SLVS324A − JULY 2001 REVISED NOVEMBER 2004
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features
DInverts Input Supply Voltage
DUp to 60-mA Output Current
DOnly Three Small 1-µF Ceramic Capacitors
Needed
DInput Voltage Range From 1.6 V to 5.5 V
DPowerSave-Mode for Improved Efficiency
at Low Output Currents (TPS60400)
DDevice Quiescent Current Typical 65 µA
DIntegrated Active Schottky-Diode for
Start-Up Into Load
DSmall 5-Pin SOT23 Package
DEvaluation Module Available
TPS60400EVM−178
applications
DLCD Bias
DGaAs Bias for RF Power Amps
DSensor Supply in Portable Instruments
DBipolar Amplifier Supply
DMedical Instruments
DBattery-Operated Equipment
description
The TPS6040x is a family of devices that generate an unregulated negative output voltage from an input voltage
ranging from 1.6 V to 5.5 V. The devices are typically supplied by a preregulated supply rail of 5 V or 3.3 V. Due
to its wide input voltage range, two or three NiCd, NiMH, or alkaline battery cells, as well as one Li-Ion cell can
also power them.
Only three external 1-µF capacitors are required to build a complete dc/dc charge pump inverter. Assembled
in a 5-pin SOT23 package, the complete converter can be built on a 50 mm2 board area. Additional board area
and component count reduction is achieved by replacing the Schottky diode that is typically needed for start-up
into load by integrated circuitry.
The TPS6040x can deliver a maximum output current of 60 mA with a typical conversion efficiency of greater
than 90% over a wide output current range. Three device options with 20-kHz, 50-kHz, and 250-kHz fixed
frequency operation are available. One device comes with a variable switching frequency to reduce operating
current in applications with a wide load range and enables the design with low-value capacitors.
typical application circuit
TPS60400
CFLY− CFLY+
35
OUTIN
GND
1
2
4
CI
1 µFCO
1 µF
Output
−1.6 V to −5.5 V,
Max 60 mA
Input
1.6 V to 5.5 V
C(fly) 1 µF
−5
−4
−3
−2
−1
0
012345
IO = 60 mA
IO = 30 mA
IO = 1 mA
TA = 25°C
VI − Input Voltage − V
− Output Voltage − V
TPS60400
OUTPUT VOLTAGE
vs
INPUT VOLTAGE
VO
Copyright 2001−2004, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
3
2
4
5
DBV PACKAGE
(TOP VIEW)
1
OUT
IN
CFLY−
CFLY+
GND
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*%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"#
#"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*&
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SLVS324A − JULY 2001 REVISED NOVEMBER 2004
2WWW.TI.COM
AVAILABLE OPTIONS
PART NUMBER†MARKING DBV
PACKAGE TYPICAL FLYING CAPACITOR
[µF] FEATURE
TPS60400DBV PFKI 1 Variable switching frequency
50 kHz−250 kHz
TPS60401DBV PFLI 10 Fixed frequency 20 kHz
TPS60402DBV PFMI 3.3 Fixed frequency 50 kHz
TPS60403DBV PFNI 1 Fixed frequency 250 kHz
†The DBV package is available taped and reeled. Add R suffix to device type (e.g. TPS60400DBVR) to order quantities of
3000 devices per reel. Add T suffix to device type (e.g. TPS60400DBVT) to order quantities of 250 devices per reel.
TPS60400 functional block diagram
Start
FF
R
S
Q
VI − VCFLY+ < 0.5 V
VI
MEAS VI < 1 V
V
I
VO > Vbe
VO
MEAS
VO
OSC
OSC
CHG
50 kHz
VO > −1 V
VI / VO
MEAS
VIVO
VCO_CONT
VO < −VI − Vbe
Phase
Generator
DC_ Startup
C(fly)
+
Q3
Q2
Q1
Q4
VI
VO
GND
Q5
Q
QB
DC_ Startup
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME NO.
I/O
DESCRIPTION
CFLY+ 5Positive terminal of the flying capacitor C(fly)
CFLY− 3Negative terminal of the flying capacitor C(fly)
GND 4 Ground
IN 2 I Supply input. Connect to an input supply in the 1.6-V to 5.5-V range. Bypass IN to GND with a capacitor that has t he
same value as the flying capacitor.
OUT 1 O Power output with VO = −VI
Bypass OUT to GND with the output filter capacitor CO.
