HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6616-B Issued Date : 1993.09.24 Revised Date : 2000.12.01 Page No. : 1/4 H2N6718V NPN EPITAXIAL PLANAR TRANSISTOR Description The H2N6718V is designed for general purpose medium power amplifier and switching. Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C)................................................................................... 1.6 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage .................................................................................... 100 V BVCEO Collector to Emitter Voltage................................................................................. 100 V BVEBO Emitter to Base Voltage ........................................................................................... 5 V IC Collector Current .............................................................................................................. 1 A Electrical Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO *VCE(sat) *hFE1 *hFE2 *hFE3 fT Cob Min. 100 100 5 80 50 20 50 - Typ. - Max. 100 350 250 20 Unit V V V nA mV MHz pF Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=80V, IE=0 IC=350mA, IB=35mA IC=50mA, VCE=1V IC=250mA, VCE=1V IC=500mA, VCE=1V VCE=10V, IC=50mA, f=100MHz VCB=10V, f=1MHz, IE=0 *Pulse Test : Pulse Width 380us, Duty Cycle2% HSMC Product Specification HI-SINCERITY Spec. No. : HE6616-B Issued Date : 1993.09.24 Revised Date : 2000.12.01 Page No. : 2/4 MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current Saturation Voltage & Collector Current 1000 1000 Saturation Voltage (mV) hFE VCE=1V 100 100 VCE(sat) @ IC=10IB 10 10 0.1 1 10 100 0.1 1000 1 Capacitance & Reverse-Biased Voltage 100 1000 Cutoff Frequency & Collector Current 100 1000 Cutoff Frequency (MHz) Capacitance (pF) 10 Collector Current (mA) Collector Current (mA) 10 Cob 1 VCE=10V 100 10 0.1 1 10 100 1000 1 10 Reverse Biased Voltage (V) 100 1000 Collector Current (mA) Power Derating Safe Operating Area 10000 1800 1000 Power Dissipation-PD(mW) Collector Current-IC (mA) 1600 100 PT=1 ms PT=100 ms 10 PT=1 s 1400 1200 1000 800 600 400 200 0 1 1 10 100 Forward Voltage-VCE (V) 1000 0 20 40 60 80 100 120 140 160 o Ambient Temperature-Ta( C) HSMC Product Specification HI-SINCERITY Spec. No. : HE6616-B Issued Date : 1993.09.24 Revised Date : 2000.12.01 Page No. : 3/4 MICROELECTRONICS CORP. Temperature Profile for Dip Soldering IR Reflow Profile 260 300 10+/-2 sec 240 10+/-2 sec 220 250 180 200 o Temperature( C) o Temperature( C) 200 160 40+/-20 sec 140 120 100 80 150 100 150+/-30 60 120+/-20 sec 50 40 20 0 0 0 50 100 150 Time(sec) 200 250 300 0 50 100 150 200 250 300 350 Time(sec) HSMC Product Specification HI-SINCERITY Spec. No. : HE6616-B Issued Date : 1993.09.24 Revised Date : 2000.12.01 Page No. : 4/4 MICROELECTRONICS CORP. TO-126ML Dimension Marking : A HSMC Logo Part Number Date Code B D F C Rank O H E Product Series Ink Marking 3 2 I Style : Pin 1.Emitter 2.Collector 3.Base G N 1 J M L K 3-Lead TO-126ML Plastic Package HSMC Package Code : D *:Typical Inches Min. Max. 0.1356 0.1457 0.0170 0.0272 0.0344 0.0444 0.0501 0.0601 0.1131 0.1231 0.0737 0.0837 0.0294 0.0494 0.0462 0.0562 DIM A B C D E F G H Millimeters Min. Max. 3.44 3.70 0.43 0.69 0.87 1.12 1.27 1.52 2.87 3.12 1.87 2.12 0.74 1.25 1.17 1.42 DIM I J K L M N O Inches Min. Max. *0.1795 0.0268 0.0331 0.5512 0.5906 0.2903 0.3003 0.1378 0.1478 0.1525 0.1625 0.0740 0.0842 Millimeters Min. Max. *4.56 0.68 0.84 14.00 15.00 7.37 7.62 3.50 3.75 3.87 4.12 1.88 2.14 Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification