DS26LS31MQML
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SNOSAM5B –AUGUST 2005–REVISED APRIL 2013
DS26LS31MQML Quad High Speed Differential Line Driver
Check for Samples: DS26LS31MQML
1FEATURES DESCRIPTION
The DS26LS31MQML is a quad differential line driver
2• Operation from Single 5V Supply designed for digital data transmission over balanced
• Outputs Won't Load Line When VCC = 0V lines. The DS26LS31MQML meets all the
• Four Line Drivers in One Package for requirements of EIA Standard RS-422 and Federal
Maximum Package Density Standard 1020. It is designed to provide unipolar
differential drive to twisted-pair or parallel-wire
• Output Short-Circuit Protection transmission lines.
• Complementary Outputs The circuit provides an enable and disable function
• Meets the Requirements of EIA Standard RS- common to all four drivers. The DS26LS31MQML
422 features TRI-STATE outputs and logically ANDed
• Pin Compatible with AM26LS31 complementary outputs. The inputs are all LS
compatible and are all one unit load.
• Glitch Free Power Up/Down The DS26LS31 features a power up/down protection
circuit which keeps the output in a high impedance
state (TRI-STATE) during power up or down
preventing erroneous glitches on the transmission
lines.
Logic and Connection Diagrams
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2005–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
DS26LS31MQML
SNOSAM5B –AUGUST 2005–REVISED APRIL 2013
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Top View
Figure 1. CDIP Package
See Package Numbers NAJ0020A, NFE0016A, NAD0016A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)
Supply Voltage 7V
Input Voltage 7V
Output Voltage 5.5V
Output Voltage (Power OFF) −0.25 to 6V
Maximum Power Dissipation at 25°C(2)
NFE0016A Package 1400 mW
NAJ0020A Package 1600 mW
NAD0016A Package 850 mW
Junction Temperature (TJ) +150°C
Thermal Resistance, Junction-to-Ambient
θJA
NFE0016A Package 94°C/W derate above +25°C at 10.6 mW/°C
NAJ0020A Package 83°C/W derate above +25°C at 12 mW/°C
NAD0016A Package 163°C/W derate above +25°C at 6.1 mW/°C
Thermal Resistance, Junction-to-Case
θJC
NFE0016A Package 16°C/W
NAJ0020A Package 19°C/W
NAD0016A Package 14°C/W
ESD Tolerance 2500V
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be specified. They are not meant to imply
that the devices should be operated at these limits. The tables of “Electrical Characteristics” provide conditions for actual device
operation.
(2) Derate CDIP = 11.5 mW/°C, LCCC = 13mW/°C, CLGA = 7.4mW/°C above 25°C.
Recommended Operating Conditions
Supply Voltage, VCC 4.5 V to 5.5 V
Temperature, TA−55°C to +125°C
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Radiation Features
DS26LS31MEFQML 300 Krads (Si)
DS26LS31MJFQML 300 Krads (Si)
DS26LS31MJFQMLV 300 Krads (Si)
DS26LS31MWFQML 300 Krads (Si)
DS26LS31MWFQMLV 300 Krads (Si)
Quality Conformance Inspection
MIL-STD-883, Method 5005 - Group A
Subgroup Description Temp (°C)
1 Static tests at +25
2 Static tests at +125
3 Static tests at -55
4 Dynamic tests at +25
5 Dynamic tests at +125
6 Dynamic tests at -55
7 Functional tests at +25
8A Functional tests at +125
8B Functional tests at -55
9 Switching tests at +25
10 Switching tests at +125
11 Switching tests at -55
DS26LS31M - SMD, QMLV & RH Electrical Characteristics DC Parameters
The following conditions apply, unless otherwise specified. +V = 5V, VCM = 0V.(1)
Sub-
Parameter Test Conditions Notes Min Max Unit groups
See and(2)
VIH Logical "1" Input Voltage VCC = 4.5V 2 V 1, 2, 3
(3)
See(2) and
VIL Logical "0" Input Voltage VCC = 5.5V .8 V 1, 2, 3
(3)
VOH Logical "1" Output Voltage VCC = 4.5V, IOH = -20mA See(3) 2.5 V 1, 2, 3
VOL Logical "0" Output Voltage VCC = 4.5V, IOL = 20mA See(3) .5 V 1, 2, 3
IIH Logical "1" Input Current VCC = 5.5V, VIN= 2.7V See(3) -2.0 20 uA 1, 2, 3
IIL Logical "0" Input Current VCC = 5.5V, VIN = .4V See(3) 100 -360 uA 1, 2, 3
IIInput Reverse Current VCC = 5.5V, VIN = 7V See(3) -.01 .1 mA 1, 2, 3
VCC = 5.5V, VO= .5V See(3) -20 uA 1, 2, 3
IOTRI-STATE Output Current VCC = 5.5V, VO= 2.5V See(3) 20 uA 1, 2, 3
VIC Input Clamp Voltage VCC = 4.5V, IIN = -18mA See(3) -1.5 V 1, 2, 3
IOS Output Short Circuit Current VCC = 5.5V See(3) -30 -150 mA 1, 2, 3
VCC = 5.5V, All Outputs Disabled or
ICC Power Supply Current See(3) 80 mA 1, 2, 3
Active
(1) Pre and post irradiation limits are identical to those listed under AC and DC electrical characteristics. These parts may be dose rate
sensitive in a space environment and demonstrate enhanced low dose rate effect. Radiation end point limits for the noted parameters
are ensured only for the conditions as specified in MIL-STD 883, Method 1019, Condition A.