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detailed description
operating principle
The TPS60400, TPS60401 charge pumps invert the voltage applied to their input. For the highest performance,
use low equivalent series resistance (ESR) capacitors (e.g., ceramic). During the first half-cycle, switches S2
and S4 open, switches S1 and S3 close, and capacitor (C(fly)) charges to the voltage at VI. During the second
half-cycle, S1 and S3 open, S2 and S4 close. This connects the positive terminal of C(fly) to GND and the
negative t o V O. By connecting C(fly) in parallel, CO is charged negative. The actual voltage at the output is more
positive than −VI, since switches S1–S4 have resistance and the load drains charge from CO.
C(fly)
1 µF
S2
S1
S3
S4
CO
1 µF
VO (−VI)
GND
VI
GND
Figure 1. Operating Principle
charge-pump output resistance
The TPS6040x devices are not voltage regulators. The charge pumps output source resistance is
approximately 15 Ω at room temperature (with VI = 5 V), and VO approaches – 5 V when lightly loaded. VO will
droop toward GND as load current increases.
VO = −(VI – RO × IO)
RO[1
ƒosc C(fly) )4ǒ2RSWITCH )ESRCFLYǓ)ESRCO
RO = output resistance of the converter
efficiency considerations
The power efficiency of a switched-capacitor voltage converter is affected by three factors: the internal losses
in the converter IC, the resistive losses of the capacitors, and the conversion losses during charge transfer
between the capacitors. The internal losses are associated with the IC’s internal functions, such as driving the
switches, oscillator, etc. These losses are af fected by operating conditions such as input voltage, temperature,
and frequency. The next two losses are associated with the voltage converter circuit’s output resistance. Switch
losses occur because of the on-resistance of the MOSFET switches in the IC. Charge-pump capacitor losses
occur because of their ESR. The relationship between these losses and the output resistance is as follows:
PCAPACITOR LOSSES + PCONVERSION LOSSES = IO2 × RO
RSWITCH = resistance of a single MOSFET-switch inside the converter
fOSC = oscillator frequency
The first term is the effective resistance from an ideal switched-capacitor circuit. Conversion losses occur during
the charge transfer between C(fly) and CO when there is a voltage difference between them. The power loss is:
PCONV.LOSS +ƪ1
2 C(fly)ǒV2
I*V2
OǓ)1
2COǒV2
RIPPLE *2VOVRIPPLEǓƫ ƒosc
(1)
(2)
SLVS324A − JULY 2001 REVISED NOVEMBER 2004
4WWW.TI.COM
efficiency considerations (continued)
The efficiency of the TPS6040x devices is dominated by their quiescent supply current at low output current an d
by their output impedance at higher current.
h^IO
IO)IQǒ1*IO RO
VIǓ
Where, IQ = quiescent current.
capacitor selection
To maintain the lowest output resistance, use capacitors with low ESR (see Table 1). The charge-pump output
resistance is a function of C(fly)’s and CO’s ESR. Therefore, minimizing the charge-pump capacitor ’s ESR
minimizes the total output resistance. The capacitor values are closely linked to the required output current and
the output noise and ripple requirements. It is possible to only use 1-µF capacitors of the same type.
input capacitor (CI)
Bypass the incoming supply to reduce its ac impedance and the impact of the TPS6040x switching noise. The
recommended bypassing depends on the circuit configuration and where the load is connected. When the
inverter is loaded from OUT to GND, current from the supply switches between 2 x I O and zero. Therefore, use
a large bypass capacitor (e.g., equal to the value of C(fly)) if the supply has high ac impedance.
flying capacitor (C(fly))
Increasing the flying capacitor’s size reduces the output resistance. Small values increases the output
resistance. Above a certain point, increasing C(fly)’s capacitance has a negligible effect, because the output
resistance becomes dominated by the internal switch resistance and capacitor ESR.
output capacitor (CO)
Increasing the output capacitor’s size reduces the output ripple voltage. Decreasing its ESR reduces both output
resistance and ripple. Smaller capacitance values can be used with light loads if higher output ripple can be
tolerated. Use the following equation to calculate the peak-to-peak ripple.
VO(ripple) +IO
fosc Co)2 IO ESRCO
Table 1. Recommended Capacitor Values
DEVICE VI
[V] IO
[mA] CI
[µF] C(fly)
[µF] CO
[µF]
TPS60400 1.8…5.5 60 1 1 1
TPS60401 1.8…5.5 60 10 10 10
TPS60402 1.8…5.5 60 3.3 3.3 3.3
TPS60403 1.8…5.5 60 1 1 1
SLVS324A − JULY 2001 REVISED NOVEMBER 2004
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detailed description (continued)
Table 2. Recommended Capacitors
MANUFACTURER PART NUMBER SIZE CAPACITANCE TYPE
Taiyo Yuden EMK212BJ474MG
LMK212BJ105KG
LMK212BJ225MG
EMK316BJ225KL
LMK316BJ475KL
JMK316BJ106KL
0805
0805
0805
1206
1206
1206
0.47 µF
1 µF
2.2 µF
2.2 µF
4.7 µF
10 µF
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
TDK C2012X5R1C105M
C2012X5R1A225M
C2012X5R1A335M
0805
0805
0805
1 µF
2.2 µF
3.3 µF
Ceramic
Ceramic
Ceramic
Table 3 contains a list of manufacturers of the recommended capacitors. Ceramic capacitors will provide the
lowest output voltage ripple because they typically have the lowest ESR-rating.
