1. Product profile
1.1 General description
100 W LDMOS power transistor for base station applications at frequencies from
2500 MHz to 2700 MHz.
[1] 3GPP test model 1; 64 DPCH; PAR = 7.2 dB at 0.01 % probability on CCDF. Channel bandwidth is
3.84 MHz.
1.2 Features and benefits
Excellent ruggedness
High efficiency
Low Rth providing excellent thermal stability
Designed for broadband operation (2500 MHz to 2700 MHz)
Lower output capacitance for improved performance in Doherty applications
Designed for low memory effects providing excellent pre-distortability
Internally matched for ease of use
Integrated ESD protection
Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances
(RoHS)
1.3 Applications
RF power amplifiers for W-CDMA base stations and multi carrier applications in the
2500 MHz to 2700 MHz frequency range
BLF8G27LS-100P
Power LDMOS transistor
Rev. 5 — 1 September 2015 Product data sheet
Table 1. Typical performance
Typical RF performance at Tcase = 25
C in a common source class-AB production test circuit.
Test signal f IDq VDS PL(AV) GpDACPR5M
(MHz) (mA) (V) (W) (dB) (%) (dBc)
Single carrier W-CDMA 2500 to 2700 860 28 25 18 33 35[1]
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Product data sheet Rev. 5 — 1 September 2015 2 of 11
BLF8G27LS-100P
Power LDMOS transistor
2. Pinning information
[1] Connected to flange.
3. Ordering information
4. Limiting values
[1] Continuous use at maximum temperature will affect the reliability.
5. Thermal characteristics
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1drain1
2drain2
3gate1
4gate2
5source [1]
5
12
34
4
35
1
2sym117
Table 3. Ordering information
Type number Package
Name Description Version
BLF8G27LS-100P - earless flanged ceramic package; 4 leads SOT1121B
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDS drain-source voltage - 65 V
VGS gate-source voltage 0.5 +13 V
Tstg storage temperature 65 +150 C
Tjjunction temperature [1] - 225 C
Table 5. Thermal characteristics
Symbol Parameter Conditions Typ Unit
Rth(j-c) thermal resistance from junction to case Tcase =80C; PL= 25 W 0.374 K/W
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Product data sheet Rev. 5 — 1 September 2015 3 of 11
BLF8G27LS-100P
Power LDMOS transistor
6. Characteristics
7. Test information
7.1 Ruggedness in class-AB operation
The BLF8G27LS-100P is capable of withstanding a load mismatch corresponding to
VSWR = 10 : 1 through all phases under the following conditions: VDS =28V;
IDq = 860 mA; PL= 100 W (CW); f = 2500 MHz.
7.2 Impedance information
[1] ZS and ZL defined in Figure 1.
Table 6. DC characteristics
Tj = 25
C; per section unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
V(BR)DSS drain-source breakdown voltage VGS =0V; I
D=0.72mA65--V
VGS(th) gate-source threshold voltage VDS = 10 V; ID= 72 mA 1.5 1.9 2.3 V
IDSS drain leakage current VGS =0V; V
DS =28V - - 1.4 A
IDSX drain cut-off current VGS =V
GS(th) +3.75 V;
VDS =10V
-14-A
IGSS gate leakage current VGS = 11 V; VDS = 0 V - - 140 nA
gfs forward transconductance VDS =10V; I
D=72 mA - 0.6 - S
RDS(on) drain-source on-state resistance VGS =V
GS(th) + 3.75 V;
ID=2.52 A
-0.2-
Table 7. RF characteristics
Test signal: single carrier W-CDMA; 3GPP test model 1 with 64 DCPH; PAR = 7.2 dB at 0.01 %
probability on the CCDF; carrier bandwidth 3.84 MHz; f1=2500MHz; f
2= 2600 MHz;
f3= 2700 MHz; RF performance at VDS =28V; I
Dq =860mA; T
case =25
C; unless otherwise
specified; in a class-AB production test circuit.
