Features
• T-1 (3 mm) auto insertable package
• AlInGaP SunPower intensity
• High light output
• Tinted diused and tinted non-diused lens options
• Wide viewing angle
• Variety of colors
• Available with straight or formed lead tape and reel
options
Description
This family of 3 mm LED Lamps is capable of withstand-
ing automatic insertion and wave soldering processes.
Designed with a thick epoxy ange and soft leadframe
material, it is ideal for clinch and cut operations.
Applications
• General purpose
• High volume manufacturing
Device Selection Guides
High Brightness Lamps Package Luminous Intensity, Viewing Angle, Package
Color Part Number Tinted Diused Min. Iv @ 20 mA 2θ1/2 Outline
Red HLMP-NG05 µ 90.2 45 A
HLMP-NG07 µ 90.2 60 B
Amber HLMP-NL06 µ 96.2 60 B
Red Orange HLMP-NH04 90.2 60 B
High Eciency Lamps Package Luminous Intensity, Viewing Angle, Package
Color Part Number Tinted Diused Min. Iv @ 10 mA 2θ1/2 Outline
GaP Yellow HLMP-N305 X 14.7 45 A
GaP Orange HLMP-N405 X 13.8 45 A
Note:
1. 2θ1/2 is the o axis angle where the luminous intensity is 1/2 the on axis intensity.
HLMP-N305, HLMP-N405, HLMP-NG0x,
HLMP-NL06, HLMP-NH04
HLMP-Nxxx
T-1 (3 mm) Auto Insertable LED Lamps
Data Sheet
2
Package Dimensions
Package Outline “A”
Package Outline “B”
2.0 (0.08) REF.
0.4 ± 0.2
(0.01 ± 0.01)
2.5 ± 0.3
(0.10 ± 0.01)
0.45 ± 0.10
(0.02 ± 0.007)
0.4 ± 0.2
(0.02 ± 0.01)
0.4 + 0.1
0
(0.2 + 0.00
- 0.00 )
3.4 ± 0.2
(0.13 ± 0.01)
CATHODE MARKS
0.65 (0.03) MAX.
3.1 ± 0.2
(0.12 ± 0.01)
4.4 ± 0.3
(0.17 ± 0.01)
3.5 ± 0.3
(0.14 ± 0.01)
5.9 ± 0.5
(0.23 ± 0.02)
23.0
(0.91)
1.0 ± 0.5
(0.04 ± 0.02)
SEATING PLANE
2.0
0.8 MAX. EPOXY MENISCUS
2.54 ± 0.3
0.44 ± 0.2
0.4 + 0.1
– 0
3.60
CATHODE FLAT
0.65 MAX.
3.10 ± 0.203.80 ± 0.30
3.50 ± 0.30
CATHODE LEAD
5.70 ± 0.5 23.0 MIN. 1.0 MIN.
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. LEADS ARE MILD STEEL. SOLDER COATED.
3. EPOXY MENISCUS OF 0.8 mm (0.03 in.) MAXIMUM
MAY EXTEND TO THE LEADS.
3
Absolute Maximum Ratings at TA = 25 ºC
AlIºnGaP
Parameter Orange Yellow Red Orange, Amber & Red Units
DC Forward Current[1] 30 20 30[2,3] mA
Reverse Voltage (Ir = 100 µA) 5 V
Junction Temperature, Tjmax 110 °C
Storage Temperature Range -40 to +85 °C
Operating Temperature Range -20 to +85 -40 to +85 °C
Notes:
1. See Figure 4 for maximum current derating vs. ambient temperature.
2. Suggested minimum DC current: 10 mA.
3. Maximum Peak Pulsed Forward Current: 50 mA, 30 mA average.
Part Numbering System
HLMP - N x xx # xxx
Mechanical Option
002: Tape & Reel, Straight Leads
Viewing Angle Options
01: 45 Degree
05: 45 Degree
04, 06, 07: 60 Degree
Color Options
3: GaP Yellow
4: GaP Orange
G: AlInGaP Red
L: AlInGaP Amber
H: AlInGaP Red Orange
4
Electrical Characteristics at TA = 25ºC
Capacitance Thermal Speed of Response
C (pF) , Resistance τs (ns)
Forward Voltage Vf (Volts) Vf = 0, f = 1 MHz RθJ-PIN Time Constant e-t/τs
Part Number Typ. Max. If (mA) Typ. (°C/W) Typ.
