Agilent T-13/4 (5 mm), T-1 (3 mm), High Intensity, Double Heterojunction AlGaAs Red LED Lamps Data Sheet Features * Exceptional brightness * Wide viewing angle * Outstanding material efficiency HLMP-D101/D105, HLMP-K101/K105 Description These solid state LED lamps utilize newly developed double heterojunction (DH) AlGaAs/GaAs material technology. This LED material has outstanding light output efficiency over a wide range of drive currents. The color is deep red at the dominant wavelength of 637 nanometres. These lamps may be DC or pulse driven to achieve desired light output. * Low forward voltage * CMOS/MOS compatible * TTL compatible * Deep red color Applications * Bright ambient lighting conditions * Moving message panels * Portable equipment * General use Package Dimensions 3.17 (0.125) 2.67 (0.105) 3.43 (0.135) 2.92 (0.115) 4.70 (0.185) 4.19 (0.165) 6.35 (0.250) 5.58 (0.220) 1.14 (0.045) 0.51 (0.020) SHOULDER 24.1 MIN. (0.95) 0.65 (0.026) MAX. 0.55 (0.022) SQ. TYP. 0.40 (0.016) CATHODE 2.79 (0.110) 2.29 (0.090) 1.52 (0.060) 1.02 (0.040) CATHODE A B C Selection Guide Package Description T-1 3/4 Red Tinted Diffused T-1 3/4 Red Untinted Non-diffused T-1 Red Tinted Diffused T-1 Red Untinted Non-diffused Device HLMPD101 D101-J00xx D101-JK0xx D105 D105-M00xx D105-NO0xx K101 K101-100xx K101-IJ0xx K105 K105-J00xx K105-KL0xx Luminous Intensity Iv (mcd) at 20 mA Min. Typ. 35.2 70.0 35.2 70.0 35.2 70.0 138.0 240.0 138.0 240.0 200.0 290.0 22.0 45.0 22.0 45.0 22.0 45.0 35.2 65.0 35.2 65.0 56.4 110.0 Max. - - 112.8 - - 580.0 - - 70.4 - - 180.4 Note: 1. 1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 the on-axis value. Part Numbering System HLMP - x x xx - x x x xx Mechanical Option 00: Bulk 01: Tape & Reel, Crimped Leads 02: Tape & Reel, Straight Leads A1: Right Angle Housing, Uneven Leads, T1 A2: Right Angle Housing, Even Leads, T1 B1: Right Angle Housing, Uneven Leads, T-1 3/4 B2: Right Angle Housing, Even Leads, T-1 3/4 DD, UQ: Ammo Pack Color Bin Options 0: Full Color Bin Distribution Maximum Iv Bin Options 0: Open (no max. limit) Others: Please refer to the Iv Bin Table Minimum Iv Bin Options Please refer to the Iv Bin Table Lens Type 01: Tinted, Diffused 05: Untinted, Nondiffused Color Options 1: AlGaAs Red Package Options D: T-1 3/4 K: T-1 2 2 1/2[1] Degree 65 65 65 24 24 24 60 60 60 45 45 45 Package Outline A A A B B B C C C C C C Absolute Maximum Ratings at TA = 25C Parameter Peak Forward Current[1,2] Average Forward Current[2] DC Current[3] Power Dissipation Reverse Voltage (IR = 100 A) Transient Forward Current (10 s Pulse)[4] LED Junction Temperature Operating Temperature Range Storage Temperature Range Value 300 mA 20 mA 30 mA 87 mW 5V 500 mA 110C -20 to +100C -55 to +100C Notes: 1. Maximum IPEAK at f = 1 kHz, DF = 6.7%. 2. Refer to Figure 6 to establish pulsed operating conditions. 3. Derate linearly as shown in Figure 5. 4. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and wire bonds. It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current. Electrical/Optical Characteristics at TA = 25C Symbol Description VF Forward Voltage VR Reverse Breakdown Voltage p Min. Typ. Max. Unit Test Condition 1.8 2.2 V IF = 20 mA 15.0 V IR = 100 A Peak Wavelength 645 nm Measurement at Peak d Dominant Wavelength 637 nm Note 1 1/2 Spectral Line Halfwidth 20 nm S Speed of Response 30 ns Exponential Time Constant, e-t/TS C Capacitance 30 pF VF = 0, f = 1 MHz RJ-PIN Thermal Resistance 260[3] 210[4] 290[5] C/W Junction to Cathode Lead V Luminous Efficacy 80 Im/W Note 2 5.0 Notes: 1. The dominant wavelength, d, is derived from the CIE chromaticity diagram and represents the color of the device. 