Symbol Parameter Conditions Min Typ Max Unit
Gppower gain PL(AV) = 25 W 16.8 18 - dB
RLin input return loss PL(AV) =25W - 12 6dB
Ddrain efficiency PL(AV) = 25 W 28 33 - %
ACPR5M adjacent channel power ratio (5 MHz) PL(AV) =25W - 35 30 dBc
Table 8. Typical impedance
Measured load-pull condition data half device; IDq = 430 mA; VDS = 28 V.
f ZS[1] ZL[1]
(MHz) () ()
2500 7.4 j12.2 5 j10.0
2600 8 j12.1 4.2 j9.0
2700 11 j16.9 4 j9.1
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Product data sheet Rev. 5 — 1 September 2015 4 of 11
BLF8G27LS-100P
Power LDMOS transistor
7.3 Test circuit
[1] Murata or capacitor of same quality.
[2] American Technical Ceramics type 600F or capacitor of same quality.
Fig 1. Definition of transistor impedance
001aaf059
drain
Z
L
Z
S
gate
Printed-Circuit Board (PCB): Rogers 4350B; r = 3.66; thickness = 0.765 mm;
thickness copper plating = 35 m.
See Table 9 for a list of components.
Fig 2. Component layout for class-AB production test circuit
Table 9. List of components
For test circuit see Figure 2.
Component Description Value Remarks
C1, C7, C11 multilayer ceramic chip capacitor 10 F[1] Murata
C2, C6, C10 multilayer ceramic chip capacitor 0.1 F[1] Murata
C3, C4, C5, C9, C13 multilayer ceramic chip capacitor 20 pF [2] ATC600F
C8, C12 electrolytic capacitor 2200 F, 63 V
R1, R2 chip resistor 9.1 Vishay Dale
SMD 0805
1
2
C2 R1
C4
C9
C10
C11
C13
C12
C8
C7
BLF8G27LS-100P
BLF8G27LS-100P
C6
C5
aaa-006796
60 mm
40 mm 40 mm
4
3
C1 C3
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Product data sheet Rev. 5 — 1 September 2015 5 of 11
BLF8G27LS-100P
Power LDMOS transistor
7.4 Graphical data
7.4.1 CW
7.4.2 CW pulsed
VDS = 28 V; IDq = 860 mA.
(1) f = 2500 MHz
(2) f = 2600 MHz
(3) f = 2700 MHz
Fig 3. Power gain and drain efficiency as function of output power; typical values
aaa-006797
0 20 40 60 80 100 120 140
80
10 10
12 20
14 30
16 40
18 50
20 60
PL (W)
Gp
Gp
(dB)(dB)(dB)
ηD
ηD
(%)(%)(%)
(1)(1)(1)
(2)(2)(2)
(3)(3)(3)
(1)(1)(1)
(2)(2)(2)
(3)(3)(3)
Gp
Gp
ηD
ηD
VDS = 28 V; IDq = 860 mA.
(1) f = 2500 MHz
(2) f = 2600 MHz
(3) f = 2700 MHz
Fig 4. Power gain and drain efficiency as function of output power; typical values
aaa-006798
0 20 40 60 80 100 120 140
12 20
14 30
16 40
18 50
20 60
PL (W)
Gp
Gp
(dB)(dB)(dB)
ηD
ηD
(%)(%)(%)
(1)(1)(1)
(2)(2)(2)
(3)(3)(3)
(1)(1)(1)
(2)(2)(2)
(3)(3)(3)
Gp
Gp
ηD
ηD
BLF8G27LS-100P#5 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 5 — 1 September 2015 6 of 11
BLF8G27LS-100P
Power LDMOS transistor
7.4.3 1-Carrier W-CDMA
VDS = 28 V; IDq = 860 mA.
(1) f = 2500 MHz
(2) f = 2600 MHz
(3) f = 2700 MHz
VDS = 28 V; IDq = 860 mA.