Table 3. Recommended Capacitor Manufacturers
MANUFACTURER CAPACITOR TYPE INTERNET
Taiyo Yuden X7R/X5R ceramic www.t-yuden.com
TDK X7R/X5R ceramic www.component.tdk.com
Vishay X7R/X5R ceramic www.vishay.com
Kemet X7R/X5R ceramic www.kemet.com
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Voltage range: IN to GND −0.3 V to 5.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OUT to GND −5.5 V to 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CFLY− to GND 0.3 V to (VO − 0.3 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CFLY+ to GND −0.3 V to (VI + 0.3 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous power dissipation See Dissipation Rating Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current 80 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −55°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum junction temperature, TJ150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE TA < 25°C
POWER RATING DERATING FACTOR
ABOVE TA = 25°CTA = 70°C
POWER RATING TA = 85°C
POWER RATING
DBV 437 mW 3.5 mW/°C280 mW 227 mW
SLVS324A − JULY 2001 REVISED NOVEMBER 2004
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recommended operating conditions
MIN NOM MAX UNIT
Input voltage range, VI1.8 5.25 V
Output current range at OUT, IO60 mA
Input capacitor, CI0 C(fly) µF
Flying capacitor, C(fly) 1µF
Output capacitor, CO1 100 µF
Operating junction temperature, TJ−40 125 °C
electrical characteristics at CI = C(fly) = CO (according to Table 1), TC = −40°C to 85°C, VI = 5 V over
recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VI
Supply voltage range
At TC = −40°C to 85°C, RL = 5 kΩ1.8 5.25
V
VISupply voltage range At TC ≥ 0°C, RL = 5 kΩ1.6 V
IOMaximum output current at VO60 mA
VOOutput voltage −VIV
TPS60400 C(fly) = 1 µF, CO = 2.2 µF 35
VP−P
Output voltage ripple
TPS60401
IO = 5 mA
C(fly) = CO = 10 µF 20
mVP−P
VP−P Output voltage ripple TPS60402 IO = 5 mA C(fly) = CO = 3.3 µF 20 mVP−P
TPS60403 C(fly) = CO = 1 µF 15
TPS60400 125 270
TPS60401
At VI = 5 V
65 190
A
TPS60402 At VI = 5 V 120 270 µA
IQ
Quiescent current (no-load input
current)
TPS60403 425 700
IQ
Quiescent current (no-load input
current) TPS60400 210
TPS60401
At T ≤ 60°C,
VI = 5 V
135
A
TPS60402 At T ≤ 60°C, VI = 5 V 210 µA
TPS60403 640
TPS60400 VCO version 30 50−250 350
fOSC
Internal switching frequency
TPS60401 13 20 28
kHz
f
OSC
Internal switching frequency
TPS60402 30 50 70
kHz
TPS60403 150 250 300
TPS60400 CI = C(fly) = CO = 1 µF 12 15
Impedance at 25°C, VI = 5 V
TPS60401 CI = C(fly) = CO = 10 µF 12 15
Ω
Impedance at 25
°
C, V
I
= 5 V
TPS60402 CI = C(fly) = CO = 3.3 µF 12 15 Ω
TPS60403 CI = C(fly) = CO = 1 µF 12 15
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TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
ηEfficiency vs Output current at 3.3 V, 5 V
TPS60400, TPS60401, TPS60402, TPS60403 2, 3
IIInput current vs Output current
TPS60400, TPS60401, TPS60402, TPS60403 4, 5
ISSupply current vs Input voltage
TPS60400, TPS60401, TPS60402, TPS60403 6, 7
Output resistance vs Input voltage at −40°C, 0°C, 25°C, 85°C
