Parameter Min. Typ. Max. Unit
RthJC Thermal resistance Junction-Case 2.1
RthJA Thermal resistance Junction-ambient 80 °C/W
RthCS Thermal resistance Case to Sink 1.0
2N7085
Prelim. 7/99
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Parameter Test Conditions Min. Typ. Max. Unit
VGS = 0 ID= 250µA
VDS = VGS ID= 250µA
VDS = 0 VGS = ±20V
VDS = 80V
VGS = 0 TJ= 125°C
VDS = 10V VGS = 10V
VGS = 10V
ID= 12A TJ= 125°C
VDS = 15V IDS = 12A
VGS = 0
VDS = 25V
f = 1MHz
VDS = 0.5 x V(BR)DSS50V
VGS = 10V ID= 20A
VDD = 50V ID= 20A
VGEN =10V
RL= 2.5
W
RG= 4.7
W
IF= 20A VGS = 0
IF= 20A
di/dt = 100A/µs
ELECTRICAL CHARACTERISTICS (TJ= 25°C unless otherwise stated)
THERMAL RESISTANCECHARACTERISTICS
Drain–Source Breakdown Voltage
Gate Threshold Voltage
Gate – Body Leakage
Zero Gate Voltage Drain Current
On–State Drain Current1
Drain – Source On–State
Resistance 1
Forward Transconductance1
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge2
Gate Source Charge2
Gate Drain Charge2
Turn–On Delay Time2
Rise Time2
Turn–Off Delay Time2
Fall Time2
Continuous Current
Pulsed Current
Diode Forward Voltage1
Reverse Recovery Time
Reverse Recovery Charge
100
24
±100
25
250
20 0.06 0.075
0.11 0.14
5.0 8.0
1400
480
110
35 50
10 20
18 25
13 30
85 120
35 80
75 95
20
80
2.5
150 400
0.5
V
V
nA
µA
A
W
S
pF
nC
ns
A
V
ns
µC
V(BR)DSS
VGS(th)
IGSS
IDSS
ID(on)
rDS(on)
gfs
Ciss
Coss
Crss
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
IS
ISM
VSD
trr
Qrr
STATIC ELECTRICAL RATINGS
DYNAMIC CHARACTERISTICS
SOURCE – DRAIN DIODE CHARACTERISTICS
1 Pulse test : Pulse Width < 300
m
s ,Duty Cycle < 2%
2 Independent of Operating Temperature