PMV48XP,215 - NEXPERIA

1. Product profile

1.1 General description

P-channel enhancement mode Field-Effect Transistor (FET) in a small

SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package using

Trench MOSFET technology.

1.2 Features and benefits

Logic-level compatible

Trench MOSFET technology

Very fast switching

1.3 Applications

High-side loadswitch

High-speed line driver

Relay driver

Switching circuits

1.4 Quick reference data

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for

drain 6 cm2.

PMV48XP

20 V, 3.5 A P-channel Trench MOSFET

Rev. 1 — 21 December 2010 Product data sheet

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VDS drain-source

voltage Tamb =25°C ---20V

VGS gate-source

voltage -12 - 12 V

IDdrain current VGS =-4.5V; T

amb =25°C [1] ---3.5A

Static characteristics

RDSon drain-source

on-state

resistance

VGS =-4.5V; I

D=-2.4A;

pulsed; tp≤300 µs; δ≤0.01;

Tj=25°C

- 4855mΩ

PMV48XP All information provided in this document is subject to legal disclaimers.

Product data sheet Rev. 1 — 21 December 2010 2 of 15

Nexperia PMV48XP

20 V, 3.5 A P-channel Trench MOSFET

2. Pinning information

3. Ordering information

4. Marking

[1] % = placeholder for manufacturing site code

Table 2. Pinning info rmation

Pin Symbol Description Simplified outline Graphi c sy mbol

1 G gate

SOT23 (TO-236AB)

2Ssource

3 D drain

017aaa094

Table 3. Orderi ng information

Type number Package

Name Description Version

PMV48XP TO-236AB plastic surface-mounted package; 3 leads SOT23

Table 4. Marking codes

Type number Marking code[1]

PMV48XP KN%

PMV48XP All information provided in this document is subject to legal disclaimers.

Product data sheet Rev. 1 — 21 December 2010 3 of 15

Nexperia PMV48XP

20 V, 3.5 A P-channel Trench MOSFET

5. Limiting values

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for drain 6 cm2.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDS drain-source voltage Tamb =25°C - -20 V

VGS gate-source voltage -12 12 V

IDdrain current VGS =-4.5V; T

amb =25°C [1] --3.5A

VGS =-4.5V; T

amb =100°C [1] --2.2A

IDM peak drain current Tamb = 25 °C; single pulse; tp≤10 µs - -14 A

Ptot total power dissipation Tamb =25°C [2] - 510 mW

[1] - 930 mW

Tsp = 25 °C - 4150 mW

Tjjunction temperature - 150 °C

Tamb ambient temperature -55 150 °C

Tstg storage temperature -65 150 °C

Source-drain diode

ISsource current Tamb =25°C [1] --1A

Fig 1. Normalized total power dissipation as a

function of junctio n temp erat u re Fig 2. Norma lized continuous drain cu rrent as a

function of junction temp erat ure

Tj (°C)

−75 17512525 75−25

017aaa123

120

Pder

(%)

Tj (°C)

−75 17512525 75−25

017aaa124

120

Ider

(%)

PMV48XP All information provided in this document is subject to legal disclaimers.

Product data sheet Rev. 1 — 21 December 2010 4 of 15

Nexperia PMV48XP

20 V, 3.5 A P-channel Trench MOSFET

6. Thermal characteristics

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm2.

IDM = single pulse

(1) tp = 100 µs

(2) tp = 1 ms

(3) tp = 10 ms

(4) DC; Tsp = 25 °C

(5) tp = 100 ms

(6) DC; Tamb = 25 °C; drain mounting pad 6 cm2

Fig 3. Safe operating area; junction to ambient; continuous and peak drain currents as a function of drain-source

voltage

017aaa125

−1

−10

−1

−10

(A)

−10

−2

(V)

−10

−1

−10

−10−1

(1)

(2)

(3)

(4)

(5)

Limit R

DSon

= V

(6)

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance

from junction to

ambient

in free air [1] - 213 245 K/W

[2] - 117 135 K/W

Rth(j-sp) thermal resistance

from junction to solder

point

- 2530K/W

PMV48XP All information provided in this document is subject to legal disclaimers.

