SPECIFICATIONS FBD DDR II Connector Mechanical Contact Retention Force: 0.75Lbs (0.34kgf) min. per Contact Durability: 25 Cycles Dram Board Insertion Force: 3 oz max. per Contact AT 540 Series Vertical Type, T/H Type 1.00mm [.039"] Pitch 240 Pos. Electrical Voltage Rating: 250V AC Current Rating: 0.5A max., 30 max., in Temperature Rise Insulation Resistance: 1000M min. initial Dielectric Withstanding Voltage: 500V DC at Sea Level Low Level Contact Resistance: 30m max. initial Physical Housing: Thermoplastic, UL 94V-0 rated in Black Color Contact: Copper alloy Ejector: Thermoplastic, UL 94V-0 rated in Ivory or Natural Color Metal Hold Down: Copper alloy Operating Temperature: -55 to +105 DRAWING ORDERING I N F O R M A T I O N PRODUCT NO.: A T 5 4 0 * * - H 3 B F- * * Memory Socket Vertrical FBD DDR II DIMM 1.00mm Pitch No. of Pos. 40=240 Pos. Tail Length 0=3.15 [.124] 1=2.67 [.105] PLATING TYPE 4N=TIN/LEAD 4F=LEAD FREE Extension Code Contact Area Plating 1=Gold Flash 2=20u" Gold 3=30u" Gold 6=10u" Gold 7=15u" Gold All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.