2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = lV/V, where IV is the luminous intensity in candelas and V is luminous efficacy in lumens/watt. 3. HLMP-D101. 4. HLMP-D105. 5. HLMP-K101/-K105. 3 Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. Figure 3. Relative luminous intensity vs. dc forward current. Figure 4. Relative efficiency vs. peak forward current. Figure 5. Maximum forward dc current vs. ambient temperature. Derating based on TJ MAX. = 110C. Figure 6. Maximum tolerable peak current vs. peak duration (IPEAK MAX. determined from temperature derated IDC MAX.). 4 Figure 7. Relative luminous intensity vs. angular displacement. HLMP-D101. Figure 8. Relative luminous intensity vs. angular displacement. HLMP-K101. Figure 9. Relative luminous intensity vs. angular displacement. HLMP-D105. Figure 10. Relative luminous intensity vs. angular displacement. HLMP-K105. 5 Intensity Bin Limits Color Red Bin I J K L M N O P Q R S T U V W X Y Z Intensity Range (mcd) Min. Max. 24.8 39.6 39.6 63.4 63.4 101.5 101.5 162.4 162.4 234.6 234.6 340.0 340.0 540.0 540.0 850.0 850.0 1200.0 1200.0 1700.0 1700.0 2400.0 2400.0 3400.0 3400.0 4900.0 4900.0 7100.0 7100.0 10200.0 10200.0 14800.0 14800.0 21400.0 21400.0 30900.0 Maximum tolerance for each bin limit is 18%. Mechanical Option Matrix Mechanical Option Code 00 01 02 A1 A2 B1 B2 DD UQ Definition Bulk Packaging, minimum increment 500 pcs/bag Tape & Reel, crimped leads, minimum increment 1300 pcs (T-1 3/4)/1800 pcs (T-1) Tape & Reel, straight leads, minimum increment 1300 pcs (T-1 3/4)/1800 pcs (T-1) Right Angle Housing, uneven leads, minimum increment 500 pcs/bag Right Angle Housing, even leads, minimum increment 500 pcs/bag Right Angle Housing, uneven leads, minimum increment 500 pcs/bag Right Angle Housing, even leads, minimum increment 500 pcs/bag Ammo Pack, straight leads in 2K increment Ammo Pack, horizontal leads in 2K increment Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information. 6 Precautions Lead Forming * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. * If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. * It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Conditions * Care must be taken during PCB assembly and soldering process to prevent damage to LED component. * Recommended soldering conditions: Pre-heat Temperature Pre-heat Time Peak Temperature Dwell Time TEMPERATURE - C Manual Solder Dipping - - 260 C Max. 5 sec Max. LAMINAR WAVE HOT AIR KNIFE TURBULENT WAVE 250 * Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25C, before handling. * Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) BOTTOM SIDE OF PC BOARD 200 CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150C (100C PCB) SOLDER WAVE TEMPERATURE = 245C AIR KNIFE AIR TEMPERATURE = 390C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40 SOLDER: SN63; FLUX: RMA 150 FLUXING 100 0 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 10 20 30 40 50 60 70 80 TIME - SECONDS Figure 11. Recommended wave soldering profile. 90 100 Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) Note: Refer to application note AN1027 for more information on soldering LED components. TOP SIDE OF PC BOARD 50 30 7 * If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. * Recommended PC board plated through hole sizes for LED component leads: * The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. Wave Soldering 105 C Max. 30 sec Max. 250 C Max. 3 sec Max. * Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (916) 788-6763 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright (c) 2004-2005 Agilent Technologies, Inc. Obsoletes 5988-2230EN November 12, 2005 5989-4250EN