LMH6682, LMH6683
www.ti.com
SNOSA43A –MAY 2004–REVISED APRIL 2013
LMH6682/6683 190MHz Single Supply, Dual and Triple Operational Amplifiers
Check for Samples: LMH6682,LMH6683
1FEATURES DESCRIPTION
The LMH6682 and LMH6683 are high speed
2VS= ±5V, TA= 25°C, RL= 100Ω, A = +2 (Typical operational amplifiers designed for use in modern
Values Unless Specified) video systems. These single supply monolithic
• DG error 0.01% amplifiers extend TI's feature-rich, high value video
• DP error 0.08° portfolio to include a dual and a triple version. The
important video specifications of differential gain (±
•−3dB BW (A = +2) 190MHz 0.01% typ.) and differential phase (±0.08 degrees)
• Slew rate (VS= ±5V) 940V/μscombined with an output drive current in each
• Supply Current 6.5mA/amp amplifier of 85mA make the LMH6682 and LMH6683
excellent choices for a full range of video
• Output Current +80/−90mA applications.
• Input Common Mode Voltage 0.5V Beyond Voltage feedback topology in operational amplifiers
V−,1.7V from V+assures maximum flexibility and ease of use in high
• Output Voltage Swing (RL= 2kΩ) 0.8V from speed amplifier designs. The LMH6682/83 is
Rails fabricated in TI's VIP10 process. This advanced
• Input Voltage Noise (100KHz) 12nV/√Hz process provides a superior ratio of speed to
quiescient current consumption and assures the user
APPLICATIONS of high-value amplifier designs. Advanced technology
and circuit design enables in these amplifiers a −3db
• CD/DVD ROM bandwidth of 190MHz, a slew rate of 940V/μsec, and
• ADC Buffer Amp stability for gains of less than −1 and greater than +2.
• Portable Video The input stage design of the LM6682/83 enables an
• Current Sense Buffer input signal range that extends below the negative
rail. The output stage voltage range reaches to within
• Portable Communications 0.8V of either rail when driving a 2kΩload. Other
attractive features include fast settling and low
distortion. Other applications for these amplifiers
include servo control designs. These applications are
sensitive to amplifiers that exhibit phase reversal
when the inputs exceed the rated voltage range. The
LMH6682/83 amplifiers are designed to be immune to
phase reversal when the specified input range is
exceeded. See applications section. This feature
makes for design simplicity and flexibility in many
industrial applications.
The LMH6682 dual operational amplifier is offered in
miniature surface mount packages, SOIC-8, and
VSSOP-8. The LMH6683 triple amplifier is offered in
SOIC-14 and TSSOP-14.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2004–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LMH6682, LMH6683
SNOSA43A –MAY 2004–REVISED APRIL 2013
www.ti.com
Connection Diagram
Figure 1. SOIC-8/VSSOP-8 (LMH6682) Figure 2. SOIC-14/TSSOP-14 (LMH6683)
Top View Top View
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
ESD Tolerance Human Body Model 2KV(3)
Machine Model 200V(4)
VIN Differential ±2.5V
Output Short Circuit Duration See(5)(6)
Input Current ±10mA
Supply Voltage (V+- V−) 12.6V
Voltage at Input/Output pins V++0.8V, V−−0.8V
Soldering Information Infrared or Convection (20 sec.) 235°C
Wave Soldering (10 sec.) 260°C
Storage Temperature Range −65°C to +150°C
Junction Temperature(7) +150°C
(1) Absolute maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Human body model, 1.5kΩin series with 100pF.
(4) Machine Model, 0Ωin series with 200pF.
(5) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(6) Output short circuit duration is infinite for VS< 6V at room temperature and below. For VS> 6V, allowable short circuit duration is 1.5ms.
(7) The maximum power dissipation is a function of TJ(MAX),θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.
Operating Ratings(1)
Supply Voltage (V+– V−) 3V to 12V
Operating Temperature Range(2) −40°C to +85°C
Package Thermal Resistance(2) SOIC-8 190°C/W
VSSOP-8 235°C/W
SOIC-14 145°C/W
TSSOP-14 155°C/W
(1) Absolute maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of TJ(MAX),θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.
2Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
www.ti.com
SNOSA43A –MAY 2004–REVISED APRIL 2013
5V Electrical Characteristics
Unless otherwise specified, all limits ensured for at TJ= 25°C, V+= 5V, V−= 0V, VO= VCM = V+/2, and RL= 100Ωto V+/2, RF
= 510Ω.Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min(1) Typ(2) Max(1) Units
SSBW −3dB BW A = +2, VOUT = 200mVPP 140 180 MHz
A = −1, VOUT = 200mVPP 180
GFP Gain Flatness Peaking A = +2, VOUT = 200mVPP 2.1 dB
DC to 100MHz
GFR Gain Flatness Rolloff A = +2, VOUT = 200mVPP 0.1 dB
DC to 100MHz
LPD 1° 1° Linear Phase Deviation A = +2, VOUT = 200mVPP, ±1° 40 MHz
GF 0.1dB 0.1dB Gain Flatness A = +2, ±0.1dB, VOUT = 200mVPP 25 MHz
FPBW Full Power −1dB Bandwidth A = +2, VOUT = 2VPP 110 MHz
DG Differential Gain A = +2, RL= 150Ωto V+/2 0.03 %
NTSC 3.58MHz Pos video only VCM = 2V
DP Differential Phase A = +2, RL= 150Ωto V+/2 0.05 deg
NTSC 3.58MHz Pos video only VCM = 2V
Time Domain Response
Tr/TfRise and Fall Time 20-80%, VO= 1VPP, AV= +2 2.1 ns
20-80%, VO= 1VPP, AV=−1 2
OS Overshoot A = +2, VO= 100mVPP 22 %
TsSettling Time VO= 2VPP, ±0.1%, AV= +2 49 ns
SR Slew Rate(3) A = +2, VOUT = 3VPP 520 V/μs
A = −1, VOUT = 3VPP 500
Distortion and Noise Response
HD2 2nd Harmonic Distortion f = 5MHz, VO= 2VPP, A = +2, RL= 2kΩ −60 dBc
f = 5MHz, VO= 2VPP, A = +2, RL=−61
100Ω
HD3 3rd Harmonic Distortion f = 5MHz, VO= 2VPP, A = +2, RL= 2kΩ −77 dBc
f = 5MHz, VO= 2VPP, A = +2, RL=−54
100Ω
THD Total Harmonic Distortion f = 5MHz, VO= 2VPP, A = +2, RL= 2kΩ −60 dBc
f = 5MHz, VO= 2VPP, A = +2, RL=−53
100Ω
enInput Referred Voltage Noise f = 1kHz 17 nV/√Hz
f = 100kHz 12
inInput Referred Current Noise f = 1kHz 8 pA/√Hz
f = 100kHz 3
CT Cross-Talk Rejection (Amplifier) f = 5MHz, A = +2, SND: RL= 100Ω −77 dB
RCV: RF= RG= 510Ω
Static, DC Performance
AVOL Large Signal Voltage Gain VO= 1.25V to 3.75V, 85 95
RL= 2kΩto V+/2
VO= 1.5V to 3.5V, 75 85 dB
RL= 150Ωto V+/2
VO= 2V to 3V, 70 80
RL= 50Ωto V+/2
CMVR Input Common-Mode Voltage CMRR ≥50dB −0.2 −0.5
Range −0.1 V
3.0 3.3
2.8
(1) All limits are ensured by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm.