(1) f = 2500 MHz
(2) f = 2600 MHz
(3) f = 2700 MHz
Fig 5. Power gain and drain efficiency as function of
output power; typical values
Fig 6. Adjacent channel power ratio (5MHz) and
adjacent channel power ratio (10MHz) as
function of output power; typical values
aaa-006799
0 10 20 30 40 50 60
12 10
14 20
16 30
18 40
20 50
PL (W)
Gp
Gp
(dB)(dB)(dB)
ηD
ηD
(%)(%)(%)
(1)(1)(1)
(2)(2)(2)
(3)(3)(3)
(1)(1)(1)
(2)(2)(2)
(3)(3)(3)
Gp
Gp
ηD
ηD
aaa-006800
0 10 20 30 40 50 60
-70 -70
-60 -60
-50 -50
-40 -40
-30 -30
-20 -20
PL (W)
ACPR
ACPR5M5M
ACPR5M
(dBc)(dBc)(dBc)
ACPR
ACPR10M10M
ACPR10M
(dBc)(dBc)(dBc)
(1)(1)(1)
(2)(2)(2)
(3)(3)(3)
(1)(1)(1)
(2)(2)(2)
(3)(3)(3)
ACPRACPR5M5M
ACPR5M
ACPRACPR10M10M
ACPR10M
BLF8G27LS-100P#5 All information provided in this document is subject to legal disclaimers. © Ampleon The Netherlands B.V. 2015. All rights reserved.
Product data sheet Rev. 5 — 1 September 2015 7 of 11
BLF8G27LS-100P
Power LDMOS transistor
8. Package outline
Fig 7. Package outline SOT1121B
References
Outline
version
European
projection Issue date
IEC JEDEC JEITA
SOT1121B
sot1121b_po
09-12-14
12-06-07
Unit(1)
mm
max
nom
min
4.75
3.45
3.94
3.68
0.18
0.08
20.02
19.61
19.96
19.66
9.53
9.27
1.14
0.89
19.94
18.92
9.91
9.65
A
Dimensions
Note
1. millimeter dimensions are derived from the original inch dimensions.
2. dimension is measured 0.030 inch (0.76 mm) from the body.
Earless flanged ceramic package; 4 leads SOT1121B
bcDD
1EE
1
9.53
9.27
FHH
1
12.83
12.57
Q
1.70
1.45
U1
20.70
20.45
U2
inches
max
nom
min
0.187
0.136
0.155
0.145
0.007
0.003
8.89
e
0.35
0.788
0.772
0.786
0.774
0.375
0.365
0.045
0.035
0.785
0.745
0.39
0.38
0.375
0.365
0.505
0.495
0.067
0.057
0.815
0.805
0.25
0.01
0.51
0.02
w2w3
0.25
0.01
y
0 5 10 mm
scale
D
H1
U1
A
F
D1D
E1
U2
H
w3
Dw2
Q
E
c
5
2
1
4
3
e
by
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Product data sheet Rev. 5 — 1 September 2015 8 of 11
BLF8G27LS-100P
Power LDMOS transistor
9. Handling information
10. Abbreviations
11. Revision history
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
Table 10. Abbreviations
Acronym Description
3GPP 3rd Generation Partnership Project
CCDF Complementary Cumulative Distribution Function
CW Continuous Wave
DPCH Dedicated Physical CHannel
ESD ElectroStatic Discharge
LDMOS Laterally Diffused Metal Oxide Semiconductor
PAR Peak-to-Average Ratio
SMD Surface Mounted Device
VSWR Voltage Standing Wave Ratio
W-CDMA Wideband Code Division Multiple Access
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BLF8G27LS-100P#5 20150901 Product data sheet BLF8G27LS-100P v.4
Modifications: •The format of this document has been redesigned to comply with the new identity
guidelines of Ampleon.
•Legal texts have been adapted to the new company name where appropriate.
BLF8G27LS-100P v.4 20130415 Product data sheet - BLF8G27LS-100P v.3
BLF8G27LS-100P v.3 20130318 Preliminary data sheet - BLF8G27LS-100P v.2
BLF8G27LS-100P v.2 20121220 Objective data sheet - BLF8G27LS-100P v.1
BLF8G27LS-100P v.1 20121203 Objective data sheet - -
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Product data sheet Rev. 5 — 1 September 2015 9 of 11
BLF8G27LS-100P
Power LDMOS transistor
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.ampleon.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Ampleon does not give any representations or
warranties as to the accuracy or completeness of information included herein
and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Ampleon sales office. In
case of any inconsistency or conflict with the short data sheet, the full data
sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
Ampleon and its customer, unless Ampleon and customer have explicitly
agreed otherwise in writing. In no event however, shall an agreement be valid
in which the Ampleon product is deemed to offer functions and qualities
beyond those described in the Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, Ampleon does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. Ampleon takes no responsibility for
the content in this document if provided by an information source outside of
Ampleon.