HLMP-N30x 2.00 2.6 10 15 290 90
HLMP-N40x 1.90 2.6 10 4 290 280
HLMP-NL06[1] 2.02 2.4 20 40 240 20
HLMP-NG0x[1] 1.90 2.4 20 40 240 20
HLMP-NH04 1.94 2.4 20 40 250 20
Note:
1. Please contact your Avago Sales Representative about operating currents below 10 mA.
Optical Characteristics at TA = 25 ºC
Luminous
Typ. Dominant Ecacy
Luminous Intensity Typ. Peak Wavelength Typ. Spectral Width
Part Number Min. If (mA) Wavelength (nm) (nm) Half Width (lm/W)
HLMP-NG05 90.2 20 635 626 17 150
HLMP-NG07 90.2 20 635 626 17 150
HLMP-NL06 96.2 20 592 590 17 480
HLMP-N305 14.7 10 583 585 36 500
HLMP-N405 13.8 10 600 602 37 380
HLMP-NH04 90.2 20 621 615 17 235
Notes:
1. The luminous intensity, lv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
2. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the color of the device.
3. The radiant intensity, le, in watts per steradian, may be found from the equation le = lv/hv, where lv is the luminous intensity in candelas and hv
is the luminous ecacy in lumens/watt.
5
Figure 1. Relative intensity vs. peak wavelength.
Figure 2. Forward current vs. forward voltage.
HLMP-N20X fig 1a
RED-ORANGE
AlInGaP RED
WAVELENGTH – nm
RELATIVE INTENSITY
1.0
0.5
0
550 600 650 700
AMBER
ORANGE
HIGH BRIGHTNESS LAMPS
DH AlGaAs RED
HLMP-N20X fig 1b
ORANGE
HIGH
EFFICIENCY
RED
WAVELENGTH – nm
RELATIVE INTENSITY
1.0
0.5
0
500 550 600 650 700
YELLOW
EMERALD GREEN
HIGH
PERFORMANCE
GREEN
HIGH EFFICIENCY LAMPS
0
90
70
60
40
20
I
F
– FORWARD CURRENT – mA
1.5 3.52.50.5
V
F
– FORWARD VOLTAGE – V
0 4.0
YELLOW
HIGH EFFICIENCY LAMPS
HIGH
EFFICIENCY
RED/ORANGE
GREEN,
EMERALD GREEN
HLMP-N20X fig 2b
1.0 2.0 3.0
10
30
50
80
0
70
60
40
20
I
F
– FORWARD CURRENT – mA
V
F
– FORWARD VOLTAGE – V
1.0 3.0
AMBER
HIGH BRIGHTNESS LAMPS
DH AsAlGaAs
RED
HLMP-N20X fig 2a
1.5 2.0 2.5
10
30
50
AlInGaP
RED/RED-
ORANGE
6
HLMP-N20X fig 3a
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
0
IF – DC FORWARD CURRENT – mA
10 20
1.0
0.5
30
1.5
HIGH BRIGHTNESS LAMPS
40
AlInGaP
DH As AlGaAs
2.0
Figure 4. Maximum forward DC current vs. ambient temperature.
Figure 3. Relative luminous intensity vs. forward current.
HLMP-N20X fig 4a-new
I
F
– FORWARD CURRENT – mA
0
0
T
A
– AMBIENT TEMPERATURE – °C
40 80
40
20
10
20 60
30
5
15
25
35
AlInGaP
Rθ
JA
= 500° C/W
Rθ
JA
= 650° C/W
Rθ
JA
= 750° C/W
10 30 50 70 90
HLMP-N20X fig 4b
I
F
– FORWARD CURRENT – mA
0
0
T
A
– AMBIENT TEMPERATURE – °C
40 80
40
20
10
20 60
30
5
15
25
35
DH As AlGaAs RED
Rθ
JA
= 559° C/W
Rθ
JA
= 689° C/W
7
HLMP-N20X fig 5
NORMALIZED INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.8
0.6
0.5
0.7
0.2
-90
0.1
0.3
0.4
-80 -70 -60 -50 -40 -20 -10 0-30 10 20 30 40 50 60 70 80 90
0.9
Figure 5. Representative spatial radiation pattern for 45° viewing angle.
