+125 OC
TSTG
Symbol Typ
Parameter Conditions Min
Max
Unit
Forward voltage VFV
Reverse current
Capacitance between terminals VR = 1V, f = 1 MHZ
IR
CT
uA
pF
14
10
CDBQC0130L-HF
Low VF SMD Schottky Barrier Diode
QW-G1113
O
Maximum Rating (at TA=25 C unless otherwise noted)
O
Electrical Characteristics (at TA=25 C unless otherwise noted)
Page 1
Typ
IO
VR
VRRM
Average forward rectified current
Reverse voltage
Repetitive Peak reverse voltage
Forward current,surge peak
Symbol
Parameter Conditions Min
Max
Unit
V
V
mA
100
30
35
Tj
Storage temperature
Junction temperature OC
+125
-40
IFSM
8.3 ms single half sine-wave
(1 cyc) 3A
REV:B
Io = 100 mA
VR = 30 Volts
RoHS Device
Halogen Free
°C/W
200
Thermal resistance Junction to ambient RΘJA
Mechanical data
- Terminals: Gold plated, solderable per
MIL-STD-750,method 2026.
- Mounting position: Any
- Weight: 0.001 grams(approx.).
- Case: 0402/SOD-923F standard package,
molded plastic.
- Polarity: Cathode band & BP
Circuit Diagram
Features
- Low forward voltage.
- Designed for mounting on small surface.
- Extremely thin package.
- Majority carrier conduction.
Comchip Technology CO., LTD.
Company reserves the right to improve product design , functions and reliability without notice.
IF = 10mA 0.30
VR = 10V
Dimensions in inches and (millimeter)
0402C/SOD-923F
0.041(1.05)
0.037(0.95)
0.026(0.65)
0.022(0.55)
0.022(0.55)
0.022(0.55)
0.018(0.45)
0.012(0.30)
0.008(0.20)
0.018(0.45)
0.001(0.02)
Max.
0.25
20
Capacitance between terminals, (PF)
Reverse voltage, (V)
RATING AND CHARACTERISTIC CURVES (CDBQC0130L-HF)
Low VF SMD Schottky Barrier Diode
Page 2
Forward current, (mA )
0.2 0.40
1
10
0.5
0
Forward voltage, (V)
Fig.1 - Forward characteristics
Reverse current, (uA )
Reverse voltage, (V)
0
1000
10
1
0 10 20 30 40
Fig.2 - Reverse characteristics
0 10 20 30 40
0
5
10
25
15
20
0
20
40
60
80
100
0 25 50 75 100 125 150
O
Ambient temperature, ( C)
Average forward current, (%)
Fig.4 - Current derating curve
1000
QW-G1113
Fig.3 - Typical capacitance between
terminals characteristics
100
REV:B
0.3
0.1
10000
Comchip Technology CO., LTD.
Company reserves the right to improve product design , functions and reliability without notice.
100
O
TJ=75 C
O
TJ=25 C
O
TJ=50 C
O
TJ=100 C
O
TJ=125 C
O
TJ=25 C
O
TJ=50 C
O
TJ=75 C
O
TJ=100 C
O
TJ=125C
30
Low VF SMD Schottky Barrier Diode
Page 3
QW-G1113
REV:B
Index hole
o
120
Trailer Device Leader
10 pitches (min)10 pitches (min)
.......
.......
....... ..............
....... ..............
End Start
d
E
F
B W
A
P
P0
P1
D1
D2
D
W1
T
C
Direction of Feed
Reel Taping Specification
Comchip Technology CO., LTD.
Company reserves the right to improve product design , functions and reliability without notice.
B C dD D2D1
E F P P0P1T
SYMBOL
A
W W
1
(mm)
(inch) 0.030 ± 0.004
SYMBOL
(mm)
(inch)
0.75 ± 0.10
0402C/
SOD-923F
0402C/
SOD-923F
1.15 ± 0.10 0.60 ± 0.10 1.55 ± 0.10 178 ± 1.00 60.0 MIN. 13.0 ± 0.20
0.045 ± 0.004 0.024 ± 0.004 0.061 ± 0.004 7.008 ± 0.04 2.362 MIN. 0.512 ± 0.008
0.069 ± 0.004 0.138 ± 0.002 0.157 ± 0.004 0.157 ± 0.004 0.079 ± 0.004 0.009 ± 0.002 0.315 ± 0.008 0.531 MAX.
1.75 ± 0.10 3.50 ± 0.05 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.10 0.22 ± 0.05 8.00 ± 0.20 13.50 MAX.
Low VF SMD Schottky Barrier Diode
Page 4
QW-G1113
REV:B
BP
Marking Code
Part Number
CDBQC0130L-HF
Marking Code
BP
Comchip Technology CO., LTD.
Company reserves the right to improve product design , functions and reliability without notice.
Standard Packaging
Case Type
5,000
REEL
( pcs )
Reel Size
(inch)
7
REEL PACK
0402C/SOD-923F
Suggested PAD Layout
SIZE
(inch)
0.028
(mm)
0.70
0.40
0.70
0.016
0.028
0402C/SOD-923F
1.10 0.043
E0.30 0.012
A
B
C
D
A
C
B
E
D
