SM12T1G - ON Semiconductor

July, 2011 − Rev. 4

1Publication Order Number:

SM05T1/D

SM05T1 Series

Transient Voltage

Suppressor Diode Array

SOT−23 Dual Common Anode Diodes

for ESD Protection

These dual monolithic silicon TVS diodes are designed for

applications requiring transient overvoltage protection capability. They

are intended for use in voltage and ESD sensitive equipment such as

computers, printers, business machines, communication systems,

medical equipment and other applications. Their dual junction common

anode design protects two separate lines using only one package. These

devices are ideal for situations where board space is at a premium.

Specification Features:

•SOT−23 Package Allows Either Two Separate Unidirectional

Configurations or a Single Bidirectional Configuration

•Working Peak Reverse Voltage Range − 5.0 V to 24 V

•Peak Power − 300 Watt (8 X 20 ms)

•Low Leakage

•Flammability Rating UL 94 V−0

•These are Pb−Free Devices

Mechanical Characteristics:

CASE: Void-Free, Transfer-Molded, Thermosetting Plastic Case

FINISH: Corrosion Resistant Finish, Easily Solderable

MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

260°C for 10 Seconds

Package Designed for Optimal Automated Board Assembly

Small Package Size for High Density Applications

Available in 8 mm Tape and Reel

Use the Device Number to Order the 7 Inch/3,000 Unit Reel

Replace the “T1” with “T3” in the Device Number to Order the

13 Inch/10,000 Unit Reel

SOT−23

CASE 318

STYLE 12

PIN 1. CATHODE

2. CATHODE

3. ANODE

MARKING DIAGRAM

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Device Package Shipping†

ORDERING INFORMATION

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

SM05T1G SOT−23

(Pb−Free)

3000/Tape & Reel

SM12T1G SOT−23

(Pb−Free)

3000/Tape & Reel

*Date Code orientation and/or overbar may

vary depending upon manufacturing location.

xxM MG

xxM = Device Code

xx = 05, 12, 15, 24, 36

M = Date Code*

G=Pb−Free Package

(Note: Microdot may be in either location)

SM15T1G SOT−23

(Pb−Free)

3000/Tape & Reel

SM24T1G SOT−23

(Pb−Free)

3000/Tape & Reel

SM36T1G SOT−23

(Pb−Free)

3000/Tape & Reel

SM05T1 Series

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MAXIMUM RATINGS

Rating Symbol Value Unit

Peak Power Dissipation @ 20 ms (Note 1) @ TL ≤ 25°CPpk 300 W

IEC 61000−4−2 (ESD) Air

Contact

±15

±8.0

IEC 61000−4−4 (EFT) 40 A

IEC 61000−4−5 (Lightening) 12 A

Total Power Dissipation on FR−5 Board (Note 2) @ TA = 25°C

Derate above 25°C

Thermal Resistance, Junction−to−Ambient

°PD°

RqJA

225

1.8

556

°mW°

mW/°C

°C/W

Total Power Dissipation on Alumina Substrate (Note 3) @ TA = 25°C

Derate above 25°C

Thermal Resistance, Junction−to−Ambient

°PD

RqJA

300

2.4

417

°mW

mW/°C

°C/W

Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C

Lead Solder Temperature − Maximum (10 Second Duration) TL260 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Non−repetitive current pulse per Figure 3

2. FR−5 = 1.0 x 0.75 x 0.62 in.

3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina

NOTE: Other voltages may be available upon request

ELECTRICAL CHARACTERISTICS

UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3)

Symbol Parameter

IPP Maximum Reverse Peak Pulse Current

VCClamping Voltage @ IPP

VRWM Working Peak Reverse Voltage

IRMaximum Reverse Leakage Current @ VRWM

VBR Breakdown Voltage @ IT

ITTest Current

QVBR Maximum Temperature Coefficient of VBR

IFForward Current

VFForward Voltage @ IF

ZZT Maximum Zener Impedance @ IZT

IZK Reverse Current

ZZK Maximum Zener Impedance @ IZK Uni−Directional TVS

IPP

VRWM

VCVBR

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Device

Marking

VRWM IR @ VRWM

VBR, Breakdown Voltage

VC @

IPP =

1 Amp

Max IPP

(Note 4)