(2) Parameter tested go-no-go only.
(3) Subgroups 1, 2 and 9, 10: Power dissipation must be externally controlled at elevated temperatures.
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DS26LS31M - SMD, QMLV and RH Electrical Characteristics AC Parameters - Propagation Delay
Time
The following conditions apply, unless otherwise specified. VCC = 5V, VIN = 1.3V to VO= 1.3V, V (pulse) = 0 to 3V.(1)
Sub-
Parameter Test Conditions Notes Min Max Unit groups
20 ns 9
tPLH Input to Output CL= 30 pF See(2) 30 ns 10, 11
20 ns 9
tPHL Input to Output CL= 30 pF See(2) 30 ns 10, 11
6 ns 9
tSkew Output to Output CL= 30 pF See(2) 9 ns 10, 11
35 ns 9
S2 Open, Enable, CL= 10 pF See(2) 53 ns 10, 11
tPLZ Enable to Output 35 ns 9
S2 Open, Enable, CL= 10 pF See(2) 53 ns 10, 11
30 ns 9
S1 Open, Enable, CL= 10 pF See(2) 45 ns 10, 11
tPHZ Enable to Output 30 ns 9
S1 Open, Enable, CL = 10 pF See(2) 45 ns 10, 11
45 ns 9
S2 Open, Enable, CL= 30 pF See(2) 68 ns 10, 11
tPZL Enable to Output 45 ns 9
S2 Open, Enable, CL= 30 pF See(2) 68 ns 10, 11
40 ns 9
S1 Open, Enable, CL= 30 pF See(2) 60 ns 10, 11
tPZH Enable to Output 40 ns 9
S1 Open, Enable, CL= 30 pF See(2) 60 ns 10, 11
(1) Pre and post irradiation limits are identical to those listed under AC and DC electrical characteristics. These parts may be dose rate
sensitive in a space environment and demonstrate enhanced low dose rate effect. Radiation end point limits for the noted parameters
are ensured only for the conditions as specified in MIL-STD 883, Method 1019, Condition A.
(2) Subgroups 1, 2 and 9, 10: Power dissipation must be externally controlled at elevated temperatures.
DS26LS31M - SMD, QMLV and RH Electrical Characteristics DC Parameters - Drift Values
The following conditions apply, unless otherwise specified. Delta calculations performed on QMLV only devices after burn-in
and at Group B5. Sub-
Parameter Test Conditions Notes Min Max Unit groups
VOL Output Low Voltage VCC = 4.5, IOL = 20 mA See(1) -50 50 mV 1
VOH Output High Voltage VCC = 4.5, IOH = -20 mA See(1) -250 250 mV 1
VCC = 5.5, All outputs disabled or
ICC Power Supply Current See(1) -8 8 mA 1
active
(1) Subgroups 1, 2 and 9, 10: Power dissipation must be externally controlled at elevated temperatures.
DS26LS31M - 883 Electrical Characteristics DC Parameters Sub-
Parameter Test Conditions Notes Min Max Unit groups
See(1) and
VIH Logical "1" Input Voltage 2 V 1, 2, 3
(2)
See(1) and
VIL Logical "0" Input Voltage .8 V 1, 2, 3
(2)
VOH Logical "1" Output Voltage VCC = 4.5V, IOH = -20mA See(2) 2.5 V 1, 2, 3
(1) Parameter tested go-no-go only.
(2) Subgroups 1, 2 and 9, 10: Power dissipation must be externally controlled at elevated temperatures.
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DS26LS31M - 883 Electrical Characteristics DC Parameters (continued) Sub-
Parameter Test Conditions Notes Min Max Unit groups
VOL Logical "0" Output Voltage VCC = 4.5V, IOL = 20mA See(2) .5 V 1, 2, 3
IIH Logical "1" Input Current VCC = 5.5V, VIN = 2.7V See(2) 20 uA 1, 2, 3
IIL Logical "0" Input Current VCC = 5.5V, VIN = .4V See(2) -200 uA 1, 2, 3
IIInput Reverse Current VCC = 5.5V, VIN = 7V See(2) .1 mA 1, 2, 3
VCC = 5.5V, VO= .5V See(2) -20 uA 1, 2, 3
IOTRI-STATE Output Current VCC = 5.5V, VO= 2.5V See(2) 20 uA 1, 2, 3
VIC Input Clamp Voltage VCC = 4.5V, IIN = -18mA See(2) -1.5 V 1, 2, 3
IOS (min) Output Short Circuit Current VCC = 5.5V See(2) -30 mA 1, 2, 3
IOS (max) Output Short Circuit Current VCC = 5.5V See(2) -150 mA 1, 2, 3
VCC = 5.5V, All Outputs Disabled or
ICC Power Supply Current See(2) 60 mA 1, 2, 3
Active
DS26LS31M - 883 Electrical Characteristics AC Parameters - Propagation Delay Time
The following conditions apply, unless otherwise specified. VCC = 5V, CL= 50pF or equivalent impedance provided by diode
load. Sub-
Parameter Test Conditions Notes Min Max Unit groups
15 ns 9
See(1) and
tPLH Input to Output (2) 30 ns 10, 11.