HLMP-N20X fig 6
NORMALIZED INTENSITY
1
0
ANGULAR DISPLACEMENT – DEGREES
0.8
0.6
0.5
0.7
0.2
-90
0.1
0.3
0.4
-80 -70 -60 -50 -40 -20 -10 0-30 10 20 30 40 50 60 70 80 90
0.9
Figure 6. Representative spatial radiation pattern for 60° viewing angle.
8
Intensity Bin Limits
Intensity Range (mcd)
Color Bin Min. Max.
H 13.8 27.6
I 22.0 44.0
J 35.2 70.4
K 56.4 112.8
L 90.2 180.4
M 138.0 276.0
N 200.0 400.0
O 290.0 580.0
Red/Orange P 500.0 1000.0
/Red-Orange Q 700.0 1400.0
R 1000.0 2000.0
S 1400.0 2800.0
T 2000.0 4000.0
U 2900.0 5800.0
V 4200.0 8400.0
W 6000.0 12000.0
X 8700.0 17400.0
Y 12600.0 25200.0
Z 18200.0 36400.0
G 14.7 29.4
H 23.5 47.0
I 37.6 75.2
J 60.1 120.2
K 96.2 192.4
L 147.0 294.0
M 212.0 424.0
Yellow/Amber N 300.0 600.0
O 450.0 900.0
P 700.0 1400.0
Q 1000.0 2000.0
R 1600.0 3200.0
S 2600.0 5200.0
T 4000.0 8000.0
U 6500.0 13000.0
V 10000.0 20000.0
W 16000.0 30000.0
Maximum tolerance for each bin limit is ±18%.
Amber Color Bin Limits
(nm at 20 mA)
Bin Name Min. Max.
1 584.5 587.0
2 587.0 589.5
4 589.5 592.0
6 592.0 594.5
Tolerance for each bin limit is ±0.5 nm.
9
Color Categories
Lambda (nm)
Color Category # Min. Max.
1 582.0 584.5
3 584.5 587.0
Yellow 2 587.0 589.5
4 589.5 592.0
5 592.0 593.0
1 597.0 599.5
2 599.5 602.0
3 602.0 604.5
Orange 4 604.5 607.5
5 607.5 610.5
6 610.5 613.5
7 613.5 616.5
8 616.5 619.5
Tolerance for each bin limit is ±0.5 nm.
Taping Options
Straight Lead
Option #002 #2CA #2CD
Dimension “B” – – –
Dimension “H” 20.5 ± 1.0 18.0 ± 1.0 20.5 ± 1.0
(0.81 ± 0.04) (0.71 ± 0.04) (0.81 ± 0.04)
Formed Lead
Option #2UK #2UL #2UM #2UN #2UP #2UQ #2UR
Dimension “B” 12.0 ± 1.0 9.0 ± 1.0 10.0 ± 1.0 11.0 ± 1.0 13.0 ± 1.0 14.0 ± 1.0 15.0 ± 1.0
(0.47 ± 0.04) (0.35 ± 0.04) (0.39 ± 0.04) (0.43 ± 0.04) (0.51 ± 0.04) (0.55 ± 0.04) (0.59 ± 0.04)
Dimension “H” 16.0 ± 1.0
(0.63 ± 0.04)
Units: mm (inches)
10
STRAIGHT LEAD
FORMED LEAD
2.5 (0.10) MAX.
14.0 ± 1.7
(0.55 ± 0.07)
18.0 ± 1.0
(0.71 ± 0.04)
6.4 ± 1.3
(0.25 ± 0.05)
12.7 ± 1.0
(0.50 ± 0.04)
9.1 ± 0.6
(0.36 ± 0.03)
0.0 ± 1.0
(0.00 ± 0.04)
11.0
(0.43)MAX.
