Pb
RoHS
EH1320HSTS-120.000M
EH13 20 HS TS -120.000M
Series
RoHS Compliant (Pb-free) 3.3V 8 Pin DIP Metal
Thru-Hole LVCMOS High Frequency Oscillator
Frequency Tolerance/Stability
±20ppm Maximum
Package
Operating Temperature Range
0°C to +70°C
Nominal Frequency
120.000MHz
Pin 1 Connection
Tri-State (Disabled Output: High Impedance)
Duty Cycle
50 ±10(%)
ELECTRICAL SPECIFICATIONS
Nominal Frequency 120.000MHz
Frequency Tolerance/Stability ±20ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Ouput Load Change, 1st Year Aging at 25°C,
Shock, and Vibration.)
Aging at 25°C ±5ppm/year Maximum
Operating Temperature Range 0°C to +70°C
Supply Voltage 3.3Vdc ±0.3Vdc
Input Current 35mA Maximum (No Load)
Output Voltage Logic High (Voh) 2.7Vdc Minimum (IOH = -8mA)
Output Voltage Logic Low (Vol) 0.5Vdc Maximum (IOL = +8mA)
Rise/Fall Time 4nSec Maximum (Measured at 20% to 80% of waveform)
Duty Cycle 50 ±10(%) (Measured at 50% of waveform)
Load Drive Capability 15pF Maximum
Output Logic Type CMOS
Pin 1 Connection Tri-State (Disabled Output: High Impedance)
Tri-State Input Voltage (Vih and Vil) 70% of Vdd Minimum to enable output, 20% of Vdd Maximum to disable output (High Impedance), No
Connect to enable output.
Absolute Clock Jitter ±250pSec Maximum, ±100pSec Typical
One Sigma Clock Period Jitter ±50pSec Maximum, ±40pSec Typical
Start Up Time 10mSec Maximum
Storage Temperature Range -55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Lead Integrity MIL-STD-883, Method 2004
Mechanical Shock MIL-STD-202, Method 213, Condition C
Resistance to Soldering Heat MIL-STD-202, Method 210
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010
Vibration MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 1 of 6
EH1320HSTS-120.000M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
7.620
±0.203
7.620 ±0.203
13.2
MAX
13.2
MAX
14
85DIA 0.457
±0.1 (X4)
5.08 MIN
5.6 MAX
0.8 ±0.1 (X3)
MARKING
ORIENTATION
PIN CONNECTION
1 Tri-State (High
Impedance)
4 Case/Ground
5 Output
8 Supply Voltage
LINE MARKING
1ECLIPTEK
2EH13TS
EH13=Product Series
3120.00M
4XXYZZ
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
OUTPUT WAVEFORM & TIMING DIAGRAM
VOH
VOL
80% of Waveform
50% of Waveform
20% of Waveform
Fall
Time
Rise
Time TW
T
Duty Cycle (%) = TW/T x 100
VIH
VIL
tPLZ tPZL
CLOCK OUTPUT TRI-STATE INPUT
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 2 of 6
EH1320HSTS-120.000M
Supply
Voltage
(VDD)
Test Circuit for CMOS Output
Output
No Connect
or Tri-State
Ground
+ +
+_
__
Power
Supply 0.01µF
(Note 1) 0.1µF
(Note 1) CL
(Note 3)
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
Voltage
Meter
Current
Meter
Oscilloscope Frequency
Counter
Probe
(Note 2)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 3 of 6
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EH1320HSTS-120.000M
High Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate) 3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 seconds
Ramp-down Rate 6°C/second Maximum
Time 25°C to Peak Temperature (t) 8 minutes Maximum
Moisture Sensitivity Level Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 4 of 6
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EH1320HSTS-120.000M
Low Temperature Infrared/Convection 185°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)185°C Maximum
Target Peak Temperature (TP Target) 185°C Maximum 2 Times
Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 5 of 6
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EH1320HSTS-120.000M
Low Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 30 - 60 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)245°C Maximum
Target Peak Temperature (TP Target) 245°C Maximum 1 Time / 235°C Maximum 2 Times
Time within 5°C of actual peak (tp)5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 2/17/2010 | Page 6 of 6
