MMPQ6700 MMPQ6700 E1 B1 E2 B2 E3 B3 E4 SOIC-16 pin #1 C1 Mark: MMPQ6700 B4 C2 C1 C3 C2 C4 C4 C3 TRANSISTOR TYPE C1 B1 E1 & C2 B2 E2 NPN C3 B3 E3 & C4 B4 E4 PNP Quad NPN & PNP General Purpose Amplifier These complementary devices can be used in switches with collector currents of 10 A to 100 mA. These devices are best used when space is the primary consideration. Sourced from Process 23 & 66. See 2N3904 (NPN) & 2N3906 (PNP) for characteristics. Absolute Maximum Ratings* Symbol TA = 25C unless otherwise noted Parameter Value Units VCEO Collector-Emitter Voltage 40 V VCBO Collector-Base Voltage 40 V VEBO Emitter-Base Voltage 5.0 V IC Collector Current - Continuous 200 mA TJ, Tstg Operating and Storage Junction Temperature Range -55 to +150 C *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. NOTES: 1) These ratings are based on a maximum junction temperature of 150 degrees C. 2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations. 3) All voltages (V) and currents (A) are negative polarity for PNP transistors. Thermal Characteristics Symbol PD RJA TA = 25C unless otherwise noted Characteristic Total Device Dissipation Derate above 25C Thermal Resistance, Junction to Ambient Effective 4 Die Each Die 1997 Fairchild Semiconductor Corporation Max Units MMPQ6700 1000 8.0 mW mW/C 125 240 C/W C/W 4 Electrical Characteristics Symbol TA = 25C unless otherwise noted Parameter Test Conditions Min Max Units OFF CHARACTERISTICS V(BR)CEO IC = 10 mA, IB = 0 V(BR)CBO Collector-Emitter Breakdown Voltage* Collector-Base Breakdown Voltage 40 V V(BR)EBO Emitter-Base Breakdown Voltage IC = 10 A, IE = 0 40 V IE = 10 A, IC = 0 5.0 ICBO Collector-Cutoff Current VCB = 30 V, IE = 0 50 nA IEBO Emitter-Cutoff Current VEB = 4.0 V, IC = 0 50 nA V ON CHARACTERISTICS* hFE DC Current Gain VCE(sat) Collector-Emitter Saturation Voltage VCE = 1.0 V, IC = 0.1 mA VCE = 1.0 V, IC = 1.0 mA VCE = 1.0 V, IC = 10 mA IC = 10 mA, IB = 1.0 mA 0.25 V VBE(sat) Base-Emitter Saturation Voltage IC = 10 mA, IB = 1.0 mA 0.90 V 30 50 70 SMALL SIGNAL CHARACTERISTICS Cob Output Capacitance VCB = 5.0 V, f = 100 kHz 4.5 pF Cib Input Capacitance 10 8.0 fT Current-Gain Bandwidth Product VBE = 0.5 V, f = 100 kHz PNP VBE = 0.5 V, f = 100 kHz NPN IC = 10 mA, VCE = 20 V, f = 100 MHz pF pF MHz *Pulse Test: Pulse Width 300 s, Duty Cycle 2.0% 200 MMPQ6700 Quad NPN & PNP General Purpose Amplifier (continued) SOIC-16 Tape and Reel Data SOIC(16lds) Packaging Configuration: Figure 1.0 Packaging Description: SOIC-16 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 2,500 units per 13" or 330cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). This and some other options are further described in the Packaging Information table. EL ECT ROST AT IC SEN SIT IVE DEVICES DO NO T SHI P OR STO RE N EAR ST RO NG EL ECT ROST AT IC EL ECT RO M AGN ETI C, M AG NET IC O R R ADIO ACT IVE FI ELD S TNR D ATE PT NUMB ER PEEL STREN GTH MIN ___ __ ____ __ ___gms MAX ___ ___ ___ ___ _ gms Antistatic Cover Tape ESD Label These full reels are individually barcode labeled and placed inside a standard intermediate box (illustrated in figure 1.0) made of recyclable corrugated brown paper. One box contains two reels maximum. And these boxes are placed inside a barcode labeled shipping box which comes in different sizes depending on the number of parts shipped. Static Dissipative Embossed Carrier Tape F63TNR Label FD85AB NDM3001 Qty per Reel/Tube/Bag Reel Size Standard (no flow code) TNR Rail/Tube 2,500 45 Pin 1 L86Z 13" Dia - 343x64x343 530x130x83 Max qty per Box 5,000 13,500 Weight per unit (gm) 0.1437 0.1437 Weight per Reel (kg) 0.7735 - Box Dimension (mm) FD85AB NDM3001 Packaging type FD85AB NDM3001 Packaging Option NDM3001 SOIC (16lds) Packaging Information FD85AB FD85AB NDM3001 Customized Label SOIC-16 Unit Orientation Note/Comments 343mm x 342mm x 64mm Standard Intermediate box ESD Label F63TNR Label F63TNR Label sample LOT: CBVK741B019 QTY: 2500 FSID: NDM3000 SPEC: F63TNR Label ESD Label D/C1: D9842 D/C2: QTY1: QTY2: SPEC REV: CPN: N/F: F (F63TNR)3 SOIC(16lds) Tape Leader and Trailer Configuration: Figure 2.0 Carrier Tape Cover Tape Components Trailer Tape 640mm minimum or 80 empty pockets (c)2000 Fairchild Semiconductor International Leader Tape 1680mm minimum or 210 empty pockets October 1999, Rev. B SOIC-16 Tape and Reel Data, continued SOIC(16lds) Embossed Carrier Tape Configuration: Figure 3.0 P0 D0 T E1 F K0 Wc W E2 B0 Tc A0 D1 P1 User Direction of Feed Dimensions are in millimeter Pkg type A0 B0 SOIC(16lds) (16mm) 6.60 +/-0.30 10.35 +/-0.25 W 16.0 +/-0.3 D0 D1 E1 E2 1.55 +/-0.05 1.60 +/-0.10 1.75 +/-0.10 F 14.25 min 7.50 +/-0.05 P1 P0 8.0 +/-0.1 4.0 +/-0.1 K0 T Wc Tc 2.40 +/-0.40 0.450 +/-0.150 13.0 +/-0.3 0.06 +/-0.02 Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). 0.9mm maximum 10 deg maximum Typical component cavity center line B0 0.9mm maximum 10 deg maximum component rotation Typical component center line Sketch A (Side or Front Sectional View) A0 Component Rotation Sketch C (Top View) Component lateral movement Sketch B (Top View) SOIC(16lds) Reel Configuration: Figure 4.0 Component Rotation W1 Measured at Hub Dim A Max B Min Dim C Dim D min Dim A max Dim N DETAIL AA W3 See detail AA 13" Diameter Option W2 max Measured at Hub Dimensions are in inches and millimeters Tape Size 16mm Reel Option 13" Dia Dim A Dim B 13.00 330 0.059 1.5 Dim C 512 +0.020/-0.008 13 +0.5/-0.2 Dim D 0.795 20.2 Dim N 4.00 100 Dim W1 0.646 +0.078/-0.000 16.4 +2/0 Dim W2 0.882 22.4 Dim W3 (LSL-USL) 0.626 - 0.764 15.9 - 19.4 July 1999, Rev. B SOIC-16 Package Dimensions SOIC-16 (FS PKG Code S3) 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.1437 (c)2000 Fairchild Semiconductor International October 1999, Rev. A1 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DOMETM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM FAST FASTrTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM MICROWIRETM OPTOLOGICTM OPTOPLANARTM PACMANTM POPTM PowerTrench QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM SILENT SWITCHER SMART STARTTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM UHCTM VCXTM DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. G