(3) Slew rate is the average of the rising and falling slew rates
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
SNOSA43A –MAY 2004–REVISED APRIL 2013
www.ti.com
5V Electrical Characteristics (continued)
Unless otherwise specified, all limits ensured for at TJ= 25°C, V+= 5V, V−= 0V, VO= VCM = V+/2, and RL= 100Ωto V+/2, RF
= 510Ω.Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min(1) Typ(2) Max(1) Units
VOS Input Offset Voltage ±1.1 ±5 mV
±7
TC VOS Input Offset Voltage Average See(4) ±2 μV/°C
Drift
IBInput Bias Current See(5) −5−20 μA
−30
TC IB Input Bias Current Drift 0.01 nA/°C
IOS Input Offset Current 50 300 nA
500
CMRR Common Mode Rejection Ratio VCM Stepped from 0V to 3.0V 72 82 dB
+PSRR Positive Power Supply Rejection V+= 4.5V to 5.5V, VCM = 1V 70 76 dB
Ratio
ISSupply Current (per channel) No load 6.5 9 mA
11
Miscellaneous Performance
VOOutput Swing RL= 2kΩto V+/2 4.10 4.25
High 3.8
RL= 150Ωto V+/2 3.90 4.19 V
3.70
RL= 75Ωto V+/2 3.75 4.15
3.50
Output Swing RL= 2kΩto V+/2 800 920
Low 1100
RL= 150Ωto V+/2 870 970 mV
1200
RL= 75Ωto V+/2 885 1100
1250
IOUT Output Current VO= 1V from either supply rail ±40 +80/−75 mA
ISC Output Short Circuit Sourcing to V+/2 −100 −155
Current(6)(7)(8) −80 mA
Sinking from V+/2 100 220
80
RIN Common Mode Input Resistance 3 MΩ
CIN Common Mode Input 1.6 pF
Capacitance
ROUT Output Resistance Closed Loop f = 1kHz, A = +2, RL= 50Ω0.02 Ω
f = 1MHz, A = +2, RL= 50Ω0.12
(4) Offset Voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change.
(5) Positive current corresponds to current flowing into the device.
(6) Short circuit test is a momentary test. See next note.
(7) Output short circuit duration is infinite for VS< 6V at room temperature and below. For VS> 6V, allowable short circuit duration is 1.5ms.
(8) Positive current corresponds to current flowing into the device.
4Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
www.ti.com
SNOSA43A –MAY 2004–REVISED APRIL 2013
±5V Electrical Characteristics
Unless otherwise specified, all limits ensured for at TJ= 25°C, V+= 5V, V−=−5V, VO= VCM = 0V, and RL= 100Ωto 0V, RF=
510Ω.Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min(1) Typ(2) Max(1) Units
SSBW −3dB BW A = +2, VOUT = 200mVPP 150 190 MHz
A = −1, VOUT = 200mVPP 190
GFP Gain Flatness Peaking A = +2, VOUT = 200mVPP 1.7 dB
DC to 100MHz
GFR Gain Flatness Rolloff A = +2, VOUT = 200mVPP 0.1 dB
DC to 100MHz
LPD 1° 1° Linear Phase Deviation A = +2, VOUT = 200mVPP, ±1° 40 MHz
GF 0.1dB 0.1dB Gain Flatness A = +2, ±0.1dB, VOUT = 200mVPP 25 MHz
FPBW Full Power −1dB Bandwidth A = +2, VOUT = 2VPP 120 MHz
DG Differential Gain A = +2, RL= 150Ωto 0V 0.01 %
NTSC 3.58MHz
DP Differential Phase A = +2, RL= 150Ωto 0V 0.08 deg
NTSC 3.58MHz
Time Domain Response
Tr/TfRise and Fall Time 20-80%, VO= 1VPP, A = +2 1.9 ns
20-80%, VO= 1VPP, A = −1 2
OS Overshoot A = +2, VO= 100mVPP 19 %
TsSettling Time VO= 2VPP, ±0.1%, A = +2 42 ns
SR Slew Rate(3) A = +2, VOUT = 6VPP 940 V/μs
A = −1, VOUT = 6VPP 900
Distortion and Noise Response
HD2 2nd Harmonic Distortion f = 5MHz, VO= 2VPP, A = +2, RL= 2kΩ −63 dBc
f = 5MHz, VO= 2VPP, A = +2, RL=−66
100Ω
HD3 3rd Harmonic Distortion f = 5MHz, VO= 2VPP, A = +2, RL= 2kΩ −82 dBc
f = 5MHz, VO= 2VPP, A = +2, RL=−54
100Ω
THD Total Harmonic Distortion f = 5MHz, VO= 2VPP, A = +2, RL= 2kΩ −63 dBc
f = 5MHz, VO= 2VPP, A = +2, RL=−54
100Ω
enInput Referred Voltage Noise f = 1kHz 18 nV/√Hz
f = 100kHz 12
inInput Referred Current Noise f = 1kHz 6 pA/√Hz
f = 100kHz 3
CT Cross-Talk Rejection (Amplifier) f = 5MHz, A = +2, SND: RL= 100Ω −78 dB
RCV: RF= RG= 510Ω
Static, DC Performance
AVOL Large Signal Voltage Gain VO=−3.75V to 3.75V, 87 100
RL= 2kΩto V+/2
VO=−3.5V to 3.5V, 80 90 dB
RL= 150Ωto V+/2
VO=−3V to 3V, 75 85
RL= 50Ωto V+/2
CMVR Input Common Mode Voltage CMRR ≥50dB −5.2 −5.5
Range −5.1 V
3.0 3.3
2.8
(1) All limits are ensured by testing or statistical analysis.