TPS60400, CI = C(fly) = CO = 1 µF
TPS60401, CI = C(fly) = CO = 10 µF
TPS60402 , CI = C(fly) = CO = 3.3 µF
TPS60403, CI = C(fly) = CO = 1 µF
8, 9, 10,
11
VOOutput voltage vs Output current at 25°C, VIN=1.8 V, 2.5 V, 3.3 V, 5 V
TPS60400, CI = C(fly) = CO = 1 µF
TPS60401, CI = C(fly) = CO = 10 µF
TPS60402 , CI = C(fly) = CO = 3.3 µF
TPS60403, CI = C(fly) = CO = 1 µF
12, 13,
14, 15
fOSC Oscillator frequency vs Temperature at VI = 1.8 V, 2.5 V, 3.3 V, 5 V
TPS60400, TPS60401, TPS60402, TPS60403 16, 17,
18, 19
fOSC Oscillator frequency vs Output current TPS60400 at 2 V, 3.3 V, 5.0 V 20
Output ripple and noise VI = 5 V, IO = 30 mA, CI = C(fly) = CO = 1 µF (TPS60400)
VI = 5 V, IO = 30 mA, CI = C(fly) = CO = 10 µF (TPS60401)
VI = 5 V, IO = 30 mA, CI = C(fly) = CO = 3.3 µF (TPS60402)
VI = 5 V, IO = 30 mA, CI = C(fly) = CO = 1 µF (TPS60403)
21, 22
Figure 2
60
65
70
75
80
85
90
95
100
0102030405060708090100
TPS60400
VI = 5 V TPS60401
VI = 5 V
TPS60400
VI = 3.3 V
TPS60401
VI = 3.3 V
TA = 25°C
Efficiency − %
TPS60400, TPS60401
EFFICIENCY
vs
OUTPUT CURRENT
IO − Output Current − mA Figure 3
60
65
70
75
80
85
90
95
100
0102030405060708090100
TPS60403
VI = 5 V TPS60402
VI = 5 V
TPS60402
VI = 3.3 V
TPS60403
VI = 3.3 V
TA = 25°C
Efficiency − %
TPS60402, TPS60403
EFFICIENCY
vs
OUTPUT CURRENT
IO − Output Current − mA
SLVS324A − JULY 2001 REVISED NOVEMBER 2004
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TYPICAL CHARACTERISTICS
Figure 4
0.1
1
10
100
0.1 1 10 100
TPS60400
VI = 5 V
TPS60401
VI = 5 V TPS60401
VI = 2 V
TPS60400
VI = 2 V
TA = 25°C
− Input Current − mA
TPS60400, TPS60401
INPUT CURRENT
vs
OUTPUT CURRENT
IO − Output Current − mA
II
Figure 5
0.1
1
10
100
0.1 1 10 100
TPS60403
VI = 5 V
TPS60403
VI = 2 V
TPS60402
VI = 5 V
TPS60402
VI = 2 V
TA = 25°C
− Input Current − mA
TPS60402, TPS60403
INPUT CURRENT
vs
OUTPUT CURRENT
IO − Output Current − mA
II
Figure 6
0
0.2
0.4
0.6
012345
IO = 0 mA
TA = 25°C
− Supply Current − mA
TPS60400, TPS60401
SUPPLY CURRENT
vs
INPUT VOLTAGE
VI − Input Voltage − V
IDD
TPS60401
TPS60400
Figure 7
0
0.2
0.4
0.6
012345
IO = 0 mA
TA = 25°C
− Supply Current − mA
TPS60402, TPS60403
SUPPLY CURRENT
vs
INPUT VOLTAGE
VI − Input Voltage − V
IDD
TPS60402
TPS60403
SLVS324A − JULY 2001 REVISED NOVEMBER 2004
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TYPICAL CHARACTERISTICS
Figure 8
0
5
10
15
20
25
30
35
40
123456
TA = 85°C
TA = 25°C
TA = −40°C
− Output Resistance −
TPS60400
OUTPUT RESISTANCE
vs
INPUT VOLTAGE
VI − Input Voltage − V
ro
IO = 30 mA
CI = C(fly) = CO = 1 µF
Ω
Figure 9
0
5
10
15
20
25
30
35
40
123456
TA = 85°C
TA = 25°C
TA = −40°C
TPS60401
OUTPUT RESISTANCE
vs
INPUT VOLTAGE
VI − Input Voltage − V
IO = 30 mA
CI = C(fly) = CO = 10 µF
− Output Resistance −
roΩ
Figure 10
0
5
10
15
20
25
30
35
40
123456
TA = 85°C
TA = 25°C
TA = −40°C
TPS60402
OUTPUT RESISTANCE
vs
INPUT VOLTAGE
VI − Input Voltage − V
IO = 30 mA
CI = C(fly) = CO = 3.3 µF
− Output Resistance −
roΩ
Figure 11
0
5
10
15
20
25
30
35
40
123456
TA = 85°C
TA = 25°C
TA = −40°C
TPS60403
OUTPUT RESISTANCE
vs
INPUT VOLTAGE
VI − Input Voltage − V
IO = 30 mA
