© Semiconductor Components Industries, LLC, 2016
November, 2016 − Rev. 9 1Publication Order Number:
MBRB1045/D
MBRB1045G,
MBRD1045G,
SBRB1045G,
SBRD81045T4G
Switch-mode
Schottky Power Rectifier
Surface Mount Power Package
This series of Power Rectifiers employs the Schottky Barrier
principle in a large metal−to−silicon power diode. State−of−the−art
geometry features epitaxial construction with oxide passivation and
metal overlay contact. Ideally suited for use in low voltage, high
frequency switching power supplies, free wheeling diodes, and
polarity protection diodes.
Features
•Guardring for Stress Protection
•Low Forward Voltage
•175°C Operating Junction Temperature
•Epoxy Meets UL 94 V−0 @ 0.125 in
•Short Heat Sink Tab Manufactured − Not Sheared!
•SBRB and SBRD8 Prefixes for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements;
AEC−Q101 Qualified and PPAP Capable
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Mechanical Characteristics:
•Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
•Weight: 1.7 grams for D2PAK (approximately)
0.4 grams for DPAK (approximately)
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
•Device Meets MSL1 Requirements
•ESD Ratings:
♦Machine Model = C (> 400 V)
♦Human Body Model = 3B (> 8000 V)
SCHOTTKY BARRIER
RECTIFIER
10 AMPERES, 45 VOLTS
1
3
4
www.onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
D2PAK
CASE 418B
3
4
1
MARKING DIAGRAM
MBRB1045G
AKA
A = Assembly Location
Y = Year
WW = Work Week
MBRB1045 = Device Code
G = Pb−Free Package
AKA = Diode Polarity
AY WW
DPAK
CASE 369C
YWW
B10
45G
Y = Year
WW = Work Week
B1045 = Device Code
G = Pb−Free Package
MARKING DIAGRAM
123
4
MBRB1045G, MBRD1045G, SBRB1045G, SBRD81045T4G
www.onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
45 V
Average Rectified Forward Current (Rated VR) TC = 135°C IF(AV) 10 A
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz) TC = 135°CIFRM 20 A
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 150
(MBRB/SBRB)
70
(MBRD/SBRD)
A
Operating Junction and Storage Temperature Range (Note 1) TJ, Tstg −65 to +175 °C
Voltage Rate of Change (Rated VR) dv/dt 10000 V/ms
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be af fected.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance,
(MBRB1045G)
Junction−to−Case (Note 2)
Junction−to−Ambient (Note 2)
(MBRD1045G)
Junction−to−Case (Note 2)
Junction−to−Ambient (Note 2)
RqJC
RqJA
RqJC
RqJA
1.0
50
2.43
68
°C/W
2. When mounted using minimum recommended pad size on FR−4 board.
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Value Unit
Maximum Instantaneous Forward Voltage (Note 3)
(IF = 10 Amps, TJ = 125°C)
(IF = 20 Amps, TJ = 125°C)
(IF = 20 Amps, TJ = 25°C)
VF0.57
0.72
0.84
V
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, TJ = 125°C)
(Rated dc Voltage, TJ = 25°C)
IR15
0.1
mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%
ORDERING INFORMATION
Device Package Shipping†
MBRB1045G
D2PAK
(Pb−Free)
50 Units / Rail
SBRB1045G 50 Units / Rail
MBRB1045T4G 800 Units / Tape & Reel
SBRB1045T4G 800 Units / Tape & Reel
MBRD1045G
DPAK
(Pb−Free)
50 Units / Rail
MBRD1045T4G 2,500 Units / Tape & Reel
SBRD81045T4G 2,500 Units / Tape & Reel
SSBRD81045T4G 2,500 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MBRB1045G, MBRD1045G, SBRB1045G, SBRD81045T4G
www.onsemi.com
3
Figure 1. Maximum Forward Voltage
1.2
