2SA1162YT1 - ON Semiconductor

 Semiconductor Components Industries, LLC, 2003

October, 2003 − Rev. 0 Publication Order Number:

2SA1162GT1/D

2SA1162GT1, 2SA1162YT1

General Purpose

Amplifier Transistors

PNP Surface Mount

•Moisture Sensitivity Level: 1

•ESD Rating: TBD

MAXIMUM RATINGS (TA = 25°C)

Rating Symbol Value Unit

Collector−Base Voltage V(BR)CBO 50 Vdc

Collector−Emitter Voltage V(BR)CEO 50 Vdc

Emitter−Base Voltage V(BR)EBO 7.0 Vdc

Collector Current − Continuous IC150 mAdc

Collector Current − Peak IC(P) 200 mAdc

Base Current IB30 mAdc

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Power Dissipation PD200 mW

Junction Temperature TJ150 °C

Storage Temperature Tstg −55 to +150 °C

SC−59

CASE 318D

STYLE 1

MARKING DIAGRAM

SAx M

SA = Specific Device Code

x = G or Y

M = Date Code

COLLECTOR

BASE 1

EMITTER

Device† Package Shipping†

ORDERING INFORMATION

2SA1162GT1 SC−59 3000/Tape & Reel

†The “T1” suffix refers to a 7 inch reel.

2SA1162YT1 SC−59 3000/Tape & Reel

http://onsemi.com

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

2SA1162GT1, 2SA1162YT1

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ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Characteristic Symbol Min Max Unit

Collector−Emitter Breakdown Voltage (IC = 2.0 mAdc, IB = 0) V(BR)CEO 50 − Vdc

Collector−Base Breakdown Voltage (IC = 10 Adc, IE = 0) V(BR)CBO 50 − Vdc

Emitter−Base Breakdown Voltage (IE = 10 Adc, IC = 0) V(BR)EBO 7.0 − Vdc

Collector−Base Cutoff Current (VCB = 50 Vdc, IE = 0) ICBO − 0.1 Adc

Emitter Cut−off Current (VEB = 5 V, IC = 0 V) IEBO − 0.1 A

Collector−Emitter Cutoff Current

(VCE = 10 Vdc, IB = 0)

(VCE = 30 Vdc, IB = 0)

ICEO −

−0.1

2.0 Adc

Adc

DC Current Gain (Note 1)

(VCE = 6.0 Vdc, IC = 2.0 mAdc) 2SA1162YT1

2SA1162GT1

hFE 120

200 240

400

−

Collector−Emitter Saturation Voltage (IC = 100 mAdc, IB = 10 mAdc) VCE(sat) − 0.3 Vdc

SMALL−SIGNAL CHARACTERISTICS

Current−Gain − Bandwidth Product

(IC = 1.0 mA, VCE = 10.0 V, f = 10 MHz) fT80 − MHz

Output Capacitance

(VCB = 10 V, f = 1.0 MHz) Cobo − 7.0 pF

Noise Figure

(IC = 0.1 mA, VCE = 6.0 Vdc, RS = 10 k, f = 1.0 kHz, BW = 200 Hz) NF − 10 dB

1. Pulse Test: Pulse Width ≤ 300 s, D.C. ≤ 2%.

2SA1162GT1, 2SA1162YT1

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PD = TJ(max) − TA

RJA

PD = 150°C − 25°C

370°C/W = 338 milliwatts

•The soldering temperature and time should not exceed

260°C for more than 10 seconds.

•When shifting from preheating to soldering, the maxi-

mum temperature gradient should be 5°C or less.

•After soldering has been completed, the device should

be allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and re-

sult in latent failure due to mechanical stress.

•Mechanical stress or shock should not be applied dur-

ing cooling

* Soldering a device without preheating can cause exces-

sive thermal shock and stress which can result in damage

to the device.

INFORMATION FOR USING THE SC−59 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to insure proper solder connection

SC−59 POWER DISSIPATION

The power dissipation of the SC−59 is a function of the

pad size. This can vary from the minimum pad size for sol-

dering to the pad size given for maximum power dissipa-

tion. Power dissipation for a surface mount device is deter-

mined b y T J(max), the maximum rated junction temperature

of the die, RJA, the thermal resistance from the device

junction t o ambient; and the operating temperature, TA. Us-

ing the values provided on the data sheet, PD can be calcu-

lated as follows.

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into

the equation for an ambient temperature TA of 25°C, one

can calculate the power dissipation of the device which in

this case is 338 milliwatts.