Typical

Capacitance

(Volts) (pF)

(Volts) (mA) Min Max mA (Volts) (Amps)

Pin 1 to 3

@ 0 Volts

SM05T1G 05M 5 10 6.2 7.3 1.0 9.8 17 225

SM12T1G 12M 12 1.0 13.3 15.75 1.0 19 12 95

SM15T1G 15M 15 1.0 16.7 19.6 1.0 24 10 100

SM24T1G 24M 24 1.0 26.7 31.35 1.0 43 5.0 60

SM36T1G 36M 36 1.0 40.0 46.95 1.0 60 4.0 45

4. 8 × 20 ms pulse waveform per Figure 3

SM05T1 Series

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TYPICAL CHARACTERISTICS

0.1 10

Figure 1. Non−Repetitive Peak Pulse Power

versus Pulse Time

tp, PULSE DURATION (ms)

100 1000

0.1

0.01

Figure 2. Steady State Power Derating Curve

PPP

, PEAK PULSE POWER (kW)

0 25 50 75 100 125 150 175

300

250

200

150

100

TEMPERATURE (°C)

FR−5 BOARD

ALUMINA SUBSTRATE

PD, POWER DISSIPATION (mW)

100

Figure 3. 8 × 20 ms Pulse Waveform Figure 4. Typical Diode Capacitance (SM05)

01 524

250

130

BIAS VOLTAGE (VOLTS)

0020406080

t, TIME (ms)

PULSE WIDTH (tP) IS DEFINED

AS THAT POINT WHERE THE

PEAK CURRENT DECAY = 8 ms

HALF VALUE IRSM/2 @ 20 ms

% OF PEAK PULSE CURRENT

PEAK VALUE IRSM @ 8 ms

C, CAPACITANCE (pF)

210

170

Figure 5. Typical Diode Capacitance (SM12)

015812

100

BIAS VOLTAGE (VOLTS)

C, CAPACITANCE (pF)

SM05T1 Series

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TYPICAL COMMON ANODE APPLICATIONS

A quad junction common anode design in a SOT−23

package protects four separate lines using only one package.

This adds flexibility and creativity to PCB design especially

when board space is at a premium. Two simplified examples

of TVS applications are illustrated below.

KEYBOARD

TERMINAL

PRINTER

ETC.

FUNCTIONAL

DECODER

I/O

SM05T1

Series

GND

Computer Interface Protection

Microprocessor Protection

I/O

RAM ROM

CLOCK

CPU

CONTROL BUS

ADDRESS BUS

DATA BUS

GND

VGG

VDD

SM05T1

Series

SM05T1

Series

SM05T1 Series

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PACKAGE DIMENSIONS

SOT−23 (TO−236)

CASE 318−08

ISSUE AN

ǒmm

inchesǓ

SCALE 10:1

0.8

0.031

0.9

0.035

0.95

0.037

0.95

0.037

2.0

0.079

STYLE 12:

PIN 1. CATHODE

2. CATHODE

3. ANODE

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS OF

BASE MATERIAL.

4. 318−01 THRU −07 AND −09 OBSOLETE, NEW

STANDARD 318−08.

VIEW C

0.25

SEE VIEW C

DIM

MIN NOM MAX MIN

MILLIMETERS

0.89 1.00 1.11 0.035

INCHES

A1 0.01 0.06 0.10 0.001

b0.37 0.44 0.50 0.015

c0.09 0.13 0.18 0.003

D2.80 2.90 3.04 0.110

E1.20 1.30 1.40 0.047

e1.78 1.90 2.04 0.070

L0.10 0.20 0.30 0.004

0.040 0.044

0.002 0.004

0.018 0.020

0.005 0.007

0.114 0.120

0.051 0.055

0.075 0.081

0.008 0.012

NOM MAX

2.10 2.40 2.64 0.083 0.094 0.104

0.35 0.54 0.69 0.014 0.021 0.029

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

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USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

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Phone: 81−3−5773−3850

SM05T1/D

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