Agilent
T-13/4 (5 mm), T-1 (3 mm),
High Intensity, Double Heterojunction
AlGaAs Red LED Lamps
Data Sheet
HLMP-D101/D105, HLMP-K101/K105
Description
These solid state LED lamps utilize
newly developed double
heterojunction (DH) AlGaAs/GaAs
material technology. This LED
material has outstanding light
output efficiency over a wide range
Features
• Exceptional brightness
• Wide viewing angle
• Outstanding material efficiency
• Low forward voltage
• CMOS/MOS compatible
• TTL compatible
• Deep red color
Applications
• Bright ambient lighting conditions
• Moving message panels
• Portable equipment
• General use
of drive currents. The color is
deep red at the dominant
wavelength of 637 nanometres.
These lamps may be DC or pulse
driven to achieve desired light
output.
Package Dimensions
ABC
1.14 (0.045)
0.51 (0.020)
3.43 (0.135)
2.92 (0.115)
24.1
(0.95)MIN.
4.70 (0.185)
4.19 (0.165)
3.17 (0.125)
2.67 (0.105)
2.79 (0.110)
2.29 (0.090)
1.52 (0.060)
1.02 (0.040)
6.35 (0.250)
5.58 (0.220)
0.55 (0.022)
0.40 (0.016)
CATHODE
∅
0.65 (0.026) MAX.
SQ. TYP.
SHOULDER
CATHODE
2
Selection Guide
Luminous Intensity
Iv (mcd) at 20 mA 2θθ
θθ
θ1/2[1] Package
Package Description Device HLMP- Min. Typ. Max. Degree Outline
T-1 3/4 Red Tinted Diffused D101 35.2 70.0 – 65 A
D101-J00xx 35.2 70.0 – 65 A
D101-JK0xx 35.2 70.0 112.8 65 A
T-1 3/4 Red Untinted Non-diffused D105 138.0 240.0 – 24 B
D105-M00xx 138.0 240.0 – 24 B
D105-NO0xx 200.0 290.0 580.0 24 B
T-1 Red Tinted Diffused K101 22.0 45.0 – 60 C
K101-100xx 22.0 45.0 – 60 C
K101-IJ0xx 22.0 45.0 70.4 60 C
T-1 Red Untinted Non-diffused K105 35.2 65.0 – 45 C
K105-J00xx 35.2 65.0 – 45 C
K105-KL0xx 56.4 110.0 180.4 45 C
Note:
1. θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 the on-axis value.
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Option
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
A1: Right Angle Housing, Uneven Leads, T1
A2: Right Angle Housing, Even Leads, T1
B1: Right Angle Housing, Uneven Leads, T-1 3/4
B2: Right Angle Housing, Even Leads, T-1 3/4
DD, UQ: Ammo Pack
Color Bin Options
0: Full Color Bin Distribution
Maximum Iv Bin Options
0: Open (no max. limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Lens Type
01: Tinted, Diffused
05: Untinted, Nondiffused
Color Options
1: AlGaAs Red
Package Options
D: T-1 3/4
K: T-1
3
Absolute Maximum Ratings at TA = 25°C
Parameter Value
Peak Forward Current[1,2] 300 mA
Average Forward Current[2] 20 mA
DC Current[3] 30 mA
Power Dissipation 87 mW
Reverse Voltage (IR = 100 µA) 5 V
Transient Forward Current (10 µs Pulse)[4] 500 mA
LED Junction Temperature 110°C
Operating Temperature Range -20 to +100°C
Storage Temperature Range -55 to +100°C
Notes:
1. Maximum IPEAK at f = 1 kHz, DF = 6.7%.
2. Refer to Figure 6 to establish pulsed operating conditions.
3. Derate linearly as shown in Figure 5.
4. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds. It is
not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.
Electrical/Optical Characteristics at TA = 25°C
Symbol Description Min. Typ. Max. Unit Test Condition
VFForward Voltage 1.8 2.2 V IF = 20 mA
VRReverse Breakdown Voltage 5.0 15.0 V IR = 100 µA
λpPeak Wavelength 645 nm Measurement at Peak
λdDominant Wavelength 637 nm Note 1
∆λ1/2Spectral Line Halfwidth 20 nm
τSSpeed of Response 30 ns Exponential Time
Constant, e-t/TS
C Capacitance 30 pF VF = 0, f = 1 MHz
RθJ-PIN Thermal Resistance 260[3] °C/W Junction to Cathode Lead
210[4]
290[5]
ηVLuminous Efficacy 80 Im/W Note 2
Notes:
1. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and represents the color of the device.
2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = lV/ηV, where IV is the luminous intensity in candelas and ηV is
luminous efficacy in lumens/watt.
3. HLMP-D101.
4. HLMP-D105.
5. HLMP-K101/-K105.
4
Figure 3. Relative luminous intensity vs. dc forward current. Figure 4. Relative efficiency vs. peak forward current.
Figure 5. Maximum forward dc current vs. ambient temperature.
Derating based on TJ MAX. = 11 0°C. Figure 6. Maximum tolerable peak current vs. peak duration (IPEAK
MAX. determined from temperature derated IDC MAX.).
Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage.
5
Figure 7. Relative luminous intensity vs. angular displacement.
HLMP-D101. Figure 8. Relative luminous intensity vs. angular displacement.
HLMP-K101.
Figure 9. Relative luminous intensity vs. angular displacement.
HLMP-D105. Figure 10. Relative luminous intensity vs. angular displacement.
HLMP-K105.
6
Intensity Bin Limits Intensity Range (mcd)
Color Bin Min. Max.
Red I 24.8 39.6
J 39.6 63.4
K 63.4 101.5
L 101.5 162.4
M 162.4 234.6
N 234.6 340.0
O 340.0 540.0
P 540.0 850.0
Q 850.0 1200.0
R 1200.0 1700.0
S 1700.0 2400.0
T 2400.0 3400.0
U 3400.0 4900.0
V 4900.0 7100.0
W 7100.0 10200.0
X 10200.0 14800.0
Y 14800.0 21400.0
Z 21400.0 30900.0
Note:
All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent
representative for further clarification/information.
Mechanical Option Matrix
Mechanical Option Code Definition
00 Bulk Packaging, minimum increment 500 pcs/bag
01 Tape & Reel, crimped leads, minimum increment 1300 pcs (T-1 3/4)/1800 pcs (T-1)
02 Tape & Reel, straight leads, minimum increment 1300 pcs (T-1 3/4)/1800 pcs (T-1)
A1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
A2 Right Angle Housing, even leads, minimum increment 500 pcs/bag
B1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
B2 Right Angle Housing, even leads, minimum increment 500 pcs/bag
DD Ammo Pack, straight leads in 2K increment
UQ Ammo Pack, horizontal leads in 2K increment
Maximum tolerance for each bin limit is ± 18%.
7
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely upon
hand operation.
Soldering Conditions
• Care must be taken during PCB assembly and
soldering process to prevent damage to LED
component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended soldering conditions:
• Wave soldering parameter must be set and
maintained according to recommended temperature
and dwell time in the solder wave. Customer is
advised to periodically check on the soldering profile
to ensure the soldering profile used is always
conforming to recommended soldering condition.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
Manual Solder
W ave Soldering Dipping
Pre-heat Temperature 105 °C Max. –
Pre-heat Time 30 sec Max. –
Peak Temperature 250 °C Max. 260 °C Max.
Dwell Time 3 sec Max. 5 sec Max.
LED Component Plated Through
Lead Size Diagonal Hole Diameter
0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm
(0.018 x 0.018 inch) (0.025 inch) (0.038 to 0.042 inch)
0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm
(0.020 x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
Note: Refer to application note AN1027 for more
information on soldering LED components.
Figure 11. Recommended wave soldering profile.
LAMINAR W A VE BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT W A VE
FLUXING
PREHEAT
01020
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – °C
60 70 80 90 100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916) 788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152 (Domestic/Interna-
tional), or 0120-61-1280 (Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2004-2005 Agilent Technologies, Inc.
Obsoletes 5988-2230EN
November 12, 2005
5989-4250EN
