Technical Data 4378 Effective April 2020
Supersedes May 2017
Product features
• Ultra low capacitance ESD suppressor ideally
suited for protecting high speed data
applications with virtually no signal distortion
• Four channel, bi-directional device helps provide
significant PCB layout space savings and trace
layout complexity
• Maintains an extremely low leakage current at
rated voltage
• Provides ESD protection with fast response
time (<1 ns) allowing equipment to pass IEC
61000-4-2 level 4 test
• Matches footprint of common higher
capacitance DFN2510-10 TVS diode packages
Applications
• Laptops, notebooks, desktop
• HDTV, set top box
• GPS and Bluetooth communication antenna
• USB 2.0, 3.0 and 3.1
• HDMI 1.3, 1.4a, 2.0
• DisplayPort ™
• SATA and eSATA
42510ESDA-TR1
Four channel ultra low capacitance ESD Suppressor
Pb
4 2510 ESDA -TR1
4 channel device
HALOGEN
HF
FREE
2.5 x 1.0 mm footprint
ESDA family
Packaging
Ordering part number
Package suffix
-TR1: 5000 parts on a 7” diameter reel
1. Maximum peak voltage with a 8/20 µs waveform and a 1 A pulse current per IEC 61000-4-2 level 4
2. Trigger voltage: Trigger measurement made using Transmission Line Pulse (TLP) method.
Product specifications
Electrical specifications Minimum Typical Maximum Units
Rated voltage 12 Vdc
Trigger voltage2300 Vdc
Clamping voltage130 Vdc
Capacitance @ 1 MHz 0.1 pF
Leakage current @ 12 Vdc 0.01 uA
Response time 0.1 ns
ESD Voltage capability to IEC6100-4-2 (contact) 10 kV
ESD Voltage capability to IEC6100-4-2 (air) 15 kV
ESD withstand pulses 1000 Number of pulses
2
Technical Data 4378
Effective April 2020
42510ESDA-TR1
Four channel ultra low capacitance ESD Suppressor
www.eaton.com/electronics
Dimensions—mm
B
W
L
D C E
T
Equivelent circuit
1 2 43GND 5
10 9 78GND 6
L W T B C D E
2.5 ±0.1 1.0 ±0.1 0.5 ±0.1 0.2 ±0.1 0.3 ±0.05 0.2 ±0.05 0.5 ±0.05
Recommended pad layout
P1
G
C
Z
P
Y
X1
X
Y G Z X X1 P P1 C
0.6 0.2 1.4 0.2 0.3 0.5 1.0 0.8
3
Technical Data 4378
Effective April 2020
42510ESDA-TR1
Four channel ultra low capacitance ESD Suppressor
www.eaton.com/electronics
HDMI layout
General specifications
Operating temperature: - 55 °C to +125 °C
Storage temperature (component): - 55 °C to +125 °C
High temperature load voltage: +125 °C for 1000 hours at rated voltage
Thermal shock: 100 cycles, -55 °C to +125 °C, 30 minuets dwell time
Resistance to solder heat: +260 °C ±5 °C 10 seconds
Moisture sensitivity level (MSL): 2
Packaging information- mm
Supplied in tape and reel packaging, 5000 parts per seven inch (178 mm) reel per EIA Standard 481-1
B C
E
L
D
W
F
A
A B C D E F L W
8.0 ±0.30 3.50 ±0.05 1.75 ±0.10 2.00 ±0.05 4.00 ±0.10 1.5 ±0.10 2.9 ±0.20 1.40 ±0.20
Case
Ground
Case
Ground
Signal
Ground
HDMI Port HDMI Chipset
Outside World
Ground
D2+
D2-
D1+
D1-
D0+
D0-
CLK+
CLK-
Ground
Ground
Ground
eSATA
Port
eSATA
Interface
GND
GND IC
GND
TX+
TX-
RX-
RX+
eSATA layout
4
Technical Data 4378
Effective April 2020
42510ESDA-TR1
Four channel ultra low capacitance ESD Suppressor
www.eaton.com/electronics
Temperature
Time
T
smin
Tsmax
Tstyp
Tp
tp
First Wave Second Wave
Preheat area Cool down area
Wave solder profile
Reference EN 61760-1:2006
Profile feature Standard SnPb solder Lead (Pb) free solder
Preheat • Temperature min. (Tsmin)100 °C 100 °C
• Temperature typ. (Tstyp)120 °C 120 °C
• Temperature max. (Tsmax)130 °C 130 °C
• Time (Tsmin to Tsmax) (ts)70 seconds 70 seconds
D preheat to max Temperature 150 °C max. 150 °C max.
Peak temperature (TP)* 235 °C – 260 °C 250 °C – 260 °C
Time at peak temperature (tp)10 seconds max
5 seconds max each wave
10 seconds max
5 seconds max each wave
Ramp-down rate ~ 2 K/s min
~3.5 K/s typ
~5 K/s max
~ 2 K/s min
~3.5 K/s typ
~5 K/s max
Time 25 °C to 25 °C 4 minutes 4 minutes
Manual solder
+280 °C (3 seconds maximum by soldering iron), generally manual/hand soldering is not recommended.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
Eaton.com/electronics
© 2020 Eaton
All Rights Reserved
Printed in USA
Publication No. 4378 BU-MC20073
April 2020
Technical Data 4378
Effective April 2020
42510ESDA-TR1
Four channel ultra low capacitance ESD Suppressor
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used
in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Solder reflow profile
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25
°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
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of their respective owners.
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Reference J-STD-020
Profile feature Standard SnPb solder Lead (Pb) free solder
Preheat and soak • Temperature min. (Tsmin)100 °C 150 °C
• Temperature max. (Tsmax)150 °C 200 °C
• Time (Tsmin to Tsmax) (ts)60-120 seconds 60-120 seconds
Ramp up rate TL to Tp3 °C/ second max. 3 °C/ second max.
Liquidous temperature (Tl)
Time (tL) maintained above TL
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)* within 5 °C of the specified classification temperature (Tc)20 seconds* 30 seconds*
Ramp-down rate (Tp to TL)6 °C/ second max. 6 °C/ second max.
Time 25 °C to peak temperature 6 minutes max. 8 minutes max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
Table 1 - Standard SnPb solder (Tc)
Package
thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5 mm) 235 °C 220 °C
≥2.5 mm 220 °C 220 °C
Table 2 - Lead (Pb) free solder (Tc)
Package
thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6 mm 260 °C 260 °C 260 °C
1.6 – 2.5 mm 260 °C 250 °C 245 °C
>2.5 mm 250 °C 245 °C 245 °C