CI = C(fly) = CO = 1 µF
− Output Resistance −
roΩ
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10 WWW.TI.COM
TYPICAL CHARACTERISTICS
Figure 12
−6
−5
−4
−3
−2
−1
0
0 102030405060
VI = 1.8 V
VI = 2.5 V
VI = 3.3 V
VI = 5 V
− Output Voltage − V
TPS60400
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
IO − Output Current − mA
VO
TA = 25°C
Figure 13
−6
−5
−4
−3
−2
−1
0
0 102030405060
VI = 1.8 V
VI = 2.5 V
VI = 3.3 V
VI = 5 V
− Output Voltage − V
TPS60401
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
IO − Output Current − mA
VO
TA = 25°C
Figure 14
−6
−5
−4
−3
−2
−1
0
0 102030405060
VI = 1.8 V
VI = 2.5 V
VI = 3.3 V
VI = 5 V
− Output Voltage − V
TPS60402
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
IO − Output Current − mA
VO
TA = 25°C
Figure 15
−6
−5
−4
−3
−2
−1
0
0 102030405060
VI = 1.8 V
VI = 2.5 V
VI = 3.3 V
VI = 5 V
− Output Voltage − V
TPS60403
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
IO − Output Current − mA
VO
TA = 25°C
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TYPICAL CHARACTERISTICS
Figure 16
0
50
100
150
200
250
−40−30−20−10 0 10 20 30 40 50 60 70 80 90
VI = 1.8 V
VI = 2.5 V
VI = 3.3 V
VI = 5 V
IO = 10 mA
− Oscillator Frequency − kHz
TPS60400
OSCILLATOR FREQUENCY
vs
FREE-AIR TEMPERATURE
TA − Free-Air Temperature − °C
fosc
Figure 17
−40−30−20−10 0 10 20 30 40 50 60 70 80 90
− Oscillator Frequency − kHz
TPS60401
OSCILLATOR FREQUENCY
vs
FREE-AIR TEMPERATURE
TA − Free-Air Temperature − °C
fosc
22
22.2
22.4
22.6
22.8
23
23.2
23.4
23.6
23.8
24
IO = 10 mA
VI = 5 V
VI = 3.3 V
VI = 2.5 V
VI = 1.8 V
Figure 18
−40−30−20−10 0 10 20 30 40 50 60 70 80 90
− Oscillator Frequency − kHz
TPS60402
OSCILLATOR FREQUENCY
vs
FREE-AIR TEMPERATURE
TA − Free-Air Temperature − °C
fosc
IO = 10 mA
VI = 5 V
VI = 3.3 V
VI = 2.5 V
VI = 1.8 V
49
50
51
52
53
54
55
56
57
Figure 19
−40−30−20−10 0 10 20 30 40 50 60 70 80 90
− Oscillator Frequency − kHz
TPS60403
OSCILLATOR FREQUENCY
vs
FREE-AIR TEMPERATURE
TA − Free-Air Temperature − °C
fosc
IO = 10 mA
VI = 5 V
VI = 3.3 V
VI = 2.5 V
VI = 1.8 V
150
160
170
180
190
200
210
220
230
240
250
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12 WWW.TI.COM
TYPICAL CHARACTERISTICS
Figure 20
0
50
100
150
200
250
300
0102030405060708090100
− Oscillator Frequency − kHz
TPS60400
OSCILLATOR FREQUENCY
vs
OUTPUT CURRENT
IO − Output Current − mA
fosc
TA = 25°C
VI = 5 V
VI = 3.3 V
VI = 1.8 V
Figure 21
− Output Voltage − mV
TPS60401, TPS60402
OUTPUT VOLTAGE
vs
TIME
VO
t − Time − µs
VI = 5 V
IO = 30 mA
TPS60402
TPS60401
50 mV/DIV
50 mV/DIV
20 µs/DIV
Figure 22
− Output Voltage − mV
TPS60400, TPS60403
OUTPUT VOLTAGE
vs
TIME
VO
t − Time − µs
VI = 5 V
IO = 30 mA
TPS60403
TPS60400
100 mV/DIV
50 mV/DIV
4 µs/DIV
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APPLICATION INFORMATION
voltage inverter
The most common application for these devices is a charge-pump voltage inverter (see Figure 23). This
application requires only two external components; capacitors C(fly) and CO, plus a bypass capacitor, if
necessary. Refer to the capacitor selection section for suggested capacitor types.