vF, INSTANTANEOUS VOLTAGE (VOLTS)
100
70
5.0
10
3.0
iF, INSTANTANEOUS FORWARD CURRENT (AMPS)
1.0
0.60.2 0.4 0.8 1.0 1.4
2.0
20
0.1
0.5
0.7
30
7.0
0.3
50
TJ = 150°C
Figure 2. Typical Forward Voltage
0.2
1.2
vF, INSTANTANEOUS VOLTAGE (VOLTS)
100
70
5.0
10
3.0
iF, INSTANTANEOUS FORWARD CURRENT (AMPS)
1.0
0.60.2 0.4 0.8 1.0 1.4
2.0
20
0.1
0.5
0.7
30
7.0
0.3
50
TJ = 150°C
0.2
100°C
25°C100°C
25°C
5.0 150
VR, REVERSE VOLTAGE (VOLTS)
10
1.0
0.1
0.01
0.001
VR, REVERSE VOLTAGE (VOLTS)
250
100
10
0.1
0.01
0.001
1010
, REVERSE CURRENT (mA)IR
20 3025
100
5.0 50
1.0
IR, REVERSE CURRENT (mA)
35 40 5045
Figure 3. Maximum Reverse Current Figure 4. Typical Reverse Current
2015 3530 4540
TJ = 150°C
125°C
100°C
75°C
25°C
25°C
75°C
100°C
125°C
150°C
MBRB1045G, MBRD1045G, SBRB1045G, SBRD81045T4G
www.onsemi.com
4
0
VR, REVERSE VOLTAGE (VOLTS)
800
600
200
0
TC, CASE TEMPERATURE (°C)
145130
18
8.0
4.0
2.0
0
135
10
C, CAPACITANCE (pF)
20 30
1400
155
6.0
40 50
Figure 5. Typical Capacitance
Figure 6. Current Derating, Case,
Rq
JC
= 1.0 °C/W
140 150 2.00
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
8.0
5.0
4.0
2.0
0
4.0
, AVERAGE FORWARD POWER DISSIPATION (WATTS)PF(AV)
6.0 108.0
10
12 1814
Figure 7. Forward Power Dissipation
, AVERAGE FORWARD CURRENT (AMPS)IF(AV)
14
10
12
3.0
1.0
9.0
7.0
6.0
dc
SQUARE
WAVE
RATED VOLTAGE APPLIED
dc
SQUARE
WAVE
400
1200
1000
16
16
NUMBER OF CYCLES AT 60 Hz
101.0
200
100
50
30
20
3.02.0 100
70
IFSM, PEAK HALF-WAVE CURRENT (AMPS)
Figure 8. Maximum Surge Capability
7.05.0 3020 7050
MBRB1045G, MBRD1045G, SBRB1045G, SBRD81045T4G
www.onsemi.com
5
PACKAGE DIMENSIONS
SEATING
PLANE
S
G
D
−T−
M
0.13 (0.005) T
231
4
3 PL
K
J
H
V
E
C
A
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.340 0.380 8.64 9.65
B0.380 0.405 9.65 10.29
C0.160 0.190 4.06 4.83
D0.020 0.035 0.51 0.89
E0.045 0.055 1.14 1.40
G0.100 BSC 2.54 BSC
H0.080 0.110 2.03 2.79
J0.018 0.025 0.46 0.64
K0.090 0.110 2.29 2.79
S0.575 0.625 14.60 15.88
V0.045 0.055 1.14 1.40
−B−
M
B
W
W
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
F0.310 0.350 7.87 8.89
L0.052 0.072 1.32 1.83
M0.280 0.320 7.11 8.13
N0.197 REF 5.00 REF
P0.079 REF 2.00 REF
R0.039 REF 0.99 REF
D2PAK 3
CASE 418B−04
ISSUE L
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8.38
5.080
DIMENSIONS: MILLIMETERS
PITCH
2X
16.155
1.016
2X
10.49
3.504
MBRB1045G, MBRD1045G, SBRB1045G, SBRD81045T4G
www.onsemi.com
6
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C
ISSUE F
5.80
0.228
2.58
0.102
1.60
0.063
6.20
0.244
3.00
0.118
6.17
0.243
ǒmm
inchesǓ
SCALE 3:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
b
D
E
b3
L3
L4b2
M
0.005 (0.13) C
c2
A
c
C
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
D0.235 0.245 5.97 6.22
E0.250 0.265 6.35 6.73
A0.086 0.094 2.18 2.38
b0.025 0.035 0.63 0.89
c2 0.018 0.024 0.46 0.61
b2 0.028 0.045 0.72 1.14
c0.018 0.024 0.46 0.61
e0.090 BSC 2.29 BSC
b3 0.180 0.215 4.57 5.46
L4 −−− 0.040 −−− 1.01
L0.055 0.070 1.40 1.78
L3 0.035 0.050 0.89 1.27
Z0.155 −−− 3.93 −−−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
7. OPTIONAL MOLD FEATURE.
12 3
4
H0.370 0.410 9.40 10.41
A1 0.000 0.005 0.00 0.13
L1 0.114 REF 2.90 REF
L2 0.020 BSC 0.51 BSC
A1
H
DET AIL A
SEATING
PLANE
A
B
C
L1
L
H
L2 GAUGE
PLANE
DETAIL A
ROTATED 90 CW5
eBOTTOM VIEW
Z
BOTTOM VIEW
SIDE VIEW
TOP VIEW
ALTERNATE
CONSTRUCTIONS
NOTE 7
Z
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