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered;
allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after
1000 hours will not continue at the first 1000 hour rate.
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM62
LM62
SNIS105E –JUNE 1999–REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics
To generate these curves the LM62 was mounted to a printed circuit board as shown in Figure 12.
Thermal Resistance
Junction to Air Thermal Time Constant
Figure 2. Figure 3.
Thermal Response
Thermal Response in in Stirred Oil Bath
Still Air with Heat Sink with Heat Sink
Figure 4. Figure 5.
Thermal Response in Still Quiescent Current
Air without a Heat Sink vs. Temperature
Figure 6. Figure 7.
4Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM62
LM62
www.ti.com
SNIS105E –JUNE 1999–REVISED MARCH 2013
Typical Performance Characteristics (continued)
To generate these curves the LM62 was mounted to a printed circuit board as shown in Figure 12.
Accuracy
vs
Temperature Noise Voltage
Figure 8. Figure 9.
Supply Voltage
vs Supply Current Start-Up Response
Figure 10. Figure 11.
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM62
LM62
SNIS105E –JUNE 1999–REVISED MARCH 2013
www.ti.com
CIRCUIT BOARD
½″Square Printed Circuit Board with 2 oz. Copper Foil or Similar.
Figure 12. Printed Circuit Board Used for Heat Sink to Generate All Curves
Mounting
The LM62 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued
or cemented to a surface. The temperature that the LM62 is sensing will be within about +0.2°C of the surface
temperature that LM62's leads are attached to.
This presumes that the ambient air temperature is almost the same as the surface temperature; if the air
temperature were much higher or lower than the surface temperature, the actual temperature measured would
be at an intermediate temperature between the surface temperature and the air temperature.
To ensure good thermal conductivity the backside of the LM62 die is directly attached to the GND pin. The lands
and traces to the LM62 will, of course, be part of the printed circuit board, which is the object whose temperature
is being measured. These printed circuit board lands and traces will not cause the LM62's temperature to deviate
from the desired temperature.
Alternatively, the LM62 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or
screwed into a threaded hole in a tank. As with any IC, the LM62 and accompanying wiring and circuits must be
kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold
temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy
paints or dips are often used to ensure that moisture cannot corrode the LM62 or its connections.
The thermal resistance junction to ambient (θJA) is the parameter used to calculate the rise of a device junction
temperature due to its power dissipation. For the LM62 the equation used to calculate the rise in the die
temperature is as follows:
TJ= TA+θJA [(+VSIQ) + (+VS−VO) IL] (1)
where IQis the quiescent current and ILis the load current on the output. Since the LM62's junction temperature
is the actual temperature being measured care should be taken to minimize the load current that the LM62 is
required to drive.
The table shown in Table 1 summarizes the rise in die temperature of the LM62 without any loading, and the
thermal resistance for different conditions.
Table 1. Temperature Rise of LM62 Due to Self-Heating and Thermal Resistance (θJA)
SOT-23 SOT-23
no heat sink(1) small heat fin(2)
θJA TJ−TAθJA TJ−TA
(°C/W) (°C) (°C/W) (°C)
Still air 450 0.17 260 0.1
Moving air 180 0.07
(1) Part soldered to 30 gauge wire.
(2) Heat sink used is ½″square printed circuit board with 2 oz. foil with part attached as shown in Figure 12 .
6Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM62
LM62
www.ti.com
SNIS105E –JUNE 1999–REVISED MARCH 2013
Capacitive Loads
The LM62 handles capacitive loading well. Without any special precautions, the LM62 can drive any capacitive
load as shown in Figure 13. Over the specified temperature range the LM62 has a maximum output impedance
of 4.7 kΩ. In an extremely noisy environment it may be necessary to add some filtering to minimize noise pickup.
It is recommended that 0.1 μF be added from +VSto GND to bypass the power supply voltage, as shown in
Figure 14. In a noisy environment it may be necessary to add a capacitor from the output to ground. A 1 μF
output capacitor with the 4.7 kΩmaximum output impedance will form a 34 Hz lowpass filter. Since the thermal
time constant of the LM62 is much slower than the 30 ms time constant formed by the RC, the overall response
time of the LM62 will not be significantly affected. For much larger capacitors this additional time lag will increase
the overall response time of the LM62.
Figure 13. LM62 No Decoupling Required for Capacitive Load
Figure 14. LM62 with Filter for Noisy Environment
Figure 15. Simplified Schematic
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LM62
R1
4.1V
R3
R2
0.1 PF
U3LM4040
R4
VOUT
V+
VT
VTemp
+
-U1
LM62V+
U2
(Low = overtemp alarm)
VT1
VT2
VTEMP
VOUT
VT1 =
R1 + R2||R3
(4.1)R2
VT2 =
R2 + R1||R3
(4.1)R2||R3
LM7211
LM62
SNIS105E –JUNE 1999–REVISED MARCH 2013
www.ti.com
Applications Circuits
Figure 16. Centigrade Thermostat
Figure 17. Conserving Power Dissipation with Shutdown
8Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM62
LM62
www.ti.com
SNIS105E –JUNE 1999–REVISED MARCH 2013
REVISION HISTORY
Changes from Revision D (March 2013) to Revision E Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 8
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: LM62
PACKAGE OPTION ADDENDUM
www.ti.com 27-Oct-2016
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM62BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 90 T7B
LM62BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 90 T7B
LM62CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 90 T7C
LM62CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 90 T7C
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com 27-Oct-2016
Addendum-Page 2
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM62BIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM62BIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM62CIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM62CIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Oct-2016
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM62BIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM62BIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM62CIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM62CIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Oct-2016
Pack Materials-Page 2
4203227/C
www.ti.com
PACKAGE OUTLINE
C
TYP
0.20
0.08
0.25
2.64
2.10 1.12 MAX
TYP
0.10
0.01
3X 0.5
0.3
TYP
0.6
0.2
1.9
0.95
TYP-80
A
3.04
2.80
B
1.4
1.2
(0.95)
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
0.2 C A B
1
3
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
3X (1.3)
3X (0.6)
(2.1)
2X (0.95)
(R0.05) TYP
4214838/C 04/2017
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
SCALE:15X
PKG
1
3
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
www.ti.com
EXAMPLE STENCIL DESIGN
(2.1)
2X(0.95)
3X (1.3)
3X (0.6)
(R0.05) TYP
SOT-23 - 1.12 mm max heightDBZ0003A
SMALL OUTLINE TRANSISTOR
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
SYMM
PKG
1
3
2
IMPORTANT NOTICE
Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its
semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers
should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
TI’s published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated
circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and
services.
Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced
documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements
different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the
associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that
include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE
TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,
INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,
DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