TPS60400
C1− C1+
35
OUTIN
GND
1
2
4
CI
1 µFCO
1 µF
−5 V,
Max 60 mA
Input 5 V
C(fly) 1 µF
Figure 23. Typical Operating Circuit
For the maximum output current and best performance, three ceramic capacitors of 1 µF (TPS60400,
TPS60403) are recommended. For lower currents or higher allowed output voltage ripple, other capacitors can
also be used. It is recommended that the output capacitors has a minimum value of 1 µF. With flying capacitors
lower than 1 µF, the maximum output power will decrease.
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APPLICATION INFORMATION
RC-post filter
TPS60400
OUT C1+
IN
C1− GND
1
2
3
5
4
C(fly) 1 µF
CO
1 µFCP
CI
1 µF
VO (−VI)
GND
VI
GND
RP
Figure 24. TPS60400 and TPS60401 With RC-Post Filter
An output filter can easily be formed with a resistor (RP) and a capacitor (CP). Cutoff frequency is given by:
ƒc+1
2pRPCP(1)
and ratio VO/VOUT is:
ŤVO
VOUTŤ+1
1)ǒ2pƒRPCPǓ2
Ǹ(2)
with RP = 50 Ω, CP = 0.1 µF and f = 250 kHz: ŤVO
VOUTŤ+0.125
The formula refers only to the relation between output and input of the ac ripple voltages of the filter.
LC-post filter
TPS60400
OUT C1+
IN
C1− GND
1
2
3
5
4
C(fly) 1 µF
CO
1 µFCP
CI
1 µF
VO (−VI)
GND
VI
GND
LP
VOUT
Figure 25. LC-Post Filter
Figure 25 shows a configuration with a LC-post filter to further reduce output ripple and noise.
SLVS324A − JULY 2001 REVISED NOVEMBER 2004
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APPLICATION INFORMATION
Table 4. Measurement Results on the TPS60400 (Typical)
VI
[V]
IO(2)
[mA]
CI
[µF] C(fly)
[µF] CO
[µF] LP
[µH]
CP
[µF] BW = 500 MH
z
VPOUT
BW = 20 MHz
VPOUT
VPOUT
VACeff [mV]
I
[V]
O(2)
[mA]
CERAMIC CERAMIC CERAMIC
P
[
µ
H]
CERAMIC
VPOUT
VP−P[mV]
VPOUT
VP−P[mV]
POUT
VACeff [mV]
5 60 1 1 1 320 240 65
5 60 1 1 2.2 120 240 32
5 60 1 1 1 0.1 (X7R) 260 200 58
5 60 1 1 1 0.1 0.1 (X7R) 220 200 60
5 60 1 1 2.2 0.1 0.1 (X7R) 120 100 30
5 60 1 1 10 0.1 0.1 (X7R) 50 28 8
rail splitter
TPS60400
OUT C1+
IN
C1− GND
1
2
3
5
4
C(fly) 1 µF
CO
1 µF
CI
1 µF
VO = VI/2
GND
VI
GND
C3
1 µF
Figure 26. TPS60400 as a High-Efficiency Rail Splitter
A switched-capacitor voltage inverter can be configured as a high efficiency rail-splitter. This circuit provides a
bipolar power supply that is useful in battery powered systems to supply dual-rail ICs, like operational amplifiers.
Moreover, the SOT23-5 package and associated components require very little board space.
After power is applied, the flying capacitor (C(fly)) connects alternately across the output capacitors C3 and CO.
This equalizes the voltage on those capacitors and draws current from VI to VO as required to maintain the
output at 1/2 VI.
The maximum input voltage between VI and GND in the schematic (or between IN and OUT at the device itself)
must not exceed 6.5 V.
SLVS324A − JULY 2001 REVISED NOVEMBER 2004
16 WWW.TI.COM
APPLICATION INFORMATION
combined doubler/inverter
In the circuit of Figure 27, capacitors CI, C(fly), and CO form the inverter, while C1 and C2 form the doubler. C1
and C (fly) are the flying capacitors; CO and C2 are the output capacitors. Because both the inverter and doubler
use part of the charge-pump circuit, loading either output causes both outputs to decline toward GND. Make
sure the sum of the currents drawn from the two outputs does not exceed 60 mA. The maximum output current at
V(pos) must not exceed 30 mA. If the negative output is loaded, this current must be further reduced.
TPS60400
OUT C1+
IN
C1− GND
1
2
3
5
4
C(fly) 1 µF
CO
1 µF
CI
1 µF
−VI
GNDGND
VI
C1
+
+
+
D2
C2
+
V(pos)
+
II ≈ −IO + 2 × IO(POS)
Figure 27. TPS60400 as Doubler/Inverter
cascading devices
T wo devices can be cascaded to produce an even larger negative voltage (see Figure 28). The unloaded output
voltage i s normally −2 × VI, but this is reduced slightly by the output resistance of the first device multiplied by the
quiescent current of the second. When cascading more than two devices, the output resistance rises
dramatically.
