GBJ2004 thru GBJ2010
FEATURES
Rating to 1000V PRV
Ideal for printed circuit board
Low forward voltage drop, high current capability.
Reliable low cost construction utilizing molded plastic
technique results in inexpensive product
The plastic material has UL flammability classification
94V-0
UL Recognition File # E95060
MECHANICAL DATA
Polarity : Symbols molded on body
Weight : 0.23 ounces, 6.6 grams
Mounting position : Any
GBJ2010
1000
700
1000
GBJ2008
800
560
800
GBJ2006
600
420
600
GBJ2004
400
280
400
@T
C
=100 C
(with heatsink
Note 2
)
(without heatsink)
NOTES : 1.Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
2.Device mounted on 300mm x 300mm x 1.6mm Cu Plate Heatsink.
V
RMS
V
DC
V
RRM
I
(AV)
I
FSM
V
F
Maximum Average Forward
Rectified Current
Peak Forward Surge Current
8.3ms single half sine-wave
superimposed on rated load
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum forward Voltage at 10.0A DC
20.0
240
1.05
T
J
Operating Temperature Range
-55 to +150
C
T
STG
Storage Temperature Range
-55 to +150
C
Typical Thermal Resistance (Note 2)
R
0JC
0.8
C/W
I
R
Maximum DC Reverse Current
at Rated DC Blocking Voltage
@T
J
=125 C
@T
J
=25 C 10
500
uA
V
A
A
V
UNIT
V
V
240
A S
2
I t
2
I t Rating for fusing (t < 8.3ms)
2
CHARACTERISTICS SYMBOL
3.6
C
J
80
pF
Typical Junction
Capacitance per element (Note 1)
REVERSE VOLTAGE - 400 to 1000 Volts
FORWARD CURRENT - 20 Amperes
GLASS PASSIVATED BRIDGE RECTIFIERS
SEMICONDUCTOR
LITE-ON
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 ambient temperature unless otherwise specified.℃
REV. 6, Feb-2013, KBDG05
GBJ
M
P
H
E
G
KJ
I
+
++
+
-
--
-
~
~~
~~
~~
~
A
D
F
N
L
B
C
Q
O O
All Dimensions in millimeter
DIM.
GBJ
MIN. MAX.
A
C
D
E
F
G
H
B
29.70 30.30
20.3019.70
17.0 18.0
4.70
10.80 11.20
2.30 2.70
3.10 3.40
4.40
3.80
M
L
K
J
I 4.80
3.40
0.800.60
2.00 2.40
0.90 1.10
7.70
7.30
N9.80 10.20
P
Q
O
2.50 2.90
3.80 4.20
(3.0) x 45
4.90