Product data sheet Rev. 1 — 21 December 2010 5 of 15

Nexperia PMV48XP

20 V, 3.5 A P-channel Trench MOSFET

FR4 PCB, standard footprint

Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

FR4 PCB, mounting pad for drain 6 cm2

Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

017aaa126

(s)

−3

10110

−2

−1

th(j-a)

(K/W)

duty cycle = 1

0.75

0.5 0.33

0.25 0.2

0.1 0.05

0.02

0.01

017aaa127

(s)

−3

10110

−2

−1

th(j-a)

(K/W)

duty cycle = 1

0.75

0.5 0.33

0.25 0.2

0.1 0.05

0.02

0.01

PMV48XP All information provided in this document is subject to legal disclaimers.

Product data sheet Rev. 1 — 21 December 2010 6 of 15

Nexperia PMV48XP

20 V, 3.5 A P-channel Trench MOSFET

7. Characteristics

Table 7. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Static characteristics

V(BR)DSS drain-source

breakdown voltage ID=-250µA; V

GS =0V; T

j=25°C -20--V

VGSth gate-source threshold

voltage ID=-250µA; V

DS =V

GS; Tj= 25 °C -0.75 -1 -1.25 V

IDSS drain leakage current VDS =-20V; V

GS =0V; T

amb =25°C ---1µA

IGSS gate leakage current VGS =-12V; V

DS =0V; T

j= 25 °C - - -100 nA

RDSon drain-source on-state

resistance VGS =-4.5V; I

D= -2.4 A; pulsed;

tp≤300 µs; δ≤0.01 ; Tj=25°C - 4855mΩ

VGS =-4.5V; I

D= -2.4 A; pulsed;

tp≤300 µs; δ≤0.01 ; Tj= 150 °C - 7080mΩ

VGS =-2.5V; I

D= -2 A; pulsed;

tp≤300 µs; δ≤0.01 ; Tj=25°C - 7181mΩ

gfs forward

transconductance VDS =-12V; I

D= - 2 A; pulsed;

tp≤300 µs; δ≤0.01 ; Tj=25°C -12-S

Dynamic character i stics

QG(tot) total gate charge ID=-1A; V

DS =-10V; V

GS =-4.5V;

Tj=25°C -8.511nC

QGS gate-source charge - 1.8 - nC

QGD gate-drain charge - 1.8 - nC

Ciss input capacitance VGS =0V; V

DS = -10 V; f = 1 MHz;

Tj=25°C - 1000 - pF

Coss output capacitance - 130 - pF

Crss reverse transfer

capacitance -90-pF

td(on) turn-on delay time VDS =-10V; V

GS =-4.5V; R

G(ext) =6Ω;

Tj=25°C; I

D=-1A -11-ns

trrise time - 13 - ns

td(off) turn-off delay time - 61 - ns

tffall time - 23 - ns

Source-drain diode

VSD source-drain voltage IS=-2.4A; V

GS =0V; T

j=25°C;

tp≤300 µs; δ≤0.01 - -0.82 -1.2 V

PMV48XP All information provided in this document is subject to legal disclaimers.

Product data sheet Rev. 1 — 21 December 2010 7 of 15

Nexperia PMV48XP

20 V, 3.5 A P-channel Trench MOSFET

Tj = 25 °C Tj = 25 °C; VDS = -3 V

(1) minimum values

(2) typical values

(3) maximum values

Fig 6. Outp ut characteristics: dra in current as a

function of drain-source volta ge; typ ical values Fig 7. Sub-threshold drain current as a function of

gate-source voltage

Tj = 25 °C

(1) VGS = -1.8 V

(2) VGS = -2.0 V

(3) VGS = -2.25 V

(4) VGS = -3.0 V

(5) VGS = -4.5 V

ID = -2.4 A

(1) Tj = 125 °C

(2) Tj = 25 °C

Fig 8. Drain-source on-state resistance as a function

of drain current; typical values Fig 9. Drain-source on-state resistance as a function

of gate-source voltage; typical value s

VDS (V)