TPS60400
OUT C1+
IN
C1− GND
1
2
3
5
4
C(fly) 1 µF
CO
1 µF
CI
1 µF
VO (−2 VI)
GND
VI
GND
TPS60400
OUT C1+
IN
C1− GND
1
2
3
5
4
CO
1 µF
GND
+
+
+
C(fly) 1 µF
Figure 28. Doubling Inverter
SLVS324A − JULY 2001 REVISED NOVEMBER 2004
17
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APPLICATION INFORMATION
paralleling devices
Paralleling multiple TPS6040xs reduces the output resistance. Each device requires its own flying capacitor
(C(fly)), but the output capacitor (CO) serves all devices (see Figure 29). Increase CO’s value by a factor of n,
where n is the number of parallel devices. Equation 1 on page 3 shows the equation for calculating output
resistance.
TPS60400
OUT C1+
IN
C1− GND
1
2
3
5
4
C(fly) 1 µF
CI
1 µF
VO (−VI)
GND
VI
GND
TPS60400
OUT C1+
IN
C1− GND
1
2
3
5
4
C(fly) 1 µF
CO
2.2 µF
+
Figure 29. Paralleling Devices
active-Schottky diode
For a short period of time, when the input voltage is applied, but the inverter is not yet working, the output
capacitor is charged positive by the load. To prevent the output being pulled above GND, a Schottky diode must
be added in parallel to the output. The function of this diode is integrated into the TPS6040x devices, which gives
a defined startup performance and saves board space.
A current sink and a diode in series can approximate the behavior of a typical, modern operational amplifier.
Figure 30 shows the current into this typical load at a given voltage. The TPS6040x devices are optimized to
start into these loads.
TPS60400
C1−C1+
53
OUT
IN
GND
1
2
4
CI
1 µFCO
1 µF
C(fly) 1 µF
Typical
Load
IO
VO (−VI)
+V
−V
VI
GND
60 mA
25 mA
0.4 V 1.25 V 5 V
Load Current
Voltage at the Load
0.4 V
Figure 30. Typical Load Figure 31. Maximum Start-Up Current
SLVS324A − JULY 2001 REVISED NOVEMBER 2004
18 WWW.TI.COM
APPLICATION INFORMATION
shutting down the TPS6040x
If shutdown is necessary, use the circuit in Figure 32. The output resistance of the TPS6040x will typically be
15 Ω plus two times the output resistance of the buffer.
Connecting multiple buffers in parallel can reduce the output resistance of the buffer driving the IN pin.
TPS60400
OUT C1+
IN
C1− GND
1
2
3
5
4
C(fly) 1 µF
CO
1 µF
CI
1 µF
VO (−VI)
GND
VI
GND
SDN
Figure 32. Shutdown Control
GaAs supply
A solution for a –2.7-V/3-mA GaAs bias supply is proposed in Figure 33. The input voltage of 3.3 V is first inverted
with a TPS60403 and stabilized using a TLV431 low-voltage shunt regulator. Resistor RP with capacitor CP is
used for filtering the output voltage.
TPS60400
OUT C1+
IN
C1− GND
1
2
3
5
4
C(fly) 0.1 µF
CO
1 µF
CI
0.1 µF
VO (−2.7 V/3 mA)
GND
VI (3.3 V)
GND
RP
TLV431
R2
R1
CP
Figure 33. GaAs Supply
VO+*ǒ1)R1
R2Ǔ Vref *R1 II(ref)
A 0.1-µF capacitor was selected for C(fly). By this, the output resistance of the inverter is about 52 Ω.
SLVS324A − JULY 2001 REVISED NOVEMBER 2004
19
WWW.TI.COM
APPLICATION INFORMATION
GaAs supply (continued)
RPMAX can be calculated using the following equation:
RPMAX +ǒVCO *VO
IO*ROǓ
With: VCO = −3.3 V; VO = −2.7 V; IO = −3 mA
RPMAX = 200 Ω − 52 Ω = 148 Ω
A 100-Ω resistor was selected for RP.
The reference voltage across R2 is 1.24 V typical. With 5-µA current for the voltage divider, R2 gets:
R2 +1.24 V
5mA[250 kW
R1 +2.7 *1.24 V
5mA[300 kW
With CP = 1 µF the ratio VO/VI of the RC post filter is:
ŤVO
VIŤ+1
1)(2p125000Hz 100W 1mF)2
Ǹ[0.01
step-down charge pump
By exchanging GND with OUT (connecting the GND pin with OUT and the OUT pin with GND), a step-down
charge pump can easily be formed. In the first cycle S1 and S3 are closed, and C(fly) with CO in series are
charged. Assuming the same capacitance, the voltage across C(fly) and CO is split equally between the
capacitors. In the second cycle, S2 and S4 close and both capacitors with VI/2 across are connected in parallel.
