13
AXK(7/8)
Socket and
header are
mated
Socket Header
0.3mm
1.8mm
PCB
Narrow-pitch
connectors
P4
FPC Reinforcing plate
Before
mating
Ideal for FPC-to-PCB connections
After
mating
The simple lock
mechanism ensures
that the connector
clicks into position
when it is inserted for
reliable single-action
insertion on the PCB.
A stacking height of 1.8mm including
the FPC area has been achieved.
This enables the number of pins to
be doubled white the size remains
the same as that for existing FPC
connectors. This, in turn, contributes
to making products and equipment
more compact.
FEATURES
1. A 0.4 mm pitch and stacking height
of 1.5 mm allow f or extra compactness
and helps design lighter, thinner,
shorter, and smaller devices.
2. High impact-resistant construction.
1) Adoption of bellows-type contacts
structure.
2) It is constructed with impact dispersion
keys inside the body to disperse shocks
when dropped.
A high level of shock resistance is
ensured by dispersing impact over the
four locations where the socket indenta-
tions and header protrusions are mated
together.
3. Construction makes designing
devices easier.
1) The lower connector surface construc-
tion pre vents contact and shorts between
the PCB and metal terminals. This
enables freedom in pattern wiring, help-
ing to make PCB’s smaller.
2) Guides are provided to take up any
position shift and facilitate insertion.
3) The connector has a simple lock
mechanism.
4. Design makes efficient mounting.
Features a terminal flatness of 0.08 mm,
construction resistant to creeping flux,
and design that facilitates visual inspec-
tion of the soldered part.
APPLICATIONS
• Cellular phones
• DVC
• Compact portable devices
Since the contact is formed by
bending thin plate, it has a spring-
like quality. This construction
helps make it resistant to dropping
and twisting.
The roll surfaces are in contact
with each other, providing high
contact reliability.
Impact dispersion Key
Socket
Header
<Socket>
Connector bottom: Create any thru-hole pattern wiring.
<Header>
Insertion guide
Socket side
contact
Header side
contact
Simple lock
mechanism
NARROW-PITCH
CONNECTORS
FOR PC BOARDS
NARROW PITCH
(0.4mm) CONNECTORS
P4 SERIES
PRODUCT TYPES
Notes) 1. Regarding ordering units: During production, Please make orders in 1-reel units. Samples for mounting confirmation: Please consult us. (See “Regarding sample
orders to confirm proper mounting” on page 9.) Samples: Small lot orders are possible.
2. The standard type comes with no positioning bosses. Connectors with positioning bosses are available for on-demand production. For this type of connector, 8th
digit of the part no. changes from 4 to 3. e.g. Stacking height 1.5mm 20 contacts for sockets: AXK720135J
3. Connectors with holding metal are available for on-demand production.
Stacking height No. of contacts Part No. Packing
Socket Header Inner carton (1-reel) Outer carton
1.5 mm
20 AXK720145
∗
AXK820145
∗
Note 1)
“Asterisk” mark on end of part No.;
J: 3,000 pieces
V: 3,000 pieces
Note 1)
“Asterisk” mark on end of part No.;
J: 6,000 pieces
V: 15,000 pieces
24 AXK724145
∗
AXK824145
∗
26 AXK726145
∗
AXK826145
∗
30 AXK730145
∗
AXK830145
∗
34 AXK734145
∗
AXK834145
∗
40 AXK740145
∗
AXK840145
∗
50 AXK750145
∗
AXK850145
∗
60 AXK760145
∗
AXK860145
∗
70 AXK770145
∗
AXK870145
∗
80 AXK780145
∗
AXK880145
∗
100 AXK700145
∗
AXK800145
∗
14
AXK(7/8)
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Item Specifications Conditions
Electrical
characteristics
Rated current 0.3A/contact (Max. 5 A at total contacts)
Rated voltage 60V AC/DC
Breakdown voltage 150V AC for 1 minute Detection current: 1mA
Insulation resistance Min. 1,000M
Ω
(initial) Using 250V DC megger (applied for 1 min.)
Contact resistance Max. 70m
Ω
Measured based on the HP4338B measurement method
of JIS C 5402
Mechanical
characteristics
Composite insertion force Max. 0.981N {100gf}/contacts
×
contacts (initial)
Composite removal force Min. 0.0588N {6gf}/contacts
×
contacts
Post holding force Min. 0.981N {100gf}/contact Measures the maximum load in the post axial direction
until removal
Environmental
characteristics
Ambient temperature –55°C to +85°C No freezing at low temperatures
Soldering heat resistance Max. peak temperature of 245°C Infrared reflow soldering
300°C within 5 seconds Soldering iron
Thermal shock resistance
(header and socket mated) 5 cycles, insulation resistance min. 100M
Ω
,
contact resistance max. 70m
Ω
Humidity resistance
(header and socket mated) 120 hours, insulation resistance min. 100M
Ω
,
contact resistance max. 70m
Ω
Bath temperature 40±2°C, humidity 90 to 95% R.H.