The 370°C/W assumes the use of the recommended foot-

print on a glass epoxy printed circuit board to achieve a

power dissipation of 338 milliwatts. Another alternative

would be to use a ceramic substrate or an aluminum core

board such as Thermal Clad. Using a board material such

as Thermal Clad, the power dissipation can be doubled us-

ing the same footprint.

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within

a short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are sub-

jected.

•Always preheat the device.

•The delta temperature between the preheat and solder-

ing should be 100°C or less.*

•When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum tem-

perature ratings as shown on the data sheet. When us-

ing infrared heating with the reflow soldering method,

the difference should be a maximum of 10°C.

inches

0.039

1.0

0.094

0.8

2.4

0.031

0.95

0.037

0.95

0.037

2SA1162GT1, 2SA1162YT1

http://onsemi.com

STEP 1

PREHEAT

ZONE 1

RAMP"

STEP 2

VENT

SOAK"

STEP 3

HEATING

ZONES 2 & 5

RAMP"

STEP 4

HEATING

ZONES 3 & 6

SOAK"

STEP 5

HEATING

ZONES 4 & 7

SPIKE"

STEP 6

VENT

STEP 7

COOLING

200°C

150°C

100°C

50°C

TIME (3 TO 7 MINUTES TOTAL) TMAX

SOLDER IS LIQUID FOR

40 TO 80 SECONDS

(DEPENDING ON

MASS OF ASSEMBLY)

205° TO 219°C

PEAK AT

SOLDER JOINT

DESIRED CURVE FOR LOW

MASS ASSEMBLIES

100°C

150°C

160°C

140°C

Figure 1. Typical Solder Heating Profile

DESIRED CURVE FOR HIGH

MASS ASSEMBLIES

170°C

For any given circuit board, there will be a group of con-

trol settings that will give the desired heat pattern. The op-

erator must set temperatures for several heating zones, and

a figure for belt speed. Taken together, these control set-

tings make up a heating “profile” for that particular circuit

board. On machines controlled by a computer, the comput-

er remembers these profiles from one operating session to

the next. Figure 1 shows a typical heating profile for use

when soldering a surface mount device to a printed circuit

board. This profile will vary among soldering systems but

it is a good starting point. Factors that can af fect the profile

include the type of soldering system in use, density and

types of components on the board, type of solder used, and

the type of board or substrate material being used. This pro-

file shows temperature versus time.

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed

circuit board, solder paste must be applied to the pads. A

solder stencil is required to screen the optimum amount of

solder paste onto the footprint. The stencil is made of brass

or stainless steel with a typical thickness of 0.008 inches.

The stencil opening size for the surface mounted package

should be the same as the pad size on the printed circuit

board, i.e., a 1:1 registration.

TYPICAL SOLDER HEATING PROFILE

The line on the graph shows the actual temperature that

might be experienced on the surface of a test board at or

near a central solder joint. The two profiles are based on a

high density and a low density board. The Vitronics

SMD310 convection/infrared reflow soldering system was

used to generate this profile. The type of solder used was

62/36/2 Tin Lead Silver with a melting point between

177−189°C. When this type of furnace is used for solder re-

flow work, the circuit boards and solder joints tend to heat

first. The components on the board are then heated by con-

duction. The circuit board, because it has a large surface

area, absorbs the thermal ener gy more ef ficiently, then dis-

tributes this energy to the components. Because of this ef-

fect, the main body of a component may be up to 30 degrees

cooler than the adjacent solder joints.

2SA1162GT1, 2SA1162YT1

http://onsemi.com

PACKAGE DIMENSIONS

SC−59

CASE 318D−04

ISSUE F

DIM

MIN MAX MIN MAX

INCHES

2.70 3.10 0.1063 0.1220

MILLIMETERS

B1.30 1.70 0.0512 0.0669

C1.00 1.30 0.0394 0.0511

D0.35 0.50 0.0138 0.0196

G1.70 2.10 0.0670 0.0826

H0.013 0.100 0.0005 0.0040

J0.09 0.18 0.0034 0.0070

K0.20 0.60 0.0079 0.0236

L1.25 1.65 0.0493 0.0649

S2.50 3.00 0.0985 0.1181

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

STYLE 1:

PIN 1. EMITTER

2. BASE

3. COLLECTOR

2SA1162GT1, 2SA1162YT1

http://onsemi.com

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

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PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

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Japan: ON Semiconductor, Japan Customer Focus Center

2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051

Phone: 81−3−5773−3850

2SA1162GT1/D

Thermal Clad is a registered trademark of the Bergquist Company.

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