C(fly)
1 µF
S2
S1
S3
S4
CO
1 µF
VO (VI/2)
GND
VI
VO (VI/2)
+
Figure 34. Step-Down Principle
TPS60400
OUT C1+
IN
C1− GND
1
2
3
5
4
C
(fly)
1
µ
F
CO
1 µF
CI
1 µF
VO (VI/2
)
GND
VI
GND
Figure 35. Step-Down Charge Pump Connection
The maximum input voltage between VI and GND in the schematic (or between IN and OUT at the device itself)
must not exceed 6.5 V. For input voltages in the range of 6.5 V to 11 V, an additional Zener-diode is
recommended (see Figure 36).
SLVS324A − JULY 2001 REVISED NOVEMBER 2004
20 WWW.TI.COM
APPLICATION INFORMATION
OUT
IN
C1−
TPS60400
C1+
GND
5
4
1
2
3
C(fly) 1 µF
5V6
CO
1 µF
CI
1 µF
VI
GND
VO (VI/2)
GND
Figure 36.
power dissipation
As given in the data sheet, the thermal resistance of the unsoldered package is RθJA = 347°C/W. Soldered on
the EVM, a typical thermal resistance of RθJA(EVM) = 180°C/W was measured.
The terminal resistance can be calculated using the following equation:
RqJA +TJ*TA
PD
Where:
TJ is the junction temperature.
TA is the ambient temperature.
PD is the power that needs to be dissipated by the device.
RqJA +TJ*TA
PD
The maximum power dissipation can be calculated using the following equation:
PD = VI × II − VO × IO = VI(max) × (IO + I(SUPPLY)) − VO × IO
The maximum power dissipation happens with maximum input voltage and maximum output current.
At maximum load the supply current is 0.7 mA maximum.
PD = 5 V × (60 mA + 0.7 mA) − 4.4 V × 60 mA = 40 mW
With this maximum rating and the thermal resistance of the device on the EVM, the maximum temperature rise
above ambient temperature can be calculated using the following equation:
∆TJ = RθJA × PD = 180°C/W × 40 mW = 7.2°C
This means that the internal dissipation increases TJ by <10°C.
The junction temperature of the device shall not exceed 125°C.
This means the IC can easily be used at ambient temperatures up to:
TA = TJ(max) − ∆TJ = 125°C/W − 10°C = 115°C
SLVS324A − JULY 2001 REVISED NOVEMBER 2004
21
WWW.TI.COM
APPLICATION INFORMATION
layout and board space
All capacitors should be soldered as close as possible to the IC. A PCB layout proposal for a single-layer board
is shown in Figure 37. Care has been taken to connect all capacitors as close as possible to the circuit to achieve
optimized output voltage ripple performance.
CFLY
CIN
COUT
U1
TPS60400
IN
GND
OUT
Figure 37. Recommended PCB Layout for TPS6040x (top layer)
device family products
Other inverting dc-dc converters from Texas Instruments are listed in Table 5.
Table 5. Product Identification
PART NUMBER DESCRIPTION
TPS6735 Fixed negative 5-V, 200-mA inverting dc-dc converter
TPS6755 Adjustable 1-W inverting dc-dc converter
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TPS60400DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS60400DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS60400DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS60400DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS60401DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS60401DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS60401DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS60401DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS60402DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS60402DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS60402DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS60402DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS60403DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS60403DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS60403DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS60403DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 1
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS60400, TPS60401, TPS60402, TPS60403 :
•Automotive: TPS60400-Q1,TPS60401-Q1,TPS60402-Q1,TPS60403-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
PACKAGE OPTION ADDENDUM
www.ti.com 18-Sep-2008
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS60400DBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS60400DBVT SOT-23 DBV 5 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS60401DBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS60401DBVT SOT-23 DBV 5 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS60402DBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS60402DBVT SOT-23 DBV 5 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS60403DBVR SOT-23 DBV 5 3000 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
TPS60403DBVT SOT-23 DBV 5 250 180.0 9.0 3.15 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS60400DBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TPS60400DBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TPS60401DBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TPS60401DBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TPS60402DBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TPS60402DBVT SOT-23 DBV 5 250 182.0 182.0 20.0
TPS60403DBVR SOT-23 DBV 5 3000 182.0 182.0 20.0
TPS60403DBVT SOT-23 DBV 5 250 182.0 182.0 20.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
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