WP3DP3BT/BD-P22 - KINGBRIGHT CORPORATION

DESCRIPTION

zMade with NPN silicon phototransistor chips

FEATURES

z Mechanically and spectrally matched to the infrared

emitting LED lamp

zBlack diffused lens

zDaylight filter

zRoHS compliant

APPLICATIONS

zInfrared applied systems

zOptoelectronic switches

zPhotodetector control circuits

zSensor technology

PACKAGE DIMENSIONS

WP3DP3BT/BD-P22

Phototransistor

Note:

1. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

ABSOLUTE MAXIMUM RATINGS at TA=25°C

Parameter Units

Collector-to-Emitter Voltage V

Emitter-to-Collector Voltage V

Power Dissipation at (or below) 25°C Free Air Temperature mW

Operating Temperature °C

Storage Temperature °C

Max.Ratings

100

-40 to +85

Lead Soldering Temperature(>5mm for 5sec) 260 °C

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ±0.25(0.01") unless otherwise noted.

3. Lead spacing is measured where the leads emerge from the package.

4. The specifications, characteristics and technical data described in the datasheet are subject to change

without prior notice.

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0.5 0.5

90°

15°

0°

30°

45°

60°

75°

-15°

-30°

-45°

-60°

-75°

-90°

0.01.0 1.0

= 25 °C

Relative sensitivity

ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C

WP3DP3BT/BD-P22

20%

40%

60%

80%

100%

600 700 800 900 1000 1100 1200

= 25 °C

Wavelength (nm)

Relative spectral sensitivity (a. u.)

RELATIVE SPECTRAL SENSITIVITY vs. WAVELENGTH RELATIVE RADIANT SENSITIVITY vs. ANGULAR DISPLACEMENT

Parameter Symbol Min. Typ. Max. Units Test Conditions

Collector-to-Emitter Breakdown Voltage VBR CEO 30 - - V IC = 100uA

Ee = 0mW/cm2

Emitter-to-Collector Breakdown Voltage VBR ECO 5 - - V IE = 100uA

Ee = 0mW/cm2

Collector-to-Emitter Saturation Voltage VCE (SAT) - - 0.8 V IC = 2mA

Ee = 20mW/cm2

Collector Dark Current ICEO - - 100 nA VCE = 10V

Ee = 0mW/cm2

Rise Time(10% to 90%) TR - 15 - µS VCE = 5V

IC = 1mA

RL = 1000Ω

Fall Time(90% to 10%) TF - 15 - µS

On State Collector Current I(ON) 0.1 0.2 - mA VCE = 5V

Ee = 1mW/cm2

λ = 940nm

Range of spectral bandwidth λ0.1 670 - 1070 nm -

Wavelength of peak sensitivity λp - 940 - nm -

Angle of half sensitivity 2θ1/2 - 50 - deg -

TECHNICAL DATA

PHOTOTRANSISTOR

0.05

0.1

0.15

0.2

0.25

0.3

012345

= 25 °C

Collector-emitter voltage V

(V)

Collector current (mA)

Ee = 0.25mW/cm

Ee = 0.5mW/cm

Ee = 1mW/cm

100

120

140

160

0 20406080100

=5V

Ee=1mW/cm

Ambient temperature (°C)

Relative collector current (%)

0.01

0.1

0.01 0.1 1 10

=5V

= 25 °C

Irradiance Ee (mW/cm

)

Collector current Ic (mA)

Collector Current vs.

Irradiance

Relative Collector Current vs.

Ambient Temperature

Collector Current vs.

Collector-Emitter Voltage

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TECHNICAL DATA

WP3DP3BT/BD-P22

PHOTOTRANSISTOR

RECOMMENDED WAVE SOLDERING PROFILE

Notes:

1. Recommend pre-heat temperature of 105°C or less (as measured with a thermocouple

attached to the LED pins) prior to immersion in the solder wave with a maximum solder bath

temperature of 260°C

2. Peak wave soldering temperature between 245°C ~ 255°C for 3 sec (5 sec max).

3. Do not apply stress to the epoxy resin while the temperature is above 85°C.

4. Fixtures should not incur stress on the component when mounting and during soldering process.

5. SAC 305 solder alloy is recommended.

6. No more than one wave soldering pass.

PACKING & LABEL SPECIFICATIONS

0.01

0.1

0 5 10 15 20 25 30

= 25 °C

Collector-emitter voltage V

(V)

Collector dark current (nA)

0.1

100

1000

0 25 50 75 100

= 20V

Ee = 0

Ambient temperature (°C)

Collector dark current (nA)

100

125

0 20406080100

Ambient temperature (°C)

Collector power dissipation

Pd (mW)

Collector Dark Current vs.

Ambient Temperature

Collector Power Dissipation vs.

Ambient Temperature

Collector Dark Current vs.

Collector-Emitter Voltage

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WP3DP3BT/BD-P22

PRECAUTIONS

Storage conditions

1. Avoid continued exposure to the condensing moisture environment and keep the product away from rapid transitions in ambient

temperature.

2. LEDs should be stored with temperature ≤ 30°C and relative humidity < 60%.

3. Product in the original sealed package is recommended to be assembled within 72 hours of opening.

Product in opened package for more than a week should be baked for 30 (+10/-0) hours at 85 ~ 100°C.

2. When soldering wires to the LED, each wire joint should be separately insulated with heat-shrink tube to prevent short-circuit contact.

Do not bundle both wires in one heat shrink tube to avoid pinching the LED leads. Pinching stress on the LED leads may damage the

internal structures and cause failure.

3. Use stand-offs (Fig.1) or spacers (Fig.2) to securely position the LED above the PCB.

4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead

bend (Fig. 3 ,Fig. 4).

5. During lead forming, use tools or jigs to hold the leads securely so that the bending force

will not be transmitted to the LED lens and its internal structures. Do not perform lead

forming once the component has been mounted onto the PCB. (Fig. 5 )

LED Mounting Method

1. The lead pitch of the LED must match the

pitch of the mounting holes on the PCB

during component placement.

Lead-forming may be required to insure

the lead pitch matches the hole pitch.

Refer to the figure below for proper lead

forming procedures.

Note 1-3: Do not route PCB trace in the contact area between the

leadframe and the PCB to prevent short-circuits.

○

Correct mounting method " x " Incorrect mounting method

Lead Forming Procedures

1. Do not bend the leads more than twice. (Fig. 6 )

2. During soldering, component covers and holders should leave

clearance to avoid placing damaging stress on the LED during

soldering. (Fig. 7)

3. The tip of the soldering iron should never touch the lens epoxy.

4. Through-hole LEDs are incompatible with reflow soldering.

5. If the LED will undergo multiple soldering passes or face other

processes where the part may be subjected to intense heat,

please check with Kingbright for compatibility.

PRECAUTIONARY NOTES

1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.

2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to

the latest datasheet for the updated specifications.

3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If

customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.

4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening

liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.

5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.

6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes

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