0−5−4−2−3−1

017aaa128

−14

(A)

−10

−6

−2

−4

−8

−12 −3 V

VGS = −4.5 V

−2.25 V

−2 V

−1.8 V

017aaa129

(V)

0.0 − 1.5−1.0−0.5

−10

−4

−10

−5

−10

−3

(A)

−10

−6

(2)(1) (3)

017aaa130

ID (A)

0.0 −12.0−8.0−4.0

0.08

0.12

0.04

0.16

0.20

RDSon

(Ω)

0.00

(2)

(1)

(3)

(5)

(4)

VGS (V)

0−5−4−2−3−1

017aaa131

0.10

0.15

0.05

0.20

0.25

RDSon

(Ω)

0.00

(2)

(1)

PMV48XP All information provided in this document is subject to legal disclaimers.

Product data sheet Rev. 1 — 21 December 2010 8 of 15

Nexperia PMV48XP

20 V, 3.5 A P-channel Trench MOSFET

VDS > ID × RDSon

(1) Tj = 25 °C

(2) Tj = 150 °C

Fig 10. Transfer characteristics: drain current as a

function of gate-source voltage; typical values Fig 11. Normalized drain-source on-state resistance as

a function of junctio n temperature; typical

values

ID = -0.25 mA; VDS = VGS

(1) maximum values

(2) typical values

(3) minimum values

f = 1 MHz; VGS = 0 V

(1) Ciss

(2) Coss

(3) Crss

Fig 12. Gate-source threshold voltage as a function of

junction temperature Fig 13. Input, output and reverse transfer capacitances

as a function of drain-source voltage; typical

values

VGS (V)

0.0 −3.0−2.0−1.0

017aaa132

−14

(A)

−2

−4

−6

−8

−10

−12 (1) (2)

(1)

(2)

Tj (°C)

−60 180120060

017aaa133

1.0

0.5

1.5

2.0

0.0

Tj (°C)

−60 180120060

017aaa134

−0.8

−0.4

−1.2

−1.6

VGS(th)

(V)

0.0

(1)

(2)

(3)

VDS (V)

−10−1102

10−1

017aaa135

103

102

104

(pF)

(2)

(1)

(3)

PMV48XP All information provided in this document is subject to legal disclaimers.

Product data sheet Rev. 1 — 21 December 2010 9 of 15

Nexperia PMV48XP

20 V, 3.5 A P-channel Trench MOSFET

ID = -2.4 A; VDS = -10 V; Tamb = 25 °C

Fig 14. Gate-source voltage as a function of gate

charge; typical values Fig 15. Gate charge waveform definitions

VGS = 0 V

(1) Tj = 150 °C

(2) Tj = 25 °C

Fig 16. Source current as a functio n of so urce-drain voltage; typical va lues

QG (nC)

0108462

017aaa136

−1.5

−3.0

−4.5

VGS

(V)

0.0

017aaa137

VGS

VGS(th)

QGS1 QGS2

QGD

VDS

QG(tot)

QGS

VGS(pl)

VSD (V)

0.0 −1.2−0.8−0.4

017aaa138

−14

(A)

−2

−4

−6

−8

−10

−12

(1) (2)

PMV48XP All information provided in this document is subject to legal disclaimers.

Product data sheet Rev. 1 — 21 December 2010 10 of 15

Nexperia PMV48XP

20 V, 3.5 A P-channel Trench MOSFET

8. Package outline

Fig 17. Package outline SOT23 (TO-236AB)

UNIT A1

max. bpcDE e1HELpQwv

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

04-11-04

06-03-16

IEC JEDEC JEITA

mm 0.1 0.48

0.38 0.15

0.09 3.0

2.8 1.4

1.2 0.95

1.9 2.5

2.1 0.55

0.45 0.1

0.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15

SOT23 TO-236AB

detail X

vMA

0 1 2 mm

scale

1.1

0.9

Plastic surface-mounted package; 3 leads SOT23

PMV48XP All information provided in this document is subject to legal disclaimers.

Product data sheet Rev. 1 — 21 December 2010 11 of 15

Nexperia PMV48XP

20 V, 3.5 A P-channel Trench MOSFET

9. Soldering

Fig 18. Reflow soldering footprint for SOT23 (TO-236AB)

Fig 19. Wave soldering footprint for SOT23 (TO-236AB)

solder lands

solder resist

occupied area

solder paste

sot023_fr

0.5

(3×)

0.6

(3×)

0.6

(3×)

0.7

(3×)

3.3

2.9

1.7

1.9

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot023_fw

2.8

4.5

1.4

4.6

1.4

(2×)

1.2

(2×)

2.2

2.6

Dimensions in mm

PMV48XP All information provided in this document is subject to legal disclaimers.

Product data sheet Rev. 1 — 21 December 2010 12 of 15

Nexperia PMV48XP

20 V, 3.5 A P-channel Trench MOSFET

10. Revision history

Table 8. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PMV48XP v.1 20101221 Product data sheet - -

PMV48XP All information provided in this document is subject to legal disclaimers.

Product data sheet Rev. 1 — 21 December 2010 13 of 15

Nexperia PMV48XP

20 V, 3.5 A P-channel Trench MOSFET

11. Legal information

11.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product

status information is available on the Internet at URL http://www.nexperia.com.

11.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. Nexperia does not give any

representations or warrant ies as to t he accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local Nexperia sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specifica t io n — The information and data provided in a Product

data sheet shall define the specification of the product as agr eed between

Nexperia and its customer, unless Nexperia and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the Nexperia product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

11.3 Disclaimers

Limited warranty and liability — Information in this document is be lieved to

be accurate and reliable. However, Nexperia does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall Nexperia be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, Nexperia’s aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of Nexperia.

Right to make changes — Nexperia reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — Nexperia products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of a Nexperia product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. Nexperia accepts no liability for inclusion and/or use of

Nexperia products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. Nexperia makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using Nexperia products, and Nexperia

accepts no liability for any assistance with applicati ons or customer product

design. It is customer’s sole responsibility to determine whether the Nexperia

product is suitable and fit for the customer’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with t heir

applications and products.

Nexperia does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo mer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using Nexperia

products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). Nexperia does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — Nexperia

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nexperia.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

PMV48XP All information provided in this document is subject to legal disclaimers.

Product data sheet Rev. 1 — 21 December 2010 14 of 15

Nexperia PMV48XP

20 V, 3.5 A P-channel Trench MOSFET

agreement shall apply. Nexperia hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of Nexperia products by customer.

No offer to sell or license — Nothing in this document may b e interpreted or

construed as an of fer to se ll product s that is op en for accept ance or the grant ,

conveyance or implication of any license under any copyrights, p atents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) descri bed herein may

be subject to export control regulat i ons. Export might require a prior

authorization from national authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific Nexperia product is automotive qualified,

the product is not suitable for aut omotive use. It i s neither qua lified nor tested

in accordance with automotive testing or application requirements. Nexperia

accepts no liability for inclusion and/or use of

non-automotive qualified products in au tomotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without Nexperia’s warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

Nexperia’s specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies Nexperia for any

liability, damages or failed product claims result ing from customer design an d

use of the product for automotive applications beyond Nexperia’s

standard warranty and Nexperia’s product specifications.

11.4 Trademarks

Notice: All refe renced brands, produc t names, service names and trademarks

are the property of their respective ow ners.

12. Contact information

For more information, please visit: http://www.nexperia.com

For sales office addresses, please send an email to: salesaddresses@nexperia.com

Nexperia PMV48XP

20 V, 3.5 A P-channel Trench MOSFET

13. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1 General description . . . . . . . . . . . . . . . . . . . . . .1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . .4

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6

8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10

9 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

10 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .12

11 Legal information. . . . . . . . . . . . . . . . . . . . . . . .13

11.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .13

11.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

11.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .13

11.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .14

12 Contact information. . . . . . . . . . . . . . . . . . . . . .14

For more information, please visit: http://www.nexperia.com

For sales office addresses, please send an email to: salesaddresses@nexperia.com

Date of release:

21 December 2010