In no event shall Ampleon be liable for any indirect, incidental, punitive,
special or consequential damages (including - without limitation - lost profits,
lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, Ampleon’ aggregate and cumulative liability towards customer
for the products described herein shall be limited in accordance with the
Terms and conditions of commercial sale of Ampleon.
Right to make changes — Ampleon reserves the right to make changes to
information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
Suitability for use — Ampleon products are not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-critical
systems or equipment, nor in applications where failure or malfunction of an
Ampleon product can reasonably be expected to result in personal injury,
death or severe property or environmental damage. Ampleon and its
suppliers accept no liability for inclusion and/or use of Ampleon products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Ampleon makes no representation
or warranty that such applications will be suitable for the specified use without
further testing or modification.
Customers are responsible for the design and operation of their applications
and products using Ampleon products, and Ampleon accepts no liability for
any assistance with applications or customer product design. It is customer’s
sole responsibility to determine whether the Ampleon product is suitable and
fit for the customer’s applications and products planned, as well as for the
planned application and use of customer’s third party customer(s). Customers
should provide appropriate design and operating safeguards to minimize the
risks associated with their applications and products.
Ampleon does not accept any liability related to any default, damage, costs or
problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
customer(s). Customer is responsible for doing all necessary testing for the
customer’s applications and products using Ampleon products in order to
avoid a default of the applications and the products or of the application or
use by customer’s third party customer(s). Ampleon does not accept any
liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — Ampleon products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.ampleon.com/terms, unless otherwise agreed in a valid written
individual agreement. In case an individual agreement is concluded only the
terms and conditions of the respective agreement shall apply. Ampleon
hereby expressly objects to applying the customer’s general terms and
conditions with regard to the purchase of Ampleon products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
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Product data sheet Rev. 5 — 1 September 2015 10 of 11
BLF8G27LS-100P
Power LDMOS transistor
Non-automotive qualified products — Unless this data sheet expressly
states that this specific Ampleon product is automotive qualified, the product
is not suitable for automotive use. It is neither qualified nor tested in
accordance with automotive testing or application requirements. Ampleon
accepts no liability for inclusion and/or use of non-automotive qualified
products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without Ampleon’ warranty of the product for such
automotive applications, use and specifications, and (b) whenever customer
uses the product for automotive applications beyond Ampleon’ specifications
such use shall be solely at customer’s own risk, and (c) customer fully
indemnifies Ampleon for any liability, damages or failed product claims
resulting from customer design and use of the product for automotive
applications beyond Ampleon’ standard warranty and Ampleon’ product
specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Any reference or use of any ‘NXP’ trademark in this document or in or on the
surface of Ampleon products does not result in any claim, liability or
entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of
the NXP group of companies and any reference to or use of the ‘NXP’
trademarks will be replaced by reference to or use of Ampleon’s own Any
reference or use of any ‘NXP’ trademark in this document or in or on the
surface of Ampleon products does not result in any claim, liability or
entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of
the NXP group of companies and any reference to or use of the ‘NXP’
trademarks will be replaced by reference to or use of Ampleon’s own
trademarks.
13. Contact information
For more information, please visit:
http://www.ampleon.com
For sales office addresses, please visit:
http://www.ampleon.com/sales
BLF8G27LS-100P
Power LDMOS transistor
© Ampleon The Netherlands B.V. 2015. All rights reserved.
For more information, please visit: http://www.ampleon.com
For sales office addresses, please visit: http://www.ampleon.com/sales
Date of release: 1 September 2015
Document identifier: BLF8G27LS-100P#5
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Thermal characteristics . . . . . . . . . . . . . . . . . . 2
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 3
7.1 Ruggedness in class-AB operation . . . . . . . . . 3
7.2 Impedance information . . . . . . . . . . . . . . . . . . . 3
7.3 Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.4 Graphical data . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.4.1 CW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.4.2 CW pulsed . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.4.3 1-Carrier W-CDMA . . . . . . . . . . . . . . . . . . . . . . 6
8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
9 Handling information. . . . . . . . . . . . . . . . . . . . . 8
10 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 8
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
13 Contact information. . . . . . . . . . . . . . . . . . . . . 10
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