(2) Typical values represent the most likely parametric norm.
(3) Slew rate is the average of the rising and falling slew rates
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
SNOSA43A –MAY 2004–REVISED APRIL 2013
www.ti.com
±5V Electrical Characteristics (continued)
Unless otherwise specified, all limits ensured for at TJ= 25°C, V+= 5V, V−=−5V, VO= VCM = 0V, and RL= 100Ωto 0V, RF=
510Ω.Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min(1) Typ(2) Max(1) Units
VOS Input Offset Voltage ±1 ±5 mV
±7
TC VOS Input Offset Voltage Average See(4) ±2 μV/°C
Drift
IBInput Bias Current See(5) −5−20 μA
−30
TC IB Input Bias Current Drift 0.01 nA/°C
IOS Input Offset Current 50 300 nA
500
CMRR Common Mode Rejection Ratio VCM Stepped from −5V to 3.0V 75 84 dB
+PSRR Positive Power Supply Rejection V+= 8.5V to 9.5V, 75 82 dB
Ratio V−=−1V
−PSRR Negative Power Supply Rejection V−=−4.5V to −5.5V, 78 85 dB
Ratio V+= 5V
ISSupply Current (per channel) No load 6.5 9.5 mA
11
Miscellaneous Performance
VOOutput Swing RL= 2kΩto 0V 4.10 4.25
High 3.80
RL= 150Ωto 0V 3.90 4.20 V
3.70
RL= 75Ωto 0V 3.75 4.18
3.50
Output Swing RL= 2kΩto 0V −4.19 −4.07
Low −3.80
RL= 150Ωto 0V −4.05 −3.89 mV
−3.65
RL= 75Ωto 0V −4.00 −3.70
−3.50
IOUT Output Current VO= 1V from either supply rail ±45 +85/−80 mA
ISC Output Short Circuit Sourcing to 0V −120 −180
Current(6)(7)(8) −100 mA
Sinking from 0V 120 230
100
RIN Common Mode Input Resistance 4 MΩ
CIN Common Mode Input 1.6 pF
Capacitance
ROUT Output Resistance Closed Loop f = 1kHz, A = +2, RL= 50Ω0.02 Ω
f = 1MHz, A = +2, RL= 50Ω0.12
(4) Offset Voltage average drift determined by dividing the change in VOS at temperature extremes into the total temperature change.
(5) Positive current corresponds to current flowing into the device.
(6) Short circuit test is a momentary test. See next note.
(7) Output short circuit duration is infinite for VS< 6V at room temperature and below. For VS> 6V, allowable short circuit duration is 1.5ms.
(8) Positive current corresponds to current flowing into the device.
6Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
SNOSA43A –MAY 2004–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics
At TA= 25°C, V+= +5V, V−=−5V, RF= 510Ωfor A = +2; unless otherwise specified.
Non-Inverting Frequency Response Inverting Frequency Response
Figure 3. Figure 4.
Non-Inverting Frequency Response for Various Gain Inverting Frequency Response for Various Gain
Figure 5. Figure 6.
Non-Inverting Phase vs. Frequency for Various Gain Inverting Phase vs. Frequency for Various Gain
Figure 7. Figure 8.
8Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
www.ti.com
SNOSA43A –MAY 2004–REVISED APRIL 2013
Typical Performance Characteristics (continued)
At TA= 25°C, V+= +5V, V−=−5V, RF= 510Ωfor A = +2; unless otherwise specified.