DIMENSION "H"
(SEE TABLE)
5.1 ± 0.7
(0.20 ± 0.03)
12.7 ± 0.3
(0.50 ± 0.01)
2.5 ± 0.3
(0.10 ± 0.01)
CATHODE
LEAD
0.7 ± 0.2
(0.03 ± 0.01)
A A
VIEW A–A
HLMP-N20X Tape Outline - Straight Lead
∅4.0 ± 0.2
(0.16 ± 0.01)TYP.
2.5 (0.10) MAX.
14.0 ± 1.7
(0.55 ± 0.07)
18.0 ± 1.0
(0.71 ± 0.04)
6.4 ± 1.3
(0.25 ± 0.05)
12.7 ± 1.0
(0.50 ± 0.04)
9.1 ± 0.6
(0.36 ± 0.03)
0.0 ± 1.0
(0.00 ± 0.04)
11.0
(0.43)MAX.
DIMENSION "H"
(SEE TABLE)
3.9 ± 0.7
(0.15 ± 0.03)
12.7 ± 0.3
(0.50 ± 0.01)
2.5 ± 0.3
(0.10 ± 0.01)
CATHODE
LEAD
0.7 ± 0.2
(0.03 ± 0.01)
A A
VIEW A–A
HLMP-N20X Tape Outline - Formed Lead
∅4.0 ± 0.2
(0.16 ± 0.01)TYP.
DIMENSION "B"
(SEE TABLE)
Tape Outline Drawing
Recommended Assembly Condition
• A single-sided phenolic printed circuit board (PCB) is
preferred. Double-sided PCB and other materials may
cause greater lead stress. Recommended through-
hole diameter is 0.93 to 1.03 mm. Leadlength below
the PCB should be 1.5 to 2.0 mm, and the clinching
angle (angle between the lead and PCB) should be 30
±10 degrees.
• If SMT devices and an adhesive are used on the same
pcb as these lamps, the adhesive should be cured
before the lamps are auto-inserted. If curing must
be done after lamp insertion, the cure
temperature and time should not exceed 140°C,
100 seconds. This is the temperature of the surface
normal to the IR source.
TAPE & REEL (for option #002 only)
AMMO PACK (for All options except #002)
Package Options
Lead Option Ammo Pack Tape & Reel
(1000 pcs.) (2000 pcs.)
Straight Lead #2C — #002
Formed Lead #2U — –
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE IS FACING
UPWARD.
MADE IN MALAYSIA
ANODE
LEDS
OPERATOR .........
HP PART # ...........
DATE CODE ........
TAPING DATE .....
BIN .......................
NO. OF GAPS .....
QUANTITY ..........
CATHODE
C
A
+
–
ANODE LEAD LEAVES
THE BOX FIRST.
336 (13.23)
52 (2.05)
140 (5.51)
DIMENSIONS IN MILLIMETERS (INCHES).
REELING ORIENTATION
CLOCKWISE
ADHESIVE TAPE MUST BE
FACING TOWARDS THE
OUTSIDE OF THE REEL.
ANODE LEAD LEAVES
THE REEL FIRST.
PROTECTIVE
CARDBOARD
110 (4.33) DIA.
336 (13.23) DIA.
DIMENSIONS IN MILLIMETERS (INCHES).
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely upon
hand operation.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without stando.
• Recommended soldering conditions:
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering prole to ensure
the soldering prole used is always conforming to
recommended soldering condition.
• If necessary, use xture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• Recommended PC board plated through hole sizes
for LED component leads:
Manual Solder
Wave Soldering Dipping
Pre-heat Temperature 105 °C Max. –
Pre-heat Time 30 sec Max. –
Peak Temperature 250 °C Max. 260 °C Max.
Dwell Time 3 sec Max. 5 sec Max.
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm
(0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch)
0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more information on
soldering LED components.
Figure 7. Recommended wave soldering prole.
LAMINAR WAVE BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT WAVE
FLUXING
PREHEAT
0 10 20
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – °C
60 70 80 90 100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4257EN
AV02-1014EN - January 23, 2008