15 ns 9
See(1) and
tPHL Input to Output (2) 30 ns 10, 11.
6 ns 9
See(1) and
tSkew Output to Output (2) 9 ns 10, 11.
35 ns 9
See(1) and
S2 Open, Enable (2) 53 ns 10, 11.
tPLZ Enable to Output 35 ns 9
See(1) and
S2 Open, /Enable (2) 53 ns 10, 11.
25 ns 9
See(1) and
S1 Open, Enable (2) 45 ns 10, 11.
tPHZ Enable to Output 25 ns 9
See(1) and
S1 Open, /Enable (2) 45 ns 10, 11.
30 ns 9
See(1) and
S2 Open, Enable (2) 68 ns 10, 11.
tPZL Enable to Output 30 ns 9
See(1) and
S2 Open, /Enable (2) 68 ns 10, 11.
30 ns 9
See(1) and
S1 Open, Enable (2) 60 ns 10, 11.
tPZH Enable to Output 30 ns 9
See(1) and
S1 Open, /Enable (2) 60 ns 10, 11.
(1) Subgroups 1, 2 and 9, 10: Power dissipation must be externally controlled at elevated temperatures.
(2) Subgroup 10 and 11 specified but not tested.
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AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS
S1 and S2 of load circuit are closed except where shown.
Figure 2. AC Test Circuit
f = 1 MHz, tr≤15 ns, tf≤6 ns
Figure 3. Propagation Delays
f = 1 MHz, tr≤15 ns, tf≤6 ns
Figure 4. Enable and Disable Times
TYPICAL APPLICATIONS
Figure 5. Two-Wire Balanced System, RS-422
RTis optional although highly recommended to reduce reflection.
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Typical Performance Characteristics
DS26LS31MQMLCN Unloaded IC
vs
Frequency DS26LS31MQML ICC
vs vs
TAVCC vs TA
Figure 6. Figure 7.
DS26LS31MQMLCN VOH DS26LS31MQMLCN VOL
vs vs
IOH vs TAIOL vs TA
Figure 8. Figure 9.
DS26LS31MQMLCN VOD
vs
IOvs TA
Figure 10.
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REVISION HISTORY
Date Revision Section Originator Changes
Released
8/04/05 A New Release, Corporate format R. Malone 2 MDS data sheets converted into a Corp. data
Ordering Info. Table, Absolute Ratings, sheet format. Following MDS data sheets will
Maximum Operating Conditions, New be Archived MDDS26LS31M-X-RH, Rev.2A0,
Radiation Section. Typos in QMLV & MNDS26LS31M-X, Rev. 0A0
RH, 883 AC Electrical Characteristics
Parameters Column
3/01/06 A1 R. Malone Added: Juction temp., Thermal Resistance θJA
and θJC. Added a Radiation Section. Changed:
Maximum Operating Conditions to
Recommended Operating Conditions, Enable
and Disable Time to Enable to Output. Revision
A will be archived.
4/15/2013 B TIS Changed layout of National Data Sheet to TI
format
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
5962-7802301VEA ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS26LS31MJ-QMLV
5962-7802301VEA Q
AM26LS31MW/883 ACTIVE CFP NAD 16 19 TBD Call TI Call TI -55 to 125 DS26LS31MW
/883 Q ACO
/883 Q >T
DS26LS31ME-SMD ACTIVE LCCC NAJ 20 50 TBD Call TI Call TI -55 to 125 DS26LS31ME
-SMD Q
5962-78023
01Q2A ACO
01Q2A >T
DS26LS31MJ-QMLV ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS26LS31MJ-QMLV
5962-7802301VEA Q
DS26LS31MJ-SMD ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS26LS31MJ-SMD
5962-7802301MEA Q
DS26LS31MJ/883 ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS26LS31MJ/883 Q
DS26LS31MW/883 ACTIVE CFP NAD 16 19 TBD Call TI Call TI -55 to 125 DS26LS31MW
/883 Q ACO
/883 Q >T
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com 15-Apr-2013
Addendum-Page 2
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF DS26LS31MQML, DS26LS31MQML-SP :
•Military: DS26LS31MQML
•Space: DS26LS31MQML-SP
NOTE: Qualified Version Definitions:
•Military - QML certified for Military and Defense Applications
•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
MECHANICAL DATA
J0016A
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J16A (REV L)
NFE0016A
MECHANICAL DATA
NAJ0020A
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E20A (Rev F)
MECHANICAL DATA
NAD0016A
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W16A (Rev T)
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