Open Loop Gain and Phase vs. Frequency Over
Open Loop Gain & Phase vs. Frequency Temperature
Figure 9. Figure 10.
Non-Inverting Frequency Response Over Temperature Inverting Frequency Response Over Temperature
Figure 11. Figure 12.
Gain Flatness 0.1dB Differential Gain & Phase for A = +2
Figure 13. Figure 14.
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
SNOSA43A –MAY 2004–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
At TA= 25°C, V+= +5V, V−=−5V, RF= 510Ωfor A = +2; unless otherwise specified.
Transient Response Negative Transient Response Positive
Figure 15. Figure 16.
Noise vs. Frequency Noise vs. Frequency
Figure 17. Figure 18.
Harmonic Distortion vs. VOUT Harmonic Distortion vs. VOUT
Figure 19. Figure 20.
10 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
www.ti.com
SNOSA43A –MAY 2004–REVISED APRIL 2013
Typical Performance Characteristics (continued)
At TA= 25°C, V+= +5V, V−=−5V, RF= 510Ωfor A = +2; unless otherwise specified.
Harmonic Distortion vs. VOUT THD vs. for Various Frequencies
Figure 21. Figure 22.
Harmonic Distortion vs. Frequency Crosstalk vs. Frequency
Figure 23. Figure 24.
ROUT vs. Frequency IOS vs. VSUPPLY Over Temperature
Figure 25. Figure 26.
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
SNOSA43A –MAY 2004–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
At TA= 25°C, V+= +5V, V−=−5V, RF= 510Ωfor A = +2; unless otherwise specified.
VOS vs. VS@−40°C VOS vs. VS@ 25°C
Figure 27. Figure 28.
VOS vs. VS@ 85°C VOS vs. VS@ 125°C
Figure 29. Figure 30.
VOS vs. VOUT VOS vs. VOUT
Figure 31. Figure 32.
12 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
www.ti.com
SNOSA43A –MAY 2004–REVISED APRIL 2013
Typical Performance Characteristics (continued)
At TA= 25°C, V+= +5V, V−=−5V, RF= 510Ωfor A = +2; unless otherwise specified.
ISUPPLY/Amp vs. VCM ISUPPLY/Amp vs. VSUPPLY
Figure 33. Figure 34.
VOUT vs. ISOURCE VOUT vs. ISINK
Figure 35. Figure 36.
VOUT vs. ISOURCE VOUT vs. ISINK
Figure 37. Figure 38.
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
SNOSA43A –MAY 2004–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
At TA= 25°C, V+= +5V, V−=−5V, RF= 510Ωfor A = +2; unless otherwise specified.
VOS vs. VCM |IB|vs. VS
Figure 39. Figure 40.
Short Circuit ISOURCE vs. VSShort Circuit ISINK vs. VS
Figure 41. Figure 42.
Linearity Input vs. Output Linearity Input vs. Output
Figure 43. Figure 44.
14 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
www.ti.com
SNOSA43A –MAY 2004–REVISED APRIL 2013
Typical Performance Characteristics (continued)
At TA= 25°C, V+= +5V, V−=−5V, RF= 510Ωfor A = +2; unless otherwise specified.
CMRR vs. Frequency PSRR vs. Frequency
Figure 45. Figure 46.
Small Signal Pulse Response for A = +2 Small Signal Pulse Response A = −1
Figure 47. Figure 48.
Large Signal Pulse Response Large Signal Pulse Response
Figure 49. Figure 50.
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
SNOSA43A –MAY 2004–REVISED APRIL 2013
www.ti.com
APPLICATIONS SECTION
LARGE SIGNAL BEHAVIOR
Amplifying high frequency signals with large amplitudes (as in video applications) has some special aspects to
look after. The bandwidth of the Op Amp for large amplitudes is less than the small signal bandwidth because of
slew rate limitations. While amplifying pulse shaped signals the slew rate properties of the OpAmp become more
important at higher amplitude ranges. Due to the internal structure of an Op Amp the output can only change with
a limited voltage difference per time unit (dV/dt). This can be explained as follows: To keep it simple, assume
that an Op Amp consists of two parts; the input stage and the output stage. In order to stabilize the Op Amp, the
output stage has a compensation capacitor in its feedback path. This Miller C integrates the current from the
input stage and determines the pulse response of the Op Amp. The input stage must charge/discharge the
feedback capacitor, as can be seen in Figure 51.