Saltwater spray resistance
(header and socket mated) 24 hours, insulation resistance min. 100M
Ω
,
contact resistance max. 70m
Ω
Bath temperature 35±2°C, saltwarter concentration 5±1%
H
2
S resistance
(header and socket mated) 48 hours, contact resistance max. 70m
Ω
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Insertion and removal life 50 times Repeated insertion and removal speed of max. 200 times/
hours
Unit weight Stacking height 1.5mm, 20 contacts; Socket: 0.04g
Header: 0.02g
Part name Material Surface treatment
Molded portion Heat-resistant resin (UL94V-0), Black —
Contact/Post Copper alloy Contact portion:
Terminal portion: Au plating over Ni
Au plating over Ni (Except for thick of terminal)
Sequence Temperature (°C) Time (minutes)
1 –55 30
2 25 Max. 5
385 30
4 25 Max. 5
+0
−3
+10
−5
+3
−0
+10
−5
mm General tolerance ±0.2
DIMENSIONS
• Socket (stacking height: 1.5mm)
A
B±0.1
0.40±0.05 0.40±0.05
0.15±0.03
4.10
1.50
0.10±0.03
(0.675)
3.75
5.10
(0.675)
(Suction face)
1.11
0.08
Dimension table (mm)
No. of
contacts AB
20 6.3 3.6
24 7.1 4.4
26 7.5 4.8
30 8.3 5.6
34 9.1 6.4
40 10.3 7.6
50 12.3 9.6
60 14.3 11.6
70 16.3 13.6
80 18.3 15.6
100 22.3 19.6
• Header (stacking height: 1.5mm) A
±0.1
B
±0.05
0.40 ±0.05
0.40±0.03
0.15
2.76
3.96
2.19
0.10±0.03
(0.29)(0.29) 3.38
3.96
(Suction face)
1.20
1.31
0.08
Dimension table (mm)
No. of
contacts AB
20 5.1 3.6
24 5.9 4.4
26 6.3 4.8
30 7.1 5.6
34 7.9 6.4
40 9.1 7.6
50 11.1 9.6
60 13.1 11.6
70 15.1 13.6
80 17.1 15.6
100 21.1 19.6
AXK(7/8)
• Socket and header are mated
Stacking height 1.5 mm
±0.15
1.50
EMBOSSED T APE DIMENSIONS
Please refer to page 56.
NOTES
1. As shown below, excess force dur-
ing insertion may result in damage to
the connector or remov al of the solder .
Please be careful. Also, to prevent
connector damage plese confirm the
correct position before mating con-
nectors.
2. Keep the PC board warp no more
than 0.03 mm in relation to the overall
length of the connector.
3. PC Boards and Recommended
Metal Mask Patterns
Connectors are mounted with high den-
sity, with a pitch interval of 0.4 to 0.5 mm.
It is therefore necessary to make sure
that the right levels of solder are used, in
order to reduce solder bridge and other
issues. The figures to the right are recom-
mended metal mask patterns. Please use
them as a reference.
• Socket
Recommended PC board pattern
(T OP VIEW)
Recommended metal mask pattern
Metal mask thickness: Here, 150 µm
(Opening area ratio: 40%)
Recommended metal mask pattern
Metal mask thickness: Here, 120 µm
(Opening area ratio: 50%)
• Header
Recommended PC board pattern
(T OP VIEW)
Recommended metal mask pattern
Metal mask thickness: Here, 150 µm
(Opening area ratio: 32%)
Recommended metal mask pattern
Metal mask thickness: Here, 120 µm
(Opening area ratio: 40%)
Max. 0.03mm Max. 0.03mm
B±0.05
0.115±0.05
0.40±0.05
0.40±0.05 0.40±0.05
0.23±0.03
5.70±0.05
3.50±0.05
5.50±0.01
4.48±0.01
(0.51)
0.10±0.01
0.35±0.01
0.20±0.01
0.40±0.01
(0.51)
(0.63) (0.63)
0.40±0.01
0.20±0.01
5.50±0.01
4.24±0.01
0.10±0.01
0.35±0.01
±0.05
0.40
±0.05
0.40±0.03
0.23
2.96±0.05
±0.05
0.115±0.05
0.40
±0.05
B
±0.05
4.56
4.10±0.01
3.50±0.01
(0.30) (0.30)
0.20±0.01
0.40±0.01
0.10±0.01
0.35±0.01
0.20±0.01
0.40±0.01
(0.37)
(0.37)
4.10±0.01
3.36±0.01
0.10±0.01
0.35±0.01
* See the dimension table on page 14 for more information on the B dimension of the socket and header.
Regarding general notes, please
refer to pages 8 and 9.
12/1/2002 All Rights Reserved, © Copyright Matsushita Electric Works, Ltd.
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