Figure 51.
When a voltage transient is applied to the non inverting input of the Op Amp, the current from the input stage will
charge the capacitor and the output voltage will slope up. The overall feedback will subtract the gradually
increasing output voltage from the input voltage. The decreasing differential input voltage is converted into a
current by the input stage (Gm).
I*Δt = C *ΔV (1)
ΔV/Δt = I/C (2)
I=ΔV*Gm (3)
where I = current
t = time
C = capacitance
V = voltage
Gm = transconductance
Slew rate ΔV/Δt = volt/second
In most amplifier designs the current I is limited for high differential voltages (Gm becomes zero). The slew rate
will than be limited as well:
ΔV/Δt = Imax/C (4)
The LMH6682/83 has a different setup of the input stage. It has the property to deliver more current to the output
stage when the input voltage is higher (class AB input). The current into the Miller capacitor exhibits an
exponential character, while this current in other Op Amp designs reaches a saturation level at high input levels:
(see Figure 52)
16 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
www.ti.com
SNOSA43A –MAY 2004–REVISED APRIL 2013
Figure 52.
This property of the LMH6682/83 guaranties a higher slew rate at higher differential input voltages.
ΔV/Δt = ΔV*Gm/C (5)
In Figure 53 one can see that a higher transient voltage than will lead to a higher slew rate.
Figure 53.
HANDLING VIDEO SIGNALS
When handling video signals, two aspects are very important especially when cascading amplifiers in a NTSC- or
PAL video system. A composite video signal consists of both amplitude and phase information. The amplitude
represents saturation while phase determines color (color burst is 3.59MHz for NTSC and 4.58MHz for PAL
systems). In this case it is not only important to have an accurate amplification of the amplitude but also it is
important not to add a varying phase shift to the video signals. It is a known phenomena that at different dc
levels over a certain load the phase of the amplified signal will vary a little bit. In a video chain many amplifiers
will be cascaded and all errors will be added together. For this reason, it is necessary to have strict requirements
for the variation in gain and phase in conjunction to different dc levels. As can be seen in the tables the number
for the differential gain for the LMH6682/83 is only 0.01% and for the differential phase it is only 0.08° at a supply
voltage of ±5V. Note that the phase is very dependent of the load resistance, mainly because of the dc current
delivered by the parts output stage into the load. For more information about differential gain and phase and how
to measure it see Application Note OA-24 SNOA370 which can be found on via TI's home page
http://www.ti.com
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
SNOSA43A –MAY 2004–REVISED APRIL 2013
www.ti.com
OUTPUT PHASE REVERSAL
This is a problem with some operational amplifiers. This effect is caused by phase reversal in the input stage due
to saturation of one or more of the transistors when the inputs exceed the normal expected range of voltages.
Some applications, such as servo control loops among others, are sensitive to this kind of behavior and would
need special safeguards to ensure proper functioning. The LMH6682/6683 is immune to output phase reversal
with input overload. With inputs exceeded, the LMH6682/6683 output will stay at the clamped voltage from the
supply rail. Exceeding the input supply voltages beyond the Absolute Maximum Ratings of the device could
however damage or otherwise adversely effect the reliability or life of the device.
DRIVING CAPACITIVE LOADS
The LMH6682/6683 can drive moderate values of capacitance by utilizing a series isolation resistor between the
output and the capacitive load. Capacitive load tolerance will improve with higher closed loop gain values.
Applications such as ADC buffers, among others, present complex and varying capacitive loads to the Op Amp;
best value for this isolation resistance is often found by experimentation and actual trial and error for each
application.
DISTORTION
Applications with demanding distortion performance requirements are best served with the device operating in
the inverting mode. The reason for this is that in the inverting configuration, the input common mode voltage
does not vary with the signal and there is no subsequent ill effects due to this shift in operating point and the
possibility of additional non-linearity. Moreover, under low closed loop gain settings (most suited to low
distortion), the non-inverting configuration is at a further disadvantage of having to contend with the input
common voltage range. There is also a strong relationship between output loading and distortion performance
(i.e. 2kΩvs. 100Ωdistortion improves by about 15dB @1MHz) especially at the lower frequency end where the
distortion tends to be lower. At higher frequency, this dependence diminishes greatly such that this difference is
only about 5dB at 10MHz. But, in general, lighter output load leads to reduced HD3 term and thus improves
THD. (See Harmonic Distortion plots, Figures 19 through 23).
PRINTED CIRCUIT BOARD LAYOUT AND COMPONENT VALUES SELECTION
Generally it is a good idea to keep in mind that for a good high frequency design both the active parts and the
passive ones are suitable for the purpose you are using them for. Amplifying frequencies of several hundreds of
MHz is possible while using standard resistors but it makes life much easier when using surface mount ones.
These resistors (and capacitors) are smaller and therefore parasitics have lower values and will have less
influence on the properties of the amplifier. Another important issue is the PCB, which is no longer a simple
carrier for all the parts and a medium to interconnect them. The board becomes a real part itself, adding its own
high frequency properties to the overall performance of the circuit. It's good practice to have at least one ground
plane on a PCB giving a low impedance path for all decouplings and other ground connections. Care should be
taken especially that on board transmission lines have the same impedance as the cables they are connected to
(i.e. 50Ωfor most applications and 75Ωin case of video and cable TV applications). These transmission lines
usually require much wider traces on a standard double sided PCB than needed for a 'normal' connection.
Another important issue is that inputs and outputs must not 'see' each other or are routed together over the PCB
at a small distance. Furthermore it is important that components are placed as flat as possible on the surface of
the PCB. For higher frequencies a long lead can act as a coil, a capacitor or an antenna. A pair of leads can
even form a transformer. Careful design of the PCB avoids oscillations or other unwanted behavior. When
working with really high frequencies, the only components which can be used will be the surface mount ones (for
more information see OA-15 SNOA367).
As an example of how important the component values are for the behavior of your circuit, look at the following
case: On a board with good high frequency layout, an amplifier is placed. For the two (equal) resistors in the
feedback path, 5 different values are used to set the gain to +2. The resistors vary from 200Ωto 3kΩ.
18 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
www.ti.com
SNOSA43A –MAY 2004–REVISED APRIL 2013
Figure 54.
In Figure 54 it can be seen that there's more peaking with higher resistor values, which can lead to oscillations
and bad pulse responses. On the other hand the low resistor values will contribute to higher overall power
consumption.
TI suggests the following evaluation boards as a guide for high frequency layout and as an aid in device testing
and characterization.
Device Package Evaluation Board PN
LMH6682MA 8-Pin SOIC CLC730036
LMH6682MM 8-Pin VSSOP CLC730123
LMH6683MA 14-Pin SOIC CLC730031
LMH6683MT 14-Pin TSSOP CLC730131
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Links: LMH6682 LMH6683
LMH6682, LMH6683
SNOSA43A –MAY 2004–REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Original (April 2013) to Revision A Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 19
20 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LMH6682 LMH6683
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMH6682MA/NOPB ACTIVE SOIC D 8 95 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LMH66
82MA
LMH6682MAX/NOPB ACTIVE SOIC D 8 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 LMH66
82MA
LMH6682MM/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 A90A
LMH6682MMX/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 A90A
LMH6683MA/NOPB ACTIVE SOIC D 14 55 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 LMH66
83MA
LMH6683MAX/NOPB ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 LMH66
83MA
LMH6683MT/NOPB ACTIVE TSSOP PW 14 94 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 LMH66
83MT
LMH6683MTX/NOPB ACTIVE TSSOP PW 14 2500 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 LMH66
83MT
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMH6682MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMH6682MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMH6682MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMH6683MAX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
LMH6683MTX/NOPB TSSOP PW 14 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1
LMH6683MTX/NOPB TSSOP PW 14 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Oct-2020
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMH6682MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMH6682MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMH6682MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LMH6683MAX/NOPB SOIC D 14 2500 367.0 367.0 35.0
LMH6683MTX/NOPB TSSOP PW 14 2500 853.0 449.0 35.0
LMH6683MTX/NOPB TSSOP PW 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Oct-2020
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
www.ti.com
EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated
