2001-2013 Microchip Technology Inc. DS39598F-page 1
PIC16F818/819
Low-Power Features:
• Power-Managed modes:
- Primary Run: XT, RC oscillator,
87 A, 1 MHz, 2V
-INTRC: 7A, 31.25 kHz, 2V
- Sleep: 0.2 A, 2V
• Timer1 oscillator: 1.8 A, 32 kHz, 2V
• Watchdog Timer: 0.7 A, 2V
• Wide operating voltage range:
- Industrial: 2.0V to 5.5V
Oscillators:
• Three Crystal modes:
- LP, XT, HS: up to 20 MHz
• Two External RC modes
• One External Clock mode:
- ECIO: up to 20 MHz
• Internal oscillator block:
- 8 use r s el ec table frequencies: 3 1 kHz, 12 5 kHz,
250kHz, 500kHz, 1MHz, 2 MHz, 4 MHz, 8 MHz
Peripheral Feat ures:
• 16 I/O pins with individual direction control
• High sink/source current: 25 mA
• Timer0: 8-bit timer/counter with 8-bit prescaler
• Ti m er1 : 1 6-b it timer/co un ter with pre sc a le r, ca n b e
incremented during Sleep via external crystal/clock
• Timer2: 8-bit timer/counter with 8-bit period
register, prescaler and postscaler
• Capture, Compare, PWM (CCP) module:
- Capture is 16-bit, max. resolution is 12.5 ns
- Compare is 16-bit, max. resolution is 200 ns
- PWM max. resolution is 10-bit
• 10-bit, 5-channel Analog-to-Digital converter
• Synchronous Serial Port (SSP) with
SPI (Master/S lave) and I 2C™ (Slave)
Pin Diagram
S pecial Microcontroller Features:
• 100,000 eras e/w ri te cy cles Enhanced Flash
program memory typical
• 1,000,000 typical erase/write cycles EEPROM
data memory typical
• EEPROM Data Retention: > 40 years
• In-Circuit Serial ProgrammingTM (ICSPTM) via two pins
• Processor read/write access to program memory
• Low-Voltage Progr amming
• In-Circuit Debugging via two pins
RA1/AN1
RA0/AN0
RA7/OSC1/CLKI
RA6/OSC2/CLKO
VDD
RB7/T1OSI/PGD
RB6/T1OSO/T1CKI/PGC
RB5/SS
RB4/SCK/SCL
RA2/AN2/VREF-
RA3/AN3/VREF+
RA4/AN4/T0CKI
RA5/MCLR/VPP
VSS
RB0/INT
RB1/SDI/SDA
RB2/SDO/CCP1
RB3/CCP1/PGM
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
PIC16F818/819
18-Pin PD I P, SOIC
Device
Prog ram Memory Data Memory
I/O Pins 10-bit
A/D (ch) CCP
(PWM)
SSP Timers
8/16-bit
Flash
(Bytes) # Single-Word
Instructions SRAM
(Bytes) EEPROM
(Bytes) SPI Slave
I2C™
PIC16F818 1792 1024 128 128 16 5 1 Y Y 2/1
PIC16F819 3584 2048 256 256 16 5 1 Y Y 2/1
18/20-Pin Enhanced Flash Microcontrollers
with nanoWatt Technology
PIC16F818/819
DS39598F-page 2 2001-2013 Mic rochip Technology Inc.
Pin Diagrams
RA1/AN1
RA0/AN0
RA7/OSC1/CLKI
RA6/OSC2/CLKO
VDD
RB7/T1OSI/PGD
RB6/T1OSO/T1CKI/PGC
RB5/SS
RB4/SCK/SCL
RA2/AN2/VREF-
RA3/AN3/VREF+
RA4/AN4/T0CKI
RA5/MCLR/VPP
VSS
RB0/INT
RB1/SDI/SDA
RB2/SDO/CCP1
RB3/CCP1/PGM
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
18-Pin PDIP, SOIC
PIC16F818/819
RA1/AN1
RA0/AN0
RA7/OSC1/CLKI
RA6/OSC2/CLKO
VDD
RB7/T1OSI/PGD
RB6/T1OSO/T1CKI/PGC
RB5/SS
RB4/SCK/SCL
RA2/AN2/VREF-
RA3/AN3/VREF+
RA4/AN4/T0CKI
RA5/MCLR/VPP
VSS
RB0/INT
RB1/SDI/SDA
RB2/SDO/CCP1
RB3/CCP1/PGM
1
2
3
4
5
6
7
8
9
20
19
18
17
16
15
14
13
12
20-Pin SSOP
10 11
VSS VDD
PIC16F818/819
28-Pin QFN(1)
16
2
RA2/AN2/VREF-
RA0/AN0
RA4/AN4/T0CKI
RA5/MCLR/VPP
NC
VSS
NC
RB0/INT
RB1/SDI/SDA
RA3/AN3/VREF+
RA7/OSC1/CLKI
RA6/OSC2/CLKO
VDD
NC
VDD
RB7/T1OSI/PGD
RB6/T1OSO/T1CKI/PGC
RB5/SS
RB4/SCK/SCL
7
PIC16F818/819
1
3
6
5
4
15
21
19
20
17
18
22
28
26
27
23
24
25
14
8
10
9
13
12
11
VSS
NC
NC
RA1/AN1
RB2/SDO/CCP1
RB3/CCP1/PGM
NC
NC NC
Note 1: For the QFN package, it is recommended that the bottom pad be connected to VSS.
2001-2013 Microchip Technology Inc. DS39598F-page 3
PIC16F818/819
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 5
2.0 Memory O rganization................................................................................................................................................................... 9
3.0 Data EEPROM and Flash Program Memory.............................................................................................................................. 25
4.0 Oscillator Configurations............................................................................................................................................................ 33
5.0 I/O Ports ................................................................................................................... .................................................................. 39
6.0 Timer0 Module ........................................................................................................................................................................... 53
7.0 Timer1 Module ........................................................................................................................................................................... 57
8.0 Timer2 Module ........................................................................................................................................................................... 63
9.0 Capture/Compare/PWM (CCP) Module..................................................................................................................................... 65
10.0 Synchronous Serial Port (SSP) Module..................................................................................................................................... 71
11.0 Analog-t o-Digital Converter (A/D) Module.................................................................................................................................. 81
12.0 Specia l Features of the CPU...................................................................................................................................................... 89
13.0 Instruction Set Summary.......................................................................................................................................................... 103
14.0 Development Support............................................................................................................................................................... 111
15.0 Electrical Characteristics.......................................................................................................................................................... 115
16.0 DC and AC Characteristics Graphs and Tables........................................................ ......... .... .... .... .......................................... 141
17.0 Packagin g In fo rmation.............................................................................................................................................................. 155
Appendix A: Revision History . ............................................................................................................................................................ 165
Appendix B: Device Differences ........................................................................................................................................................ 165
INDEX................................................................................................................................................................................................ 167
The Micro chip Web Site........ ............................................................................................................................................................. 173
Customer Change Notification Service........................................................................... ................ ................................................... 173
Customer Support....................... ................. ...... ................. ...... ................. ................. ....................................................................... 173
Reader Response.............................................................................................................................................................................. 174
PIC16F818/819 Product Identification System .................................................................................................................................. 175
TO OUR VALUE D CUSTOMERS
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You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the dat a sheet and recommended workarounds, may exist for current
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PIC16F818/819
DS39598F-page 4 2001-2013 Mic rochip Technology Inc.
NOTES:
2001-2013 Microchip Technology Inc. DS39598F-page 5
PIC16F818/819
1.0 DEVICE OVERVIEW
This document contains device specific information for
the operation of the PIC16F818/819 devices. Additional
information may be found in the “PIC® Mid-Range MCU
Family Reference Manual” (DS33023) which may be
downloaded from the Microchip web site. The Reference
Manual should be considered a complementary docu-
ment to this data sheet and is highly recommended
reading for a better understanding of the device architec-
ture and operation of the peripheral mod ules.
The PIC16F818/819 belongs to the Mid-Range family
of the PIC® de vices. Th e devices diff er from eac h other
in the amo unt of Flash program me mo ry, data me mo ry
and data EEPROM (see Table 1-1). A block diagra m of
the devi ces i s shown in Figure 1-1. These devic es con-
tain features that are new to the PIC16 product line:
• Internal RC oscillator with eight selectable
frequencies, including 31.25 kHz, 125 kHz,
250 kHz, 500 kHz, 1 MHz, 2 MHz, 4 MHz and
8 MHz. The INTRC can be configured as the
system clock via the configuration bits. Refer to
Section 4.5 “Internal Oscillator Block” and
Section 12.1 “Configuration Bits” for further
details.
• The Timer1 module current consumption has
been gre atly reduc ed from 20 A (previous PIC1 6
devi ces) to 1. 8 A typical (32 kHz at 2V), which is
ideal for real-time clock applications. Refer to
Section 6.0 “Timer0 Module” for further details.
• The amou nt of oscillator selections has increased.
The RC and INTRC modes can be selected with
an I/O pin configured as an I/O or a clock output
(FOSC/4). An external clock can be configured
with an I/O pin. Refer to Section 4.0 “Oscillator
Configurations” for further details.
TABLE 1-1: AVAILABLE MEMORY IN
PIC16F818/819 DEVICES
There are 16 I/O pins that are user configurable on a
pin-to-pin basis. Some pins are multiplexed with other
device functions. These functions include:
• External Inte rrupt
• Change on PORTB Interrupt
• Timer0 Clock Input
• Low-Power Timer1 Clock/Oscillator
• Capture/Compare/PWM
• 10-bit, 5-channel Analog-to-Digital Converter
• SPI/I2C
•MCLR (RA5) can be configured as an Input
Table 1-2 details the pinout of the devices with
descriptions and details for each pin.
Device Program
Flash Dat a
Memory Data
EEPROM
PIC16F818 1K x 14 128 x 8 128 x 8
PIC16F819 2K x14 256 x 8 256 x 8
Device Program
Flash Data
Memory Data
EEPROM
PIC16F818/819
DS39598F-page 6 2001-2013 Mic rochip Technology Inc.
FIGURE 1-1: PIC16F81 8/819 BLOCK DIAGRAM
Flash
Memory
1K/2K x 14
13 Data Bus 8
14
Program
Bus
Instruction reg
Program Counter
8-Level Stack
(13-bit)
RAM
File
Registers
128/256 x 8
Direct Addr 7
RAM Addr(1) 9
Addr MUX
Indirect
Addr
FSR reg
Status reg
MUX
ALU
W reg
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Instruction
Decode &
Control
Timing
Generation
RA7/OSC1/CLKI
RA6/OSC2/CLKO
MCLR VDD, VSS
Timer0
10-bit, 5-channel Synchronous
Serial Port
PORTA
8
8
Brown-out
Reset
Note 1: Higher order bits are from the Status re gister.
CCP1
Timer1 Timer2
RA5/MCLR/VPP
RA6/OSC2/CLKO
RA4/AN4/T0CKI
RA3/AN3/VREF+
RA2/AN2/VREF-
RA1/AN1
8
3
Program
PORTB RB0/INT
RB1/SDI/SDA
RB2/SDO/CCP1
RB3/CCP1/PGM
RB4/SCK/SCL
RB5/SS
RB6/T1OSO/T1CKI/PGC
RB7/T1OSI/PGD
RA7/OSC1/CLKI
RA0/AN0
128/256 Bytes
Data EE
A/D
2001-2013 Microchip Technology Inc. DS39598F-page 7
PIC16F818/819
TABLE 1-2: PIC16F818/819 PINOUT DESCRIPTIONS
Pin Name PDIP/
SOIC
Pin#
SSOP
Pin# QFN
Pin# I/O/P
Type Buffer
Type Description
PORTA is a bidirectional I/O port.
RA0/AN0
RA0
AN0
17 19 23 I/O
ITTL
Analog Bidir ect ion al I/O pin.
Analog input channel 0.
RA1/AN1
RA1
AN1
18 20 24 I/O
ITTL
Analog Bidir ect ion al I/O pin.
Analog input channel 1.
RA2/AN2/VREF-
RA2
AN2
VREF-
1126
I/O
I
I
TTL
Analog
Analog
Bidir ect ion al I/O pin.
Analog input channel 2.
A/D reference voltage (low) input.
RA3/AN3/VREF+
RA3
AN3
VREF+
2227
I/O
I
I
TTL
Analog
Analog
Bidir ect ion al I/O pin.
Analog input channel 3.
A/D reference voltage (high) input.
RA4/AN4/T0CKI
RA4
AN4
T0CKI
3328
I/O
I
I
ST
Analog
ST
Bidir ect ion al I/O pin.
Analog input channel 4.
Clock input to the TMR0 timer/counter.
RA5/MCLR/VPP
RA5
MCLR
VPP
441 I
I
P
ST
ST
–
Input pin.
Master Clear (Reset). Input/programming
voltage input. This pin is an active-low Reset
to the device.
Programming threshold voltage.
RA6/OSC2/CLKO
RA6
OSC2
CLKO
15 17 20 I/O
O
O
ST
–
–
Bidir ect ion al I/O pin.
Osci llator crys tal ou tput. Connec ts to c rysta l or
resonator in Crystal Osci llator mode.
In RC mode, this pin outputs CLKO signal
which has 1/4 the frequency of OSC1 and
denotes the instruction cycle rate.
RA7/OSC1/CLKI
RA7
OSC1
CLKI
16 18 21 I/O
I
I
ST
ST/CMOS(3)
–
Bidir ect ion al I/O pin.
Oscillator crystal input.
External clock source input.
Legend: I = Input O = Output I/O = Input/Output P = Power
– = Not used TTL = TTL Input ST = Schmitt Trigger Input
Note 1: This buffe r is a Schmitt Trigger input when configured as the external interrupt.
2: This buffe r is a Schmit t Trigger i nput when used in Serial Programming mode.
3: This buffe r is a Schmit t Trigger input when configured in RC Osc illator mod e and a CMOS input otherw ise.
PIC16F818/819
DS39598F-page 8 2001-2013 Mic rochip Technology Inc.
PORTB is a bidirectional I/O port. PORTB can be
software programmed for internal weak pull-up on
all inputs.
RB0/INT
RB0
INT
677
I/O
ITTL
ST(1) Bidir ect ion al I/O pin.
External interrupt pin.
RB1/SDI/SDA
RB1
SDI
SDA
788
I/O
I
I/O
TTL
ST
ST
Bidir ect ion al I/O pin.
SPI data in.
I2C™ data.
RB2/SDO/CCP1
RB2
SDO
CCP1
899
I/O
O
I/O
TTL
ST
ST
Bidir ect ion al I/O pin.
SPI data out.
Capture input, Compare ou tput, PWM output.
RB3/CCP1/PGM
RB3
CCP1
PGM
91010
I/O
I/O
I
TTL
ST
ST
Bidir ect ion al I/O pin.
Capture input, Compare ou tput, PWM output.
Low-Voltage ICSP™ Programming enable pin.
RB4/SCK/SCL
RB4
SCK
SCL
10 11 12 I/O
I/O
I
TTL
ST
ST
Bidirectional I/O pin. Interrupt-on-change pin.
Synchronous serial clock input/output for SPI.
Synchronous serial clock input for I2C.
RB5/SS
RB5
SS
11 12 13 I/O
ITTL
TTL Bidirectional I/O pin. Interrupt-on-change pin.
Slave select for SPI in Slave mode.
RB6/T1OSO/T1CKI/PGC
RB6
T1OSO
T1CKI
PGC
12 13 15 I/O
O
I
I
TTL
ST
ST
ST(2)
Interrupt-on-change pin.
Timer1 Oscillator output.
Timer 1 clock input.
In-cir cu it deb ugg er and ICSP program m ing
clock pin.
RB7/T1OSI/PGD
RB7
T1OSI
PGD
13 14 16 I/O
I
I
TTL
ST
ST(2)
Interrupt-on-change pin.
Timer1 oscillator input.
In-cir cu it deb ugg er and ICSP program m ing
data pin.
VSS 5 5, 6 3, 5 P – Ground reference for logic and I/O pins.
VDD 14 15, 16 17, 19 P – Positive supply for logic and I/O pins.
TABLE 1-2: PIC16F818/819 PINOUT DESCRIPTIONS (CONTINUED)
Pin Name PDIP/
SOIC
Pin#
SSOP
Pin# QFN
Pin# I/O/P
Type Buffer
Type Description
Legend: I = Input O = Output I/O = Input/Output P = Power
– = Not used TTL = TTL Input ST = Schmitt Trigger Input
Note 1: This buffe r is a Schmitt Trigger input when configured as the external interrupt.
2: This buffe r is a Schmit t Trigger i nput when used in Serial Programming mode.
3: This buffer is a Schmitt Trigger input when configured in RC Oscillator mode and a CMOS input otherwise.
2001-2013 Microchip Technology Inc. DS39598F-page 9
PIC16F818/819
2.0 MEMORY ORGANIZATION
There are two memory blocks in the PIC16F818/819.
These are the program memory and the data memory.
Each block has its own bus, so access to each block
can occur during the same oscillator cycle.
The data memory can be further broken down into the
general purpose RAM and the Special Function
Registers (SFRs). The operation of the SFRs that
control the “core” are described here. The SFRs used
to control the peripheral modules are described in the
section discussing each individual peripheral module.
The data memory area also contains the data
EEPROM memory. This memory is not directly mappe d
into the data memory but is indirectly mapped. That is,
an indir ect addres s pointer s peci fies th e addre ss of th e
data EEPROM memory to read/write. The PIC16F818
device’ s 1 28 bytes of dat a EEPROM me mory h ave th e
address range of 00h-7Fh a nd the PIC16 F819 dev ice’ s
256 byte s of dat a EEPROM memo ry hav e the add res s
range of 00h-FFh. More details on the EEPROM
memory can be found in Section 3.0 “Data EEPROM
and Flash Program Memory”.
Addit ional informat ion on devi ce memory may be found
in the “PIC® Mid-Range Reference Manual”
(DS33023).
FIGURE 2-1: PROGRAM MEMORY MAP
AND STACK FOR
PIC16F818
2.1 Program Memory Organization
The PIC16F818/819 devices have a 13-bit program
counter capable of addressing an 8K x 14 program
memory space. For the PIC16F818, the first 1K x 14
(0000h-03FFh) is physically implemented (see
Figure 2-1). For the PIC16F819, the first 2K x 14 is
located at 0000h-07FFh (see Figure 2-2). Accessing a
locatio n above the physic ally implem ented addres s will
cause a wraparound. For example, the same instruc-
tion will be accessed at locations 020h, 420h, 820h,
C20h, 1020h, 1420h, 1820h and 1C20h.
The Rese t v ector is a t 000 0h and t he in terrupt vecto r i s
at 0004h.
FIGURE 2-2: PROGRAM MEMORY MAP
AND STACK FOR
PIC16F819
PC<12:0>
13
0000h
0004h
0005h
Stack Level 1
St ack Level 8
Reset Vec tor
Interrupt Vector
On-Chip
CALL, RETURN
RETFIE, RETLW
1FFFh
Stack Level 2
Program
Memory Page 0 03FFh
0400h
Wraps to
0000h-03FFh
PC<12:0>
13
0000h
0004h
0005h
Stack Lev el 1
St ack Level 8
Reset Vector
Interrupt Vector
On-Chip
CALL, RETURN
RETFIE, RETLW
1FFFh
Stack Level 2
Program
Memory Page 0
07FFh
0800h
Wraps to
0000h-07FFh
PIC16F818/819
DS39598F-page 10 2001-2013 Microchip Technology Inc.
2.2 Data Memory Organization
The dat a memory is p arti tioned into m ultip le ban ks th at
cont ain the Genera l Purpose R egisters a nd the S pecia l
Function Registers. Bits RP1 (Status<6>) and RP0
(Status<5>) are the bank select bits.
Each bank extends up to 7Fh (128 bytes). The lower
locations of each bank are reserved for the Special
Function Registers. Above the Special Function Regis-
ters are the General Purpos e Regist ers, imp lement ed
as static RAM. All implemented banks contain SFRs.
Some “high use” SFRs from one bank may be mirrored
in another bank for code reduction and quicker access
(e.g., the Status register is in Banks 0-3).
2.2.1 GENERAL PURPOSE REGISTER
FILE
The register file can be accessed either directly or
indirectly through the File Select Register, FSR.
RP1:RP0 Bank
00 0
01 1
10 2
11 3
Note: EEPROM dat a memory description can be
found in Section 3.0 “Data EEPROM and
Flash Program Memory” of this data
sheet.
2001-2013 Microchip Technology Inc. DS39598F-page 11
PIC16F818/819
FIGURE 2-3: PIC16F818 REGISTER FILE MAP
Indirect addr.(*)
TMR0
PCL
STATUS
FSR
PORTA
PORTB
PCLATH
INTCON
PIR1
TMR1L
TMR1H
T1CON
TMR2
T2CON
SSPBUF
SSPCON
CCPR1L
CCPR1H
CCP1CON
OPTION_REG
PCL
STATUS
FSR
TRISA
TRISB
PCLATH
INTCON
PIE1
PCON
PR2
SSPSTAT
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
8Dh
8Eh
8Fh
90h
91h
92h
93h
94h
95h
96h
97h
98h
99h
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
20h A0h
7Fh FFh
Bank 0 Bank 1
File
Address
Indirect addr.(*) Indirect add r.(*)
PCL
STATUS
FSR
PCLATH
INTCON
PCL
STATUS
FSR
PCLATH
INTCON
100h
101h
102h
103h
104h
105h
106h
107h
108h
109h
10Ah
10Bh
180h
181h
182h
183h
184h
185h
186h
187h
188h
189h
18Ah
18Bh
17Fh 1FFh
Bank 2 Bank 3
Indirect addr.(*)
TMR0 OPTION_REG
ADRESH
ADCON0 ADCON1
General
Purpose
Register Accesses
20h-7Fh
TRISB
PORTB
96 Bytes
10Ch
10Dh
10Eh
10Fh
110h
18Ch
18Dh
18Eh
18Fh
190h
EEDATA
EEADR EECON1
EEDATH
EEADRH
Unimplemented data memory locations, read as ‘0’.
* Not a physical register.
Note 1: These registers are reserved; maintain these registers clear.
File
Address
File
Address
File
Address
SSPADD
120h
11Fh 1A0h
19Fh
General
Purpose
Register
32 Bytes BFh
C0h
Accesses
40h-7Fh
Accesses
20h-7Fh
PIR2 PIE2
OSCCON
OSCTUNE
ADRESL
EECON2
Reserved(1)
Reserved(1)
PIC16F818/819
DS39598F-page 12 2001-2013 Microchip Technology Inc.
FIGURE 2-4: PIC16F819 REGISTER FILE MAP
Indirect addr.(*)
TMR0
PCL
STATUS
FSR
PORTA
PORTB
PCLATH
INTCON
PIR1
TMR1L
TMR1H
T1CON
TMR2
T2CON
SSPBUF
SSPCON
CCPR1L
CCPR1H
CCP1CON
OPTION_REG
PCL
STATUS
FSR
TRISA
TRISB
PCLATH
INTCON
PIE1
PCON
PR2
SSPSTAT
00h
01h
02h
03h
04h
05h
06h
07h
08h
09h
0Ah
0Bh
0Ch
0Dh
0Eh
0Fh
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Ch
1Dh
1Eh
1Fh
80h
81h
82h
83h
84h
85h
86h
87h
88h
89h
8Ah
8Bh
8Ch
8Dh
8Eh
8Fh
90h
91h
92h
93h
94h
95h
96h
97h
98h
99h
9Ah
9Bh
9Ch
9Dh
9Eh
9Fh
20h A0h
7Fh FFh
Bank 0 Bank 1
File
Address
Indirect addr.(*) Indirect add r.(*)
PCL
STATUS
FSR
PCLATH
INTCON
PCL
STATUS
FSR
PCLATH
INTCON
100h
101h
102h
103h
104h
105h
106h
107h
108h
109h
10Ah
10Bh
180h
181h
182h
183h
184h
185h
186h
187h
188h
189h
18Ah
18Bh
17Fh 1FFh
Bank 2 Bank 3
Indirect addr.(*)
TMR0 OPTION_REG
ADRESH
ADCON0 ADCON1
General
Purpose
Register
TRISB
PORTB
96 Bytes
10Ch
10Dh
10Eh
10Fh
110h
18Ch
18Dh
18Eh
18Fh
190h
EEDATA
EEADR EECON1
EEDATH
EEADRH
Unimplemented data memory locati ons, read as ‘0’.
* Not a physical register.
Note 1: These registers are reserved; maintain these registers clear.
File
Address
File
Address
File
Address
SSPADD
120h
11Fh 1A0h
19Fh
General
Purpose
Register
80 Bytes
EFh
F0h
Accesses
70h-7Fh
Accesses
20h-7Fh
PIR2 PIE2
OSCCON
OSCTUNE
ADRESL
EECON2
Reserved(1)
Reserved(1)
16Fh
170h
Accesses
70h-7Fh
General
Purpose
Register
80 Bytes
2001-2013 Microchip Technology Inc. DS39598F-page 13
PIC16F818/819
2.2.2 SPECIAL FUNCTION REGISTERS
The Special Function Registers are registers used by
the CPU and peripheral modules for controlling the
desired operation of the device. These registers are
implemented as static RAM. A list of these registers is
given in Table 2-1.
The Special Function Registers can be classified into
two sets: core (CPU) and peripheral. Those registers
associated with the core functions are described in
detail in this section. Those related to the operation of
the peripheral features are described in detail in the
peripheral feature section.
TABLE 2-1: SPECIAL FUNCTION REGISTER SUMMARY
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Details on
page:
Bank 0
00h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 23
01h TMR0 Timer0 Module Register xxxx xxxx 53, 17
02h(1) PCL Program Counter’s (PC) Least Significant Byte 0000 0000 23
03h(1) STATUS IRP RP1 RP0 TO PD Z DC C 0001 1xxx 16
04h(1) FSR Indirect Data Memory Address Pointer xxxx xxxx 23
05h PORTA PORTA Data Latch when written; PORTA pins when read xxx0 0000 39
06h PORTB PORTB Data Latch when written; PORTB pins when read xxxx xxxx 43
07h —Unimplemented — —
08h —Unimplemented — —
09h —Unimplemented — —
0Ah(1,2) PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 23
0Bh(1) INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 18
0Ch PIR1 —ADIF —— SSPIF CCP1IF TMR2IF TMR1IF -0-- 0000 20
0Dh PIR2 — — — EEIF — — — — ---0 ---- 21
0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx 57
0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx 57
10h T1CON —— T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 57
11h TMR2 Timer2 Module Register 0000 0000 63
12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 64
13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx 71, 76
14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 73
15h CCPR1L Capture/Compare/PWM Register (LSB) xxxx xxxx 66, 67, 68
16h CCPR1H Capture/Compare/PWM Register (MSB) xxxx xxxx 66, 67, 68
17h CCP1CON —— CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 65
18h —Unimplemented — —
19h —Unimplemented — —
1Ah —Unimplemented — —
1Bh —Unimplemented — —
1Ch —Unimplemented — —
1Dh —Unimplemented — —
1Eh ADRESH A/D Result Register High Byte xxxx xxxx 81
1Fh ADCON0 ADCS1 ADCS0 CHS2 CHS1 CHS0 GO/DONE —ADON0000 00-0 81
Legend: x = unknown , u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<12:8>, whose contents are
transferred to the upper byte of the program counter.
3: Pin 5 is an input only; the state of the TRISA5 bit has no effect and will always read ‘1’.
PIC16F818/819
DS39598F-page 14 2001-2013 Microchip Technology Inc.
Bank 1
80h(1) INDF Addressing this location uses contents of FSR to address data memory (not a physical register) 0000 0000 23
81h OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 17, 54
82h(1) PCL Program Counter’s (PC) Least Significant Byte 0000 0000 23
83h(1) STATUS IRP RP1 RP0 TO PD ZDCC0001 1xxx 16
84h(1) FSR Indirect Data Memory Address Pointer xxxx xxxx 23
85h TRISA TRISA7 TRISA6 TRISA5(3) PORTA Data Direction Register (TRISA<4:0> 1111 1111 39
86h TRISB PORTB Data Direction Register 1111 1111 43
87h —Unimplemented — —
88h —Unimplemented — —
89h —Unimplemented — —
8Ah(1,2) PCLATH — — — Write Buffer for the upper 5 bits of the PC ---0 0000 23
8Bh(1) INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 18
8Ch PIE1 —ADIE —— SSPIE CCP1IE TMR2IE TMR1IE -0-- 0000 19
8Dh PIE2 — — — EEIE — — — — ---0 ---- 21
8Eh PCON — — — — — —PORBOR ---- --qq 22
8Fh OSCCON — IRCF2 IRCF1 IRCF0 — IOFS — — -000 -0-- 38
90h(1) OSCTUNE —— TUN5 TUN4 TUN3 TUN2 TUN1 TUN0 --00 0000 36
91h —Unimplemented — —
92h PR2 Timer2 Pe rio d Re gist e r 1111 1111 68
93h SSPADD Synchronous Serial Port (I2C™ mode) Address Register 0000 0000 71, 76
94h SSPSTAT SMP CKE D/A PSR/WUA BF 0000 0000 72
95h —Unimplemented — —
96h —Unimplemented — —
97h —Unimplemented — —
98h —Unimplemented — —
99h —Unimplemented — —
9Ah —Unimplemented — —
9Bh —Unimplemented — —
9Ch —Unimplemented — —
9Dh —Unimplemented — —
9Eh ADRESL A/D Result Register Low Byte xxxx xxxx 81
9Fh ADCON1 ADFM ADCS2 —— PCFG3 PCFG2 PCFG1 PCFG0 00-- 0000 82
TABLE 2-1: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Details on
page:
Legend: x = unknown , u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<12:8>, whose contents are
transferred to the upper byte of the program counter.
3: Pin 5 is an input only; the state of the TRISA5 bit has no effect and will always read ‘1’.
2001-2013 Microchip Technology Inc. DS39598F-page 15
PIC16F818/819
Bank 2
100h(1) I NDF Addressing this location uses contents of FSR to address data memory (not a physi cal regis ter) 0000 0000 23
101h TMR0 Timer0 Modu le Register xxxx xxxx 53
102h(1 PCL Program Counter’s (PC) Least Signifi cant Byte 0000 0000 23
103h(1) STATUS IRP RP1 RP0 TO PD ZDCC0001 1xxx 16
104h(1) FSR Indirect Dat a Memory Address Point er xxxx xxxx 23
105h —Unimplemented — —
106h PORT B PORTB Dat a Latch when wri tten; PORTB pins when read xxxx xxxx 43
107h —Unimplemented — —
108h —Unimplemented — —
109h —Unimplemented — —
10Ah(1,2) PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 23
10Bh(1) INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 18
10Ch EEDA TA EEPROM/Flash Data Register Low Byte xxxx xxxx 25
10Dh EEADR EEPROM/Flas h Address Register Low Byte xxxx xxxx 25
10Eh EEDATH —— EEPROM/Flash Data Register High Byte --xx xxxx 25
10Fh EEADRH — — — — — EE PROM/ Fl ash Addr ess R egist er
Hig h Byte ---- -xxx 25
Bank 3
180h(1) I NDF Addressing this location uses contents of FSR to address data memory (not a physi cal regis ter) 0000 0000 23
181h OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 17, 54
182h(1) PCL Program Counter’s (PC) Least Significant Byte 0000 0000 23
183h(1) STATUS IRP RP1 RP0 TO PD ZDCC0001 1xxx 16
184h(1) FSR Indirect Dat a Memory Address Point er xxxx xxxx 23
185h —Unimplemented — —
186h TRISB PORTB Data Direction Register 1111 1111 43
187h —Unimplemented — —
188h —Unimplemented — —
189h —Unimplemented — —
18Ah(1,2) PCLATH — — — Write Buffer for the upper 5 bits of the Program Counter ---0 0000 23
18Bh(1) INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 18
18Ch EECON1 EEPGD —— FREE WRERR WREN WR RD x--x x000 26
18Dh EECON2 EEPROM Control Register 2 (not a physical register) ---- ---- 25
18Eh —Reserved; mai nt ain cl ear 0000 0000 —
18Fh —Reserved; maint ai n cl ear 0000 0000 —
TABLE 2-1: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Details on
page:
Legend: x = unknown , u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: The upper byte of the program counter is not directly accessible. PCLATH is a holding register for the PC<12:8>, whose contents are
transferred to the upper byte of the program counter.
3: Pin 5 is an input only; the state of the TRISA5 bit has no effect and will always read ‘1’.
PIC16F818/819
DS39598F-page 16 2001-2013 Microchip Technology Inc.
2.2.2.1 Status Register
The S tatus register , shown in Register 2-1, contains the
arit hmeti c statu s of th e ALU, the Re set sta tus an d the
bank select bits for data memory.
The Status register can be the destination for any
instruction, as with any other register. If the Status
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabl ed. These bit s are set or clea red according to the
device logic. Furthermore, the TO and PD bits are not
writable. Therefore, the result of an instruction with the
Status register as destination may be different than
intended.
For exam pl e, CLRF STATUS, will c lea r the up per three
bits and set th e Z bit. Thi s leaves the Status re gister a s
‘000u u1uu’ (where u = unchanged).
It is recommended, therefore, that only BCF, BSF,
SWAPF and MOVWF instructions are used to alter the
S t atus regis ter becaus e these inst ructions do not affec t
the Z, C or DC bits from the Status register. For other
instructions not affecting any status bits, see
Section 13.0 “Instruction Set Summary”.
REGISTER 2-1: STATUS: STATUS REGISTER (ADDRESS 03h, 83h, 103h, 183h)
Note: The C and DC bits operate as a borrow
and digit borrow bit, respectively, in
subtraction. See the SUBLW and SUBWF
instructions for examples.
R/W-0 R/W-0 R/W-0 R-1 R-1 R/W-x R/W-x R/W-x
IRP RP1 RP0 TO PD ZDCC
bit 7 bit 0
bit 7 IRP: Register Bank Select bit (used for indirect addressing)
1 = Bank 2, 3 (100h-1FFh)
0 = Bank 0, 1 (00h-FFh)
bit 6-5 RP<1:0>: Register Bank Select bits (used for direct addressing)
11 = Bank 3 (180h-1FFh)
10 = Bank 2 (100h-17Fh)
01 = Bank 1 (80h-FFh)
00 = Bank 0 (00h-7Fh)
Each bank is 128 bytes.
bit 4 TO: Time-out bit
1 = After power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
bit 3 PD: Powe r-dow n bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instructi on
bit 2 Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1 DC: Digit carry/borrow bit (ADDWF, ADDLW, SUBLW and SUBWF instru cti ons )(1)
1 = A carry-out from the 4th low order bit of the result occurred
0 = No carry-out from the 4th low order bit of the result
bit 0 C: Carry/borrow bit (ADDWF, ADDLW, SUBLW and SUBWF instructions)(1,2)
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1: For borrow, the polarity is reversed. A subtraction is executed by adding the two’s
complement of the second operand.
2: For rotate (RRF, RLF) instructi ons, thi s bit is loa ded w ith eith er the hig h or low-ord er
bit of the source register.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
2001-2013 Microchip Technology Inc. DS39598F-page 17
PIC16F818/819
2.2.2.2 OPTION_REG Register
The OPTION_REG register is a readable and writable
register that contains various control bits to configure
the TMR0 prescaler/WDT postscaler (single assign-
able register known also as the prescaler), the external
INT inte rrupt, TMR0 and the weak pull-u ps o n POR TB.
REGISTER 2-2: OPTION_REG: OPTION REGISTER (ADDRESS 81h, 181h)
Note: To achieve a 1:1 prescaler assignment for
the TMR 0 re gis ter, assign the pres ca ler to
the Watchdog Timer.
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
bit 7 bit 0
bit 7 RBPU: PORTB Pull-up Enab le bit
1 = PORTB pull-ups are disabled
0 = PORTB pull-ups are enabled by individual port latch values
bit 6 INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of RB0/INT pin
0 = Interrupt on falling edge of RB0/INT pin
bit 5 T0CS: TMR0 Clock Source Select bit
1 = Transition on T0CKI pin
0 = Internal instruction cycle clock (CLKO)
bit 4 T0SE: TMR0 Source Edge Select bit
1 = Increment on hig h-to -low trans it ion on T0CKI pin
0 = Increment on low- to -hi gh trans it ion on T0CKI pin
bit 3 PSA: Prescaler Ass ign me nt bit
1 = Prescaler is assigned to the WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0 PS2:PS0: Prescaler Rate Sele ct bits
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1 : 1
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
Bit Value TMR0 Rate WDT Rate
PIC16F818/819
DS39598F-page 18 2001-2013 Microchip Technology Inc.
2.2.2.3 INTCON Register
The INTCON register is a readable and writable regis-
ter that contains various enable and flag bits for the
TMR0 register overflow, RB port change and external
RB0/INT pin interrupts.
REGISTER 2-3: INTCON: INTERRUPT CONTROL REGISTER (ADDRESS 0Bh, 8Bh, 10Bh, 18Bh)
Note: Interru pt flag bit s get set when an interru pt
conditi on oc curs regard le ss of the sta te of
its corresponding enable bit or the Global
Interrupt Enable bit, GIE (INTCON<7>).
User software should ensure the appropri-
ate interrupt flag bits are clear prior to
enabling an interrupt.
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-x
GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF
bit 7 bit 0
bit 7 GIE: Global Interrupt Enable bit
1 = Enables all unmasked interrupts
0 = Disables al l interrupts
bit 6 PEIE: Peripheral Interrupt Enable bit
1 = Enables all unmasked peripheral interrupts
0 = Disables all peripheral interrupts
bit 5 TMR0IE: TMR0 Overflow Interrupt Enable bit
1 = Enables the TMR0 interrupt
0 = Disables the TMR0 interru pt
bit 4 INTE: RB0/INT External Interrupt Enable bit
1 = Enables the RB0/INT external interrupt
0 = Disables the RB0/INT external inte rrup t
bit 3 RBIE: RB Port Change Interrupt Enable bit
1 = Enables the RB port change interrupt
0 = Disables the RB port change interrupt
bit 2 TMR0IF: TMR0 Overflow Interrupt Flag bit
1 = TMR0 register has overflowed (must be cleared in software)
0 = TMR0 register did not overflow
bit 1 INTF: RB0/INT External Interrupt Flag bit
1 = The RB0/INT external interrupt occurred (must be cleared in software)
0 = The RB0/INT external interrupt did not occur
bit 0 RBIF: RB Port Change Interrupt Flag bit
A mismat ch condition will continue to set fla g b it R BIF. Re ad ing PO RTB will end th e m isma tch
co ndition and allow flag bit RBIF to be cleared.
1 = At least one of the RB7:RB4 pins changed state (must be cleared in software)
0 = None of the RB7:RB4 pins have changed state
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
2001-2013 Microchip Technology Inc. DS39598F-page 19
PIC16F818/819
2.2.2.4 PIE1 Register
This register contains the individual enable bits for the
peripheral interrupts.
REGISTER 2-4: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1 (ADDRESS 8Ch)
Note: Bit PEIE (INTCON<6>) must be set to
enable any peripheral interrupt.
U-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
—ADIE—— SSPIE CCP1IE TMR2IE TMR1IE
bit 7 bit 0
bit 7 Unimplemented: Read as ‘0’
bit 6 ADIE: A/D Converter In terrupt Enable bit
1 = Enables the A/D converter interrupt
0 = Disables the A/D converter interrupt
bit 5-4 Unimplemented: Read as ‘0’
bit 3 SSPIE: Synchronous Serial Port Interrupt Enable bit
1 = Enables the SSP interrupt
0 = Disables the SSP interrupt
bit 2 CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt
0 = Disables the CCP1 interrupt
bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1 = Enables the TMR2 to PR2 match interrupt
0 = Disables the TMR2 to PR2 match interrupt
bit 0 TMR1IE: TMR1 Overflow Interrupt Enable bit
1 = Enables the TMR1 overflow inte rrupt
0 = Disables the TMR1 overflow interrupt
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
PIC16F818/819
DS39598F-page 20 2001-2013 Microchip Technology Inc.
2.2.2.5 PIR1 Register
This register contains the individual flag bits for the
peripheral interrupts.
REGISTER 2-5: PIR1: PERIPHERAL INTERRUPT REQUEST (FLAG) REGISTER 1 (ADDRESS 0Ch)
Note: Interru pt flag bi ts are s et when an interrupt
conditi on oc curs regard le ss of the sta te of
its corresponding enable bit or the Global
Interrupt Enable bit, GIE (INTCON<7>).
User software should ensure the appropri-
ate interrupt flag bits are clear prior to
enabling an interrupt.
U-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
—ADIF—— SSPIF CCP1IF TMR2IF TMR1IF
bit 7 bit 0
bit 7 Unimplemented: Read as ‘0’
bit 6 ADIF: A/D Converter Interrupt Flag bit
1 = An A/D conversion completed
0 = The A/D conversion is not complete
bit 5-4 Unimplemented: Read as ‘0’
bit 3 SSPIF: Synchronous Serial Port (SSP) Interrupt Flag bit
1 = The SSP interrupt condition has occurred and must be clea red in software befo re returning
fro m t he I n t err u pt S erv ic e R out i ne . T h e co nd iti o ns t hat wil l s et t hi s b i t a re a t ran sm is si on /
reception has taken place.
0 = No SSP interrupt condition has occurred
bit 2 CCP1IF: CCP1 Interrupt Flag bit
Capture mode:
1 = A TMR1 register capture occurred (must be cleared in software)
0 = No TM R1 re gister capture occurred
Compare mode:
1 = A TMR1 register compare match occurred (must be cleared in software)
0 = No TMR1 register compare match occurred
PWM mode:
Unused in this mode .
bit 1 TMR2IF: TMR2 to PR2 Match Interrupt Flag bit
1 = TMR2 to PR2 match occurred (must be cleared in software)
0 = No TMR2 to PR2 match occurred
bit 0 TMR1IF: TMR1 Overflow Interrupt Flag bit
1 = TMR1 register overflowed (must be cleared in software)
0 = TMR1 register did not overflow
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
2001-2013 Microchip Technology Inc. DS39598F-page 21
PIC16F818/819
2.2.2.6 PIE2 Register
The PIE2 register contains the individual enable bit for
the EEPROM write operation interrupt.
REGISTER 2-6: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2 (ADDRESS 8Dh)
2.2.2.7 PIR2 Register
The PIR2 regis ter contains the flag bit for the EEPROM
write operation interrupt.
.
REGISTER 2-7: PIR2: PERIPHERAL INTERRUPT REQUES T (FLAG) REGIST ER 2 (ADDRESS 0Dh)
U-0 U-0 U-0 R/W-0 U-0 U-0 U-0 U-0
— — — EEIE — — — —
bit 7 bit 0
bit 7-5 Unimplemented: Read as ‘0’
bit 4 EEIE: EEPROM Write Operation Interrupt Enable bit
1 = Enable EE write interrupt
0 = Disable EE write interrupt
bit 3-0 Unimplemented: Read as ‘0’
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Note: Interru pt flag bi ts are s et when an interrupt
conditi on occ urs regard les s of the sta te of
its corresponding enable bit or the Global
Interrupt Enable bit, GIE (INTCON<7>).
User software should ensure the appropri-
ate interrupt flag bits are clear prior to
enabling an interrupt.
U-0 U-0 U-0 R/W-0 U-0 U-0 U-0 U-0
— — — EEIF — — — —
bit 7 bit 0
bit 7-5 Unimplemented: Read as ‘0’
bit 4 EEIF: EEPROM Write Operation Interrupt Enable bit
1 = Enable EE write interrupt
0 = Disable EE write interrupt
bit 3-0 Unimplemented: Read as ‘0’
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
PIC16F818/819
DS39598F-page 22 2001-2013 Microchip Technology Inc.
2.2.2.8 PCON Regist er
The Power Control (PCON) register contains a flag bit
to allow differentiation between a Power-on Reset
(POR), a Brown-out Reset, an external MCLR Reset
and WDT Reset.
REGISTER 2-8: PCON: POWER CONTROL REGISTER (ADDRESS 8Eh)
Note: Interru pt flag bit s get set when an interru pt
condition occurs regardless of the state of
its corresponding enable bit or the Global
Interrupt Enable bit, GIE (INTCON<7>).
User sof tware sho uld ensure the ap propri-
ate interrupt flag bits are clear prior to
enabling an interrupt.
Note: BOR is unknown on Power-on Reset. It
must the n be set b y th e us er an d c hec ke d
on subsequent Resets to see if BOR is
clear , indicating a brown-out has occurred.
The BOR status bit is a ‘don’t care’ and is
not necessarily predictable if the brown-
out circuit is disabled (by clearing the
BOREN bit in the Configuration word).
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-x
— — — — — —PORBOR
bit 7 bit 0
bit 7-2 Unimplemented: Read as ‘0’
bit 1 POR: Power-on Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0 BOR: Brown-out Reset Status bit
1 = No Brown-out Reset occurred
0 = A Brown-out Reset occurred (must be set in software after a Brown-out Reset occurs)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
2001-2013 Microchip Technology Inc. DS39598F-page 23
PIC16F818/819
2.3 PCL and PCLATH
The Program Counter (PC) is 13 bits wide. The low
byte comes from the PCL register, which is a readable
and writable register. The upper bits (PC<12:8>) are
not readable but are indirectly writable through the
PCLATH register. On any Reset, the upper bits of the
PC will b e clea red. Fig ure 2-5 shows the two situat ion s
for the loading of the PC. The upper example in the
figure shows how the PC is loaded on a write to PCL
(PCLATH<4:0> PCH). The lower example in the
figure shows how the PC is loaded during a CALL or
GOTO instructi on (PCLATH<4:3> PC H).
FIGURE 2-5: LOADING OF PC IN
DIFFERENT SITUATIONS
2.3.1 COMPU TED GO TO
A comput ed GOTO is a ccom pli shed by addi ng an offset
to the program counter (ADDWF PCL). When doing a
table read using a computed GOTO method, care
should be ex ercise d if th e t able loca tion c rosse s a PCL
memory boundary (each 256-byte block). Refer to the
application note AN556, “Implementing a Table Read”
(DS00556).
2.3.2 STACK
The PI C16F8 18/819 famil y has an 8-leve l deep x 13-b it
wide hardware stack. The stack space is not part of
either program or data space and the Stack Pointer is
not readable or writable. The PC is PUSHed onto the
stack when a CALL instruction is executed or an
interrupt causes a branch. The stack is POPed in the
event of a RETURN, RETLW or a RETFIE instruction
execution. PCLATH is not affected by a PUSH or POP
operation.
The st ack operates as a circular buf fer . This means th at
af ter the st ack ha s be en PUSHed ei ght time s, th e nin th
push ove rwr ites the va lu e that was s tored fro m the firs t
push. The tenth push overwr i tes the se cond push (and
so on).
2.4 Indirect Addressing: INDF and
FSR Registers
The INDF register is no t a physica l register . Addr essing
INDF actu ally ad dresse s the regi ster w hose ad dress i s
cont ained in the FSR reg ister (FSR is a pointer). This is
indirect addressing.
EXAMPLE 2-1: INDIRECT ADDRESS ING
Reading INDF itself indirectly (FSR = 0) will produce
00h. Writing to the INDF register indirectly results in a
no operation (although status bits may be affected).
A simple program to clear RAM locations, 20h-2Fh,
using indirect addressing is shown in Example 2-2.
EXAMPLE 2-2: HOW TO CLEAR RAM
USING INDIRECT
ADDRESSING
An effective 9-bit address is obtained by concatenating
the 8-bit FSR register and the IRP bit (Status<7>) as
shown in Figure 2-6.
PC
12 8 7 0
5PCLATH<4:0>
PCLATH
Instruction with
ALU
GOTO,CALL
Opcode < 10:0 >
8
PC
12 11 10 0
11
PCLATH<4:3>
PCH PCL
87
2
PCLATH
PCH PCL
PCL as
Destination
Note 1: There are no status bits to indicate stack
overflow or stack underflow conditions.
2: There are no instructions/mnemonics
called PUSH or POP. These are actions
that occur from the execution of the
CALL, RETURN, RETLW and RETFIE
instructions or the vectoring to an
interr upt add res s.
• Register file 05 contains the value 10h
• Register file 06 contains the value 0Ah
• Load the value 05 into the FSR register
• A read of th e IND F r egi ste r will return the val ue
of 10h
• Increment the value of the FSR register by one
(FSR = 06)
• A read of the INDF register now will return the
value of 0Ah
MOVLW 0x20 ;initialize pointer
MOVWF FSR ;to RAM
NEXT CLRF INDF ;clear INDF register
INCF FSR ;inc pointer
BTFSS FSR, 4 ;all done?
GOTO NEXT ;NO, clear next
CONTINUE
: ;YES, continue
PIC16F818/819
DS39598F-page 24 2001-2013 Microchip Technology Inc.
FIGURE 2-6: DIRECT/INDIRECT ADDRE SS ING
Note 1: For register file map detail, see F igure 2-3 or Figure 2-4.
Data
Memory(1)
Indirect AddressingDirect Addressing
Bank Select Location Select
RP1:RP0 6 0
From Opcode IRP FSR Register
70
Bank Select Location Select
00 01 10 11
Bank 0 Bank 1 Bank 2 Bank 3
FFh
80h
7Fh
00h
17Fh
100h
1FFh
180h
2001-2013 Microchip Technology Inc. DS39598F-page 25
PIC16F818/819
3.0 DATA EEPROM AND FLASH
PROGRAM MEMORY
The data EEPROM and Flash program memory are
readable and writable during normal operation (over
the full VDD range). Thi s memory is not directly mapped
in the register file space. Instead, it is indirectly
addressed through the Special Function Registers.
There are six SFRs used to read and write this
memory:
• EECON1
• EECON2
• EEDATA
• EEDATH
• EEADR
• EEADRH
This section focuses on reading and writing data
EEPROM and Flash program memory during normal
operation. Refer to the appropriate device program-
ming specification document for serial programming
information.
When interfacing the data memory block, EEDATA
holds the 8-bit data for read/write and EEADR h olds the
address of the EEPROM location being accessed.
These devices have 128 or 256 bytes of data
EEPROM, with an address range from 00h to 0FFh.
Addresses from 80h to FFh are unimplemented on the
PIC16F818 device and will read 00h. When writing to
unimplemented locations, the charge pump will be
turned off.
When interfacing the program memory block, the
EEDATA and EEDATH registers form a two-byte word
that holds the 14 -bit data for read/ write an d the EEADR
and EEA DRH re gisters form a tw o-byte word th at holds
the 13-bit address of the EEPROM location being
accessed. These devices have 1K or 2K words of
program Flash, with an address range from 0000h to
03FFh for the PIC16F818 and 0000h to 07FFh for the
PIC16F8 19. Add resse s abov e the range of the respe c-
tive dev ice will wra paround to t he beginning o f program
memory.
The EEPROM data memory allows single byte read
and write. The Flash program memory allows single-
word reads and four-word block writes. Program
memory writes must first start with a 32-word block
erase, then write in 4-word blocks. A byte write in data
EEPROM memory automatically erases the location
and writes the new data (erase before write).
The write time is controlled by an on-chip timer. The
write/erase voltages are generated by an on-chip
charge pump, rated to operate over the voltage range
of the device for byte or word operations.
When the device is code-protected, the CPU may
continu e to rea d and wr ite th e data EEPROM memory.
Depending on the settings of the write-protect bits, the
device may or may not be able to write certain blocks
of the program memory; however , reads of the program
memory ar e allowed. Whe n code-prote cted, the dev ice
programmer can no longer access data or program
memory; thi s d oes NOT inh ib it in tern al re ad s or wri tes .
3.1 EEADR and EEADRH
The EEADRH:EEADR register pair can address up to
a maximum of 256 bytes of data EEPROM or up to a
maximum of 8K words of program EEPROM. When
selecting a data address value, only the LSB of the
address is writte n to the EEADR regi st er. When se lect-
ing a program address value, the MSB of the address
is written to the EEADRH register and the LSB is
written to the EEADR register.
If the device contains less memory than t he full address
reach of the address register pair, the Most Significant
bits of the reg isters are not im plem ented. F or exam ple,
if the de vi ce has 128 bytes o f da t a EEPROM, th e M os t
Signific ant bit of EEADR i s not impl ement ed on a cces s
to data EEPROM.
3.2 EECON1 and EECON2 Registers
EECON1 is the control register for memory accesses.
Control bit, EEPGD, determines if the access will be a
program or data memory access. When clear, as it is
when Reset, any subsequent operations will operate
on the data memory. When set, any subsequent
operations will operate on the program memory.
Control bits, RD and WR, initiate read and write,
resp ectivel y. These bi ts cannot be cleared, on ly set in
software. They are cleared in hardware at completion
of the read or write operation. The inability to clear the
WR bit in software prevents the accidental, premature
termination of a write operation.
The WREN bit, when set, will allow a write or erase
operation. On power-up, the WREN bit is clear. The
WRERR bit is set when a write (or erase) operation is
interrupted by a MCLR or a WDT Time-out Reset
during normal operation. In these s ituations, following
Reset, the user can check the WRERR bit and rewrite
the location. The data and address will be unchanged
in the EEDATA and EEADR registers.
Interrupt flag bit, EEIF in the PIR2 register, is set when
the write is complete. It must be cleared in software.
EECON2 is not a physical register. Reading EECON2
will read all ‘0’s. The EECON2 register is used
exclusively in the EEPROM write sequence.
PIC16F818/819
DS39598F-page 26 2001-2013 Microchip Technology Inc.
REGISTER 3-1: EECON1: EEPROM ACCESS CONTROL REGISTER 1 (ADDRESS 18Ch)
R/W-x U-0 U-0 R/W-x R/W-x R/W-0 R/S-0 R/S-0
EEPGD —— FREE WRERR WREN WR RD
bit 7 bit 0
bit 7 EEPGD: Program/Data EEPROM Select bit
1 = Accesses program memory
0 = Accesses data memory
Reads ‘0’ after a POR; this bit cannot be changed while a write operation is in progress.
bit 6-5 Unimplemented: Read as ‘0’
bit 4 FREE: EEPROM Forced Row Erase bit
1 = Erase t he program memory row a ddressed by EEADRH:EEADR on th e next WR command
0 = Perform write-only
bit 3 WRERR: EEPROM Error Flag bit
1 = A write operation is prematurely terminated (any MCLR or any WDT Reset during normal
operation)
0 = The write operation completed
bit 2 WREN: EEPROM Write Enable bit
1 = Allows write cycles
0 = Inhibits write to the EEPROM
bit 1 WR: Write Control bit
1 = Initiates a write cycle. The bit is cleared by hardware once write is complete. The WR bit
can only be set (not cleared) in software.
0 = Write cycle to the EEPROM is complete
bit 0 RD: Read Control bit
1 = Initiates an EEPROM read, RD is cleared in hardware. The RD bit can only be set (not
cleared) in software.
0 = Does not initiate an EEPROM read
Legend:
R = Readable bit W = Writable bit S = Set only U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
2001-2013 Microchip Technology Inc. DS39598F-page 27
PIC16F818/819
3.3 Reading Data EEPROM Memory
To read a data memory location, the user must write the
address to the EEADR register, clear the EEPGD
control bit (EECON1<7>) and then set control bit, RD
(EECON1<0>). The data is available in the very next
cycle in the EEDATA register; therefore, it can be read
in the next instruction (see Example 3-1). EEDATA will
hold this value until another read or until it is written to
by the user (during a write operation).
The steps to reading the EEPROM data memory are:
1. Write the address to EEADR. Make sure that the
address is not larger than the memory size of
the device.
2. Clear the EEPGD bit to point to EEPROM data
memory.
3. Set the RD bit to start the read operation.
4. Read the data from the EED ATA regi ster.
EXAMPLE 3-1: DATA EEPROM READ
3.4 Writing to Data EEPROM Memory
To write an EEPROM data location, the user must first
write the address to the EEADR register and the data
to the EEDATA register. Then, the user must follow a
specific write sequence to initiate the write for each
byte.
The write will not initiate if the write sequence is not
exactly followed (write 55h to EECON2, write AAh to
EECON2, then set WR bit) for each byte. We strongly
recommend that interrupts be disabled during this
code segment (see Example 3-2).
Additionally, the WREN bit in EECON1 must be set to
enable write. This mechanism prevents accidental
writes to data EEPROM due to errant (unexpected)
code execution (i.e., lost programs). The user should
keep the WREN bit clear at all times except when
updating EEPROM. The WREN bit is not cleared
by hardware
After a write sequence has been initiated, clearing the
WREN bit wil l not af fect this wri te cycle. T he WR bit will
be inhibited from being set unless the WREN bit is set.
At the completion of the write cycle, the WR bit is
cleared in hardware and the EE Write Complete
Interrupt Flag bit (EEIF) is set. The user can either
enable this interrupt or poll this bit. EEIF must be
clea red by software.
The steps to write to EEPROM data memory are:
1. If step 10 is not implemented, check the WR bit
to see if a write is in progress.
2. Write the address to EEADR. Make su re that the
address is not larger than the memory size of
the device.
3. Write the 8-bit data value to be programmed in
the EEDATA register.
4. Clear the EEPGD bit to point to EEPROM data
memory.
5. Set the WREN bit to en able program operations.
6. Disable interrupts (if enabled).
7. Execute the special five instruction sequence:
• Write 55h to EECON2 in two steps (first to W,
then to EECON2)
• Write AAh to EECON2 in two steps (first to W,
then to EECON2)
• Set the WR bit
8. Enable interrupts (if using interrupts).
9. Clear the WREN bit to disable program
operations.
10. At the completion of the write cycle, the WR bit
is cleared and the EEIF interrupt flag bit is set
(EEIF must be cleared by fi rmware). If step 1 is
not implemented, then firmware should check
for EEIF to b e s et, or W R to b e cle ar, to i ndi ca te
the end of the program cycle.
EXAMPLE 3-2: DATA EEPROM WRITE
BANKSEL EEADR ; Select Bank of EEADR
MOVF ADDR, W ;
MOVWF EEADR ; Data Memory Address
; to read
BANKSEL EECON1 ; Select Bank of EECON1
BCF EECON1, EEPGD ; Point to Data memory
BSF EECON1, RD ; EE Read
BANKSEL EEDATA ; Select Bank of EEDATA
MOVF EEDATA, W ; W = EEDATA
BANKSEL EECON1 ; Select Bank of
; EECON1
BTFSC EECON1, WR ; Wait for write
GOTO $-1 ; to complete
BANKSEL EEADR ; Select Bank of
; EEADR
MOVF ADDR, W ;
MOVWF EEADR ; Data Memory
; Address to write
MOVF VALUE, W ;
MOVWF EEDATA ; Data Memory Value
; to write
BANKSEL EECON1 ; Select Bank of
; EECON1
BCF EECON1, EEPGD ; Point to DATA
; memory
BSF EECON1, WREN ; Enable writes
BCF INTCON, GIE ; Disable INTs.
MOVLW 55h ;
MOVWF EECON2 ; Write 55h
MOVLW AAh ;
MOVWF EECON2 ; Write AAh
BSF EECON1, WR ; Set WR bit to
; begin write
BSF INTCON, GIE ; Enable INTs.
BCF EECON1, WREN ; Disable writes
Required
Sequence
PIC16F818/819
DS39598F-page 28 2001-2013 Microchip Technology Inc.
3.5 Reading Flash Program Memory
To read a program memory location, the user must
write two bytes of the address to the EEADR and
EEADRH registers, set the EEPGD control bit
(EECON1<7>) and then set control bit, RD
(EECON1<0>). Once the read control bit is set, the
program memory Flash controller will use the second
instruction cycle to read the data. This causes the
second instruction immediately following the
“BSF EECON1, RD” ins tructi on to be ig nored. Th e dat a
is available in the very next cycle in the EEDATA and
EEDATH registers; therefore, it can be read as two
bytes in the following instructions. EEDATA and
EEDATH registers will hold th is value u ntil anothe r read
or until it is written to by the user (during a write
operation).
EXAMPLE 3-3: FLASH PROGRAM READ
3.6 Erasing Flash Program Memory
The minimum erase block is 32 words. Only through
the use of an external programmer, or through ICSP
control, can larger blocks of program memory be bulk
erase d. Word erase in the Fla sh array is not supporte d.
When initiating an erase sequence from the micro-
controll er itself, a blo ck of 32 words of program memor y
is erased. The Most Significant 11 bits of the
EEADRH:EEADR point to the block being erased.
EEADR< 4:0> are ignored.
The EECON1 register commands the erase operation.
The EEPGD bit must be set to point to the Flash
progra m memory. The WREN bit must be set to enable
write op erations. T he FREE bit is s et to select an e rase
operation.
For protec tio n, t he w ri te i nit iate sequ enc e f or EECO N2
must be used.
After the “BSF EECON1, WR” instruction, the processor
requires two cycles to set up the erase operation. The
user mus t place two NOP instructi ons after the WR bit is
set. The processor will halt internal operations for the
typical 2 ms, only during the cycle in which the erase
takes place. This is not Sleep mode, as the clocks and
peripherals will continue to run. After the erase cycle,
the processor will resume operation with the third
instruction after the EECON1 write instruction.
3.6.1 FLASH PROGRAM MEMORY
ERASE SEQUENCE
The sequence of events for erasing a block of internal
program memory location is:
1. Load EEADRH:EEADR with address of row
being erased.
2. Set EEPGD bit to point to program memo ry; set
WREN bit to enable writes and set FREE bit to
enable the erase.
3. Disable int errup ts.
4. Write 55h to EECON2.
5. Write AAh to EECON2.
6. Set the WR bit. This will begin the row erase
cycle.
7. The CPU will stall for duration of the erase.
BANKSEL EEADRH ; Select Bank of EEADRH
MOVF ADDRH, W ;
MOVWF EEADRH ; MS Byte of Program
; Address to read
MOVF ADDRL, W ;
MOVWF EEADR ; LS Byte of Program
; Address to read
BANKSEL EECON1 ; Select Bank of EECON1
BSF EECON1, EEPGD ; Point to PROGRAM
; memory
BSF EECON1, RD ; EE Read
;
NOP ; Any instructions
; here are ignored as
NOP ; program memory is
; read in second cycle
; after BSF EECON1,RD
BANKSEL EEDATA ; Select Bank of EEDATA
MOVF EEDATA, W ; DATAL = EEDATA
MOVWF DATAL ;
MOVF EEDATH, W ; DATAH = EEDATH
MOVWF DATAH ;
2001-2013 Microchip Technology Inc. DS39598F-page 29
PIC16F818/819
EXAMPLE 3-4: ERASING A FLASH PROGRAM MEMORY ROW
BANKSEL EEADRH ; Select Bank of EEADRH
MOVF ADDRH, W ;
MOVWF EEADRH ; MS Byte of Program Address to Erase
MOVF ADDRL, W ;
MOVWF EEADR ; LS Byte of Program Address to Erase
ERASE_ROW
BANKSEL EECON1 ; Select Bank of EECON1
BSF EECON1, EEPGD ; Point to PROGRAM memory
BSF EECON1, WREN ; Enable Write to memory
BSF EECON1, FREE ; Enable Row Erase operation
;
BCF INTCON, GIE ; Disable interrupts (if using)
MOVLW 55h ;
MOVWF EECON2 ; Write 55h
MOVLW AAh ;
MOVWF EECON2 ; Write AAh
BSF EECON1, WR ; Start Erase (CPU stall)
NOP ; Any instructions here are ignored as processor
; halts to begin Erase sequence
NOP ; processor will stop here and wait for Erase complete
; after Erase processor continues with 3rd instruction
BCF EECON1, FREE ; Disable Row Erase operation
BCF EECON1, WREN ; Disable writes
BSF INTCON, GIE ; Enable interrupts (if using)
PIC16F818/819
DS39598F-page 30 2001-2013 Microchip Technology Inc.
3.7 Writing to Flash Program Memory
Flash program memory may only be written to if the
desti nati on addr ess i s in a se gment of me mory th at is
not write-protected, as defined in bits WRT1:WRT0 of
the device Configuration Word (Register 12-1). Flash
prog ram memor y must b e writte n in four -word bl ocks.
A block consists of four words with sequential
addresses, with a lower boundary defined by an
addr ess, wher e EE ADR< 1:0 > = 00. At the same time,
all bl ock w rit es t o prog ram me mor y are d one as wr ite-
only operations. The program memory must first be
erased. Th e write operation is edge-aligned and cannot
occur across boundaries.
To write to the program memory, the data must first be
loaded into the buffer registers. There are four 14-bit
buffer registers and they are addressed by the low
2 bits of EEADR.
The following sequence of events illustrate how to
perform a write to program memory:
• Set the EEPGD and WREN bits in the EECON1
register
• Clear the FREE bit in EECON1
• Write address to EEADRH:EEADR
• Write data to EEDATH:EEDATA
• Write 55 to EECON2
• Write AA to EECON2
• Set WR bit in EECON 1
The user must follow the same specific sequence to
initiate the write for each word in the program block by
writing each program word in se quence (00, 01, 10,
11).
There are 4 buffer register words and all four locations
MUST be written to with correct data.
After the “BSF EECON1, WR” instruction, if
EEADR xxxxxx11, then a short write will occur.
This short write-only transfers the data to the buffer
register. The WR bit will be cleared in hardware after
one cycle.
After the “BSF EECON1, WR” instruction, if
EEADR = xxxxxx11, then a long write will occur. This
will simultaneously transfer the data from
EEDATH:EEDATA to the buf fer registers and begin the
write of all four words. The processor will execute the
next instruction and then ignore the subsequent
inst ruction. The us er should pl ace NOP instru ctions in to
the seco nd wo rds . Th e pro ce ssor w il l th en h alt int erna l
operat io ns for typ ic all y 2 msec in which the w rite takes
place. This is not a Sleep mode, as the clocks and
peripherals will continue to run. After the write cycle,
the processor will resume operation with the 3rd
instruction after the EECON1 write instruction.
Aft er each long writ e, the 4 buf fer registers will be reset
to 3FFF.
FIGURE 3-1: BLOCK WRITES TO FLASH PROGRAM MEMORY
14 14 14 14
Program Memory
Buffer Register
EEADR<1:0> = 00
Buffer Register
EEADR<1:0> = 01
Buffer Register
EEADR<1:0> = 10
Buffer Register
EEADR<1:0> = 11
EEDATA
EEDATH
75 07 0
68
First word of block
to be written
to Flash
automatically
after this word
is wri tt e n
transferred
All buffers are
2001-2013 Microchip Technology Inc. DS39598F-page 31
PIC16F818/819
An example of the complete four-word write sequence
is shown in Example 3-5. The initial address is loaded
into the EEADRH:EEADR register pair; the four words
of dat a a re load ed us ing in direct addres sing, assum ing
that a row erase sequence has already been
performed.
EXAMPLE 3-5: WRITING TO FLASH PROGRAM MEMORY
; This write routine assumes the following:
; 1. The 32 words in the erase block have already been erased.
; 2. A valid starting address (the least significant bits = '00') is loaded into EEADRH:EEADR
; 3. This example is starting at 0x100, this is an application dependent setting.
; 4. The 8 bytes (4 words) of data are loaded, starting at an address in RAM called ARRAY.
; 5. This is an example only, location of data to program is application dependent.
; 6. word_block is located in data memory.
BANKSEL EECON1 ;prepare for WRITE procedure
BSF EECON1, EEPGD ;point to program memory
BSF EECON1, WREN ;allow write cycles
BCF EECON1, FREE ;perform write only
BANKSEL word_block
MOVLW .4
MOVWF word_block ;prepare for 4 words to be written
BANKSEL EEADRH ;Start writing at 0x100
MOVLW 0x01
MOVWF EEADRH ;load HIGH address
MOVLW 0x00
MOVWF EEADR ;load LOW address
BANKSEL ARRAY
MOVLW ARRAY ;initialize FSR to start of data
MOVWF FSR
LOOP
BANKSEL EEDATA
MOVF INDF, W ;indirectly load EEDATA
MOVWF EEDATA
INCF FSR, F ;increment data pointer
MOVF INDF, W ;indirectly load EEDATH
MOVWF EEDATH
INCF FSR, F ;increment data pointer
BANKSEL EECON1
MOVLW 0x55 ;required sequence
MOVWF EECON2
MOVLW 0xAA
MOVWF EECON2
BSF EECON1, WR ;set WR bit to begin write
NOP ;instructions here are ignored as processor
NOP
BANKSEL EEADR
INCF EEADR, f ;load next word address
BANKSEL word_block
DECFSZ word_block, f ;have 4 words been written?
GOTO loop ;NO, continue with writing
BANKSEL EECON1
BCF EECON1, WREN ;YES, 4 words complete, disable writes
BSF INTCON, GIE ;enable interrupts
Required
Sequence
PIC16F818/819
DS39598F-page 32 2001-2013 Microchip Technology Inc.
3.8 Protection Against Spurious Wr ite
There are conditions when the device should not write
to the data EEPROM memory. To protect against
spurious EEPROM writes, various mechanisms have
been b uilt-in. O n power-u p, WREN is cleared. Also, th e
Power-up Timer (72 ms duration) prevents an
EEPROM write.
The wri te in iti ate sequence and the WREN bi t tog eth er
help prevent an accidental write during brown-out,
power glit ch or software malfuncti on.
3.9 Operation During Code-Protect
When the dat a EEPROM is code- prote ct ed, the micro-
controll er can read and writ e to th e EEPROM n ormally.
However, all external access to the EEPROM is
disabl ed. External write access to the progra m memory
is also disabled.
When program memory is code-protected, the micro-
controller can read and write to program memory
normally as well as execute instructions. Writes by the
device may be selectively inhibited to regions of
the memory depending on the setting of bits,
WRT1:WRT0, of the Configuration Word (see
Section 12.1 “Configuration Bits” for additional
information). External access to the memory is also
disabled.
TABLE 3-1: REGISTERS/BIT S ASSOCIATED WITH DATA EEPROM AND
FLASH PROGRAM MEMORIES
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
Power-on
Reset
Value on
all other
Resets
10Ch EEDATA EEPROM/Flash Data Register Low Byte xxxx xxxx uuuu uuuu
10Dh EEADR EEPROM/Flash Address Register Low Byte xxxx xxxx uuuu uuuu
10Eh EEDATH —— EEPROM/Flash Data Register High Byte --xx xxxx --uu uuuu
10Fh EEADRH — — — — — EEPROM/Flash Address
Register High Byte ---- -xxx ---- -uuu
18Ch EECON1 EEPGD —— FREE WRERR WREN WR RD x--x x000 x--x q000
18Dh EECON2 EEPROM Control Register 2 (not a physical register) ---- ---- ---- ----
0Dh PIR2 — — — EEIF — — — — ---0 ---- ---0 ----
8Dh PIE2 — — —EEIE— — — — ---0 ---- ---0 ----
Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’, q = value depends upon condition.
Shaded cells are not used by data EEPROM or Flash program memory.
2001-2013 Microchip Technology Inc. DS39598F-page 33
PIC16F818/819
4.0 OSCILLATOR
CONFIGURATIONS
4.1 Oscillator Types
The PIC16F818/819 can be operated in eight different
oscillator modes. The user can program three configu-
ration bits (FOSC2:FOSC0) to select one of these eight
modes (modes 5-8 are new PIC16 oscillator
configurations):
1. LP Low-Pow er Crystal
2. XT Crystal/Resonator
3. HS High-Speed Crystal /Res ona tor
4. RC External Resi st or/Capacitor with
FOSC/4 output on RA6
5. RCIO External Resi st or/C apacitor with
I/O on RA6
6. INTIO1 Internal Osci ll ator with FOSC/4
output on RA6 and I/O on RA7
7. INTIO2 Internal Oscillator with I/O on RA6
and RA7
8. ECIO External Clock with I/O on RA6
4.2 Crystal Oscillator/Cerami c
Resonators
In XT, LP or HS modes, a crystal or ceramic resonator
is connected to the OSC1/CLKI and OSC2/CLKO pins
to est abl ish osci llatio n (see Fi gure 4-1 and Figure 4-2).
The PIC16F818/819 oscillator design requires the use
of a parallel cut crystal. Use of a series cut crystal may
give a frequency out of the crystal manufacturer’s
specifications.
FIGURE 4-1: CRYSTAL OPERATION
(HS, XT OR LP OSC
CONFIGURATION)
T ABLE 4-1: CAPACITOR SELECTION FOR
CRYSTAL OSCILLATOR (FOR
DESIGN GUIDANCE ONLY)
Note 1: See Table 4-1 for typical values of C1 and C2.
2: A series resi stor (RS) may be required for AT
strip cut crystals.
3: RF varies with the crystal chosen (typically
between 2 M to 10 M.
C1(1)
C2(1)
XTAL
OSC2
RS(2)
OSC1
RF(3) Sleep
To Internal
Logic
PIC16F818/819
Osc Type Crystal
Freq
Typica l Cap acitor V alu es
Tested:
C1 C2
LP 32 kHz 33 pF 33 pF
200 kHz 15 pF 15 pF
XT 200 kHz 56 pF 56 pF
1 MHz 15 pF 15 pF
4 MHz 15 pF 15 pF
HS 4 MHz 15 pF 15 pF
8 MHz 15 pF 15 pF
20 MHz 15 pF 15 pF
Capacitor values are for design guidance only.
These capacito rs were tested with th e crystals listed
below for basic start-up and operation. These values
were not optimized.
Dif ferent capa citor values m ay be required to prod uce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
VDD and temperature range for the application.
See the notes following this table for additional
information.
Note 1: Higher capacitance increases the stability
of the oscillator but also increases the
sta rt-up time.
2: Since each crystal has its own character-
istic s, th e use r shoul d cons ult th e crys tal
manufacturer for appropriate values of
external components.
3: RS may be r equ ired in HS mode , as we ll
as XT mode, to av oid ove rdrivi ng cryst als
with low d rive l evel sp ecification.
4: Always veri fy os ci lla tor performance over
the VDD and temperature range that is
expected for the application.
PIC16F818/819
DS39598F-page 34 2001-2013 Microchip Technology Inc.
FIGURE 4-2: CERAMIC RESO NATOR
OPERATION (HS OR XT
OSC CONFIGURATION)
TABLE 4-2: CERAMIC RESONATORS (FOR
DESIGN GUIDANC E O NLY)
4.3 External Clock Input
The ECIO Oscillator mode requires an external clock
source to be connected to the OSC1 pin. There is no
oscill ator start -up time requi red after a Pow er-on Reset
or after an exit from Sleep mode.
In the ECIO Oscillator mode, the OSC2 pin becomes
an additional general purpose I/O pin. The I/O pin
becomes bit 6 of PORTA (RA6). Figure 4-3 shows the
pin connections for the ECIO Oscillator mode.
FIGURE 4-3: EXTERNAL CLOCK INPUT
OPERATION
(ECIO CONFIGURATION)
Typical Capacitor Values Used:
Mode Freq OSC1 OSC2
XT 455 kHz
2.0 MHz
4.0 MHz
56 pF
47 pF
33 pF
56 pF
47 pF
33 pF
HS 8.0 MHz
16.0 MHz 27 pF
22 pF 27 pF
22 pF
Capacitor values are for design guidance only.
These capacitors were tested with the resonators
listed below for basic start-up and operation. These
values were not optimized.
Dif ferent cap acitor values ma y be required to prod uce
acceptable oscillator operation. The user should test
the performance of the oscillator over the expected
VDD and temperature range for the application.
See the notes following this table for additional
information.
Note: When using resonators with frequencies
above 3.5 MHz, the use of HS mode rather
than XT mode is recommend ed. HS mode
may be used at any VDD for which the
controller is rated. If HS is selected, it is
possible that the gain of the oscillator will
overdrive the resonator. Therefore, a
series resistor should be placed between
the OSC2 pin and the resonator. As a
good starting point, the recommended
value of RS is 330
Note 1: See Table 4-2 for typical values of C1 and C2.
2: A series resistor (RS) may be required.
3: RF varies with the resonator chosen (ty pically
between 2 M to 10 M.
C1(1)
C2(1)
RES
OSC2
RS(2)
OSC1
RF(3) Sleep
To Internal
Logic
PIC16F818/819
OSC1/CLKI
I/O (OSC2)
RA6
Clock from
Ext. System PIC16F818/819
2001-2013 Microchip Technology Inc. DS39598F-page 35
PIC16F818/819
4.4 RC Oscillator
For timing insensitive applications, the “RC” and
“RCIO” device options offer additional cost savings.
The RC oscillator frequency is a function of the supply
voltage, the resistor (REXT) and capacitor (CEXT)
values and the operating temperature. In addition to
this, the oscillator frequency will vary from unit to unit
due to normal manufacturing variation. Furthermore,
the dif ference in lead frame cap acitance between pack-
age types will also affect the oscillation frequency,
especi all y for lo w CEXT values. The user also ne eds to
take into account variation due to tolerance of external
R and C components used. Figure 4-4 shows how the
R/C combination is connected.
In the RC Oscillator mode, the oscillator frequency
divided by 4 is available on the OSC2 pin. This signal may
be used for test purposes or to synchronize other logic.
FIGURE 4-4: RC OSCILLATOR MODE
The RCIO Oscillator mode (Figure 4-5) functions like
the RC mode except that the OSC2 pin becomes an
additional general purpose I/O pin. The I/O pin
becomes bit 6 of PORTA (RA6).
FIGURE 4-5: RCIO OSCILLATOR MODE
4.5 Internal Oscillator Block
The PIC16F818/819 devices include an internal
oscillator block which generates two different clock
signals; either can be used as the system’s clock
source. This can eliminate the need for external
oscillator circuits on the OSC1 and/or OSC2 pins.
The main output (INTOSC) is an 8 MHz clock source
which can be used to directly drive the system clock. It
also driv es the INT OSC postscal er which can prov ide a
range of clock frequencies from 125 kHz to 4 MHz.
The other clock source is the internal RC oscillator
(INTRC) which provides a 31.25 kHz (32 s nominal
period) output. The INTRC oscillator is enabled by
selecting the INTRC as the system clock source or
when any of the following are enabled:
• Power-up Time r
• Watchdog Timer
These features are discussed in greater detail in
Section 12.0 “Special Features of the CPU”.
The clock source frequency (INTOSC direct, INTRC
direct or INTOSC postscaler) is selected by configuring
the IRCF bits of the OSCCON register (Register 4-2).
4.5.1 INTRC MODES
Using the internal oscillator as the clock source can
elimin ate the ne ed for up to two extern al oscil lator pins ,
which can then be used for digital I/O. Two distinct
configurations are available:
• In INTIO1 mode, the O SC2 pin outputs FOSC/4
while OSC1 functions as RA7 for digital input and
output.
• In INTIO2 mode, OSC1 functions as RA7 and
OSC2 functions as RA6, both for digital input and
output.
OSC2/CLKO
CEXT
REXT
PIC16F818/819
OSC1
FOSC/4
Internal
Clock
VDD
VSS
Recommended values: 3 k REXT 100 k
CEXT > 20 pF
CEXT
REXT
PIC16F818/819
OSC1 Internal
Clock
VDD
VSS
Recommended values: 3 k REXT 100 k
CEXT > 20 pF
I/O (OSC2)
RA6
Note: Throughout this data sheet, when referring
specifically to a generic clock source, the
term “INTRC” may als o be used to refer to
the clock modes using the internal
oscillator block. This is regardless of
whether the actual frequency used is
INTOSC (8 MHz), the INTOSC postscaler
or INTRC (31.25 kHz).
PIC16F818/819
DS39598F-page 36 2001-2013 Microchip Technology Inc.
4.5.2 OSCTUNE REGISTER
The internal oscillator’s output has been calibrated at the
factory but can be adjusted in the application. This is
done by writing to the OSCTUNE register (Register 4-1).
The tuning sensitivity is constant throughout the tuning
range. The OSCTUNE register has a tuning range of
±12.5%.
When the OSCTUNE register is modified, the INTOSC
and INTRC frequencies will begin shif ting to the new fre-
quency. The INTRC clock will reach the new frequency
within 8 clock cycles (approximately 8 * 32 s = 256 s);
the INTOSC clock will stabilize within 1 ms. Code execu-
tion continues during this shift. There is no indication that
the shift has occurred. Operation of features that d epend
on the 31.25 kHz INTRC clock source frequency, such
as the WDT, Fail-Safe Clock Monitor and peripherals,
will also be af fec ted by the cha nge in frequency.
REGISTER 4-1: OSCTUNE: OSCILLATOR TUNING REGISTER (ADDRESS 90h)
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— TUN5 TUN4 TUN3 TUN2 TUN1 TUN0
bit 7 bit 0
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 TUN<5:0>: Frequency Tuning bits
011111 = Maximum frequency
011110 =
•
•
•
000001 =
000000 = Center frequency. Oscillator module is running at the calibrated frequency.
111111 =
•
•
•
100000 = Minimum frequency
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
2001-2013 Microchip Technology Inc. DS39598F-page 37
PIC16F818/819
4.5.3 OSCILLATOR CONTROL REGISTER
The OSCCON register (Register 4-2) controls several
aspects of the system clock’s operation.
The Inter nal Oscillator Select bits, IRCF2:IRCF0, select
the freque ncy o utput o f the interna l oscill ator block that
is us ed to driv e th e sys tem cl ock. The c hoi ces a re t he
INTRC source (31.25 kHz), the INTOSC source
(8 MHz) or one of the six frequencies derived from the
INTOSC postscaler (125 kHz to 4 MHz). Changing the
configuration of these bits has an immediate change on
the multiplexor’s frequency output.
4.5.4 MODIFYING TH E IRCF BITS
The IRCF bits can be modified at any time regardless of
which clock source is currently being used as the
system clock. The internal oscillator allows users to
change the frequency during run time. This is achieved
by modifying the IRCF bits in the OSCCON register.
The sequen ce of events tha t occur after the IRCF bits
are modified is dependent upon the initial value of the
IRCF bits before they are modified. If the INTRC
(31.25 kHz, IRCF<2:0> = 000) is running and the IRCF
bits are modified to any other va lue than ‘000’, a 4 ms
(approx. ) clock swit ch delay is turned o n. Code e xecu-
tion continues at a higher than expected frequency
while the new frequency stabilizes. T ime sensitive code
should wait for the IOFS bit in the OSCCON register to
become set before continuing. This bit can be
monitored to ensure that the frequency is stable before
using the system clock in time critical applications.
If th e IRCF b its a re modif ied wh ile the internal oscilla tor
is running at any other frequency than INTRC
(31.25 kHz, IRCF<2:0> 000), there is no need for a
4 ms (approx.) clock switch delay. The new INTOSC
frequency will be stable immediately after the eight
falling edges. The IOFS bit will remain set after clock
switching oc curs.
4.5.5 CLOCK TRANSITION SEQUENCE
WHEN THE IRCF BITS ARE
MODIFIED
Following are three different sequences for switching
the internal RC oscillator frequency.
• Clock before switch: 31.25 kHz (IRCF<2:0> = 000)
1. IRCF bits are modified to an INTOSC/INTOSC
postscaler frequency.
2. The clock switching circuitry waits for a falling
edge of the current clock, at which point CLKO
is held low.
3. Th e clock switching c ircuitry th en waits for eight
falling edges of requested clock, after which it
switches CLKO to this new clock source.
4. Th e IOFS bit is clear to ind icate that the cl ock is
unstable and a 4 ms (approx.) delay is started.
Time dependent code should wait for IOFS to
become set.
5. Switchover is complete.
• Clock before switch: One of INTOSC/INTOSC
postscaler (IRCF<2:0> 000)
1. IRCF bits are modified to INTRC
(IRCF<2:0> = 000).
2. The clock switching circuitry waits for a falling
edge of the current clock, at which point CLKO
is held low.
3. Th e clock switching c ircuitry th en waits for eight
falling edges of requested clock, after which it
switches CLKO to this new clock source.
4. Oscillator switchover is complete.
• Clock before switch: One of INTOSC/INTOSC
postscaler (IRCF<2:0> 000)
1. IRCF bits are modified to a different INTOSC/
INTOSC postscaler frequency.
2. The clock switching circuitry waits for a falling
edge of the current clock, at which point CLKO
is held low.
3. The clock switching circuitry then waits for eight
falling edges of requested clock, after which it
switches CLKO to this new clock source.
4. The IOFS bit is set.
5. Oscillator switchover is complete.
Note: Caution must be t aken when mod ifying the
IRCF bits using BCF or BSF instructions. It
is possible to modify the IRCF bits to a
frequency that may be out of the VDD spec-
ification range; for example, VDD = 2.0V
and IRCF = 111 (8 MHz).
PIC16F818/819
DS39598F-page 38 2001-2013 Microchip Technology Inc.
FIGURE 4-6: PI C16F 81 8/8 19 CLOCK DIAG RAM
REGISTER 4-2: OSCCON: OSCILLATOR CONTROL REGISTER (ADDRESS 8Fh)
PIC18F818/819 CONFIG (FOSC2:FOSC0)
OSC1
OSC2
Sleep LP, XT, HS, RC, EC
CPU
Peripherals
Postscaler
MUX
MUX
8 MHz
4 MHz
2 MHz
1 MHz
500 kHz
125 kHz
250 kHz
OSCCON<6:4>
111
110
101
100
011
010
001
000
31.25 kHz
31.25 kHz
Source
Internal
Oscillator
Block
WDT
31.25 kHz
8 MHz
Internal Oscillator
(INTRC)
(INTOSC)
U-0 R/W-0 R/W-0 R/W-0 U-0 R-0 U-0 U-0
— IRCF2 IRCF1 IRCF0 —IOFS— —
bit 7 bit 0
bit 7 Unimplemented: Read as ‘0’
bit 6-4 IRCF2:IRCF0: Internal Oscillator Frequency Select bits
111 = 8 MHz (8 MHz source drives clock directly)
110 = 4 M Hz
101 = 2 M Hz
100 = 1 M Hz
011 = 500 kHz
010 = 250 kHz
001 = 125 kHz
000 = 31.25 kHz (INTRC source drives clock directly)
bit 3 Unimplemented: Read as ‘0’
bit 2 IOFS: INTOSC Frequency Stable bit
1 = Frequency is stable
0 = Frequency is not stable
bit 1-0 Unimplemented: Read as ‘0’
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
2001-2013 Microchip Technology Inc. DS39598F-page 39
PIC16F818/819
5.0 I/O PORTS
Some pins for these I/O ports are multiplexed with an
alternate function for the peripheral features on the
device. In general, when a peripheral is enabled, that
pin may not be used as a general purpose I/O pin.
Addit ion al inf orm atio n o n I/O ports ma y be found in the
“PIC® Mid-Range MCU Family Reference Manual”
(DS33023).
5.1 PORTA and the TRISA Register
PORTA is an 8-bit wide, bidirectional port. The corre-
sponding data direction register is TRISA. Setting a
TRISA bit (= 1) will make the corresponding PORTA
pin an input (i.e., put the corresponding output driver in
a high-impedance mode). Clearing a TRISA bit (= 0)
will mak e the correspond ing PORTA pin an output (i.e .,
put the contents of the output latch on the selected pin).
Reading the PORTA register reads the status of the
pins, where as wri tin g to i t wi ll write to th e port latch. All
write operations are read-modify-write operations.
Therefore , a write to a port implies that the port pins are
read, this value is modified and then written to the port
data l atch.
Pin RA4 is multiplexed with the Timer0 module clock
input an d with an analog input to become the RA4/AN4/
T0CKI pin. The RA4/AN4/T0CKI pin is a Schmitt
Trigger input and full CMOS output driver.
Pin RA5 is multiplexed with the Master Clear module
input. The RA5/MCLR/VPP pin is a Schmitt Trigger input.
Pin RA6 is mul tiplexed with th e oscillator module input
and external oscillator output. Pin RA7 is multiplexed
with the oscillator module input and external oscillator
input. Pin RA6/OSC2/CLKO and pin RA7/OSC1/CLKI
are Schmitt Trigger inputs and full CMOS output drivers.
Pins RA<1:0> are multiplexed with analog inputs. Pins
RA<3:2> are multiplexed with analog inputs and VREF
inputs . Pins RA<3:0> have TTL inputs and full CMOS
output drivers.
EXAMPLE 5-1: INITIALIZI NG PORTA
TABLE 5-1: PORTA FUNCTIONS
TABLE 5-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA
Note: On a Power-on Reset, the pins
PORTA<4:0> are configured as analog
inputs and read as ‘0’.
BANKSEL PORTA ; select bank of PORTA
CLRF PORTA ; Initialize PORTA by
; clearing output
; data latches
BANKSEL ADCON1 ; Select Bank of ADCON1
MOVLW 0x06 ; Configure all pins
MOVWF ADCON1 ; as digital inputs
MOVLW 0xFF ; Value used to
; initialize data
; direction
MOVWF TRISA ; Set RA<7:0> as inputs
Name Bit# Buffer Function
RA0/AN0 bit 0 TTL Input/output or analog input.
RA1/AN1 bit 1 TTL Input/output or analog input.
RA2/AN2/VREF- bit 2 TTL Input/output, analog input or VREF-.
RA3/AN3/VREF+ bit 3 TTL Input/output, analog input or VREF+.
RA4/AN4/T0CKI bit 4 ST Input/output, analog input or external clock input for Timer0.
RA5/MCLR/VPP bit 5 ST Input, Master Clear (Reset) or programming voltage input.
RA6/OSC2/CLKO bit 6 ST Input/output, connects to crystal or resonator, oscillator output or 1/4 the
frequency of OSC1 and denotes the instruction cycle in RC mode.
RA7/OSC1/CLKI bit 7 ST/CMOS(1) Input/output, connects to crystal or resonator or oscillator input.
Legend: TTL = TTL input, ST = Schmitt Trigger input
Note 1: This buff er is a Schmi tt T rigg er input w hen con figured in RC Osc illato r mode and a CMOS input oth erwise.
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR Value on all
other Re s e ts
05h PORTA RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 xxx0 0000 uuu0 0000
85h TRISA TRISA7 TRISA6 TRISA5(1) PORTA Data Direction Register 1111 1111 1111 1111
9Fh ADCON1 ADFM ADCS2 —— PCFG3 PCFG2 PCFG1 PCFG0 00-- 0000 00-- 0000
Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA.
Note 1: Pin 5 is an input only; the state of the TRISA5 bit has no effect and will always read ‘1’.
PIC16F818/819
DS39598F-page 40 2001-2013 Microchip Technology Inc.
FIGURE 5-1: BLOCK DIAGRAM OF
RA0/AN0:RA1/AN1 PINS
FIGURE 5-2: BLOCK DIAGRAM OF
RA3/AN3/VREF+ PIN
FIGURE 5-3: BLOCK DIAGRAM OF
RA2/AN2/VREF- PIN
FIGURE 5-4: BLOCK DIAGRAM OF
RA4/AN4/T0CKI PIN
Data
Bus QD
Q
CK P
N
WR
PORTA
WR
TRISA
Data Latch
TRIS Latch
RD TRISA
RD PORTA
Analog VSS
VDD
I/O pin
QD
Q
CK
Input Mode
DQ
EN
TTL
Input Buffer
VDD
To A/D Module Channel Input
VSS
Data
Bus QD
Q
CK P
N
WR
PORTA
WR
TRISA
Data Latch
TRIS Latch
RD TRISA
RD PORTA
Analog VSS
VDD
I/O pin
QD
Q
CK
Input Mode
DQ
EN
VDD
To A/D Module Channel Input
To A/D Module VREF+ Input
VSS
TTL
Input Buffer
Data
Bus QD
Q
CK P
N
WR
PORTA
WR
TRISA
Data Latch
TRIS Latch
RD TRISA
RD PORTA
Analog VSS
VDD
I/O pin
QD
Q
CK
Input Mode
DQ
EN
VDD
To A/D Modu le Channel Input
To A/D Module VREF- Input
VSS
TTL
Input Buffer
Data
Bus QD
Q
CK P
N
WR
PORTA
WR
TRISA
Data Latch
TRIS Latch
RD TRISA
RD PORTA
Analog VSS
VDD
I/O pin
QD
Q
CK
Input Mode
DQ
EN
VDD
To A/D Module Channel Input
TMR0 Clock Input
VSS
Schmitt Trigger
Input Buffer
2001-2013 Microchip Technology Inc. DS39598F-page 41
PIC16F818/819
FIGURE 5-5: BLOCK DIAGRAM OF RA5/MCLR/VPP PIN
FIGURE 5-6: BLOCK DIAGRAM OF RA6/OSC2/CLKO PIN
DQ
EN
MCLR Filter
RA5/MCLR/VPP
RD Port
MCLR Circuit
MCLRE
MCLRE
Data
Bus
RD TRIS
Schmitt T r igger
Buffer
VSS
VSS Schmitt Trigger
Input Buffer
Data
Bus QD
Q
CK
P
N
WR
PORTA
WR
TRISA
Data Latch
TRIS Latch
RD TRISA
RD PORTA
VSS
VDD
RA6/OSC2/CLKO
Q
D
Q
CK
DQ
EN
Oscillator
Circuit
From OSC1
(FOSC = 1x0,011)
P
N
VSS
VDD
CLKO (FOSC/4)
VDD
Note 1: I/O pins have protection diodes to VDD and VSS.
2: CLKO signal is 1/4 of the FOSC frequency.
(FOSC = 1x1)VSS
Schmitt Tri gger
Input Buffer
(FOSC = 1x0,011)
PIC16F818/819
DS39598F-page 42 2001-2013 Microchip Technology Inc.
FIGURE 5-7: BLOCK DIAGRAM OF RA7/OSC1/CLKI PIN
Data
Bus QD
Q
CK
WR
PORTA
WR
TRISA
Data Latch
TRIS Latch
RD TRISA
RD PORTA
Q
D
Q
CK
DQ
EN
Oscillator
Circuit
RA7/OSC1/CLKI
P
N
VSS
VDD
FOSC = 10x
VDD
Note 1: I/O pins have protection diodes to VDD and VSS.
(FOSC = 011)
FOSC = 10x
From OSC2
VSS
Schmitt Tri gger
Input Buffer
2001-2013 Microchip Technology Inc. DS39598F-page 43
PIC16F818/819
5.2 PORTB and the TRISB Register
PORTB is an 8-bit wide, bidirectional port. The corre-
sponding data direction register is TRISB. Setting a
TRISB bit (= 1) will make the corresponding PORTB
pin an input (i.e., put the corresponding output driver in
a high-impedance mode). Clearing a TRISB bit (= 0)
will make th e corresp onding POR TB pi n an out put (i.e .,
put the contents of the output latch on the selected pin).
Each of th e POR TB pins has a we ak inte rnal pul l-up. A
single control bit can turn on all the pull-ups. This is
performed by clearing bit RBPU (OPTION_REG<7>).
The weak pull-up is automatically turned off when the
port pin is configured as an output. The pull-ups are
disabled on a Power-on Reset.
Four of POR TB’s pi ns, RB7:RB4, hav e an interrupt-o n-
change feature. Only pins configured as inputs can
cause this interrupt to occur (i.e., any RB7:RB4 pin
configured as an output is excluded from the interrupt-
on-change comparison). The input pins (of RB7:RB4)
are compared with the old value latched on the last
read of PORTB. The “mismatch” outputs of RB7:RB4
are ORed together to generate the RB Port Change
Interrupt with Flag bit, RBIF (INTCON<0>).
This interrupt can wake the device from Sleep. The
user, in the Interrupt Service Routine, can clear the
inter rupt in the fol lowi ng man ne r :
a) Any read or write of PORTB. This will end the
mismatch condition.
b) Clear flag bit RBIF.
A mism at c h c ond it i on wi ll cont i n ue to s et f lag bi t RB IF.
Reading PORTB will end the mismatch condition and
allow flag bit RBIF to be cleared.
The interrupt-on-change feature is recommended for
wake-up on key depression operation and operations
where PORTB is only used for the interrupt-on-change
feature. Polling of PORTB is not recommended while
using the interrupt-on-change feature.
RB0/INT is an external interrupt input pin and is
configured using the INTEDG bit (OPTION_REG<6>).
PORTB i s multiplexed w ith several pe ripheral function s
(see Table 5-3). PORTB pins have Schmitt Trigger
input buffers.
When enabling peripheral functions, care should be
taken in defining TRIS bits for each PORTB pin. Some
peripherals override the TRIS bit to make a pin an out-
put, while other peripherals override the TRIS bit to
make a pin an input. Since the TRIS bit override is in
effect while the peripheral is enabled, read-modify-
write instructions (BSF, BCF, XORWF) with TRISB as
the destination should be avoided. The user should
refer to the corresponding peripheral section for the
correct TRIS bit settings.
PIC16F818/819
DS39598F-page 44 2001-2013 Microchip Technology Inc.
TABLE 5-3: PORTB FUNCTIONS
TABLE 5-4: SUMMARY OF REGISTERS ASSOCIATED WITH PORTB
Name Bit# Buffer Function
RB0/INT bit 0 TTL/ST(1) Input/output pin or external interrupt input.
Internal software programmable weak pull-up.
RB1/SDI/SDA bit 1 TTL/ST(5) Input/output pin, SPI data input pin or I2C™ data I/O pin.
Internal software programmable weak pull-up.
RB2/SDO/CCP1 bit 2 TTL/ST(4) Input/output pin, SPI data output pin or
Capture input/Compare output/PWM output pin.
Internal software programmable weak pull-up.
RB3/CCP1/PGM(3) bit 3 TTL/ST(2) Input/output pin, Capture input/Compare output/PWM output pin
or programming in LVP mode. Internal software programmable
weak pull-up.
RB4/SCK/SCL bit 4 TTL/ST(5) Input/output pin or SPI and I2C clock pin (with interrupt-on-change).
Internal software programmable weak pull-up.
RB5/SS bit 5 TTL Input/output pin or SPI slave select pin (with interrupt-on-change).
Internal software programmable weak pull-up.
RB6/T1OSO/T1CKI/
PGC bit 6 TTL/ST(2) Input/output pin, Timer1 oscillator output pin, Timer1 clock input pin or
serial prog ram ming cl ock (wi th inte rrupt -on-c ha nge ).
Internal software programmable weak pull-up.
RB7/T1OSI/PGD bit 7 TTL/ST(2) Input/output pin, Timer1 oscillator input pin or serial programming data
(with interrupt-on-change).
Internal software programmable weak pull-up.
Legend: TTL = TTL input, ST = Schmitt Trigger input
Note 1: This buffe r is a Schmitt Trigger input when configured as the external interrupt.
2: This buffe r is a Schmit t Trigger i nput when used in Serial Programming mode.
3: Low-Voltage ICSP™ Programming (LVP) is enabled by default which disables the RB3 I/O function. LVP
must be disabled to enable RB3 as an I/O pin and allow maximum compatibility to the other 18-pin
mid-range dev ic es .
4: This buffer is a Schmitt Trigger input when configured for CCP or SSP mode.
5: This buffe r is a Schmitt Trigger input when configured for SPI or I2C mode.
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
06h, 106h PORTB RB7 RB6 RB5 RB4 RB3 RB2 RB1 RB0 xxxx xxxx uuuu uuuu
86h, 186h TRISB PORTB Data Direction Register 1111 1111 1111 1111
81h, 181h OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
Legend: x = unknown, u = unchanged. Shaded cells are not used by PORTB.
2001-2013 Microchip Technology Inc. DS39598F-page 45
PIC16F818/819
FIGURE 5-8: BLOCK DIAGRAM OF RB0 PIN
Note 1: I/O pins have diode protection to VDD and VSS.
2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit.
Data L a tc h
RBPU(2)
P
VDD
QD
CK
QD
CK
QD
EN
Data Bus
WR
WR
RD TRISB
RD PORTB
Weak
Pull-up
RD PORTB
I/O pin(1)
TTL
Input
Buffer
TRIS Latch
To IN T 0 o r CCP
PORTB
TRISB
PIC16F818/819
DS39598F-page 46 2001-2013 Microchip Technology Inc.
FIGURE 5-9: BLOCK DIAGRAM OF RB1 PIN
Data Latch
RBPU(2)
P
VDD
Q
D
CK
QD
CK
QD
EN
Data Bus
WR
WR
RD TRISB
RD PORTB
Weak
Pull-up
RD PORTB
SDA(3)
I/O pin(1)
TTL
Input
Buffer
Schmitt Trigger
Buffer
TRIS Latch
Note 1: I/O pins have diode protection to VDD and VSS.
2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit.
3: The SDA Schmitt Trigger conforms to the I2C specification.
1
0
SDA Output
P
N
VSS
VDD
Q
SDA Drive
Port/SSPEN Sel ect
I2C™ Mode
SDI
PORTB
TRISB
2001-2013 Microchip Technology Inc. DS39598F-page 47
PIC16F818/819
FIGURE 5-10: BLOCK DIAGRAM OF RB2 PIN
Data Latch
RBPU(2)
P
VDD
QD
CK
QD
CK
QD
EN
Data Bus
WR
WR
RD TRISB
RD PORTB
Weak
Pull-up
RD PORTB
I/O pin(1)
TTL
Input
Buffer
TRIS Latch
Note 1: I/O pins have diode protection to VDD and VSS.
2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit.
0
1
0
1
CCPMX
CCP
SDO
Module Select
PORTB
TRISB
PIC16F818/819
DS39598F-page 48 2001-2013 Microchip Technology Inc.
FIGURE 5-11: BLOCK DIAGRAM OF RB3 PIN
Data Latch
RBPU(2)
P
VDD
QD
CK
QD
CK
QD
EN
Data Bus
WR
WR
RD TRISB
RD PORTB
Weak
Pull-up
RD PORTB
I/O pin(1)
TTL
Input
Buffer
TRIS Latch
PORTB
Note 1: I/O pins have diode protection to VDD and VSS.
2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit.
0
1
CCP
To PGM or CCP
CCP1<M3:M0> = 1000, 1001, 11xx and CCPMX = 0
CCP1<M3:M0> = 0100, 0101, 0110, 0111 and CCPMX = 0
or LVP = 1
TRISB
2001-2013 Microchip Technology Inc. DS39598F-page 49
PIC16F818/819
FIGURE 5-12: BLOCK DIAGRAM OF RB4 PIN
Data Latch
From other
RBPU(2)
P
VDD
I/O pin(1)
QD
CK
QD
CK
QD
EN
QD
EN
Data Bus
WR
WR
Set RBIF
TRIS Latch
RD TRISB
RD PORTB
RB7:RB4 pins
Weak
Pull-up
RD PORTB
Latch
TTL
Input
Buffer
Q3
Q1
PORTB
Note 1: I/O pins have diode protection to VDD and VSS.
2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit.
3: The SCL Schmitt Trigger conforms to the I2C™ specification.
SCK
SCK/SCL 1
0
Port/SSPEN
SCL(3)
P
N
VSS
VDD
SCL Drive
TRISB
PIC16F818/819
DS39598F-page 50 2001-2013 Microchip Technology Inc.
FIGURE 5-13: BLOCK DIAGRAM OF RB5 PIN
Data Latch
From other
RBPU(2)
P
VDD
I/O pin(1)
QD
CK
QD
CK
QD
EN
QD
EN
Data Bus
WR
WR
Set RBIF
TRIS Latch
RD TRISB
RD PORTB
RB7:RB4 pins
Weak
Pull-up
RD PORTB
Latch
Q3
Q1
PORTB
SS
Port/SSPEN
Note 1: I/O pins have diode protection to VDD and VSS.
2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit.
TRISB
TTL
Input
Buffer
2001-2013 Microchip Technology Inc. DS39598F-page 51
PIC16F818/819
FIGURE 5-14: BLOCK DIAGRAM OF RB6 PIN
Data Latch
From other
RBPU(2)
P
VDD
I/O pin(1)
QD
CK
QD
CK
QD
EN
QD
EN
Data Bus
WR
WR
Set RBIF
TRIS Latch
RD TRISB
RD PORTB
RB7:RB4 pins
Weak
Pull-up
RD PORTB
Latch
Q3
Q1
PORTB
Note 1: I/O pins have diode protection to VDD and VSS.
2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit.
T1CKI/PGC
T1OSCEN/ICD/
From T1OS O Output
TTL
Inpu t Bu ffe r
T1OSCEN
TRISB
Program Mode
PIC16F818/819
DS39598F-page 52 2001-2013 Microchip Technology Inc.
FIGURE 5-15: BLOCK DIAGRAM OF RB7 PIN
Data Latch
From other
RBPU(2)
P
VDD
I/O pin(1)
QD
CK
QD
CK
QD
EN
QD
EN
Data Bus
WR
T1OSCEN
Set RBIF
TRIS Latch
RD TRISB
RD PORTB
RB7:RB4 pins
Weak
Pull-up
RD PORTB
Latch
Q3
Q1
PORTB
Note 1: I/O pins have diode protection to VDD and VSS.
2: To enable weak pull-ups, set the appropriate TRIS bit(s) and clear the RBPU bit.
PGD
PGD 1
0
Port/Program Mode/ICD
Analog
TTL
Input Buffer
Input Mode
To T1OSI Input
1
0
PGD DRVEN
T1OSCEN
WR
TRISB
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PIC16F818/819
6.0 TIMER0 MODULE
The Timer0 module timer/counter has the following
features:
• 8-bit timer/counter
• Readable and writable
• 8-bit software programmable prescaler
• Internal or external clock select
• Interrupt-on-overflow from FFh to 00h
• Edge select for external clock
Additional information on the Timer0 module is
available in the “PIC® Mid-Range MCU Family Refer-
ence Manual” (DS330 23) .
Figure 6-1 is a bl ock diagram o f the T imer0 mod ule and
the prescaler shared with the WDT.
6.1 Timer0 Operation
Timer0 operation is controlled through the
OPTION_REG register (se e Register 2-2). T imer mod e
is selected by clearing bit T0CS (OPTION_REG<5>).
In T imer m ode, the T ime r0 module w ill incr ement eve ry
instruc tion cy cle (with out pr escal er). If the TMR0 regis-
ter is w ritten , the i ncrem ent is inhi bited f or the follow ing
two instruction cycles. The user can work around this
by writing an adjusted value to the TMR0 register.
Counter mode is selected by setting bit T0CS
(OPTION_REG<5>). In Counter mode, Timer0 will
increment either on every rising or falling edge of pin
RA4/AN4/T0CKI. The incrementing edge is determined
by the Timer0 Source Edge Select bit, T0SE
(OPTION_REG<4>). Clearing bit T0SE selects the
rising edg e. Restrict ions on the exter nal clock input are
discus se d in detail in Sec tion 6.3 “Using T i mer0 w ith
an External Clock”.
The prescaler is mutually exclusively shared between
the Timer0 module and the Watchdog Timer. The
prescaler is not readable or writable. Section 6.4
“Prescaler” details the operation of the prescaler.
6.2 Timer0 Interrupt
The TMR0 interrupt is generated when the TMR0
register overflows from FFh to 00h. This overflow sets
bit, TMR0IF (INTCON<2>). The interrupt can be
masked by clearing bit, TMR0IE (INTCON<5>). Bit
TMR0IF must be cleared in software by the Timer0
module Interrupt Service Routine before re-enabling
this interrupt. The TMR0 interrupt cannot awaken the
processor from Sleep since the timer is shut-off during
Sleep.
FIGURE 6-1: BLOCK DIAGRAM OF THE TIMER0/WDT PRESCALER
RA4/AN4/T0CKI
T0SE
pin
M
U
X
CLKO (= FOSC/4)
Sync
2
Cycles TMR0 reg
8-bit Prescaler
8-to-1 MUX
M
U
X
MUX
31.25 kHz
WDT Timer
PSA
01
0
1
WDT
Time-out
PS2:PS0
8
Note: T0CS, T0SE, PSA, PS2:PS0 are (OPTION_RE G <5:0>).
PSA
WDT Enable bit
M
U
X
0
10
1
Data Bus
Set Flag bit TMR0IF
on Overflow
8
PSA
T0CS
PRESCALER
PIC16F818/819
DS39598F-page 54 2001-2013 Microchip Technology Inc.
6.3 Using Timer0 with an
External Clock
When no pr escal er is used, t he ex ternal clo ck inp ut is
the same as the pre sc al er outp ut. Th e sy nch ron iz atio n
of T0CKI with the internal phase clocks is accom-
plishe d by sampling the prescale r output on the Q2 and
Q4 cycles of the internal phase clocks. Therefore, it is
necessary for T0CKI to be high for at least 2 TOSC (and
a small RC delay of 20 ns) and low for at least 2 TOSC
(and a small RC delay of 20 ns). Refer to the electrical
specification of the desired device.
6.4 Prescaler
There is only one prescaler av ai lab le wh ic h is m utu all y
exclus ively shar ed between th e T imer0 mod ule and the
Watchdog Timer. A prescaler assignment for the
T imer0 module means that there is no prescaler for the
Watchdog Timer and vice versa. This prescaler is not
readable or writable (see Figure 6-1).
The PSA and PS2:PS0 bits (OPTION_REG<3:0>)
determine the prescaler assignment and prescale ratio.
When assigned to the Timer0 module, all instructions
writing to the TMR0 register (e.g., CLRF 1, MOVWF 1,
BSF 1, x....etc.) will clear the prescaler. When
assigned to WDT, a CLRWDT instruction will clear the
prescaler along with the Watchdog Timer. The
prescaler is not readable or writable.
REGISTER 6-1: OPTION_REG: OPTION REGISTER (ADDRESS 81h, 181h)
Note: Writing to TMR0 when the prescaler is
assign ed to Timer0 will cle ar the pre scal er
count but will not change the prescaler
assignment.
R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
bit 7 bit 0
bit 7 RBPU: PORTB Pull-up Enable bit
1 = PORTB pull-ups are disabled
0 = PORTB pull-ups are enabled by individual port latch values
bit 6 INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of RB0/INT pin
0 = Interrupt on falling edge of RB0/INT pin
bit 5 T0CS: TMR0 Clock Source Select bit
1 = Transition on T0CKI pin
0 = Internal instruction cycle clock (CLKO)
bit 4 T0SE: TMR0 Source Edge Select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3 PSA: Prescaler Assignment bit
1 = Prescaler is assigned to the WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0 PS2:PS0: Prescaler Rate Select bits
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Note: To avoid an uninten ded device Reset, the instru cti on sequence shown in the “PIC®
Mid-Range MCU Family Reference Manual” (DS33023) must be executed when
changing the prescaler assignment from Timer0 to the WDT. This sequence must
be followed even if the WDT is disabled.
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
1 : 1
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
Bit Value TMR0 Rate WDT Rate
2001-2013 Microchip Technology Inc. DS39598F-page 55
PIC16F818/819
EXAMPLE 6-1: CHANGING THE PRESCALER ASSIGNMENT FROM TIMER0 TO WDT
EXAMPLE 6-2: CHANGING THE PRESCALER ASSIGNMENT FROM WDT TO TIMER0
TABLE 6-1: REGISTERS ASSOCIATED WITH TIMER0
BANKSEL OPTION_REG ; Select Bank of OPTION_REG
MOVLW b'xx0x0xxx' ; Select clock source and prescale value of
MOVWF OPTION_REG ; other than 1:1
BANKSEL TMR0 ; Select Bank of TMR0
CLRF TMR0 ; Clear TMR0 and prescaler
BANKSEL OPTION_REG ; Select Bank of OPTION_REG
MOVLW b'xxxx1xxx' ; Select WDT, do not change prescale value
MOVWF OPTION_REG
CLRWDT ; Clears WDT and prescaler
MOVLW b'xxxx1xxx' ; Select new prescale value and WDT
MOVWF OPTION_REG
CLRWDT ; Clear WDT and prescaler
BANKSEL OPTION_REG ; Select Bank of OPTION_REG
MOVLW b'xxxx0xxx' ; Select TMR0, new prescale
MOVWF OPTION_REG ; value and clock source
Add r e s s Nam e Bit 7 Bit 6 B it 5 B it 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
01h,101h TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu
0Bh,8Bh,
10Bh,18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u
81h,181h OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0 1111 1111 1111 1111
Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’. Shaded cells are not used by Timer0.
PIC16F818/819
DS39598F-page 56 2001-2013 Microchip Technology Inc.
NOTES:
2001-2013 Microchip Technology Inc. DS39598F-page 57
PIC16F818/819
7.0 TIMER1 MODULE
The Timer1 module is a 16 -bi t timer/c ou nter c ons is tin g
of two 8-bit registers (TMR1H and TMR1L) which are
readable and writable. The TMR1 register pair
(TMR1H:TMR1L) increments from 0000h to FFFFh
and rol ls over to 0000h. Th e TMR1 inter rupt, if e nabled,
is generated on overflow which is latched in interrupt
flag bit, TMR1IF (PIR1<0>). This interrupt can be
enabled/disabled by setting/clearing TMR1 Interrupt
Enable bit, TMR1IE (PIE1<0>).
Timer1 can also be used to provide Real-Time Clock
(RTC) functionality to applications with only a minimal
addition of external components and code overhead.
7.1 Timer1 Operation
Timer1 can operate in one of three modes:
•as a timer
• as a synchronous counter
• as an asynchronous counter
The operating mode is determined by the clock select
bit, TMR1CS (T1CON<1>).
In Timer mode, Timer1 increments every instruction
cycle. In Counter mode, it increments on every rising
edge of the external clock input.
Timer1 can be enabled/disabled by setting/clearing
control bit, TMR1ON (T1CON<0>).
Timer1 also has an internal “Reset input”. This Reset
can be generated by the CCP1 module as the special
event trigger (see Section 9.1 “Capture Mode”).
Register 7-1 shows the Timer1 Control register.
When the Timer1 oscillator is enabled (T1OSCEN is
set), the RB6/T1OSO/T1CKI/PGC and RB7/T1OSI/
PGD pins become inputs. That is, the TRISB<7:6>
value is ignored and these pins read as ‘0’.
Additional information on timer modules is available in
the “PIC® Mid-Range MCU Family Reference Manual”
(DS33023).
REGISTER 7-1: T1CON: TIMER1 CONTROL REGISTER (ADDRESS 10h)
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON
bit 7 bit 0
bit 7-6 Unimplemented: Read as ‘0’
bit 5-4 T1CKPS1:T1CKPS0: Timer1 Input Clock Prescale Select bits
11 = 1:8 Prescale value
10 = 1:4 Prescale value
01 = 1:2 Prescale value
00 = 1 :1 Prescale value
bit 3 T1OSCEN: Timer1 Oscillator Enable Control bit
1 = Oscillator is enabl ed
0 = Oscillator is shut-off (the oscillator inverter is turned off to eliminate power drain)
bit 2 T1SYNC: Timer1 External Clock Input Synchronization Co ntrol bit
TMR1CS = 1:
1 = Do not synchronize external clock input
0 = Synchronize external clock input
TMR1CS = 0:
This bit is ignored. Timer1 uses the internal clock when TMR1CS = 0.
bit 1 TMR1CS: Timer1 Clock Source Select bit
1 = External clock from pin RB6/T1OSO/T1CKI/PGC (on the rising edge)
0 = Internal clock (FOSC/4)
bit 0 TMR1ON: Timer1 On bit
1 = Enables Timer1
0 =Stops Timer1
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
PIC16F818/819
DS39598F-page 58 2001-2013 Microchip Technology Inc.
7.2 Timer1 Operation in Timer Mode
Timer mode is selected by clearing the TMR1CS
(T1CON<1>) bit. In this mode, the input clock to the
timer is FOSC/4. The synchronize control bit, T1SYNC
(T1CON<2>), has no effect since the internal clock is
always in sync.
7.3 Timer1 Counter Operation
Timer1 may operate in Asynchronous or Synchronous
mode depending on the setting of the TMR1CS bit.
When Timer1 is being incremented via an external
source, increments occur on a rising edge. After T imer1
is enab led in Coun ter mode, the module must first have
a falling edge before the counter begins to increment.
7.4 Timer1 Operation in Synchr onized
Counter Mode
Counter mode is selected by setting bit TMR1CS. In
this mode, the timer increments on every rising edge of
clock input on pin RB7/T1OSI/PGD when bit
T1OSCEN is set, or on pin RB6/T1OSO/T1CKI/PGC
when bit T1OSCEN is cleared.
If T1SYNC is cleared, then the external clock input is
synchronized with internal phase clocks. The synchro-
nization is done after the prescaler stage. The
prescaler stage is an asynchronous ripple counter.
In this configuration, during Sleep mode, T imer1 will not
increment even if the external clock is present, since
the synchronization circuit is shut-off. The prescaler,
however, will continue to increment.
FIGURE 7-1: TIMER1 INCREMENTING EDGE
FIGURE 7-2: TIMER1 BLOCK DIAGRAM
T1CKI
(Default High)
T1CKI
(Default Low)
Note: Arrows indicate counter increments.
TMR1H TMR1L
T1OSC T1SYNC
TMR1CS
T1CKPS1:T1CKPS0 Q Clock
T1OSCEN
Enable
Oscillator(1)
FOSC/4
Internal
Clock
TMR1ON
On/Off
Prescaler
1, 2, 4, 8 Synchronize
det
1
0
0
1
Synchronized
Clock Input
2
RB7/T1OSI/PGD
RB6/T1OSO/T1CKI/PGC
Note 1: When the T1OSCEN bit is cleared, the inverter is turned off. This eliminates power drain.
Set Flag bit
TMR1IF on
Overflow TMR1
2001-2013 Microchip Technology Inc. DS39598F-page 59
PIC16F818/819
7.5 Timer1 Operation in
Asynchronous Counter Mode
If control bi t, T1SYNC (T1CON<2>), is set, the ext ernal
clock input is not synchronized. The timer continues to
increment asynchronous to the internal phase clocks.
The timer will continue to run during Sleep and can
generate an interrupt on overflow that will wake-up the
processor. However, special precautions in software
are needed to read/write the timer.
In Asynchronous Counter mode, Timer1 cannot be
used as a time base for capture or compare ope rations.
7.5.1 READING AND WRITING TIMER1
IN ASYNCHRONOUS COUNTER
MODE
Reading TMR1H or TMR1L while the timer is running
from an e xternal asyn chronous cl ock will ens ure a valid
read (taken care of in hardware). However, the user
should keep i n mind that rea ding t he 16-bi t time r in tw o
8-bit values itself poses certain problems, since the
timer may overflow between the reads.
For writes , it is re commend ed that th e user s imply sto p
the timer and write the desired values. A write conten-
tion may occur by writing to the timer registers while the
register is incrementing. This may produce an
unpredictable value in the timer register.
Reading the 16-bit value requires some care. The
example codes provided in Example 7-1 and
Example 7-2 demonstrate how to write to and read
Timer1 while it is running in Asynchronous mode.
EXAMPLE 7-1: WRITING A 16-BIT FREE RUNNING TIMER
EXAMPLE 7-2: READING A 16-BIT FREE RUNNING TIMER
; All interrupts are disabled
CLRF TMR1L ; Clear Low byte, Ensures no rollover into TMR1H
MOVLW HI_BYTE ; Value to load into TMR1H
MOVWF TMR1H, F ; Write High byte
MOVLW LO_BYTE ; Value to load into TMR1L
MOVWF TMR1H, F ; Write Low byte
; Re-enable the Interrupt (if required)
CONTINUE ; Continue with your code
; All interrupts are disabled
MOVF TMR1H, W ; Read high byte
MOVWF TMPH
MOVF TMR1L, W ; Read low byte
MOVWF TMPL
MOVF TMR1H, W ; Read high byte
SUBWF TMPH, W ; Sub 1st read with 2nd read
BTFSC STATUS, Z ; Is result = 0
GOTO CONTINUE ; Good 16-bit read
; TMR1L may have rolled over between the read of the high and low bytes.
; Reading the high and low bytes now will read a good value.
MOVF TMR1H, W ; Read high byte
MOVWF TMPH
MOVF TMR1L, W ; Read low byte
MOVWF TMPL ; Re-enable the Interrupt (if required)
CONTINUE ; Continue with your code
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DS39598F-page 60 2001-2013 Microchip Technology Inc.
7.6 Timer1 Oscillator
A crystal oscillator circuit is buil t-in between pins T1OSI
(input) and T1OSO (amplifier output). It is enabled by
setting control bit, T1OSCEN (T1CON<3>). The
oscillator is a low-power oscillator, rated up to
32.768 kHz. It will continue to run during Sleep. It is
primaril y i ntended for a 32 kHz cr yst al. The circuit fo r a
typical LP oscillator is shown in Figure 7-3. Table 7-1
shows th e cap aci tor sel ection for the Timer1 o scill ator.
The user m us t prov id e a so ftware tim e de lay to en su re
proper oscillator start-up.
FIGURE 7-3: EXTERNAL
COMPONENTS FOR THE
TIMER1 LP OSCILLATOR
T ABLE 7-1: CAP ACITOR SELECTION FOR
THE TIMER1 OSCILLATOR
7.7 Timer1 Oscillator Layout
Considerations
The Timer1 oscillator circuit draws very little power
during operation. Due to the low-power nature of the
oscillator, it may also be sensitive to rapidly changing
signals in close proximity.
The oscillator circuit, shown in Figure 7-3, should be
located as close as possible to the microcontroller.
There sho uld be no circu its pas sing within the oscillator
circuit boundaries other than VSS or VDD.
If a high-speed c irc ui t mus t b e l oc ate d n ear the oscilla-
tor, a grounded guard ring around the oscillator circuit,
as shown in Figure 7-4, may be helpful when used on
a single-sided PCB or in addition to a ground plane.
FIGURE 7-4: OSCILLATOR CIRCUIT
WITH GROUNDED
GUARD RING
Note: The Timer1 oscillator shares the T1OSI
and T1OSO pins with the PGD and PGC
pins used for programming and
debugging.
When usi ng th e Timer1 osci ll at or, In -Ci rcu it
Serial Programming™ (ICSP™) may not
function correctly (high-voltage or low-
voltage) or the In-Circuit Debugger (ICD)
may not communicate with the controller.
As a result of using either ICSP or ICD, the
T imer1 crystal may be damaged.
If ICSP or ICD operatio ns are requi red, the
crystal should be disconnected from the
circuit (disconnect either lead) or installed
after programming. The oscillator loading
capacitors may remain in-circuit during
ICSP or ICD operation.
PIC16F818/819
T1OSI
T1OSO
C2
33 pF
C1
33 pF
XTAL
32.768 kHz
Note: See the Notes with Table 7-1 for additional
information about capacitor selection.
Osc Type Freq C1 C2
LP 32 kHz 33 pF 33 pF
Note 1: Microchip suggests this value as a starting
point in validating the oscillator circuit.
2: Higher capacit ance inc reases the st abilit y
of the oscillator but also increases the
start-up time.
3: Since each resonator/crystal has its own
characteristics, the user should consult
the resonator/crystal manufacturer for
appropriate values of external
components.
4: Capacitor values are for design guidance
only.
OSC1
VSS
OSC2
RB7
RB6
RB5
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7.8 Resetting Timer1 Using a CCP
Trigger Output
If the CCP1 module is configured in Compare mode to
generate a “special event trigger” signal
(CCP1M3:CCP1M0 = 1011), the signal will reset
Timer1 and start an A/D conversion (if the A/D module
is enabled).
T ime r1 must be c onfigured fo r either T ime r or Synchr o-
nized Counter mode to take advantage of this feature.
If Timer1 is running in Asynchronous Counter mode,
this Reset operation may not work.
In the event that a write to Timer1 coincides with a
special event trigger from CCP1, the write will take
precedence.
In this mode of operation, the CCPR1H:CCPR1L
register pair e f fectively becomes th e pe riod regi ster for
Timer1.
7.9 Resetting Timer1 Register Pair
(TMR1H , TMR1L )
TMR1H an d TMR1L reg isters are not rese t to 00h on a
POR or any other Reset, except by the CCP1 special
event triggers.
T1CON re gister is rese t to 00h on a Pow er-on Rese t or
a Brown-out Reset, which shuts off the timer and
leaves a 1:1 prescale. In all other Resets, the register
is unaffected.
7.10 Timer1 Prescaler
The prescaler counter is cleared on writes to the
TMR1H or TMR1L registers.
7.11 Using Timer1 as a
Real-Time Clock
Adding an extern al LP os cilla tor to Timer1 (such a s the
one described in Section 7.6 “Timer1 Oscillator”),
gives users the option to include RTC functionality in
their applications. This is accomplished with an inex-
pensive watch crystal to provide an accurate time base
and several lines of application code to calculate the
time. When operating in Sleep mode and using a
battery or supercapacitor as a power source, it can
completely eliminate the need for a separate RTC
device and battery backup.
The application code routine, RTCisr, shown in
Example 7-3, demonstrates a simple method to
increment a counter at one-second intervals using an
Interrupt Service Routine. Incrementing the TMR1
register pair to overflow, triggers the interrupt and calls
the routine which increments the seconds counter by
one; additional counters for minutes and hours are
inc remented as the previous counter overflows.
Since the register pair is 16 bits wide, counting up to
overflow the register directly from a 32.768 kHz clock
would take 2 seconds. To force the overflow at the
required one-second intervals, it is necessary to pre-
load it; th e simplest method is to set the MSb of TMR1H
with a BSF instruction. Note that the TMR1L register is
never preloaded or altered; doing so may introduce
cumulative error over man y cycles.
For this method to be accurate, Timer1 must operate in
Asynchrono us mode and the Timer1 overflow int errupt
must be enabled (PIE1<0> = 1) as shown in the routine,
RTCinit. The Ti mer1 oscillator must also be enable d
and running at all times.
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EXAMPLE 7-3: IMPLEMENTING A REAL-TIME CLOCK USING A TIMER1 INTERRUPT SERVICE
TABLE 7-2: REGISTERS ASSOCIATED WITH TIMER1 AS A TIMER/COUNTER
RTCinit BANKSEL TMR1H
MOVLW 0x80 ; Preload TMR1 register pair
MOVWF TMR1H ; for 1 second overflow
CLRF TMR1L
MOVLW b’00001111’ ; Configure for external clock,
MOVWF T1CON ; Asynchronous operation, external oscillator
CLRF secs ; Initialize timekeeping registers
CLRF mins
MOVLW .12
MOVWF hours
BANKSEL PIE1
BSF PIE1, TMR1IE ; Enable Timer1 interrupt
RETURN
RTCisr BANKSEL TMR1H
BSF TMR1H, 7 ; Preload for 1 sec overflow
BCF PIR1, TMR1IF ; Clear interrupt flag
INCF secs, F ; Increment seconds
MOVF secs, w
SUBLW .60
BTFSS STATUS, Z ; 60 seconds elapsed?
RETURN ; No, done
CLRF seconds ; Clear seconds
INCF mins, f ; Increment minutes
MOVF mins, w
SUBLW .60
BTFSS STATUS, Z ; 60 seconds elapsed?
RETURN ; No, done
CLRF mins ; Clear minutes
INCF hours, f ; Increment hours
MOVF hours, w
SUBLW .24
BTFSS STATUS, Z ; 24 hours elapsed?
RETURN ; No, done
CLRF hours ; Clear hours
RETURN ; Done
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
0Bh,8Bh,
10Bh,18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 —ADIF — — SSPIF CCP1IF TMR2IF TMR1IF -0-- 0000 -0-- 0000
8Ch PIE1 —ADIE — — SSPIE CCP1IE TMR2IE TMR1IE -0-- 0000 -0-- 0000
0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
10h T1CON —— T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu
Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module.
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8.0 TIMER2 MODULE
Timer2 is an 8-bit timer with a prescaler and a
post scaler . It can be used as the PWM tim e base for the
PWM mod e of the C CP1 modul e. The TMR 2 regist er is
readable and writable and is cleared on any device
Reset.
The in put cloc k (FOSC/4) has a prescale option of 1:1,
1:4 or 1:16, selected by control bits,
T2CKPS1:T2CKPS0 (T2CON<1: 0>).
The Timer2 module has an 8-bit period register, PR2.
Timer2 increments from 00h until it matches PR2 and
then resets to 00h on the next increment cycle. PR2 is
a readable and writable register. The PR2 register is
initialized to FFh upon Reset.
The match output of TMR2 goes through a 4-bit
postscaler (which gives a 1:1 to 1:16 scaling inclusive)
to generate a TMR2 interrupt (latched in flag bit,
TMR2IF (PIR1<1>)).
T imer2 can b e shut-of f by clearing control bit, T MR2ON
(T2CON<2> ), to minimize power consumption.
Register 8-1 shows the Timer2 Control register.
Additional information on timer modules is available in
the “PIC® Mid-Range MCU Family Reference Manual”
(DS33023).
8.1 Timer2 Prescaler and Postscaler
The prescaler and postscaler counters are cleared
when any of the following occurs:
• A write to the TMR2 register
• A write to the T2CON register
• Any devic e R ese t (P ower-o n Re se t, MCL R, WDT
Reset or Brown-out Reset)
TMR2 is not cleared when T2CON is written.
8.2 Output of TMR2
The output of TMR2 (before the postscaler) is fed to the
Synchron ous Seria l Port m odu le whi ch op tio nal ly use s
it to generat e a shif t clo ck .
FIGURE 8-1: TIMER2 BLOCK DIAGRAM
Comparator
TMR2
Sets Flag
TMR2 reg
Output(1)
Reset
Postscaler
Prescaler
PR2 reg
2
FOSC/4
1:1 1:16
1:1, 1:4, 1: 1 6
EQ
4
bit TMR2IF
Note 1: TMR2 register output can be sof tware
selected by the SSP module as a baud clock.
to
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DS39598F-page 64 2001-2013 Microchip Technology Inc.
REGISTER 8-1: T2CON: TIMER2 CONTROL REGISTER (ADDRESS 12h)
TABLE 8-1: REGISTERS ASSOCIATED WITH TIMER2 AS A TIMER/COUNTER
U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
— TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0
bit 7 bit 0
bit 7 Unimplemented: Read as ‘0’
bit 6-3 TOUTPS3:TOUTPS0: Timer2 Output Postscale Select bits
0000 =1:1 Postscale
0001 =1:2 Postscale
0010 =1:3 Postscale
•
•
•
1111 =1:16 Postscale
bit 2 TMR2ON: Timer2 On bit
1 = Timer2 is on
0 = Timer2 is off
bit 1-0 T2CKPS1:T2CKPS0: Timer2 Clock Prescale Select bits
00 = Prescaler is 1
01 = Prescaler is 4
1x = Prescaler is 16
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Add r e s s N a m e Bit 7 Bit 6 Bit 5 Bi t 4 B it 3 B it 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
0Bh, 8Bh,
10Bh, 18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 —ADIF — — SSPIF CCP1IF TMR2IF TMR1IF -0-- 0000 -0-- 0000
8Ch PIE1 —ADIE — — SSPIE CCP1IE TMR2IE TMR1IE -0-- 0000 -0-- 0000
11h TMR2 Timer2 Module Register 0000 0000 0000 0000
12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
92h PR2 Timer2 Period Register 1111 1111 1111 1111
Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the Timer2 module.
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9.0 CAPTURE/COMPARE/PWM
(CCP) MODULE
The Cap ture /C ompare/PW M (CC P) m od ule co ntains a
16-bit register that can operate as a:
• 16-bit Capture register
• 16-bit Compare register
• PWM Master/Slave Duty Cycl e register
Table 9-1 shows the timer resources of the CCP
module modes.
Capture/Compare/PWM Register 1 (CCPR1) is com-
prised of two 8-bit registers: CCPR1L (low byte) and
CCPR1H (high byte). The CCP1CON register controls
the operation of CCP1. The special event trigger is
generate d by a comp are match w hich will reset T i mer1
and start an A/D conversion (if the A/D module is
enabled).
The CCP module’s input/output pin (CCP1) can be
configu red as RB2 or RB3. T his selec tion is s et in bit 1 2
(CCPMX) of the Configuration Word register.
Additional information on the CCP module is available
in th e “PIC® Mid-Range MCU Family Reference Man-
ual” (DS3 302 3) a nd in Applica tion Note AN594, “Using
the CCP Module(s)” (DS00594).
TABLE 9-1: CCP MODE – TIMER
RESOURCE
REGISTER 9-1: CCP1CON: CAPTURE/COMPARE/PWM CONTROL REGISTER 1 (ADDRESS 17h)
CCP Mode Timer Resource
Capture
Compare
PWM
Timer1
Timer1
Timer2
U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
—— CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0
bit 7 bit 0
bit 7-6 Unimplemented: Read as ‘0’
bit 5-4 CCP1X:CCP1Y: PWM Least Significant bits
Capture mo de:
Unused.
Compare mode:
Unused.
PWM mode:
These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPRxL.
bit 3-0 CCP1M3:CCP1M0: CCP1 Mode Select bits
0000 = Capture/Compare/PWM disabled (resets CCP1 module)
0100 = Capture mode, every falling edge
0101 = Capture mode, every rising edge
0110 = Capture mode, every 4th rising edge
0111 = Capture mode, every 16th rising edge
1000 = Compare mode, set output on match (CCP1IF bit is set)
1001 = Compare mode, clear output on match (CCP1I F bit is set)
1010 = Compare mode, generate software interrupt on match (CCP1IF bit is set, CCP1 pin is
unaffected)
1011 = Compare mode, trigger special event (CCP1IF bit is set, CCP1 pin is unaffected);
CCP1 resets TMR1 and starts an A/D conversion (if A/D module is enabled)
11xx =PWM mode
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
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DS39598F-page 66 2001-2013 Microchip Technology Inc.
9.1 Capture Mode
In Capture mode, CCPR1H:CCPR1L captures the
16-bit val ue of the TMR1 register when an event occurs
on the CCP1 pin. An event is defined as:
• Every falling edge
• Every rising edge
• Every 4th rising edge
• Every 16th rising edge
An even t is sel ected by c ontrol bit s, CCP1 M3:CCP1M 0
(CCP1CON<3:0>). When a capture is made, the inter-
rupt request flag bit, CCP1IF (PIR1<2>), is set. It must
be cle ared in so ftware. If a nother captu re occurs b efore
the value in register CCPR1 is read, the old captured
value is overwritten by the new captured value.
9.1.1 CCP PIN CONFIGURATION
In Capture mode, the CCP1 pin should be configured
as an input by setting the TRISB<x> bit.
FIGURE 9-1: CAPTURE MODE
OPERATION BLOCK
DIAGRAM
9.1.2 TIMER1 MODE SELECTION
Timer1 must be running in Timer mode or Synchro-
nized Counter mode for the CCP module to use the
capture feature. In Asynchronous Counter mode, the
capture operation may not work.
9.1.3 SOFTWARE INTERRUPT
When the Capture mode is changed, a false capture
interrupt may be generated. The user should keep bit,
CCP1IE (PIE1<2>), clear to avoid false interrupts and
should clear the flag bit, CCP1IF, following any such
change in ope rati ng mod e.
9.1.4 CCP PRESCALER
There are four prescaler settings specified by bits
CCP1M3:CCP1M0. Whenever the CCP module is
turned off, or the CCP module is not in Capture mode,
the prescaler counter is cleared. This means that any
Reset will clear the prescaler counter.
Switching from one capture prescaler to another may
generate an interrupt. Also, the prescaler counter will
not be cleared; there fore, the first capture ma y be from
a non-zero prescaler. Example 9-1 shows the
recommended method for switching between capture
prescalers. This example also clears the prescaler
counter and will not generate the “false” interrupt.
EXAMPLE 9-1: CHANGING BETWEEN
CAPTURE PRESCALERS
Note 1: If the CCP1 pin is configured as an
output, a write to the port can cause a
capture co ndition.
2: The TR ISB b it (2 o r 3 ) is d ependent upon
the setting of configuration bit 12
(CCPMX).
CCPR1H CCPR1L
TMR1H TMR1L
Set Flag bit CCP1IF
(PIR1<2>)
Capture
Enable
Q’s CCP1CON<3:0>
CCP1 pin
Prescaler
1, 4, 16
and
Edge Dete ct
CLRF CCP1CON ;Turn CCP module off
MOVLW NEW_CAPT_PS ;Load the W reg with
;the new prescaler
;move value and CCP ON
MOVWF CCP1CON ;Load CCP1CON with this
;value
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9.2 Compare Mode
In C ompare mo de, t he 16 -bit CC PR1 r egist er va lue is
constantly compared against the TMR1 register pair
value. When a match occurs, the CCP1 pin is:
• Driven high
•Driven low
• Remains unchanged
The action on the pin is based on the value of control
bits, CCP1M3:CCP1M0 (CCP1CON<3:0>). At the
same time, interrupt flag bit CCP1IF is set.
FIGURE 9-2: COMPARE MODE
OPERATION BLOCK
DIAGRAM
9.2.1 CCP PIN CONFIGURATION
The user m us t co nfig ure t he CC P1 p in a s an outp ut b y
clearing the TRISB<x> bit.
9.2.2 TIMER1 MODE SELECTION
Timer1 must be running in Timer mode or Synchro-
nized Counter mode if the CCP module is using the
compare feature. In Asynchronous Counter mode, the
compare operation may not work.
9.2.3 SOFTWARE INTERRUPT MODE
When gen erat e sof tware i nte rrupt is chosen, the CCP1
pin is not af fected. On ly a CCP interrupt is generated (if
enabled).
9.2.4 SPECIAL EVEN T TRIGGER
In this mode, an internal hardware trigger is generated
that may be used to initiate an action.
The special event trigger output of CCP1 resets the
TMR1 re gist e r p ai r and starts an A/D co nv ersi on (if th e
A/D module is enabled). This allows the CCPR1
register to effectively be a 16-bit programmable period
register for Timer1.
TABLE 9-2: REGISTERS ASSOCIATED WITH CAPTURE, COMPARE AND TIMER1
CCPR1H CCPR1L
TMR1H TMR1L
Comparator
QS
ROutput
Logic
Special Event T rigger
Set Flag bit CCP1IF
(PIR1<2>)
Match
CCP1 pin
TRISB<x> CCP1CON<3:0>
Mode Select
Output Enable
Special event trigger will:
• Reset Timer1 but not set interrupt flag bit, TMR1IF
(PIR1<0>)
• Set GO/DONE bit (ADCON0<2>) which starts an A/D
conversion
Note 1: Clearing the CC P1CON regi ster will forc e
the CCP1 compare output latch to the
default low level. This is not the data
latch.
2: The TR ISB b it (2 o r 3) is dependent upo n
the setting of configuration bit 12
(CCPMX).
Note: The special event trigger from the CCP1
module will not set interrupt flag bit,
TMR1IF (PIR1<0>).
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value o n
POR, BOR
Value on
all other
Resets
0Bh,8Bh
10BH,18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 —ADIF — — SSPIF CCP1IF TMR2IF TMR1IF -0-- 0000 -0-- 0000
8Ch PIE1 —ADIE — — SSPIE CCP1IE TMR2IE TMR1IE -0-- 0000 -0-- 0000
86h TRISB PORTB Data Direction Register 1111 1111 1111 1111
0Eh TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
0Fh TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
10h T1CON —— T1CKPS1 T1CKPS0 T1OSCEN T1SYNC TMR1CS TMR1ON --00 0000 --uu uuuu
15h CCPR1L Capture/ Compare/PW M Regist er 1 (LSB) xxxx xxxx uuuu uuuu
16h CCPR1H Capt ure/ Compare/PW M Register 1 (MSB ) xxxx xxxx uuuu uuuu
17h CCP1CON — — CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000
Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by Capture and Timer1.
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9.3 PWM Mode
In Pulse -Width Modulati on (PWM) m ode, the CCP1 pin
produces up to a 10-bit resolution PWM output. Since
the CCP1 pin is multip lexed with the POR TB data latch,
the TRISB<x> bit must be cleared to make the CCP1
pin an out put.
Figure 9-3 shows a simplified block diagram of the
CCP module in PWM mode.
For a st ep by step pr ocedure on h ow to set up the CCP
module for PWM operation, see Section 9.3.3 “Setup
for PWM Operatio n”.
FIGURE 9-3: SIMPLIFIED PWM BLOCK
DIAGRAM
A PWM output (Figure 9-4) has a time base (period)
and a time that the output stays high (duty cycle). The
frequency of the PWM is the inverse of the period
(1/period).
FIGURE 9-4: PWM OUTPUT
9.3.1 PWM PERIO D
The PWM period is specified by writing to the PR2
register. The PWM period can be calculated using the
following formula.
EQUATION 9-1:
PWM frequency is defined as 1/[PWM period].
When TM R2 is equal to PR2, t he following three event s
occur on the next increment cycle:
•TMR2 is cleared
• The CCP1 pin is set (exception: if PWM duty
cycle = 0%, the CCP1 pin will not be set)
• The PWM duty cycle is latched from C CPR1L into
CCPR1H
9.3.2 PWM DUTY CYCLE
The PWM duty cycle is specified by writing to the
CCPR1L register and to the CCP1CON<5:4> bits. Up
to 10- b i t re so l uti on is av ai l ab le. T he CC PR 1L c on tai ns
the eight MSbs and the CCP1CON<5:4> contains the
two LSbs. This 10-bit value is represented by
CCPR1L:CCP1CON<5:4>. The following equation is
used to calculate the PWM duty cycle in time.
EQUATION 9-2:
CCPR1L and CCP1CON<5:4> can be written to a t any
time but the duty cycle value is not latched into
CCPR1H until after a match between PR2 and TMR2
occurs (i.e., the period is complete). In PWM mode,
CCPR1H is a read-only register.
The CCPR1H register and a 2-bit internal latch are
used to double-buffer the PWM duty cycle. This
double-buffering is essential for glitchless PWM
operation.
When the CCPR1H and 2-bit latch match TMR2,
concatenated with an internal 2-bit Q clock or 2 bits of
the TMR2 prescaler, the CCP1 pin is cleared.
Note: Clearing the CCP1CON register will force
the CCP1 PWM o utpu t la tch to th e de fau lt
low l evel. T his is not t he PO RTB I /O data
latch.
CCPR1L
CCPR1H (Slave)
Comparator
TMR2
Comparator
PR2
(Note 1)
RQ
S
Duty Cycle Registers CCP1CON<5:4>
Clear Timer,
CCP1 pin and
latch D.C.
TRISB<x>
CCP1 pin
Note 1: 8-bit timer is concatenated with 2-bit internal Q cl ock
or 2 bit s of the presca ler to create 10-bit time base.
Period
Duty Cycle
TMR2 = PR2
TMR2 = Duty Cycle
TMR2 = PR2
Note: The Timer2 postscaler (see Section 8.0
“Timer2 Module”) is not used in the
determination of the PWM frequency. The
postscaler could be used to have a servo
update rate at a different frequency than
the PWM output.
PWM Period = [(PR2) + 1] • 4 • TOSC •
(TMR2 Prescal e Value)
PWM Duty Cycle = (CCPR1L:CCP1CON<5:4>) •
TOSC • (TMR2 Prescale Value)
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The ma ximum P WM res olut ion (b its) fo r a giv en PWM
frequency is given by the following formula.
EQUATION 9-3:
9.3.3 SETUP FOR PWM OPERATION
The following steps should be taken when configuring
the CCP module for PWM operation:
1. Set the PWM period by wr iting to the PR2 register .
2. Set the PWM duty cycle by writing to the
CCPR1L register and CCP1CON<5:4> bits.
3. Make the CCP1 pin an output by clearing the
TRISB<x> bit.
4. Set the TMR2 prescale value and enable T imer2
by writing to T2CON.
5. Configure th e CCP1 module for PWM operation.
TABLE 9-3: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS AT 20 MHz
TABLE 9-4: REGISTERS ASSOCIATED WITH PWM AND TIMER2
Note: If the PWM duty cycle value is longer than
the PWM period, the CCP1 pin will not be
cleared.
log(FPWM
log(2)
FOSC )bits
=
Resolution
Note: The TRISB bit (2 or 3) is dependant upon
the setting of configuration bit 12
(CCPMX).
PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz
Timer Prescaler (1, 4, 16) 16 4 1 1 1 1
PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17
Maximum Resol ution (bits) 10 10 10 8 7 5.5
Ad d r ess Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
0Bh,8Bh
10Bh,18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 —ADIF — — SSPIF CCP1IF TMR2IF TMR1IF -0-- 0000 -0-- 0000
8Ch PIE1 —ADIE — — SSPIE CCP1IE TMR2IE TMR1IE -0-- 0000 -0-- 0000
86h TRISB PORTB Data Direction Register 1111 1111 1111 1111
11h T MR2 Timer2 Module Register 0000 0000 0000 0000
92h PR2 Ti mer2 Module Peri od Regist er 1111 1111 1111 1111
12h T2CON — TOUTPS3 TOUTPS2 TOUTPS1 TOUTPS0 TMR2ON T2CKPS1 T2CKPS0 -000 0000 -000 0000
15h CCPR1L C apture /Comp ar e/PWM Regi ster 1 (LSB) xxxx xxxx uuuu uuuu
16h CCPR1H Capt ure /Comp are/ PWM Regist er 1 (MSB) xxxx xxxx uuuu uuuu
17h CCP1CON —— CCP1X CCP1Y CCP1M3 CCP1M2 CCP1M1 CCP1M0 --00 0000 --00 0000
Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by PWM and Timer2.
PIC16F818/819
DS39598F-page 70 2001-2013 Microchip Technology Inc.
NOTES:
2001-2013 Microchip Technology Inc. DS39598F-page 71
PIC16F818/819
10.0 SYNCHRONOUS SERIAL PORT
(SSP) MODULE
10.1 SSP Module Overvi ew
The Synchronous Serial Port (SSP) module is a serial
interface useful for communicating with other periph-
eral or microcontroller devices. These peripheral
devices may be serial EEPROMs, shift registers,
display drivers, A/D converters, etc. The SSP module
can operate in one of two modes:
• Serial Peripheral Interface (SPI)
• Inter-Integrated Circuit (I2C)
An overview of I2C operations and additional informa-
tion on t he SSP module c an be fo und in the “PIC® Mid-
Range MCU Family Reference Manual” (DS33023).
Refer to Application Note AN578, “Use of the SSP
Module in the I2C™ Multi-Master Environment”
(DS00578).
10.2 SPI Mode
This section contains register definitions and
operational characteristics of the SPI module.
SPI mode allows 8 bits of data to be synchronously
transmitted and received simultaneously. To
accomplish communication, typically three pins are
used:
• Serial Data Out (SDO) RB2/SDO/ CCP1
• Serial Data In (SDI) RB1/SDI/SDA
• Serial Clock (SCK) RB4/SCK/SCL
Additionally, a fourth pin may be used when in a Slave
mode of operation:
• Slave Select (SS) RB5/SS
When initializing the SPI, several options need to be
specified. This is done by programming the appropriate
control bits in the SSPCON register (SSPCON<5:0>)
and the SSPSTAT register (SSPSTAT<7:6>). These
control bits allow the following to be specified:
• Master mode (SCK is the clock output)
• Slave mode (SCK is the clock input)
• Clock Polarity (Idle state of SCK)
• Clock Edge (output data on rising/falling
edge of SCK)
• Clock Rate (Master mode only)
• Slave Select mode (Slave mode only)
Note: Before enabling the module in SPI Slave
mode, the state of the clock line (SCK)
must match the polarity selected for the
Idle state. The clock line can be observed
by read ing the SCK pin. The pola rity of th e
Idle state is determined by the CKP bit
(SSPCON<4>).
PIC16F818/819
DS39598F-page 72 2001-2013 Microchip Technology Inc.
REGISTER 10-1: SSPSTAT: SYNCHRONOUS SERIAL PORT STATUS REGISTER (ADDRESS 94h)
R/W-0 R/W-0 R-0 R-0 R-0 R-0 R-0 R-0
SMP CKE D/A PSR/WUA BF
bit 7 bit 0
bit 7 SMP: SPI Data Input Sample Phase bit
SPI Master mode:
1 = Input data sampled at end of data output time
0 = Input data sampled at middle of data output time (Microwire)
SPI Slave mode:
This bit must be cleared when SPI is used in Slave mode.
I2 C mode:
This bit must be maintained clear.
bit 6 CKE: SPI Clock Edge Select bit
1 = Transmit occurs on transition from active to Idle clock state
0 = Transmit occurs on transition from Idle to active clock state
Note: Polarity of clock state is set by the CKP bit (SSPCON<4>).
I2 C mode:
This bit must be maintained clear.
bit 5 D/A: Data/Address bit (I2C mode only)
In I2 C Slave mode:
1 = Indicates that the last byte received was data
0 = Indicates that the last byte received was address
bit 4 P: Stop bit(1) (I2C mode only)
1 = Indicates that a Stop bit has been detected last
0 = Stop bit was not detected last
bit 3 S: Start bit(1) (I2C mode only)
1 = Indicates that a Start bit has been detected last (this bit is ‘0’ on Reset)
0 = Start bit was not detected last
bit 2 R/W: Read/Write Information bit (I2C mode only)
Holds the R/W bit information following the last address match and is only valid from address
match to the next Start bit, Stop bit or ACK bit.
1 =Read
0 = Write
bit 1 UA: Update Address bit (10-bit I2C mode only)
1 = Indicates that the user needs to update the address in the SSPADD register
0 = Address does not need to be updated
bit 0 BF: Buffer Full Status bit
Receive (SPI and I2 C modes):
1 = Receive complete, SSPBUF is full
0 = Receive not complete, SSPBUF is empty
Tra nsmit (In I2 C mode onl y):
1 = Transmit in progress, SSPBUF is full (8 bits)
0 = Transmit complete, SSPBUF is empty
Note 1: This bit is cl eared when the SSP module is dis abled (i.e., th e SSPEN bit is cleared) .
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
2001-2013 Microchip Technology Inc. DS39598F-page 73
PIC16F818/819
REGISTER 10-2: SSPCON: SYNCHRONOUS SERIAL PORT CONTROL REGISTER 1 (ADDRESS 14h)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0
WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0
bit 7 bit 0
bit 7 WCOL: Write Collision Detect bit
1 = An attempt to write the SSPBUF register failed because the SSP module is busy
(must be cleared in software)
0 = No collision
bit 6 SSPOV: Receive Overflow Indicator bit
In SPI mode:
1 = A ne w byte is rec eive d while t he SSPBUF regi ster is st ill hol ding t he prev ious d ata . In case
of overflow, the data in SSPSR is lost. Overflow can only occur in Slave mode. The user
must read the SSPBUF, even if only transmitting data, to avoid setting overflow. In Master
mode, the o verflow bi t is not set sinc e each new rec eption (and transmi ssion) is ini tiated b y
writing to the SSPBUF register.
0 = No overflow
In I2 C mode:
1 = A byt e is received wh ile the SSPBUF reg ister is stil l holdin g the previous byte. SSPOV is a
“don’t care” in Transmit mode. SSPOV must be cleared in software in either mode.
0 = No overflow
bit 5 SSPEN: Synchronous Serial Port Enable bit(1)
In SPI mode:
1 = Enables serial port and configures SCK, SDO and SDI as serial port pins
0 = Disables serial port and configures these pins as I/O port pi ns
In I2 C mode:
1 = Enables the serial port and configures the SDA and SCL pins as serial port pins
0 = Disables serial port and configures these pins as I/O port pi ns
Note 1: In both modes, when enabled, these pins must be properly configured as input or
output.
bit 4 CKP: Clock Polarity Select bit
In SPI mode:
1 = T rans mit ha ppens on fallin g edge, re ceive on risin g edge. Id le st ate for cl ock is a high le vel.
0 = Transmit happens on rising edge, receive on falling edge. Idle state for clock is a low level.
In I2 C Sl ave mode:
SCK release control.
1 = Enable clock
0 = Holds clock low (clock stretch). (Used to ensure data setup time.)
bit 3-0 SSPM<3:0>: Synchronous Serial Port Mode Select bits
0000 = SPI Master mode, clock = OSC/4
0001 = SPI Master mode, clock = OSC/16
0010 = SPI Master mode, clock = OSC/64
0011 = SPI Master mode, clock = TMR2 output/2
0100 = SPI Slave mode, clock = SCK pin. SS pin control enabled.
0101 = SPI Slave mode, clock = SCK pin. SS pin control disabled. SS can be used as I/O pin.
0110 =I
2C Slave mode, 7-bit address
0111 =I
2C Slave mode, 10-bit address
1011 =I
2C Firmware Controlled Master mode (Slave Idle)
1110 =I
2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled
1111 =I
2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled
1000, 1001, 1010, 1100, 1101 = Reserved
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
PIC16F818/819
DS39598F-page 74 2001-2013 Microchip Technology Inc.
FIGURE 10-1: SSP BLOCK DIAGRAM
(SPI MODE) To enable the serial port, SSP Enable bit, SSPEN
(SSPCON<5>), must be set. To reset or reconfigure
SPI mode, clear bit SSPEN, reinitialize the SSPCON
register and then set bit SSPEN. This configures the
SDI, SDO, SCK and SS pins as serial port pins. Fo r the
pins to behave as the serial port function, they must
have their data direction bits (in the TRISB register)
appropriately programmed. That is:
• SDI must have TRISB<1> set
• SDO must have TRISB<2> cleared
• SCK (Master mode) must have TRISB<4> cleared
• SCK (Slave mode) must have TRISB<4> set
•SS
must have TRISB<5> set
TABLE 10-1: REGISTERS ASSOCIATED WITH SPI OPERATION
Read Write
Internal
Data Bus
RB1/SDI/SDA
RB2/SDO/
RB5/SS
RB4/SCK/
SSPSR reg
SSPBUF reg
SSPM3:SSPM0
bit 0 Shift
Clock
SS Control
Enable
Edge
Select
Clock Select
TMR2 Output
TCY
Prescaler
4, 16, 64
TRISB<4>
2
Edge
Select
2
4
SCL
CCP1
Note 1: When the SPI is in Slave mode
with the SS pin control enabled
(SSPCON<3:0> = 0100), the SPI module
will reset if the SS pin is set to VDD.
2: If the SPI is used in Slave mode with
CKE = 1, then the SS pin control must be
enabled.
3: When the SPI is in Slave mode
with the SS pin control enabled
(SSPCON<3:0> = 0100), the state of the
SS pin can a ffect the st a te re ad back from
the TRISB<2> bit. The peripheral OE
signal from the SSP module into PORTB
controls the state that is read back from
the TRISB<2> bit. If read-modify-write
instructions, such as BSF are performed
on the TRISB register while the SS pin is
high, this will cause the TRISB<2> bit to
be set, thus disabling the SDO output.
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
0Bh,8Bh
10Bh,18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 —ADIF —— SSPIF CCP1IF TMR2IF TMR1IF -0-- 0000 -0-- 0000
8Ch PIE1 —ADIE ——SSPIECCP1IE TMR2IE TMR1IE -0-- 0000 -0-- 0000
86h TRISB PORTB Data Direction Register 1111 1111 1111 1111
13h SSPB UF Synch ronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu
14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000
94h SSPSTAT SMP CKE D/A P S R/W UA BF 0000 0000 0000 0000
Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used by the SSP in SPI mode.
2001-2013 Microchip Technology Inc. DS39598F-page 75
PIC16F818/819
FIGURE 10-2: SPI MODE TIMING, MASTER MODE
FIGURE 10-3: SPI MODE TIMING (SLAVE MODE WITH CKE = 0)
FIGURE 10-4: SPI MODE TIMING (SLAVE MODE WITH CKE = 1)
SCK (CKP = 0,
SDI (SMP = 0)
SSPIF
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
SDI (SMP = 1)
SCK (CKP = 0,
SCK (CKP = 1,
SCK (CKP = 1,
SDO
bit 7
bit 7 bit 0
bit 0
CKE = 0)
CKE = 1)
CKE = 0)
CKE = 1)
SCK (CKP = 0)
SDI (SMP = 0)
SSPIF
bit 7 b i t 6 bit 5 bit 4 bit 3 bit 2 bi t 1 bit 0
SCK (CKP = 1)
SDO
bit 7 bit 0
SS (Optional)
SCK (CKP = 0)
SDI (SMP = 0)
SSPIF
bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 b it 0
SCK (CKP = 1)
SDO
bit 7 bit 0
SS
PIC16F818/819
DS39598F-page 76 2001-2013 Microchip Technology Inc.
10.3 SSP I 2C Mode Operation
The SSP module in I2C mode full y implemen ts all s lave
functions, except general call support and provides
inter rupts on S ta rt and S top bit s in hardware to fac ilitate
firmwa re im ple me nt a tion s of the master functio ns . The
SSP module implements the standard mode
specifications, as well as 7-bit and 10-bit addressing.
Two pins are used for data transfer. These are the
RB4/SCK/SCL pin, which is the clock (SCL) and the
RB1/SDI/SDA pin, which is the data (SDA). The user
must configure these pins as inputs or outputs through
the TRISB<4,1> bits.
To ensure proper communication of the I 2C Slave mode,
the TRIS bits (TRISx [SDA, SCL]) corresponding to the
I2C pin s must be set to ‘1’. If any TRIS bits (TRISx<7:0>)
of the port containing the I2C pins (PORTx [SDA, SCL])
are changed in software during I2C communication
using a Read-Modify-Write instruction (BSF, BCF), then
the I2C mode may stop functioning properly and I2C
communication m ay suspend . Do not chan ge any of the
TRISx bits (TRIS bits of the port cont aining the I2C pins)
using the instruction BSF or BCF during I2C comm unica-
tion. If it is absolutely necessary to change the TRISx
bits during communication, the following method can be
used:
EXAMPL E 10-1:
The SSP mod ule fun ctions a re enabl ed by settin g SSP
Enable bit, SSPEN (SSPCON<5>).
FIGURE 10-5: SSP BLOCK DIAGRAM
(I2C™ MODE)
The SSP module has five registers for I2C operation:
• SSP Control Register (SSPCON)
• SSP Status Register (SSPSTAT)
• Serial Receive/Transmit Buffer (SSPBUF)
• SSP Shift Register (SSPSR) – Not directly
accessible
• SSP Address Register (SSPADD)
The SSPCON register allows control of the I2C opera-
tion. Four mode selection bits (SSPCON<3:0>) allow
one of the following I2C modes to be selected:
•I
2C Slave mode (7-bit address)
•I
2C Slave mode (10-bit address)
•I
2C Slave mode (7-bit address) with Start and
Stop bit interrupts enabled to support Firmware
Master mode
•I
2C Slave mode (10-bit address) with Start and
Stop bit interrupts enabled to support Firmware
Master mode
•I
2C Firmware Controlled Master mode with Start
and Stop bit interrupts enabled, slave is Idle
Selection of any I2C mode, with the SSPEN bit set,
forces the SCL and SDA pins to be open-drain,
provided these pins are programmed to inputs by
setting the appropriate TRISB bits. Pull-up resistors
must be provided externally to the SCL and SDA pins
for proper operation of the I2C module.
Additional information on SSP I2C operation may be
found in the “PIC® M id-Range M CU Fami ly Reference
Manual” (DS33023).
MOVF TRISC, W ; Example for an 18-pin part such as the PIC16F818/819
IORLW 0x18 ; Ensures <4:3> bits are ‘11’
ANDLW B’11111001’ ; Sets <2:1> as output, but will not alter other bits
; User can use their own logic here, such as IORLW, XORLW and ANDLW
MOVWF TRISC
Read Write
SSPSR Reg
Match Detect
SSPADD Reg
Start and
Stop Bit Detect
SSPBUF R eg
Internal
Data Bus
Addr Match
Set, Reset
S, P Bits
(SSPSTAT Reg)
RB4/SCK/
RB1/
Shift
Clock
MSb
SDI/ LSb
SDA
SCL
2001-2013 Microchip Technology Inc. DS39598F-page 77
PIC16F818/819
10.3.1 SLAVE MODE
In Slave mod e, the SCL and SDA pins mu st be co nfi g-
ured as in puts (TRISB<4,1> set). The SSP modu le wil l
override the input state with the output data when
required (sl ave-tra nsmit ter).
When an add ress is matched, or the data transfer af ter
an add res s mat ch i s rece ived , th e ha rdw are au tom ati -
cally will generate the Acknowledge (ACK) pulse and
then loa d the SSPBUF re gis ter with the received v alu e
currently in the SSPSR register.
Either or both of the following conditions will cause the
SSP module not to give this ACK pulse:
a) The Buffer Full bit, BF (SSPSTAT<0>), was set
before the transfer was received.
b) The overflow bit, SSPOV (SSPCON<6>), was
set before the transfer was received.
In this case, the SSPSR register value is not loaded
into the SSPBUF but bit, SSPIF (PIR1<3>), is set.
Table 10-2 shows what happens when a data transfer
byte is received, given the status of bits BF and
SSPOV. The shaded cells show the condition where
user s oftw are d id no t prope rly c lear th e ove rflow cond i-
tion. Flag bit BF is cleared by reading the SSPBUF
register while bit SSPOV is cleared through software.
The SCL clock input must have a minimum high and
low fo r pro per op eration. The high and l ow ti me s o f th e
I2C specification, as well as the requirement of the SSP
module, are shown in timing parameter #100 and
parameter #101.
10.3.1.1 Addressing
Once the SSP module has been enabled, it waits for a
Start condition to occur. Following the Start condition,
the eight bits are shifted into the SSPSR register. All
incoming bits are sampled with the rising edge of the
clock (SCL) line. The value of register SSPSR<7:1> is
compared to the value of the SSPADD register. The
address is compared on the falling edge of the eighth
clock (SCL) pulse. If the addresses match and the BF
and SSPOV bits are clear, the following events occur:
a) The SSPSR register value is loaded into the
SSPBUF register.
b) The Buffer Full bit, BF, is set.
c) An ACK pulse is generated.
d) SSP Interrupt Flag bit, SSPIF (PIR1<3>), is set
(interrupt is generated if enabled) – on the falling
edge of the ninth SCL pulse.
In 10-bit Address mode, two address bytes need to be
received by the slave device. The five Most Significant
bits (MSbs) of the first address byte specify if this is a
10-bit address. Bit R/W (SSPSTAT <2>) must specify a
write so the slave device will receive the second
address by te. Fo r a 10 -bi t add res s, t he fi rst byt e woul d
equal ‘1111 0 A9 A8 0’, where A9 and A8 are the
two MSbs of the address.
The sequence of events for 10-bit address is as
follows, with ste p s 7-9 for slave -tran sm itt er:
1. Receive first (high) byte of address (bits SSPIF,
BF and bit UA (SSPSTAT<1>) are set).
2. Update the SSPADD register with second (low)
byte of address (clears bit UA and releases the
SCL line).
3. Read the SSPBUF register (clears bit BF) and
clear flag bit, SSPIF.
4. Receive second (low) byte of address (bits
SSPIF, BF and UA are set).
5. Update t he SSPADD registe r with the f irst (high)
byte of a ddre ss ; if match rele as es SCL li ne, this
will clear bit UA .
6. Read the SSPBUF register (clears bit BF) and
clear flag bit, SSPIF.
7. Receive Repeated Start condition.
8. Receive first (high) byte of address (bits SSPIF
and BF are set).
9. Read the SSPBUF register (clears bit BF) and
clear flag bit, SSPIF.
10.3.1.2 Reception
When the R/W bi t of the addres s byte i s clea r and an
address match occurs, the R/W bit of the SSPSTAT
register i s cleared . Th e receive d addre ss is loa ded in to
the SSPBUF register.
When the address byte overflow condition exists, then
a no Acknowledge (ACK) pulse is given. An overflow
conditi on is in dicated if ei ther bit, BF (SSPSTAT<0>), is
set or bit, SSPOV (SSPCON<6>), is set.
An SSP interrupt is generated for each data transfer
byte. Flag bit, SSPIF (PIR1<3>), must be cleared in
software. The SSPSTAT register is used to determine
the status of the byte.
10.3.1.3 Transmission
When the R/W bit of the incoming address byte is set
and an address match occurs, the R/W bit of the
SSPSTAT register is set. The received address is
loaded into the SSPBUF register. The ACK pulse will
be sent on the ninth bit and pin RB4/SCK/SCL is held
low. The transmit data must be loaded into the
SSPBUF registe r which also load s the SSPSR register .
Then pin RB4/SCK/SCL should be enabled by setting
bit, CKP (SSPCON<4>). The master device must
monitor the SCL pin prior to asserting another clock
pulse. T he slave devices may be h olding of f th e master
device by stretching the clock. The eight data bits are
shifted out on the falling edge of the SCL input. This
ensures that the SDA signal is valid during the SCL
high time (Figure 10-7).
PIC16F818/819
DS39598F-page 78 2001-2013 Microchip Technology Inc.
An SSP interrupt is generated for each data transfer
byte. Flag bit SSPIF must be cleared in software and
the SSPSTAT register is used to determine the status
of the byte. Flag bit SSPIF is set on the falling edge of
the ninth clock pulse.
As a s lave-t r ansm itte r, the AC K puls e from the mas ter-
receiver is latched on the rising edge of the ninth SCL
input pulse. If the SDA line was high (not ACK), then
the dat a tran sfer is com plete. When th e ACK is latched
by the slave device, the slave logic is reset (resets
SSPSTAT register) and the slav e de vice then monitors
for another occurrence of the Start bit. If the SDA line
was low (ACK), the transmit data must be loaded into
the SSPBUF register which also loads the SSPSR
register. Then pin RB4/SCK/ SCL should be enabled b y
setting bit , CKP.
TABLE 10-2: DATA TRANSFER RECEIVED BYTE ACTIONS
FIGURE 10-6: I2C™ WAVEFORMS FOR RECEPTION (7-BIT ADDRESS)
FIGURE 10-7: I2C™ WAVEFORMS FOR TRANSMISSION (7-BIT ADDRESS)
Status Bits as Data
Transfer is Received SSPSR SSPBUF Generate ACK Pulse Set bit SSPIF
(SSP interrupt occurs if enabled)
BF SSPOV
00 Yes Yes Yes
10 No No Yes
11 No No Yes
0 1 No No Yes
Note 1: Shaded cells show the conditions where the user software did not properly clear the overflow condition.
P
9
8
7
6
5
D0
D1
D2
D3D4D5
D6D7
S
A7 A6 A5 A4 A3 A2 A1SDA
SCL 123456789123456789123
4
Bus master
terminates
transfer
Bit SSPOV is set because the SSPBUF register is still full
Cleared in software
SSPBUF register is read
ACK Receiving Data
Receiving Data D0
D1
D2
D3D4
D5
D6D7
ACK
R/W = 0
Receiving Address
SSPIF (PIR 1<3>)
BF (SSPSTAT<0>)
SSPOV (SSPCON<6>)
ACK
ACK is not sent
SDA
SCL
SSPIF (PIR1<3>)
BF (SSPSTAT<0>)
CKP (SSPCON<4>)
A7 A6 A5 A4 A3 A2 A1 ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK
Transmitting DataR/W = 1Receiving Ad dr ess
123456789 123456789 P
Cleared in software
SSPBUF is written in software
Set bit after writing to SSPBUF
SData is
Sampled
(the SSPBUF must be written to
before the CKP bit can be set)
From SSP Interrupt
Service R out i ne
SCL held low
while CPU
responds to SSPIF
2001-2013 Microchip Technology Inc. DS39598F-page 79
PIC16F818/819
10.3.2 MASTER MODE OPERATION
Master mode operation is supported in firmware using
interrupt generation on the detection of the Start and
Stop conditions. The Stop (P) and Start (S) bits are
cleared from a Reset or when the SSP module is dis-
abled. The Stop (P) and Start (S) bits will toggle based
on the Start and S top conditions. Control of the I2C bus
may be taken when the P bit is set or the bus is Idle and
both the S and P bits are clear.
In Master mode operation, the SCL and SDA lines are
manipulated in firmware by clearing the corresponding
TRISB<4,1> bit(s). The output level is always low,
irrespective of the value(s) in PORTB<4,1>. So when
transmitting data, a ‘1’ data bit must have the
TRISB<1> bit set (input) and a ‘0’ data bit must have
the TRISB<1> bit cleared (output). The same scenario
is tru e for the S CL line wit h the TRISB <4> bit . Pull-up
resistors must be provided externally to the SCL and
SDA pins for proper operation of the I2C module.
The following events will cause the SSP Interrupt Flag
bit, SSPIF, to be set (SSP interrupt if enabled):
• Start condition
• Stop condition
• Data transfer byte transmitted/received
Master mode operation can be done with either the
Slave mode Idle (SSPM3:SSPM0 = 1011) or with the
Slave m ode ac tiv e. W he n bo th M as ter mode operation
and Slave modes are used, the software needs to
differentiate the source(s) of the interrupt.
For more information on Master mode operation, see
AN554, “Software Implementation of I2C™ Bus
Master” (DS00554).
10.3.3 MULTI-MASTER MODE OPERATION
In Multi-Master mode operation, the interrupt genera-
tion on the detection of the Start and Stop conditions
allows the determination of when the bus is free. The
Stop (P) and Start (S) bits are cleared from a Reset or
when the SSP module is disabled. The Stop (P) and
Start (S) bits will toggle based on the Start and Stop
conditions. Control of the I 2C bus ma y be taken wh en
bit P (SSPSTAT<4>) is set or the bus is Idle and both
the S and P b its cl ear. When th e bu s is b us y, ena bl i ng
the SSP interrupt will generate the interrupt when the
Stop condition occurs.
In Mul ti -Mast er mode o per atio n, t he SD A li ne m ust be
monitored to see if the signal level is the expected
output level. This check only needs to be done when a
high lev el is output. If a high level is expec ted and a low
level is present, the device needs to release the SDA
and SCL l ines (set T RISB<4, 1>). There are two sta ges
where this arbitration can be lost:
• Address Transfer
• Data Transfer
When the slave logic is enabled, the Slave device
continues to receive. If arbitration was lost during the
address transfer stage, communication to the device
may be in progr ess. If addres sed, a n ACK puls e wi ll be
generated. If arbitration was lost during the data
transfer stage, the device will need to retransfer the
data at a lat er time.
For more information on Multi-Master mode operation,
see AN578, “Use of the SSP Module in the I2C™
Multi-Master Environment” (DS00578).
TABLE 10-3: REGISTERS ASSOCIATED WITH I2C™ OPERATION
Add r e s s N a m e Bi t 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
0Bh, 8Bh,
10Bh,18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 —ADIF ——SSPIFCCP1IF TMR2IF TMR1IF -0-- 0000 -0-- 0000
8Ch PIE1 —ADIE —— SSPIE CCP1IE TMR2IE TMR1IE -0-- 0000 -0-- 0000
13h SSPBUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu
93h SSPADD Synchronous Serial Port (I2C™ mode) Address Regist er 0000 0000 0000 0000
14h SSPCON WCOL SSPOV SSPEN CKP SSPM3 SSPM2 SSPM1 SSPM0 0000 0000 0000 0000
94h SSPSTAT SMP(1) CKE(1) D/A PSR/WUA BF 0000 0000 0000 0000
86h TRISB PORTB Data Direction Register 1111 1111 1111 1111
Legend: x = unknown, u = unchanged, - = unimplemented locations read as ‘0’.
Shaded cells are not used by SSP module in SPI mode.
Note 1: Maintain these bits clear in I2C mode.
PIC16F818/819
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NOTES:
2001-2013 Microchip Technology Inc. DS39598F-page 81
PIC16F818/819
11.0 ANALOG-TO-DIGITAL
CONVERTER (A/D) MODULE
The Analog-to-Digital (A/D) converter module has five
inputs for 18/20 pin devices.
The conversion of an analog input signal results in a
corresponding 10-bit digital number. The A/D module
has a high and low-voltage reference input that is
softw are se lec table to so me c ombi nati on o f VDD, VSS,
RA2 or RA3.
The A/D converter has a unique feature of being able
to operate while the device is in Sleep mode. To oper-
ate in Sleep, th e A/D conv ersion clock mu st b e derive d
from the A/D’s internal RC oscillator.
The A/D module has four registers:
• A/D Result High Register (ADRESH)
• A/D Result Low Register (ADRESL)
• A/D Control Register 0 (ADCON0)
• A/D Control Register 1 (ADCON1)
The ADCON0 register, shown in Register 11-1,
controls the operation of the A/D module. The
ADCON1 register, shown in Register 11-2, configures
the functions of the port pins. The port pins can be
configu red as anal og inputs (RA3 ca n also be a vol tage
reference) or as digital I/Os.
Addition al informa tion on using the A/D module can b e
found in the “PIC® M id-Range M CU Family R eference
Manual” (DS33023).
REGISTER 11-1: ADCON0: A/D CONTROL REGISTER 0 (ADDRESS 1Fh)
R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 R/W-0
ADCS1 ADCS0 CHS2 CHS1 CHS0 GO/DONE —ADON
bit 7 bit 0
bit 7-6 ADCS1:ADCS0: A/D Conversion Clock Sele ct bits
If ADCS2 = 0:
00 = FOSC/2
01 = FOSC/8
10 = FOSC/32
11 = FRC (clock derived from the internal A/D module RC oscillator)
If ADCS2 = 1:
00 = FOSC/4
01 = FOSC/16
10 = FOSC/64
11 = FRC (clock derived from the internal A/D module RC oscillator)
bit 5-3 CHS2:CHS0: Analog Channel Select bits
000 = Channel 0 (RA0/AN0)
001 = Channel 1 (RA1/AN1)
010 = Channel 2 (RA2/AN2)
011 = Channel 3 (RA3/AN3)
100 = Channel 4 (RA4/AN4)
bit 2 GO/DONE: A/D Conversion Status bit
If ADON = 1:
1 = A/D conversion in progress (setting this bit starts the A/D conversion)
0 = A/D conversion not in progress (this bit is automatically cleared by hardware when the
A/D conversion is complete)
bit 1 Unimplemented: Read as ‘0’
bit 0 ADON: A/D On bit
1 = A/D converter module is operating
0 = A/D converter module is shut-off and consumes no operating current
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
PIC16F818/819
DS39598F-page 82 2001-2013 Microchip Technology Inc.
REGISTER 11-2: ADCON1: A/D CONTROL REGISTER 1 (ADDRESS 9Fh)
R/W-0 R/W-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0
ADFM ADCS2 — — PCFG3 PCFG2 PCFG1 PCFG0
bit 7 bit 0
bit 7 ADFM: A/D Result Format Select bit
1 = Right justified, 6 Most Significant bits of ADRESH are read as ‘0’
0 = Left justified, 6 Least Si gnificant bits of ADRESL ar e read as ‘0’
bit 6 ADCS2: A/D Clock Divide by 2 Select bit
1 = A/D clock source is di vided by 2 when system cl ock is used
0 = Disabled
bit 5-4 Unimplemented: Read as ‘0’
bit 3-0 PCFG<3:0>: A/D Port Configuration Control bits
A = Analog input D = Digital I/O
C/R = Number of analog input channels/Number of A/D voltage references
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
PCFG AN4 AN3 AN2 AN1 AN0 VREF+VREF-C/R
0000 AA AAAAV
DD AVSS 5/0
0001 AVREF+ AAAAN3AVSS 4/1
0010 AA AAAAV
DD AVSS 5/0
0011 AVREF+ AAAAN3AVSS 4/1
0100 DA DAAAVDD AVSS 3/0
0101 DV
REF+ DAAAN3AVSS 2/1
011x DD DDDAVDD AVSS 0/0
1000 AVREF+ VREF- AAAN3AN23/2
1001 AA AAAAV
DD AVSS 5/0
1010 AVREF+ AAAAN3AVSS 4/1
1011 AVREF+ VREF- AAAN3AN23/2
1100 AV
REF+ VREF- AAAN3AN23/2
1101 DVREF+ VREF- AAAN3AN22/2
1110 DD DDAAVDD AVSS 1/0
1111 DV
REF+ VREF- DAAN3AN21/2
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PIC16F818/819
The ADRESH:ADRESL registers contain the result of
the A/D conversion. When the A/D conversion is
complete, the result is loaded into the A/D Result register
pair, the GO/DONE bit (ADCON0<2>) is cleared and
A/D Interrupt Flag bit, ADIF, is set. The block diagram of
the A/D module is shown in Figure 11-1.
After the A/D module has been configured as desired,
the selected channel must be acquired before the
conversion is started. The analog input channels must
have their corresponding TRIS bits selected as inputs.
To determine sample time, see Section 11.1 “A/D
Acquisition Requirements”. After this sample time
has elapsed, the A/D conversion can be started.
These steps should be followed for doing an A/D
conversion:
1. Configure the A/D module:
• Config ure ana log pins /vo lt age reference and
digital I/O (ADCON1)
• Select A/D input channel (ADCON0)
• Select A /D conversion clock (ADCON0)
• Turn on A/D module (ADCON0)
2. Configure A/D interrupt (if desired):
• Clear ADIF bit
• Set ADIE bit
• Set GIE bit
3. Wait the required acquisition time.
4. Start conversion:
• Set GO/DONE bit (ADCON0)
5. Wait for A/D conversion to complete by either:
• Polling for the GO/DONE bit to be cleared
(with interrupts disabled); OR
• Waiting for the A/D interrupt
6. Read A/D Result register pair
(ADRESH:ADRESL), clear bit ADIF if required.
7. For next conversion, go to step 1 or step 2 as
required. The A/D conversion time per bit is
defined as TAD. A minimum wait of 2 TAD is
required before the next acquisition starts.
FIGURE 11-1: A/D BLOCK DIAGRAM
(Input Voltage)
VIN
VREF+
(Reference
Voltage)
AVDD
PCFG<3:0>
CHS<3:0>
RA3/AN3/VREF+
RA2/AN2/VREF-
RA1/AN1
RA0/AN0
011
010
001
000
A/D
Converter
VREF-
(Reference
Voltage) AVSS
PCFG<3:0>
RA4/AN4/T0CKI
100
PIC16F818/819
DS39598F-page 84 2001-2013 Microchip Technology Inc.
11.1 A/D Acquisition Requirements
For the A/D converter to meet its specified accuracy,
the charge holding capacitor (CHOLD) must be allowed
to fully charge to the input channel voltage level. The
analog i nput model is shown in Figure 1 1-2. The source
impeda nce (RS) and the inte rnal sam pling swi tch (RSS)
impedance directly affect the time required to charge
the capacitor CHOLD. The sampling switch (RSS)
impedance varies over the device voltage (VDD), see
Figure 11-2. The maximum recommended imped-
ance for analog sou rces is 2. 5 k. As the imped ance
is decreased, the acquisition time may be decreased.
After the analog input channel is selected (changed),
this acquisition must be done before the conversion
can be sta rted.
To calculate the minimum acquisition time,
Equation 11-1 may be used. This equation assumes
that 1/2 LS b error is used (1024 st eps for the A/D). The
1/2 LSb er ror is the ma ximu m error allow ed for the A/D
to meet its specified resolution.
To calculate the minimum acquisition time, TACQ, see
the “PIC® Mid-Range MCU Family Reference Manual”
(DS33023).
EQUATION 11-1: ACQUISITION TIME
FIGURE 11-2: ANALOG INPUT MODEL
TACQ
TC
TACQ
=
=
=
=
=
=
=
=
Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient
TAMP + TC + TCOFF
2 s + TC + [(Temperature – 25°C)(0.05 s/°C)]
CHOLD (RIC + RSS + RS) In(1/2047)
-120 pF (1 k + 7 k + 10 k) In(0.0004885)
16.47 s
2 s + 16.47 s + [(50°C – 25C)(0.05 s/C)
19.72 s
Note 1: The reference voltage (VREF) has no effect on the equation since it cancels itself out.
2: The charge holding capacitor (CHOLD) is not discharged after each conversion.
3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin
leakage specification.
4: After a conversion has completed, a 2.0 TAD delay must complete before acquisition can begin again.
During this time, the holding capacitor is not connected to the selected A/D input channel.
CPIN
VA
RSANx
5 pF
VDD
VT = 0.6V
VT = 0.6V ILEAKAGE
RIC 1K
Sampling
Switch
SS RSS
CHOLD
= DAC Capacitance
VSS
6V
Sampling Switch
5V
4V
3V
2V
567891011
(k)
VDD
= 120 pF
± 500 nA
Legend: CPIN
VT
ILEAKAGE
RIC
SS
CHOLD
= input capacitance
= threshold voltage
= leakage current at the pin due to
= interconnect resistance
= sampling switch
= sample/hold capacitance (from DAC)
various junctions
2001-2013 Microchip Technology Inc. DS39598F-page 85
PIC16F818/819
11.2 Selecting the A/D Conversion
Clock
The A/D conversion time per bit is defined as TAD. The
A/D conversion requires 9.0 TAD per 10-bi t c onvers io n.
The source of the A/D conversion clock is software
selectable. The seven possible options for TAD are:
•2T
OSC
•4TOSC
•8TOSC
•16TOSC
•32TOSC
•64TOSC
• Internal A/D module RC osc il lat or (2-6 s)
For correct A/D conversions, the A/D conversion clock
(TAD) must be selected to ensure a minimum TAD time
as small as possible, but no less than 1.6 s and not
greater than 6.4 s.
Table 11-1 shows the resultant TAD ti mes der ive d from
the device operating frequencies and the A/D clock
sour ce se lec ted .
11.3 Configuring Anal og Port Pins
The ADCON1 and TRISA registers control the opera-
tion of the A/D port pins. The port pins that are desired
as analog inputs must have their corresponding TRIS
bits set (input). If the TRIS bit is cleared (output), the
digital output level (VOH or VOL) will be converted.
The A/D operation is independent of the state of the
CHS<2:0> bits and the TRIS bit s .
TABLE 11-1: TAD vs. MAXIMUM DEVICE OPERATING FREQUENCIES (ST ANDARD DEVICES (F))
Note 1: When reading the Port register, all pins
configured as analog input channels will
read as c lea red (a lo w l ev el). Pin s co nfi g-
ured as digital inputs will convert an
analog input. Analog levels on a digitally
configured input will not affect the
conversion accuracy.
2: Analog le vels on any pin that is defined as
a digital input (including the AN4:AN0
pins) may cause the input buffer to
consume current out of the device
specification.
AD Clock Source (TAD)Maximum Device Frequency
Operation ADCS<2> ADCS<1:0>
2 TOSC 0001.25 MHz
4 TOSC 1002.5 MHz
8 TOSC 001 5 MHz
16 TOSC 101 10 MHz
32 TOSC 010 20 MHz
64 TOSC 110 20 MHz
RC(1,2,3) X11(Note 1)
Note 1: The RC source has a typical TAD time of 4 s but can vary between 2-6 s.
2: When the device frequencies are greater than 1 MHz, the RC A/D conversion clock source is only
recommended for Sl eep operation.
3: For extended voltage devices (LF), please refer to Section 15.0 “Electrical Characteristics”.
PIC16F818/819
DS39598F-page 86 2001-2013 Microchip Technology Inc.
11.4 A/D Conversions
Clearing the GO/DONE bit during a conversion will
abort the current conversion. The A/D Result register
pair will NOT be upda ted wi th th e partial ly comp leted
A/D conversion sample . That is, the ADRESH:ADRESL
registers will continue to contain the value of the last
completed conversion (or the last value written to the
ADRESH:ADRESL regi sters). After the A/D con version
is aborted, a 2-TAD wait is required before the next
acquisition is started. After this 2-TAD wait, acquisition
on the selected channel is automatically started. The
GO/DONE bit can then be set to start the conversion.
In Figure 11-3, after the GO bit is set, the first time
segment has a minimum of T CY and a maximum of T AD.
11.4.1 A/D RESULT REGISTERS
The ADRESH:ADRESL register pair is the location
where the 10-bit A/D result is loaded at the completion
of the A/D co nversion . This register p air is 16 bit s wide.
The A/D mod ule gives the flexi bility to lef t or right justify
the 10-bit result in the 16-bit result register. The A/D
Format Select bit (ADFM) controls this justification.
Figure 11-4 shows the operation of the A/D result
justific ation. The extra bits are loaded with ‘0’s. W hen
an A/D result will not overwrite these locations (A/D
disable), these registers may be used as two general
purpose 8-bit registers.
FIGURE 11-3: A/D CONVERSION TAD CYCLES
FIGURE 11-4: A/D RESULT JUSTIFICATION
Note: The GO/DONE bit should NOT be set in
the same instruction that turns on the A/D.
TAD1TAD2 TAD3 TAD4 TAD5 TAD6
T
AD
7 T
AD
8
TAD9
Set GO bit
Holding Capacitor is disconnected from analog input (typically 100 ns)
b9 b8 b7 b6 b5 b4 b3 b2
TAD10 TAD11
b1 b0
TCY to TAD
Conversion starts
ADRES is loaded,
GO bit is cleared,
ADIF bit is set,
Holding Capacitor is connected to analog input
10-bit Result
ADRESH ADRESL
0000 00
ADFM = 0
0
2 1 0 77
10-bit Result
ADRESH ADRESL
10-bit Result
0000 00
70 7 6 5 0
ADFM = 1
Right Justified Left Justified
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PIC16F818/819
11.5 A/D Operation During Sleep
The A/D module can operate during Sleep mode. This
requires that the A/D clock source be set to RC
(ADCS1:ADCS0 = 11). When the RC clock source is
selected, the A/D module waits one instruction cycle
before starting the conversion. This allows the SLEEP
instruction to be executed which eliminates all digital
switchi ng noise fro m the conv ersion. Whe n the conver-
sion i s comple ted, the GO /DONE bit will be cleared and
the result loaded into the ADRES register. If the A/D
interrupt is enabled, the device will wake-up from
Sleep. If the A/D interrupt is not enabled, the A/D
modul e wil l then be t urned off, alt hough the A DON bi t
will remain set.
When the A/D clock sour ce is anoth er clock optio n (not
RC), a SLEEP instructi on will cause the present conver-
sion t o be aborte d and the A/D mod ule to be turned of f,
though the ADON bit will remain set.
Turning off the A/D places the A/D m odu le in it s low est
current consumption state.
11.6 Effects of a Reset
A device Reset forces all registers to their Reset state.
The A/D module is disabled and any conversion in
progress is aborted. All A/D input pins are configured
as analog inputs.
The value that is in the ADRESH:ADRESL registers
is not modified for a Power-on Reset. The
ADRESH:ADRESL registers w ill cont ain unkno wn data
after a Power-on Reset.
11.7 Use of the CCP Trigger
An A/D convers ion can be st arted by th e “special event
trigger” of the CCP module. This requires that the
CCP1M3:CCP1M0 bits (CCP1CON<3:0>) be
programmed as ‘1011’ and that the A/D module is
enabled (ADON bit is set). Wh en the trigger occu rs, the
GO/DONE bit will be set, starting the A/D conversion
and the Timer1 counter will be reset to zero. Timer1 is
reset to autom atical ly rep eat th e A/D ac quisi tion perio d
with minimal software overhead (moving the
ADRESH:ADRESL to the de sired loc ation). Th e appro-
priate analog input channel must be selected and the
minimum acquisition done before the “special event
trigger” sets the GO/DONE bi t (starts a conversion).
If the A/D module is not enabled (ADON is cleared),
then the “special event trigger” will be ignored by the
A/D module but will still reset the Timer1 counter.
TABLE 11-2: REGISTERS/BITS ASSOCIATED WITH A/D
Note: For the A/D module to operate in Sleep,
the A/D clock source must be set to RC
(ADCS1:ADCS0 = 11). To perform an A/D
conversion in Sleep, ensure the SLEEP
instruction immediately follows the
instruction that sets the GO/DONE bit.
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on
all other
Resets
0Bh,8Bh
10Bh,18Bh INTCON GIE PEIE TMR0IE INTE RBIE TMR0IF INTF RBIF 0000 000x 0000 000u
0Ch PIR1 —ADIF— — SSPIF CCP1IF TMR2IF TMR1IF -0-- 0000 -0-- 0000
8Ch PIE1 —ADIE— — SSPIE CCP1IE TMR2IE TMR1IE -0-- 0000 -0-- 0000
1Eh ADRESH A/D Result Register High Byte xxxx xxxx uuuu uuuu
9Eh ADRESL A/D Result Register Low Byte xxxx xxxx uuuu uuuu
1Fh ADCON0 ADCS1 ADCS0 CHS2 CHS1 CHS0 GO/DONE —ADON0000 00-0 0000 00-0
9Fh ADCON1 ADFM ADCS2 —— PCFG3 PCFG2 PCFG1 PCFG0 00-- 0000 00-- 0000
05h PORTA RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 xxx0 0000 uuu0 0000
85h TRISA TRISA7 TRISA6 TRISA5 P O RTA Data Direction Register 1111 1111 1111 1111
Legend: x = unknown, u = unchanged, - = unimplemented, read as ‘0’. Shaded cells are not used for A/D conversion.
PIC16F818/819
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PIC16F818/819
12.0 SPECIAL FEATURES OF
THE CPU
These devices have a host of features intended to
maximize sys tem reliability, minimize cost through elimi-
nation of external components, provide power-saving
operating modes and offer code protection:
• Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Oscillator Start-up Ti mer (OST)
- Brown-out Reset (BOR)
• Interrupts
• Watchdog Timer (WDT)
• Sleep
• Code Protection
• ID Locations
• In-Circuit Serial Programming
There are two timers that offer necessary delays on
power-up. One is the Oscillator Start-up Timer (OST),
intende d to keep the chip in Reset until the crystal os cil-
lator is stable. The other is the Power-up T imer (PWRT)
which provides a fixed delay of 72 ms (nominal) on
power-up only. It is designed to keep the part in Reset
while the power supply stabilizes and is enabled or
disabled using a configuration bit. With these two
timers on-chip, most applications need no external
Reset circuitry.
Sleep mode is designed to offer a very low-current
power-down mode. The user can wake-up from Sleep
through external Reset, Watchdog Timer wake-up or
through an interrupt.
Several oscillator options are also made available to
allow the part to fit the application. The RC oscillator
option saves system cost while the LP crystal option
saves power. Configuration bits are used to select the
desired oscillator mode.
Additional information on special features is available
in th e “PIC® Mid-Range MCU Family Reference Man-
ual” (DS33023).
12.1 Configuration Bits
The configuration bits can be programmed (read as
‘0’), or left unprogrammed (read as ‘1’), to select
various device configurations. These bits are mapped
in program memory location 2007h.
The user will note that address 2007h is beyond the
user program memory space which can be accessed
only during programming.
PIC16F818/819
DS39598F-page 90 2001-2013 Microchip Technology Inc.
REGISTER 12-1: CONFIGURATION WORD (ADDRESS 2007h)(1)
R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
CP CCPMX DEBUG WRT1 WRT0 CPD LVP BOREN MCLRE FOSC2 PWRTEN WDTEN FOSC1 FOSC0
bit 13 bit 0
bit 13 CP: Flash Progra m Memory Code Prote ctio n bit
1 = C o de p rotection of f
0 = All memory locations code-protected
bit 12 CCPMX: CCP1 Pin Selec ti on bi t
1 = CCP1 function on RB2
0 = CCP1 function on RB3
bit 11 DEB UG: In-Circuit Debugger Mode bit
1 = In-Circuit De bu gg er disabled, R B6 and R B7 are ge ne ral p urp os e I/O p in s
0 = In-Circuit De bu gg er enabled, R B6 and RB7 are dedicate d to the deb ug ger
bit 10-9 WRT1:WRT0: Fla s h Program Memo ry Write Enabl e b its
For PIC16F818:
11 = Write protec ti on off
10 = 000h to 01FF write-pro te ct ed, 0200 to 0 3F F m a y be modifi ed b y EECO N c on tro l
01 = 000h to 03FF w ri te-protected
For PIC16F819:
11 = Write protec ti on off
10 = 0000 h to 01FFh write- pro t e cted, 0200h to 07 FFh may be m odi fi ed b y EECO N con trol
01 = 0000 h to 03FFh write- pro t e cted, 0400h to 07 FFh may be m odi fi ed b y EECO N con trol
00 = 0000 h to 05FFh write- pro t e cted, 0600h to 07 FFh may be m odi fi ed b y EECO N con trol
bit 8 CPD: Data EE Memory Code Protection bit
1 = C o de p rotection of f
0 = Data EE memory locations code-protected
bit 7 LVP: Low -Volt age Prog ramm ing Ena ble bi t
1 = RB3/PGM pin has PGM function, Low-V oltage Programming enabled
0 = RB3/PGM pin has digital I/O function, HV on MCLR must be used for programming
bit 6 BOREN: Brown-out Reset Enable bit
1 = BOR en ab le d
0 = BOR disabl ed
bit 5 MCLRE: RA5/MCLR/VPP Pin Function Select bit
1 = RA5/MCL R/VPP pin fu nc ti on i s MCL R
0 = RA5/MCL R/VPP pin fu nc ti on i s di gi t al I/O, MCLR interna ll y ti ed to V DD
bit 3 PWRTEN: Power-up Timer Enab le bi t
1 = PWRT disabled
0 = PWRT enabled
bit 2 WDTEN: Watchdog Timer Enable bit
1 = WDT en abled
0 = WDT di sabl ed
bit 4, 1-0 FOSC2:FOSC0: Oscillator Selection bits
111 = EXTRC os cil la tor ; CL KO fu nc ti on o n RA 6/OSC2 /CL KO p in
110 = EXTRC os c illa tor ; p ort I/ O fu nc tio n on RA6 /OSC2 /CLKO pi n
101 = INTR C os c il la tor ; C L KO fu nc ti on on RA6/O SC2 /C L KO p in an d po rt I /O fu nc ti on o n
RA7/O SC 1/ CLKI pin
100 = INTR C osc il la tor; port I/O fu nc ti on on b oth R A6 / OS C2 /C LK O pin and R A 7/O SC 1 /C L KI p in
011 = EXTCLK; po rt I/O f un ct ion o n RA6/OSC2/CL KO p in
010 = HS oscillator
001 = XT os ci llator
000 = LP oscillator
Note 1: The erased (unprogrammed) value of the Configuration Word is 3FFFh.
Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’
-n = Value when device is unprogrammed u = Unchanged from programmed state
2001-2013 Microchip Technology Inc. DS39598F-page 91
PIC16F818/819
12.2 Reset
The PIC16F818/819 differentiates between various
kinds of Re set :
• Power-on Reset (POR)
•MCLR
Reset during normal operation
•MCLR
Reset during Sl eep
• WDT Reset during normal operation
• WDT wake-up during Sleep
• Brown-out Reset (BOR)
Some regi sters a re not af fected in any Rese t condit ion.
Their statu s is unk nown o n POR and unchan ged i n any
other Reset. Most other registers are reset to a “Reset
state” on Power-on Reset (POR), on the MCLR and
WDT Rese t, on MCL R Reset during Sleep and Brown-
out Reset (BOR). They are not affected by a WDT
wake-up which is viewed as the resumption of normal
operation. The TO and PD bits are set or cleared
differently in different Reset situations as indicated in
Table 12-3. These bits are used in software to
determine the nature of the Reset. Upon a POR, BOR
or wake-up from Sleep, the CPU requires
approximately 5-10 s to become ready for code
execution. This delay runs in parallel with any other
timers. See Table 12-4 for a full description of Reset
states of all registers.
A simp lified block di agram o f the on- chip Re set cir cuit
is sh own in Figur e 12-1.
FIGURE 12-1: SIMPLI FIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
S
RQ
External
Reset
MCLR
VDD
OSC1
WDT
Module
VDD Rise
Detect
OST/PWRT
INTRC
WDT
Time-out
Power-on Reset
OST
10-bit Ripple Counter
PWRT
Chip_Reset
10-bit Ripple Counter
Reset
Enable OST
Enable PWR T
Sleep
Brown-out
Reset BOREN
31.25 kHz
PIC16F818/819
DS39598F-page 92 2001-2013 Microchip Technology Inc.
12.3 MCLR
PIC16F818/819 device has a noise filter in the MCLR
Reset path. The filter will detect and ignore small
pulses.
It should be noted that a WDT Reset does not drive
MCLR pin low.
The behavior of the ESD protection on the MCLR pin
has been altered from previous devices of this family.
Volta ges app lied to the pin th at exce ed it s spe cif icatio n
can resul t in both MCLR an d excess ive current be yond
the device specification during the ESD event. For this
reason, Microchip recommends that the MCLR pin no
longer be tied directly to VDD. The use of an
RC network, as shown in Figure 12-2, is suggested.
The RA5/MCLR/VPP pin can be configured for MCLR
(default) or as an I/O pin (RA5). This is configured
through the MCLRE bit in the Configuration Word
register.
FIGURE 12-2: RECOMME NDED MCLR
CIRCUIT
12.4 Power-on Reset (POR)
A Power-on Reset pulse is generated on-chip when
VDD rise is detected (in the ran ge of 1.2V -1.7V). To take
advantage of the POR, tie the MCLR pin to VDD as
described in Section 12.3 “MCLR”. A maximum rise
time fo r VDD is specif ied. See Section 15.0 “Ele ctrical
Characteristics” for details.
When the device starts normal operation (exits the
Reset condition), device operating parameters (volt-
age, fr equency, temp erature, ...) mus t be met to ensu re
operation. If these conditions are not met, the device
must be held in Reset until the operating conditions are
met. For more information, see Application Note
AN607, “Power-up Trouble Shootin g” (DS00607).
12.5 Power-up Timer (PWRT)
The Power-up Timer (PWRT) of the PIC16F818/819 is
a counter that uses the INTRC oscillator as the clock
input. This yields a count of 72 ms. While the PWRT is
counting, the device is held in Reset.
The power-up time delay depends on the INTRC and
will vary from chip-to-chip due to temperature and
process variation. See DC parameter #33 for details.
The PWRT is enabled by clearing configuration bit,
PWRTEN.
12.6 Oscillator Start-up Timer (OST)
The Oscillator Start-up Timer (OST) provides 1024
oscillator cycles (from OSC1 input) delay after the
PWRT delay is over (if enabled). This helps to ensure
that the crystal oscillator or resonator has started and
stabilized.
The OST time-out is invoked only for XT, LP and HS
modes and only on Power-on Reset or wake-up from
Sleep.
12.7 Brown-out Reset (BOR)
The configuration bit, BOREN, can enable or disable
the Brown-out Reset circuit. If VDD falls below VBOR
(parameter #D005, about 4V) for longer than TBOR
(param eter #3 5, abou t 100 s), the brown-ou t situa tion
will reset the device. If VDD falls below VBOR for less
than TBOR, a Reset may not occur.
Once the brown-out occurs, the device will remain in
Brown-out Reset until VDD rises above VBOR. The
Power-up Timer (if enabled) will keep the device in
Rese t fo r TPWRT (parameter #33, about 72 ms). If VDD
should fall below VBOR during TPWRT, the Brown-out
Reset process will restart when VDD rises above VBOR
with the Power-up Timer Reset. Unlike previous PIC16
devices, the PWRT is no longer automatically enabled
when the Brown-out Reset circuit is enabled. The
PWRTEN and BOREN configuration bits are
independent of each other.
12.8 Time-out Sequence
On power-up, the time-out sequence is as follows: the
PWRT delay starts (if enabled) when a POR occurs.
Then, OST starts countin g 102 4 os ci ll ator cycle s whe n
PWRT ends (LP, XT, HS). When the OST ends, the
device comes out of Reset.
If MCLR is kept low long enough, all delays will expire.
Bringing MCLR high will begin execution immediately.
This is useful for testing purposes or to synchronize
more than one PIC16F818/819 device operating in
parallel.
Table 12-3 shows the Reset conditions for the Status,
PCON and PC registers, while Table 12-4 shows the
Reset conditions for all the regi sters.
C1
0.1 F
R1
1 k (or greater)
(optional, not critical)
VDD
MCLR
PIC16F818/819
2001-2013 Microchip Technology Inc. DS39598F-page 93
PIC16F818/819
12.9 Power Control/Status Register
(PCON)
The Pow er Control /S t atu s regis ter, PCON, has two bit s
to indicate the type of Reset that last occurred.
Bit 0 is Brown-out Reset Status bit, BOR. Bit BOR is
unknown on a Power-on Reset. It must then be set by
the user and checked on subsequent Resets to see if
bit BOR cleared, indicating a Brown-out Reset
occurred. When the Brown-out Reset is disabled, the
state of the BOR bit is unpredictable.
Bit 1 is Po wer-on Reset S ta tus bit, POR. It is cleared on
a Power-on Reset and unaffected otherwise. The user
must set this bit following a Power-on Reset.
TABLE 12-1: TIME-OUT IN VARIOUS SITUATIONS
TABLE 12-2: STATUS BITS AND THEIR SIGNIFICANCE
TABLE 12-3: RESET CONDITION FOR SPECIAL REGISTERS
Oscillator
Configuration Power-up Brown-out Reset Wake-up
from Sleep
PWRTE = 0PWRTE = 1PWRTE = 0PWRTE = 1
XT, HS, LP TPWRT + 1024 • TOSC 1024 • TOSC TPWRT + 1024 • TOSC 1024 • TOSC 1024 • TOSC
EXTRC, EXTCLK, INTRC TPWRT 5-10 s(1) TPWRT 5-10 s(1) 5-10 s(1)
Note 1: CPU start-up is always invoked on POR, BOR and wake-up from Sleep.
POR BOR TO PD
0x11Power-on Reset
0x0xIllegal, TO is set on POR
0xx0Illegal, PD is set on POR
1011Brown-out Reset
1101WDT Reset
1100WDT wake-up
11uuMCLR Reset during normal opera tion
1110MCLR Reset during Sleep or interrupt wake-up from Sleep
Legend: u = unchanged, x = unknown
Condition Program
Counter Status
Register PCON
Register
Power-on Reset 000h 0001 1xxx ---- --0x
MCLR Reset during normal operation 000h 000u uuuu ---- --uu
MCLR Reset during Sleep 000h 0001 0uuu ---- --uu
WDT Reset 000h 0000 1uuu ---- --uu
WDT wake-up PC + 1 uuu0 0uuu ---- --uu
Brown-out Reset 000h 0001 1uuu ---- --u0
Interrupt wake-up from Sleep PC + 1(1) uuu1 0uuu ---- --uu
Legend: u = unchanged, x = unknow n, - = unimplemented bit, read as ‘0’
Note 1: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector
(0004h).
PIC16F818/819
DS39598F-page 94 2001-2013 Microchip Technology Inc.
TABLE 12-4: INITIALIZATION CONDITIONS FOR ALL REGISTERS
Register Power-on Rese t,
Brown-out Reset MCLR Reset,
WDT Reset Wake-up via WDT or
Interrupt
Wxxxx xxxx uuuu uuuu uuuu uuuu
INDF N/A N/A N/A
TMR0 xxxx xxxx uuuu uuuu uuuu uuuu
PCL 0000h 0000h PC + 1(2)
STATUS 0001 1xxx 000q quuu(3) uuuq quuu(3)
FSR xxxx xxxx uuuu uuuu uuuu uuuu
PORTA xxx0 0000 uuu0 0000 uuuu uuuu
PORTB xxxx xxxx uuuu uuuu uuuu uuuu
PCLATH ---0 0000 ---0 0000 ---u uuuu
INTCON 0000 000x 0000 000u uuuu uuuu(1)
PIR1 -0-- 0000 -0-- 0000 -u-- uuuu(1)
PIR2 ---0 ---- ---0 ---- ---u ----(1)
TMR1L xxxx xxxx uuuu uuuu uuuu uuuu
TMR1H xxxx xxxx uuuu uuuu uuuu uuuu
T1CON --00 0000 --uu uuuu --uu uuuu
TMR2 0000 0000 0000 0000 uuuu uuuu
T2CON -000 0000 -000 0000 -uuu uuuu
SSPBUF xxxx xxxx uuuu uuuu uuuu uuuu
SSPCON 0000 0000 0000 0000 uuuu uuuu
CCPR1L xxxx xxxx uuuu uuuu uuuu uuuu
CCPR1H xxxx xxxx uuuu uuuu uuuu uuuu
CCP1CON --00 0000 --00 0000 --uu uuuu
ADRESH xxxx xxxx uuuu uuuu uuuu uuuu
ADCON0 0000 00-0 0000 00-0 uuuu uu-u
OPTION_REG 1111 1111 1111 1111 uuuu uuuu
TRISA 1111 1111 1111 1111 uuuu uuuu
TRISB 1111 1111 1111 1111 uuuu uuuu
PIE1 -0-- 0000 -0-- 0000 -u-- uuuu
PIE2 ---0 ---- ---0 ---- ---u ----
PCON ---- --qq ---- --uu ---- --uu
OSCCON -000 -0-- -000 -0-- -uuu -u--
OSCTUNE --00 0000 --00 0000 --uu uuuu
PR2 1111 1111 1111 1111 1111 1111
SSPADD 0000 0000 0000 0000 uuuu uuuu
SSPSTAT 0000 0000 0000 0000 uuuu uuuu
ADRESL xxxx xxxx uuuu uuuu uuuu uuuu
ADCON1 00-- 0000 00-- 0000 uu-- uuuu
EEDATA xxxx xxxx uuuu uuuu uuuu uuuu
EEADR xxxx xxxx uuuu uuuu uuuu uuuu
EEDATH --xx xxxx --uu uuuu --uu uuuu
EEADRH ---- -xxx ---- -uuu ---- -uuu
EECON1 x--x x000 u--x u000 u--u uuuu
EECON2 ---- ---- ---- ---- ---- ----
Legend: u = unchanged, x = unknown, - = unimplemented bit, read as ‘0’, q = value depends on condition,
r = reserved, maintain clear
Note 1: One or more bits in INTCON, PIR1 and PR2 will be affected (to cause wake-up).
2: When the wake-up is due to an interrupt and the GIE bit is set, the PC is loaded with the interrupt vector (0004h).
3: See Table 12-3 for Reset value for specific conditions.
2001-2013 Microchip Technology Inc. DS39598F-page 95
PIC16F818/819
FIGURE 12-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD THROUGH
PULL-UP RESISTOR)
FIGURE 12-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD THROUGH
RC NETWORK): CASE 1
FIGURE 12-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED TO VDD THROUGH
RC NETWORK): CASE 2
TPWRT
TOST
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
TPWRT
TOST
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
TPWRT
TOST
PIC16F818/819
DS39598F-page 96 2001-2013 Microchip Technology Inc.
FIGURE 12-6: SLOW RISE TIME (MCLR TIED TO VDD THROUGH RC NETWORK)
12.10 Interrupts
The PIC16F818/819 has up to nine sources of inter-
rupt. The Interrupt Control register (INTCON) records
individual interrupt requests in flag bits. It also has
individual and global interrupt enable bits.
A Global Interrupt Enable bit, GIE (INTCON<7>),
enables (if set) all unmasked interrupts or disables (if
cleared) all interrupts. When bit GIE is enabled and an
inter rupt’s flag bit and mask bit are s et, the int errupt will
vector immediately. Individual interrupts can be
disabled through their corresponding enable bits in
various registers. Individual interrupt bits are set
regardless of the status of the GIE bit. The GIE bit is
cleared on Reset.
The “return from interrupt” instruction, RETFIE, exits
the interrupt routine, as well as sets the GIE bit, which
re-enabl es inte rrupts.
The RB0/INT pin interrupt, the RB port change interrupt
and the TMR 0 over flo w interru pt f lag s are co nt a ine d in
the INTCON register.
The peripheral interrupt flags are contained in the
Special Function Register, PIR1. The corresponding
interrupt enable bits are contained in Special Function
Register, PIE1 and the peripheral in terrupt enabl e bit is
contained in Special Functi on Regi ster, INTCON.
When an interrupt is serviced, the GIE bit is cleared to
disable any further interrupt, the return address is
pushed onto the stack and the PC is loaded with 0004h.
Once in the Interrupt Service Routine, the source(s) of
the interrupt can be determined by polling the interrupt
flag bits. The interrupt flag bit(s) must be cleared in
software before re-enabling interrupts to avoid
recursive interrupts.
For external interrupt events, such as the INT pin or
PORTB change interrupt, the interrupt latency will be
three or four instruction cycles. The exact latency
depends on when the interrupt event occurs relative to
the current Q cycle. The latency is the same for one or
two-cycle instructions. Individual interrupt flag bits are
set regardless of the status of their corresponding
mask bit, PEIE bit or the GIE bit.
FIGURE 12-7: INTERRUPT LOGIC
VDD
MCLR
Internal POR
PWRT Time-out
OST Time-out
Internal Reset
0V 1V
5V
TPWRT
TOST
Note: Individual interrupt flag bits are set
regardless of the status of their
corresponding mask bit or the GIE bit.
ADIF
ADIE
SSPIF
SSPIE
CCP1IF
CCP1IE
TMR2IF
TMR2IE
TMR1IF
TMR1IE
TMR0IF
TMR0IE
INTF
INTE
RBIF
RBIE
GIE
PEIE
Wake-up (if in Sleep mode)
Interrupt to CPU
EEIF
EEIE
2001-2013 Microchip Technology Inc. DS39598F-page 97
PIC16F818/819
12.10.1 INT INTERRUPT
External in terrupt on the RB0/INT pin is edg e triggered,
either rising if bit INTEDG (OPTION_REG<6>) is set,
or falling if the INTEDG bit is clear. When a valid edge
appears on the RB0/INT pin, flag bit, INTF
(INTCON<1 >), i s s et. T his in terru pt c an b e d isa bl ed b y
clear ing en abl e bi t, I NTE (IN TCON <4 >). Fla g bi t IN TF
must be cleared in software in the Interrupt Service
Routin e before re-enablin g this interrupt. The INT int er-
rupt can wake-up the processor from Sleep if bit INTE
was set prior to going into Sleep. The status of Global
Interrupt Enable bit, GIE, decides whether or not the
processor branches to the interrupt vector following
wake-up. See Section 12.13 “Power-Down Mode
(Sleep)” for details on Sleep mode.
12.10.2 TMR0 INTERRUPT
An overflow (FFh 00h) in the TMR0 register will set
flag bit, TMR0IF (INTCON<2>). The interrupt can be
enabled/disabled by setting/clearing enable bit,
TMR0IE (INTCON<5>) (see Section 6.0 “Timer0
Module”).
12.10.3 PORTB INTCON CHANGE
An input change on PORTB<7:4> sets flag bit, RBIF
(INTCON<0>). The interrupt can be enabled/disabled
by setting/clearing enable bit, RBIE (INTCON<3>). See
Section 3.2 “EECON1 and EECON2 Registers” .
12.11 Context Saving During Interrupts
During an interrupt, only the return PC value is saved
on the stack. Typically, users may wish to save key
registers during an interrupt (i.e., W, Status registers).
This will have to be implemented in software as shown
in Example 12-1.
For PIC16F818 devices, the upper 64 bytes of each
bank are common. Temporary holding registers,
W_TEMP and STATUS_TEMP, should be placed here.
These 64 locations do not require banking and
therefore, make it easier for context save and restore.
For PIC16F819 devices, the upper 16 bytes of each
bank are common.
EXAMPLE 12-1: SAVING STATUS AND W REGISTERS IN RAM
MOVWF W_TEMP ;Copy W to TEMP register
SWAPF STATUS, W ;Swap status to be saved into W
CLRF STATUS ;bank 0, regardless of current bank, Clears IRP,RP1,RP0
MOVWF STATUS_TEMP ;Save status to bank zero STATUS_TEMP register
:
:(ISR) ;Insert user code here
:
SWAPF STATUS_TEMP, W ;Swap STATUS_TEMP register into W
;(sets bank to original state)
MOVWF STATUS ;Move W into STATUS register
SWAPF W_TEMP, F ;Swap W_TEMP
SWAPF W_TEMP, W ;Swap W_TEMP into W
PIC16F818/819
DS39598F-page 98 2001-2013 Microchip Technology Inc.
12.12 Watchdog Timer (WDT)
For PIC16F818/819 devices, the WDT is driven by the
INTRC oscillator. When the WDT is enabled, the
INTRC (31.25 kHz) oscillator is enabled. The nominal
WDT period is 16 ms and has the same accuracy as
the INTRC oscillator.
During n ormal operati on, a WDT time-o ut generates a
device Reset (Watch dog Time r Reset). If the device is
in Sleep mode, a WDT time-out causes the device to
wake-up and continue with normal operation (Watchdog
T imer wake-up). The TO bit in t he S t at us re gist er wil l be
cleared upon a Watchdog Timer time-out.
The WDT can be permanent ly disabled by clear ing con-
figuration bit, WDTEN (see Section 12.1 “Configuration
Bits”).
WDT time-out period values may be found in
Section 15.0 “Electrical Characteristics” under
param ete r #31 . Values for the WDT p resc al er (ac tua ll y
a posts caler but shared with the T imer0 pres caler) may
be assigned using the OPTION_REG register.
FIGURE 12-8: WATCHDOG TIMER BLOCK DIAGRAM
TABLE 12-5: SUMMARY OF WATCHDOG TIMER REGISTERS
Note 1: The CLRWDT and SLEEP instructions
clear the WDT and the postscaler if
assigned to the WDT and prevent it from
timing out and generat ing a device Res et
condition.
2: When a CLRWDT instruction is executed
and the pre scaler is assi gned to the WDT,
the pr escaler count will be cle ared but th e
presc al er ass ig nme nt is not changed.
From TMR0 Clock Source
(Figure 6-1)
To TMR0 (Figure 6-1)
Postscaler
INTRC
WDT
Enable Bit
0
1M
U
X
PSA
8-to-1 MUX PS2:PS0
01
MUX PSA
WDT
Time-out
Note: PSA and PS2:PS0 are bits in t he OPTIO N_REG register.
8
31.25 kHz
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
81h,181h OPTION_REG RBPU INTEDG T0CS T0SE PSA PS2 PS1 PS0
2007h Configuration bits(1) LVP BOREN MCLRE FOSC2 PWRTEN WDTEN FOSC1 FOSC0
Legend: Shaded cells are not used by the Watchdog Timer.
Note 1: See Register 12-1 for operation of these bits.
2001-2013 Microchip Technology Inc. DS39598F-page 99
PIC16F818/819
12.13 Power-Down Mode (Sleep)
Power-Down mode is entered by executing a SLEEP
instruction.
If enabled, the Watchdog Timer will be cleared but
keeps running, the PD bit (Status<3>) is cleared, the
TO (Status<4>) bit is set and the oscillator driver is
turned off. The I/O ports maintain the status they had
before the SLEEP instruction was executed (driving
high, low or high-impedance).
For lo west curr ent c onsum pti on in this mo de, plac e all
I/O pins at either VDD or VSS, ensure no external cir-
cuitr y is dr awing cu rrent from th e I/O pi n, powe r-down
the A/D and disable external clocks. Pull all I/O pins
that are high-impedance inputs, hi gh or low externally,
to avoid switching currents caused by floating inputs.
The T0CKI input should also be at VDD or VSS for
lowest current consumption. The contribution from
on-chip pull-u ps on POR TB should also be considered.
The MCLR pin must be at a logic high level (VIHMC).
12.13.1 WAKE-UP FROM SLEE P
The devi ce can wa ke-up from Sleep through one of th e
following events:
1. External Reset input on MCLR pin.
2. Watchdog Timer wake-up (if WDT was
enabled).
3. Interrupt from INT pin, RB port change or a
peripheral interrupt.
External MCLR Reset will cause a device Reset. All
other events are considered a continuation of program
execut ion and c aus e a “wak e-u p”. The TO and PD bit s
in the Status register can be used to determine the
cause of the device Reset. The PD bi t, w h ic h is set on
power-up, is cleared when Sleep is invoked. The TO bit
is cleared if a WDT time-out occurred and caused
wake-up.
The follo wing periph eral interrupt s can wake the device
from Sleep:
1. TMR1 interrup t. T imer1 m ust be ope rating as a n
asynchronous counter.
2. CCP Capture mode interrupt.
3. Special event trigger (Timer1 in Asynchronous
mode using an external clock).
4. SSP (Start/Stop) bit detect interrupt.
5. SSP transmit or receive in Slave mode (SPI/I2C).
6. A/D conversion (when A/D clock source is RC).
7. EEPROM write operation completion.
Other peripherals cannot generate interrupts since
during Sleep, no on-chip clocks are present.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is prefetched. For the device to
wake-up thro ugh an interrupt eve nt, the corres pon din g
interrupt enable bit must be set (enabled). Wake-up
occurs regardless of the state of the GIE bit. If the GIE
bit is clear (disabled), the device continues execution at
the inst ruction af ter the SLEEP ins truction. If the GIE b it
is set (enabled), the device executes the instruction
after the SLEEP instruction and then branches to the
interrupt address (0004h). In cases where the
execution of the instruction following SLEEP is not
desirable, the user should have a NOP after the SLEEP
instruction.
12.13.2 WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and inte rrupt fla g bit s et, one of the fo llow ing wil l occu r:
• If the interrupt occurs before the execution of a
SLEEP instruction, the SLEEP instruction will
comple te as a NOP. Therefore, th e WDT and WDT
pos tsc aler will not be cleare d, the TO bit will not
be set and PD bit will not be cleared.
• If the interrupt occurs during or after the
execution of a SLEEP inst ruc tio n, the dev ic e will
immediately wake-up from Sleep. The SLEEP
instruction will be completely executed before the
wake-up. Therefore, the WDT and WDT
postsc aler will be cleared, t he TO bit will be set
and the PD bit will be cleared.
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes. To
determine whether a SLEEP ins tructio n execut ed, test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
To ensure that the WDT is cleared, a CLRWDT instruction
should be executed before a SLEEP instruction.
PIC16F818/819
DS39598F-page 100 2001-2013 Microchip Technology Inc.
FIGURE 12-9: WAKE-UP FROM SLEEP THROUGH INTERRUPT
12.14 In-Circuit Debugger
When the DEBUG bit in the Configuration Word is
progra mmed to a ‘0’, the In-Circu it Debugger functi on-
ality is enabled . This function allows simple debuggin g
functions when used with MPLAB® ICD. When the
microcontroller has this feature enabled, some of the
resources ar e no t avai labl e for ge ner al use . Tabl e 1 2- 6
shows which features are consumed by the background
debugger.
TABLE 12-6: DEBUGGER RESOURCES
To use the In-Circuit Debugger function of the micro-
controller, the design must implement In-Circuit Serial
Programming connections to MCLR/VPP, VDD, GND,
RB7 and RB6. This will interface to the in-circuit
debugger module available from Microchip or one of
the third party development tool companies.
12.15 Program Verification/Code
Protection
If the code protection bit(s) have not been
programmed, the on-chip program memory can be
read out for verification purposes.
12.16 ID Locations
Four memory locations (2000h-2003h) are designated
as ID locations, where the user can store checksum or
other code identification numbers. These locations are
not accessible during normal execution but are
readable and writable during program/verify. It is
recommended that only the four Least Significant bits
of the ID location are used.
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
CLKO(4)
INT pin
INT F Flag
(INTCON<1>)
GIE bit
(INTCON<7>)
INSTRUCTION FLOW
PC
Instruction
Fetched
Instruction
Executed
PC PC + 1 PC + 2
Inst(PC) = Sleep
Inst(PC – 1)
Inst(PC + 1)
Sleep
Processor in
Sleep
Interru pt Late ncy
(Note 2)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h) Inst(0005h)
Inst(0004h)
Dummy Cycle
PC + 2 0004h 0005h
Dummy Cycle
TOST(2)
PC + 2
Note 1: XT, HS or LP Oscillator mode assumed.
2: TOST = 1024 TOSC (drawing not to scale). This delay will not be there for RC Oscillator mode.
3: GIE = 1 assumed. In this case , af ter wa ke-u p, the proces sor ju mp s to the interr upt rout in e. If GIE = 0, execution w ill continue in-line.
4: CLKO is not available in these oscillator modes but shown here for timing reference.
I/O pins RB6, R B7
Stack 1 level
Program Memory Address 0000h must be NOP
Last 100h wor ds
Data Memory 0x070 (0x0F0, 0x170, 0x1F0)
0x1EB-0x1EF
2001-2013 Microchip Technology Inc. DS39598F-page 101
PIC16F818/819
12.17 In-Circuit Serial Programming
PIC16F818/819 microcontrollers can be serially
progra mmed w hile in t he en d app licati on c ircuit. This is
simply done with tw o lines for cl ock and dat a and thre e
other lines for power, ground and the programming
volt age (see Figure 12-10 for an ex amp le ). Thi s a llo w s
customers to manufacture boards with unprogrammed
devices and then program the microcontroller just
before shipping the product. This also allows the most
recent firmware or a custom firmware to be
programmed.
For more information on serial programming, please refer
to the “PIC16F818/819 Flash Memory Programming
Specification” (DS39603).
FIGURE 12-10: TYPICAL IN-CIRCUIT
SERIAL PROGRAMMING
CONNECTION
Note: The Timer1 oscillator shares the T1OSI
and T1OSO pins with the PGD and PGC
pins used for programming and
debugging.
When using the Timer1 oscillator, In-Circuit
Serial Programming™ (ICSP™) may not
function correctly (high voltage or low
voltage) or the In-Circuit Debugger (ICD)
may not communicate with the controller.
As a result of using either ICSP or ICD, the
Timer1 crystal may be dam aged.
If ICSP or ICD operatio ns are requi red, the
crystal should be disconnected from the
circuit (disconnect either lead) or installed
after programming. The oscillator loading
capacitors may remain in-circuit during
ICSP or ICD operation.
External
Connector
Signals
To Norma l
Connections
To Normal
Connections
PIC16F818/819
VDD
VSS
MCLR/VPP
RB6
RB7
+5V
0V
VPP
CLK
Data I/O
VDD
* * *
*
* Isolation devices (as required).
† RB3 only used in LVP mode.
RB3†
RB3/PGM
PIC16F818/819
DS39598F-page 102 2001-2013 Microchip Technology Inc.
12.18 Low-Voltage ICSP Programming
The LVP bit of the Configurat ion W ord r egiste r enable s
Low-V ol tage ICSP Program ming. This mode all ows the
microcontroller to be programmed via ICSP using a
VDD source in the operating voltage range. This only
means that VPP does not have to be brought to VIHH but
can instead be left at the normal operating voltage. In
this mode, the RB3/PGM pin is dedicated to the
programming function and ceases to be a general
purpose I/O pin.
If Low-V oltage Programming mo de is not used, the LVP
bit can be programmed to a ‘0’ and RB3/PGM becomes
a digital I/O pin. However, the LVP bit may only be
programm ed whe n Pro gram m ing m ode is en tere d wi th
VIHH on MCLR. The LVP bi t can only be changed w hen
using high voltage on MCLR.
It should be noted that once the LVP bit is programmed
to ‘0’, only the High-Voltage Programming mode is
available and only this mode can be used to program
the device.
When using Low-Voltage ICSP, the part must be
supplied at 4.5V to 5.5V if a bulk eras e will be ex ecuted.
This includes reprogramming of the code-protect bits
from an ON state to an OFF state. For all other cases of
Low-Voltage ICSP, the part may be programmed at the
normal operating voltage. This means calibration values,
unique user IDs or user code can be reprogrammed or
added.
The following LVP step s assume the LVP bit is set in the
Configuration Word register.
1. Apply VDD to the VDD pin .
2. Drive MCLR low.
3. Apply VDD to the RB3/PGM pin.
4. Apply VDD to the MCLR pin .
5. Follow with the associated programming steps.
Note 1: The High-Voltage Programming mode is
always available, regardless of the state
of the LVP bit, by applying VIHH to the
MCLR pin.
2: While in Low-Voltage ICSP mode
(LVP = 1), the RB3 pin can no longer be
used as a general purpose I/O pin.
3: When using Low-Voltage ICSP Program-
ming (LVP) and the pull-ups on PORTB
are enabled, bit 3 in the TRISB register
must be cleared to disable the pull-up on
RB3 and ensure the proper operation of
the device.
4: RB3 should not be allowed to float if LVP
is enabled. An external pull-down device
should be used to default the device to
normal operating mode. If RB3 floats
high, the PIC16F818/819 device will
enter Programming mode.
5: LVP mode is enabled by default on all
device s shi pped from Microchi p. It can b e
disabled by clearing the LVP bit in the
Configuration Word register.
6: Disabling LVP will provide maximum
compatibility to other PIC16CXXX
devices.
2001-2013 Microchip Technology Inc. DS39598F-page 103
PIC16F818/819
13.0 INSTRUCTION SET SUMMARY
The PIC16 instruction set is highly orthogonal and is
comprised of three basic categories:
•Byte-oriented operations
•Bit-oriented operations
•Literal and cont rol operations
Each PIC16 instruction is a 14-bit word divided into an
opcode, which specifies the instruction type and one or
more operands, which further specify the operation of
the instruction. The formats for each of the categories
are presen ted in Fig ure 13-1, while the vari ous op code
fields are sum m ariz ed in Table 13-1.
Table 13-2 lists the instructions recognized by the
MPASMTM assembler. A complete description of each
instruction is also available in the “PIC® Mid-Range
MCU Family Re ference Man ual” (DS33023).
For byte-oriented instructions, ‘f’ represents a file
register designator and ‘d’ represents a destination
designator. The file register designator specifies which
file register is to be used by the instruction.
The desti nation designator specifies where the result of
the operation is to be placed. If ‘d’ is zero, the result is
placed in the W regis ter . If ‘d’ is one, the res ult is place d
in the file register specified in the instruction.
For bit-oriented instructions, ‘b’ represents a bit field
design ator, which select s the bi t affected by the ope ra-
tion, w hi le ‘f’ represent s th e a ddre ss of the file in which
the bit is located.
For literal and control operations, ‘k’ represents an
eight or eleven-bit constant or literal value
One instr uction cycle co nsists of four os cillator periods .
For an oscill ator fre quenc y of 4 MHz, this giv es a nor-
mal instruction execution time of 1 s. All instructions
are executed within a single instruction cycle, unless a
conditional test is true, or the program counter is
change d as a result of an instruction. When this occurs,
the execution takes two instruction cycles, with the
second cycle executed as a NOP.
All instruction examples use the format ‘0xhh’ to
represent a hexadecimal number, where ‘h’ signifies a
hexadecimal digit.
13.1 READ-MODIFY-WRITE
OPERATIONS
Any instruction that specifies a file register as part of
the instruction performs a Read-Modify-Write (R-M-W)
operatio n. The register is read, the data is modi fied and
the resul t is stored ac cording to e ither the ins truction or
the destination designator ‘d’. A read operation is
perfor me d on a regi st er ev en if the instructi on w ri tes to
that register.
For example, a “CLRF PORTB” instruction will read
PORTB, clear all the data bits, then write the result
back to PORTB. This example would have the
unintended result that the condition that sets the RBIF
flag would be cleared.
TABLE 13-1: OPCODE FIELD
DESCRIPTIONS
FIGURE 13-1: GENERAL FORMAT FOR
INSTRUCTIONS
Note: To maintain upward compatibility with
future PIC16F818/819 products, do not
use the OPTION and TRIS instructions.
Field Description
fRegister file address (0x00 to 0x7F)
WWorking register (accumulator)
bBit address within an 8-bit file register
kLiteral field , constant data or label
xDon’t care location (= 0 or 1).
The assembler will generate code with x = 0.
It is the recommended form of use for
compatibility with all Microchip software tools.
dDestination select; d = 0: store result in W,
d = 1: store result in file register f.
Default is d = 1.
PC Program Counter
TO Time-out bit
PD Power-Down bit
Byte-oriented file r egister op erations
13 8 7 6 0
d = 0 for destination W
OPCODE d f (FILE #)
d = 1 for destination f
f = 7-bit file register address
Bit-oriente d file register operations
13 10 9 7 6 0
OPCODE b (BIT # ) f (FILE #)
b = 3-bit bit address
f = 7-bit file register address
Literal and control operations
13 8 7 0
OPCODE k (literal )
k = 8-bit immediate value
13 11 10 0
OPCODE k (literal)
k = 11-bit immediate value
General
CALL and GOTO instructions only
PIC16F818/819
DS39598F-page 104 2001-2013 Microchip Technology Inc.
TABLE 13-2: PIC16F818/819 INSTRUCTION SET
Mnemonic,
Operands Description Cycles 14-Bit Opcode Status
Affected Notes
MSb LSb
BYTE-ORIENTED FILE REGISTER OPERATIONS
ADDWF
ANDWF
CLRF
CLRW
COMF
DECF
DECFSZ
INCF
INCFSZ
IORWF
MOVF
MOVWF
NOP
RLF
RRF
SUBWF
SWAPF
XORWF
f, d
f, d
f
-
f, d
f, d
f, d
f, d
f, d
f, d
f, d
f
-
f, d
f, d
f, d
f, d
f, d
Add W and f
AND W with f
Clear f
Clear W
Complement f
Decrement f
Decrement f, Skip if 0
Increment f
Increment f, Skip if 0
Inclusive OR W with f
Move f
Mov e W to f
No Operation
Rotate Left f through Carry
Rotate Right f through Carry
Subtract W from f
Swap nibbles in f
Exclusive OR W with f
1
1
1
1
1
1
1 (2)
1
1 (2)
1
1
1
1
1
1
1
1
1
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
0111
0101
0001
0001
1001
0011
1011
1010
1111
0100
1000
0000
0000
1101
1100
0010
1110
0110
dfff
dfff
lfff
0xxx
dfff
dfff
dfff
dfff
dfff
dfff
dfff
lfff
0xx0
dfff
dfff
dfff
dfff
dfff
ffff
ffff
ffff
xxxx
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
0000
ffff
ffff
ffff
ffff
ffff
C, DC, Z
Z
Z
Z
Z
Z
Z
Z
Z
C
C
C, DC, Z
Z
1, 2
1, 2
2
1, 2
1, 2
1, 2, 3
1, 2
1, 2, 3
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF
BSF
BTFSC
BTFSS
f, b
f, b
f, b
f, b
Bit Clear f
Bit Se t f
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
1
1
1 (2)
1 (2)
01
01
01
01
00bb
01bb
10bb
11bb
bfff
bfff
bfff
bfff
ffff
ffff
ffff
ffff
1, 2
1, 2
3
3
LITERAL AND CONTROL OPERATIONS
ADDLW
ANDLW
CALL
CLRWDT
GOTO
IORLW
MOVLW
RETFIE
RETLW
RETURN
SLEEP
SUBLW
XORLW
k
k
k
-
k
k
k
-
k
-
-
k
k
Add literal and W
AND literal with W
Call subroutine
Clear Watchdog Timer
Go to address
Inclusive OR literal with W
Move litera l to W
Return from interrupt
Return with literal in W
Return from Subroutine
Go into Standby mode
Subtract W from literal
Exclusive OR literal with W
1
1
2
1
2
1
1
2
2
2
1
1
1
11
11
10
00
10
11
11
00
11
00
00
11
11
111x
1001
0kkk
0000
1kkk
1000
00xx
0000
01xx
0000
0000
110x
1010
kkkk
kkkk
kkkk
0110
kkkk
kkkk
kkkk
0000
kkkk
0000
0110
kkkk
kkkk
kkkk
kkkk
kkkk
0100
kkkk
kkkk
kkkk
1001
kkkk
1000
0011
kkkk
kkkk
C, DC, Z
Z
TO, PD
Z
TO, PD
C, DC, Z
Z
Note 1: When an I/O register is modified as a function of itself ( e.g., MOVF PORTB, 1), the value used will be that value
present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and is driven low by an
external device, the data will be written back with a ‘0’.
2: If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be cleared if
assigned to the Timer0 module.
3: If the Program Counter (PC) is modified or a conditional test is true, the instruction requires two cycles. The second
cycle is executed as a NOP.
Note: Additional information on the mid-range instruction set is available in the “PIC® Mid-Range MCU Family
Reference Manual” (DS33023).
2001-2013 Microchip Technology Inc. DS39598F-page 105
PIC16F818/819
13.2 Instruction Descriptions
ADDLW Add Literal and W
Syntax: [ label ] ADDLW k
Operands: 0 k 255
Operation: (W) + k (W)
Status Affected: C, DC, Z
Description: The contents of the W register
are added to the eight-bi t literal ‘k’
and the result is placed in the W
register.
ADDWF Add W and f
Syntax: [ label ] ADDWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) + (f) (destination)
Status Affected: C, DC, Z
Desc ription: Ad d the content s of the W register
with reg ister ‘f’. If ‘d’ = 0, the resu lt
is stored in the W register. If
‘d’ = 1, the re su lt i s sto red back in
register ‘f’.
ANDLW AND Literal with W
Syntax: [ label ] ANDLW k
Operands: 0 k 255
Operation: (W) .AND. (k) (W)
Status Affected: Z
Description: The contents of W regi ster are
ANDed with the ei ght-bit literal ‘k’.
The result is placed in the W
register.
ANDWF AND W with f
Syntax: [ label ] ANDWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .AND. (f) (d estination)
Status Af fe cte d: Z
Description: AND the W register with register
‘f’. If ‘d’ = 0, the result is stored in
the W regis ter. If ‘d’ = 1, the result
is stored back in register ‘f’.
BCF Bit Clear f
Syntax: [ label ] BCF f,b
Operands: 0 f 127
0 b 7
Operation: 0 (f<b>)
Status Af fe cte d: None
Description: Bit ‘b’ in register ‘f’ is cleared.
BSF Bit Set f
Syntax: [ label ] BSF f,b
Operands: 0 f 127
0 b 7
Operation: 1 (f<b>)
Status Af fe cte d: None
Description: Bit ‘b’ in register ‘f’ is set.
PIC16F818/819
DS39598F-page 106 2001-2013 Microchip Technology Inc.
BTFSS Bit Test f, Skip if Set
Syntax: [ label ] BTFSS f,b
Operands: 0 f 127
0 b < 7
Operation: skip if (f<b>) = 1
Status Affected: None
Description: If bit ‘b’ in register ‘f’ = 0, the next
instructi on is exec uted .
If bit ‘b’ = 1, then the next
instructi on is discarded an d a NOP
is exec ute d i nst ead, making this a
2 TCY instruction.
BTFSC Bit Test, Skip if Clear
Syntax: [ label ] BTFSC f,b
Operands: 0 f 127
0 b 7
Operation: skip if (f<b>) = 0
Status Affected: None
Description: If bit ‘b’ in register ‘f’ = 1, the next
instruction is executed.
If bit ‘b’ in register ‘f’ = 0, the next
inst ruc tion is di sc ard ed and a NOP
is exec ute d ins te ad, m ak in g thi s a
2 TCY instruct ion.
CALL Call Subroutine
Syntax: [ label ] CALL k
Operands: 0 k 204 7
Operation: (PC) + 1 TOS,
k PC<10:0>,
(PCLATH<4:3>) PC<12:11>
Status Affected: None
Description: Call subroutine. First, return
address (PC + 1) is pushed onto
the stack. The eleven-bit
immediate address is loaded into
PC bits<10:0>. The upper bits of
the PC are loa ded from PCLATH.
CALL is a two-cycle instruction.
CLRF Clear f
Syntax: [ label ] CLRF f
Operands: 0 f 127
Operation: 00h (f)
1 Z
Status Af fe cte d: Z
Description: The contents of register ‘f’ are
cleared and the Z bit is set.
CLRW Clear W
Syntax: [ label ] CLRW
Operands: None
Operation: 00h (W)
1 Z
Status Af fe cte d: Z
Description: W register is cleared. Zero bit (Z)
is se t.
CLRWDT Clear Watchdog Timer
Syntax: [ label ] CLRWDT
Operands: None
Operation: 00h WDT
0 WDT prescaler,
1 TO
1 PD
Status Af fe cte d: TO, PD
Description: CLRWDT instruction resets the
W atchdog T imer . It also resets the
prescaler of the WDT. Status bits
TO and PD are set.
2001-2013 Microchip Technology Inc. DS39598F-page 107
PIC16F818/819
COMF Complement f
Syntax: [ label ] COMF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (destination)
Status Affected: Z
Description: The contents of register ‘f’ are
complemented. If ‘d’ = 0, the
result is stored in W. If ‘d’ = 1, the
result is stored back in register ‘f’.
DECF Decrement f
Syntax: [ label ] DECF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) – 1 (destination)
Status Affected: Z
Description: Decrement register ‘f’. If ‘d’ = 0,
the result is stored in the W
register. If ‘d’ = 1, the result is
stored back in register ‘f’.
DECFSZ Decrement f, Skip if 0
Syntax: [ label ] DECFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) – 1 (destination);
skip if result = 0
Status Affected: None
Description: The contents of register ‘f’ are
decremented. If ‘d’ = 0, the result
is placed in the W register. If
‘d’ = 1, the result is placed back in
register ‘f’.
If the result is ‘1’, the next
instruction is executed. If the
resu lt is ‘0’, then a NOP is
executed instead, making it a
2 TCY instruction.
GOTO Unconditional Branch
Syntax: [ label ] GOTO k
Operands: 0 k 2047
Operation: k PC<10:0>
PCLATH<4:3> PC<12:11>
Status Af fe cte d: None
Description: GOTO is an unconditional branch.
The e leven-bit immediat e v alu e i s
loaded into PC bits<10:0>. The
upper bits of PC are loaded
from PCLATH<4:3>. GOTO is a
two-cycle in struction.
INCF Increment f
Syntax: [ label ] INCF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination)
Status Af fe cte d: Z
Description: The contents of register ‘f’ are
incremented. If ‘d’ = 0, the result
is placed in the W register. If
‘d’ = 1, the resul t is placed back in
register ‘f’.
INCFSZ Increment f, Skip if 0
Syntax: [ label ] INCFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination),
skip if result = 0
Status Af fe cte d: None
Description: The contents of register ‘f’ are
incremen ted. If ‘d’ = 0, th e result is
placed in the W register. If ‘d’ = 1,
the result is placed back in
register ‘f’.
If the result is ‘1’, the next
instruction is executed. If the
result is ‘0’, a NOP is executed
instead, making it a 2 TCY
instruction.
PIC16F818/819
DS39598F-page 108 2001-2013 Microchip Technology Inc.
IORLW Inclusive OR Literal with W
Syntax: [ label ] IORLW k
Operands: 0 k 255
Operation: (W) .OR. k (W)
Status Affected: Z
Desc ription: The conten ts of the W register are
ORed with the eight-bit literal ‘k’.
The result is placed in the W
register.
IORWF Inclusive OR W with f
Syntax: [ label ] IORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .OR. (f) (destination)
Status Affected: Z
Description: Inclusive OR the W register with
register ‘f’. If ‘d’ = 0, the result is
placed in th e W re gis ter. If ‘d’ = 1,
the result is placed back in
register ‘f’.
MOVF Move f
Syntax: [ label ] MOVF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (destination )
Status Affected: Z
Description: The contents of register ‘f’ are
moved t o a destination dependant
upon the status of ‘d’. If ‘d’ = 0,
the dest ination is W register. If
‘d’ = 1, th e desti na tion is file re gis-
ter ‘f’ itself. ‘d’ = 1 is useful to test
a file register since status flag Z is
affected.
MOVLW Move Literal to W
Syntax: [ label ] MOVLW k
Operands: 0 k 255
Operation: k (W)
Status Af fe cte d: None
Description: The eight-bit literal ‘k’ is loaded
into W register. The don’t cares
will assemble as ‘0’s.
MOVWF Move W to f
Syntax: [ label ] MOVWF f
Operands: 0 f 127
Operation: (W) (f)
Status Af fe cte d: None
Description: Move data from W register to
register ‘f’.
NOP No Operation
Syntax: [ label ] NOP
Operands: None
Operation: No operation
Status Af fe cte d: None
Description: No operation.
2001-2013 Microchip Technology Inc. DS39598F-page 109
PIC16F818/819
RETFIE Return from Interrupt
Syntax: [ label ] RETFIE
Operands: None
Operation: TOS PC,
1 GIE
Status Affected: None
RETLW Return with Literal in W
Syntax: [ label ] RETLW k
Operands: 0 k 255
Operation: k (W);
TOS PC
Status Affected: None
Description: The W register is loaded with the
eight-bit literal ‘k’. The program
counter is loaded from the top of
the stack (the return address).
This is a two-cycle instruction.
RETURN Return from Subroutin e
Syntax: [ label ] RETURN
Operands: None
Operation: TOS PC
Status Affected: None
Description: Return from subroutine. The stack
is POPed an d t he top o f th e s t a ck
(TOS) is loaded into the program
counter. This is a two-cycle
instruction.
RLF Rotate Left f through Carry
Syntax: [ label ] RLF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Af fe cte d: C
Description: The contents of register ‘f’ are
rotated one bit to the left through
the C arry flag . If ‘ d’ = 0, the res ult
is placed in the W register. If
‘d’ = 1, the result is st ored back in
register ‘f’.
RRF Rotate Right f through Carry
Syntax: [ label ] RRF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Af fe cte d: C
Description: The contents of register ‘f’ are
rotate d one bit to the righ t through
the Carry flag. If ‘d’ = 0, the result
is placed in the W register. If
‘d’ = 1, the result is placed ba ck in
register ‘f’.
SLEEP Enter Sleep mode
Syntax: [ label ]SLEEP
Operands: None
Operation: 00h WDT,
0 WDT prescaler,
1 TO,
0 PD
Status Af fe cte d: TO, PD
Descripti on : The Power-Down st atu s bit, PD,
is cleared. Time-out status bit,
TO, is set. Watchdog Timer and
its prescaler are cleared.
The processor is put into Sleep
mode with the oscillator stopped.
Register fC
Register fC
PIC16F818/819
DS39598F-page 110 2001-2013 Microchip Technology Inc.
SUBLW Subtract W from Literal
Syntax: [ label ] SUBLW k
Operands: 0 k 255
Operation: k – (W) W)
Status Affected: C, DC, Z
Desc ript ion : The W register is subtra cte d (2’ s
complement method) from the
eight-bit literal ‘k’. The result is
placed in the W register.
SUBWF Subtract W from f
Syntax: [ label ] SUBWF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) – (W) destination)
Status Affected: C, DC, Z
Description: Subtract (2’s complement method)
W register from register ‘f’. If
‘d’ = 0, the result is stored in the W
register. If ‘d’ = 1, the result is
stored back in register ‘f’.
SWAPF Swap Nibbles in f
Syntax: [ label ] SWAPF f,d
Operands: 0 f 127
d [0,1]
Operation: (f<3:0>) (destination<7:4>),
(f<7:4>) (destination<3:0>)
Status Affected: None
Description: The upper and lower nibbles of
register ‘f’ are exchanged. If
‘d’ = 0, the result is placed in W
register. If ‘d’ = 1, the result is
placed in register ‘f’.
XORLW Exclusive OR Literal with W
Syntax: [ label ]XORLW k
Operands: 0 k 255
Operation: (W) .XOR. k W)
Status Af fe cte d: Z
Description: The contents of the W register
are XORed with the eight-b it
literal ‘k’. The result is placed in
the W register.
XORWF Exclusive OR W with f
Syntax: [ label ] XORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .XOR. (f) destination)
Status Af fe cte d: Z
Description: Exclusive OR the contents of the
W register with register ‘f’. If
‘d’ = 0, the result is stored in the
W register. If ‘d’ = 1, the result is
stored back in register ‘f’.
2001-2013 Microchip Technology Inc. DS39598F-page 111
PIC16F818/819
14.0 DEVELOPMENT SUPPORT
The PIC® microcontrollers and dsPIC® digital signal
controllers are supported with a full range of software
and hardware development tools:
• Integrated Development Environment
- MPLAB® IDE Software
• Compilers/Assemblers/Linkers
- MPLAB C Compiler for Various Device
Families
- HI-TECH C® for Various Device Families
- MPASMTM Assembler
-MPLINK
TM Object Linker/
MPLIBTM Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
• Simulators
- MPLAB SIM Software Simulator
•Emulators
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debuggers
- MPLAB ICD 3
- PICkit™ 3 Debug Express
• Device Progra mmers
- PICkit™ 2 Programmer
- MPLAB PM3 Device Programmer
• Low-Cost Demonstrati on/Development Boards,
Evaluation Kits, and Starter Kits
14.1 MPLAB Integrated Development
Environment Software
The MPLAB IDE software brings an ease of software
development previously unseen in the 8/16/32-bit
microcontroller market. The MPLAB IDE is a Windows®
operating system-based application that contains:
• A single graphical interface to all debugging tools
- Simulator
- Programmer (sold separately)
- In-Circuit Emulator (sold separately)
- In-C ircuit De bugg e r (sold separ atel y)
• A full-featured editor with color-coded context
• A multiple project manager
• Customizable data windows with direct edit of
contents
• High-level source code debugging
• Mouse over variable inspection
• Drag and drop variables from source to watch
windows
• Exten si ve on-l in e help
• Integration of selec t third party tools, such as
IAR C Compilers
The MPLAB IDE allows you to:
• Edit your source files (either C or assem bly)
• One-tou ch compile o r assemble , and downl oad to
emulator and simulator tools (automatically
updates all project information)
• Debug us ing :
- Sour ce fil es (C or assembly)
- Mixed C and assembly
- Machine code
MPLAB IDE supports multiple debugging tools in a
single development paradigm, from the cost-effective
simulators, through low-cost in-circuit debuggers, to
full-featured emulators. This eliminates the learning
curve when upgrading to tools with increased flexibility
and power.
PIC16F818/819
DS39598F-page 112 2001-2013 Microchip Technology Inc.
14.2 MPLAB C Compilers for Various
Device Families
The MPLAB C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC18,
PIC24 and PIC32 families of microcontrollers and the
dsPIC30 and dsPIC33 families of digital signal control-
lers. These compilers provide powerful integration
capabilities, superior code optimization and ease of
use.
For easy source level debugging, the compilers provide
symbol info rmation tha t is optimized to the MPLAB IDE
debugger.
14.3 HI-TECH C for Various Device
Families
The HI-TECH C Compiler code development systems
are complete ANSI C compilers for Microchip’s PIC
family of microcontrollers and the dsPIC family of dig ital
signal controllers. These compilers provide powerful
integration capabilities, omniscient code generation
and ease of use.
For easy source level debugging, the compilers provide
symbol info rmation tha t is optimized to the MPLAB IDE
debugger.
The compilers include a macro assembler, linker, pre-
process or , and one-s tep driver , and can run on multipl e
platforms.
14.4 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files fo r the MPLINK Ob ject Linker , Int el® standa rd HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code and COFF files for
debugging.
The MPASM Assembler features include:
• Integration into MPLAB IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multi-purpose
sour ce fil es
• Directives that allow complete control over the
assembly process
14.5 MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler and the
MPLA B C18 C Compiler. It can link relocatable objects
from precompiled libraries, using directives from a
linker script.
The MPLIB O bject Li brarian manage s the cre ation an d
modification of library files of precompiled code. When
a rout in e from a l ibra ry is called fro m a so urc e f ile , only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion an d extr action
14.6 MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC devices. MPLAB C Compiler uses
the asse mbler to pro duce i ts o bje ct file . The ass embl er
generates relocatable object files that can then be
archived or linked with other relocatable object files and
arch ives to c rea te an e xecu tabl e fil e. N otab le fe atu res
of the assembler include:
• Support for the entire device instruction set
• Support for fixed-point and floating-point data
• Command line interface
• Rich dire cti ve set
• Flexible macro language
• MPLAB IDE compatibility
2001-2013 Microchip Technology Inc. DS39598F-page 113
PIC16F818/819
14.7 MPLAB SIM Software Simulator
The MPLAB SIM Software Simulator allows code
development in a PC-hosted environment by simulat-
ing the PIC MCUs and dsPIC® DSCs on an instruction
level. On any gi ven instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most periph erals and i nternal regi sters.
The MPLAB SIM Software Simulator fully supports
symbolic debugging using the MPLAB C Compilers,
and the MPASM and MPLAB Assemblers. The soft-
ware simulator offers the flexibility to develop and
debug code outside of the hardware laboratory envi-
ronment, making it an excellent, economical software
developm ent tool .
14.8 MPLAB REAL ICE In-Circuit
Emulator System
MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs PIC® Flash MCUs and dsPIC® Flash DSCs
with the easy-to-use, powerful graphical user interface of
the MPLAB Integrated D evelopment Environment (IDE),
included with each kit.
The emulator is connected to the design engineer’s PC
using a high-speed USB 2.0 interface and is connected
to the target with either a connector compatible with in-
circuit debugger systems (RJ11) or with the new high-
speed, noise tolerant, Low-Voltage Differential Signal
(LVDS) interconnection (CAT5).
The emulator is field upgrad able through future firmware
downloads in MPLAB IDE. In upcoming releases of
MPLAB IDE, new devices will be supported, and new
features will be added. MPLAB REAL ICE offers
significant advantages over competitive emulators
including low-cost, full-speed emulation, run-time
variable watches, trace analysis, complex breakpoints, a
ruggedized probe interface and long (up to three meters)
interconnection cables.
14.9 MPLAB ICD 3 In-Circuit Debugger
System
MPLAB ICD 3 In-Circuit Debugger System is Micro-
chip's most cost effective high-speed hardware
debugger/programmer for Microchip Flash Digital Sig-
nal Controller (DSC) and microcontroller (MCU)
device s. It debugs and programs PIC® Flash microcon-
trollers and dsPIC® DSCs with the powerful, yet easy-
to-use graphical user interface of MPLAB Integrated
Development Environment (IDE).
The MPLAB ICD 3 In-Circuit Debugger probe is con-
nect ed to t he des ign e nginee r's PC using a hig h-spee d
USB 2.0 i nte rfac e a nd is co nnected to the target with a
connector compatible with the MPLAB ICD 2 or MPLAB
REAL ICE systems (RJ-11). MPLAB ICD 3 support s all
MPLAB ICD 2 headers.
14.10 PICkit 3 In-Circuit Debugger/
Programmer and
PICkit 3 Debug Express
The MPLAB PICkit 3 allows debugging and program-
ming of PIC® and dsPIC® Flash microcontrollers at a
most af fordable price point using the powerful graphi cal
user interface of the MPLAB Integrated Development
Environment (IDE). The MPLAB PICkit 3 is connected
to the design engineer's PC using a full speed USB
interface and can be connected to the target via an
Microchip debug (RJ-11) connector (compatible with
MPLAB ICD 3 and MPLAB REAL ICE). The connector
uses two device I/O pins and the reset line to imple-
ment in-circuit debugging and In-Circuit Serial Pro-
gramming™.
The PICkit 3 Debug Express include the PICkit 3, demo
board and microcontroller , hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
PIC16F818/819
DS39598F-page 114 2001-2013 Microchip Technology Inc.
14.11 PICkit 2 Development
Programmer/Debugger and
PICkit 2 Debug Express
The P ICkit™ 2 Develo pment Program mer/Debu gger i s
a low-cost development tool with an easy to use inter-
face fo r programmin g and debu gging Micr ochip’s Flash
families of microcontrollers. The full featured
Windows® programming interface supports baseline
(PIC10F, PIC12F5xx, PIC16F5xx), midrange
(PIC12F6xx, PIC16F), PIC18F, PIC24, dsPIC30,
dsPIC33, and PIC32 fam il ies o f 8 - bi t, 1 6-b it, an d 3 2-b it
microcontrollers, and many Microchip Serial EEPROM
produ cts . With Mic rochip ’s power ful MPL AB Integrate d
Development Environment (IDE) the PICkit™ 2
enables in-circuit debugging on most PIC® microcon-
trollers. In-Circuit-Debugging runs, halts and single
steps the program while the PIC microcontroller is
embedded in the application. When halted at a break-
point, the file reg ist ers can be ex amin ed and m odifie d.
The PICkit 2 Debug Express include the PICkit 2, demo
board and microcontroller, hookup cables and CDROM
with user’s guide, lessons, tutorial, compiler and
MPLAB IDE software.
14.12 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64 ) for me nus an d err or messag es an d a modu-
lar, detachable socket assembly to support various
package types. The ICSP™ cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Devic e Programmer can rea d, verify an d program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or U SB cable.
The MPL AB PM3 has high-spe ed comm unications and
optimized algorithms for quick programming of large
memory devices and inc orporates an MMC card for file
storage and data applications.
14.13 Demonstration/Development
Boards, Evaluation Kits, and
Starter Kits
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully func-
tional systems. Most boards include prototyping areas for
adding custom circuitry and provide application firmware
and source code for examination and modification.
The board s support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory .
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™ demon-
stration/development board series of circuits, Microchip
has a line of evaluation kits and demonstration software
for analog filter design, KEELOQ® security ICs, CAN,
IrDA®, PowerSmart battery management, SEEVAL®
evaluation system, Sigma-Delta ADC, flow rate
sensing, plus many more.
Also available are starter kits that contain everything
needed to experience t he specified d evice. This usually
includes a single application and debug capability, all
on one board.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
2001-2013 Microchip Technology Inc. DS39598F-page 115
PIC16F818/819
15.0 ELECTRICAL CHARAC TERISTICS
Absolute Maximum Ratings †
Ambient temperature under bias ............................................................................................................ -40°C to +125°C
Storage temperature.............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to VSS (except VDD and MCLR) ...................................................-0.3V to (VDD + 0.3V)
Volta ge on VDD with respect to VSS ............................................................................................................ -0.3 to +7.5V
Volta ge on MCLR with respect to VSS (Note 2).............................................................................................-0.3 to +14V
Total powe r dissipation (Note 1) ..................................................................................................................................1W
Maximum current out of VSS pin...........................................................................................................................200 mA
Maximum current into VDD pin..............................................................................................................................200 mA
Input clamp current, IIK (VI < 0 or VI > VDD)..........................................................................................................±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD)...................................................................................................±20 mA
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk byPORTA........................................................................................................................100 mA
Maximum current sourced by PORTA...................................................................................................................100 mA
Maximum current sunk byPORTB........................................................................................................................100 mA
Maximum current sourced by PORTB ..................................................................................................................100 mA
Note 1: Power dissip ation i s calcu lated as follows: Pdi s = VDD x { IDD – IOH} + {(VDD – V OH) x IOH} + (VOL x IOL)
2: Voltage spikes at the MCLR pin may cause latch-up. A series resistor of greater than 1 k should be used
to pull MCLR to VDD, rather than tying the pin directly to VDD.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
PIC16F818/819
DS39598F-page 116 2001-2013 Microchip Technology Inc.
FIGURE 15-1: PIC16F81 8/819 VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL, EXTENDED)
FIGURE 15-2: PIC16LF81 8/819 VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
Frequency
Voltage
6.0V
5.5V
4.5V
4.0V
2.0V
20 MHz
5.0V
3.5V
3.0V
2.5V
16 MHz
Frequency
Voltage
6.0V
5.5V
4.5V
4.0V
2.0V
5.0V
3.5V
3.0V
2.5V
FMAX = (12 MHz/V) (VDDAPPMIN – 2.5V) + 4 MHz
Note 1: VDDAPPMIN is the minimum voltage of the PIC® device in the application.
4 MHz 10 MHz
Note 2: FMAX has a maximum frequency of 10 MHz.
2001-2013 Microchip Technology Inc. DS39598F-page 117
PIC16F818/819
15.1 DC Charact eristics: Supply Voltage
PIC16F818/819 (Industrial, Extended)
PIC16LF818/819 (I ndustrial)
PIC16LF818/819
(Industrial) Stand ard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
PIC16F818/819
(Industrial, Extended)
Stand ard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Symbol Characteristic Min Typ Max Units Conditions
VDD Supply Voltag e
D001 PIC16LF818/819 2.0 — 5.5 V HS, XT, RC and LP Oscillator mode
D001 PIC16F818/819 4.0 —5.5 V
D002 VDR RAM Data Retention
Voltage(1) 1.5 — — V
D003 VPOR VDD Start Vo l tage
to ensure internal
Power-on Reset signal
— — 0.7 V S ee Section 12.4 “Power-on Reset (POR)”
for details
D004 SVDD VDD Rise Rate
to ensure internal
Power-on Reset signal
0.05 — — V/ms S ee Section 12.4 “Power-on Reset (POR)”
for details
VBOR Brown-out R e set Voltage
D005 PIC16LF818/819 3.65 — 4.35 V
D005 PIC16F818/819 3.65 —4.35 V FMAX = 14 MHz(2)
Legend: Shading of rows is to assist in readability of the table.
Note 1: This is the limit to which VDD can be lowered in Sleep mode, or during a device Reset, without losing RAM data
2: When BOR is enabled, the device will operate correctly until the VBOR voltage trip point is reached.
PIC16F818/819
DS39598F-page 118 2001-2013 Microchip Technology Inc.
15.2 DC Charact eristics: Power-Down and Supply Current
PIC16F818/819 (I ndustrial, Extended)
PIC16LF818/819 (I ndustrial)
PIC16LF818/819
(Industrial) Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
PIC16F818/819
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Typ Max Units Conditions
Power-Down Current (IPD)(1)
PIC16LF818/819 0.1 0.4 A -40°C VDD = 2.0V0.1 0.4 A+25°C
0.4 1.5 A+85°C
PIC16LF818/819 0.3 0.5 A -40°C VDD = 3.0V0.3 0.5 A+25°C
0.7 1.7 A+85°C
All devices 0.6 1.0 A -40°C
VDD = 5.0V
0.6 1.0 A+25°C
1.2 5.0 A+85°C
Extended devices 6.0 28 A +125°C
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in k.
2001-2013 Microchip Technology Inc. DS39598F-page 119
PIC16F818/819
Supply Current (IDD)(2,3)
PIC16LF818/819 9 20 A -40°C VDD = 2.0V
FOSC = 32 kHZ
(LP Oscillator)
715A+25°C
715A+85°C
PIC16LF818/819 16 30 A -40°C VDD = 3.0V14 25 A+25°C
14 25 A+85°C
All devices 32 40 A -40°C
VDD = 5.0V
26 35 A+25°C
26 35 A+85°C
Extended devices 35 53 A +125°C
15.2 DC Charact eristics: Power-Down and Supply Current
PIC16F818/819 (I ndustrial, Extended)
PIC16LF818/819 (I ndustrial) (Continued)
PIC16LF818/819
(Industrial) Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
PIC16F818/819
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in k.
PIC16F818/819
DS39598F-page 120 2001-2013 Microchip Technology Inc.
Supply Current (IDD)(2,3)
PIC16LF818/819 72 95 A -40°C VDD = 2.0V
FOSC = 1 MH Z
(RC Oscillator)(3)
76 90 A+25°C
76 90 A+85°C
PIC16LF818/819 138 175 A -40°C VDD = 3.0V136 170 A+25°C
136 170 A+85°C
All devices 310 380 A -40°C
VDD = 5.0V
290 360 A+25°C
280 360 A+85°C
Extended devices 350 500 A +125°C
PIC16LF818/819 270 315 A -40°C VDD = 2.0V
FOSC = 4 MHz
(RC Oscillator)(3)
280 310 A+25°C
285 310 A+85°C
PIC16LF818/819 460 610 A -40°C VDD = 3.0V450 600 A+25°C
450 600 A+85°C
All devices 900 1060 A -40°C
VDD = 5.0V
890 1050 A+25°C
890 1050 A+85°C
Extended devices .920 1.5 mA +125°C
15.2 DC Charact eristics: Power-Down and Supply Current
PIC16F818/819 (I ndustrial, Extended)
PIC16LF818/819 (I ndustrial) (Continued)
PIC16LF818/819
(Industrial) Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
PIC16F818/819
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in k.
2001-2013 Microchip Technology Inc. DS39598F-page 121
PIC16F818/819
Supply Current (IDD)(2,3)
All devices 1.8 2.3 mA -40°C VDD = 4.0V
FOSC = 20 MHZ
(HS Os cillator)
1.6 2.2 mA +25°C
1.3 2.2 mA +85°C
All devices 3.0 4.2 mA -40°C
VDD = 5.0V
2.5 4.0 mA +25°C
2.5 4.0 mA +85°C
Extended devices 3.0 5.0 mA +125°C
15.2 DC Charact eristics: Power-Down and Supply Current
PIC16F818/819 (I ndustrial, Extended)
PIC16LF818/819 (I ndustrial) (Continued)
PIC16LF818/819
(Industrial) Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
PIC16F818/819
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in k.
PIC16F818/819
DS39598F-page 122 2001-2013 Microchip Technology Inc.
Supply Current (IDD)(2,3)
PIC16LF818/819 8 20 A -40°C VDD = 2.0V
FOSC = 31.25 kHz
(RC_RUN mode,
Internal RC Oscillator)
715A+25°C
715A+85°C
PIC16LF818/819 16 30 A -40°C VDD = 3.0V14 25 A+25°C
14 25 A+85°C
All devices 32 40 A -40°C
VDD = 5.0V
29 35 A+25°C
29 35 A+85°C
Extended devices 35 45 A +125°C
PIC16LF818/819 132 160 A -40°C VDD = 2.0V
FOSC = 1 MHz
(RC_RUN mode,
Internal RC Oscillator)
126 155 A+25°C
126 155 A+85°C
PIC16LF818/819 260 310 A -40°C VDD = 3.0V230 300 A+25°C
230 300 A+85°C
All devices 560 690 A -40°C
VDD = 5.0V
500 650 A+25°C
500 650 A+85°C
Extended devices 570 710 A +125°C
PIC16LF818/819 310 420 A -40°C VDD = 2.0V
FOSC = 4 MHz
(RC_RUN mode,
Internal RC Oscillator)
300 410 A+25°C
300 410 A+85°C
PIC16LF818/819 550 650 A -40°C VDD = 3.0V530 620 A+25°C
530 620 A+85°C
All devices 1.2 1.5 mA -40°C
VDD = 5.0V
1.1 1.4 mA +25°C
1.1 1.4 mA +85°C
Extended devices 1.3 1.6 mA +125°C
15.2 DC Charact eristics: Power-Down and Supply Current
PIC16F818/819 (I ndustrial, Extended)
PIC16LF818/819 (I ndustrial) (Continued)
PIC16LF818/819
(Industrial) Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
PIC16F818/819
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in k.
2001-2013 Microchip Technology Inc. DS39598F-page 123
PIC16F818/819
Supply Current (IDD)(2,3)
PIC16LF818/819 .950 1.3 mA -40°C VDD = 3.0V
FOSC = 8 MHz
(RC_RUN mode,
Internal RC Oscillator)
.930 1.2 mA +25°C
.930 1.2 mA +85°C
All devices 1.8 3.0 mA -40°C
VDD = 5.0V
1.7 2.8 mA +25°C
1.7 2.8 mA +85°C
Extended devices 2.0 4.0 mA +125°C
15.2 DC Charact eristics: Power-Down and Supply Current
PIC16F818/819 (I ndustrial, Extended)
PIC16LF818/819 (I ndustrial) (Continued)
PIC16LF818/819
(Industrial) Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
PIC16F818/819
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in k.
PIC16F818/819
DS39598F-page 124 2001-2013 Microchip Technology Inc.
D022
(IWDT)Module Differential Currents (IWDT, IBOR, ILVD, IOSCB, IAD)
Wa tchdog T imer 1.5 3.8 A -40°C VDD = 2.0V2.2 3.8 A+25°C
2.7 4.0 A+85°C
2.3 4.6 A -40°C VDD = 3.0V2.7 4.6 A+25°C
3.1 4.8 A+85°C
3.0 10.0 A -40°C
VDD = 5.0V
3.3 10.0 A+25°C
3.9 13.0 A+85°C
Extended Devices 5.0 21.0 A +125°C
D022A
(IBOR)Brown-out Reset 40 60 A-40C to +85CV
DD = 5.0V
D025
(IOSCB)Timer1 Oscillator 1.7 2.3 A -40°C VDD = 2.0V
32 kHz on Timer1
1.8 2.3 A+25°C
2.0 2.3 A+85°C
2.2 3.8 A -40°C VDD = 3.0V2.6 3.8 A+25°C
2.9 3.8 A+85°C
3.0 6.0 A -40°C VDD = 5.0V3.2 6.0 A+25°C
3.4 7.0 A+85°C
D026
(IAD)A/D Converter 0.001 2.0 A-40C to +85CV
DD = 2.0V
A/D on, Sleep, not converting
0.001 2.0 A-40C to +85CV
DD = 3.0V
0.003 2.0 A-40C to +85CVDD = 5.0V
Extended Devices 4.0 8.0 A-40C to +125C
15.2 DC Charact eristics: Power-Down and Supply Current
PIC16F818/819 (I ndustrial, Extended)
PIC16LF818/819 (I ndustrial) (Continued)
PIC16LF818/819
(Industrial) Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
PIC16F818/819
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Typ Max Units Conditions
Legend: Shading of rows is to assist in readability of the table.
Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta
current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading
and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on
the current consumption.
The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD;
MCLR = VDD; WDT enabled/disabled as specified.
3: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be estimated
by the formula Ir = VDD/2REXT (mA) with REXT in k.
2001-2013 Microchip Technology Inc. DS39598F-page 125
PIC16F818/819
15.3 DC Charact eristics: Internal RC Accuracy
PIC16F818/819, PIC16F818/ 819 TSL (Industrial, Extended)
PIC16LF818/819, PIC16LF818/ 819 TSL (Industrial)
PIC16LF818/819(3)
PIC16LF818/819 TSL(3)
(Industrial)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
PIC16F818/819(3)
PIC16F818/819 TSL(3)
(Industrial, Extended)
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Min Typ Max Units Conditions
INTOSC Accuracy @ Freq = 8 MHz, 4 MHz, 2 MHz, 1 MHz, 500 kHz, 250 kHz, 125 kHz(1)
PIC16LF818/819 -5 ±1 5 % +25°C VDD = 2.7-3.3V-25 — 25 % -10°C to +85°C
-30 — 30 % -40°C to +85°C
PIC16F818/819(4) -5 ±1 5 % +25°C
VDD = 4.5-5.5V
-25 —25 %-10°C to +85°C
-30 —30 %-40°C to +85°C
-35 —35 %-40°C to +125°C
PIC16LF818/819 TSL -2 ±1 2 % +25°C VDD = 2.7-3.3V-5 — 5 % -10°C to +85°C
-10 — 10 % -40°C to +85°C
PIC16F818/819 TSL(5) -2 ±1 2 % +25°C
VDD = 4.5-5.5V
-5 — 5 % -10°C to +85°C
-10 —10 %-40°C to +85°C
-15 —15 %-40°C to +125°C
INTRC Accuracy @ Freq = 31 kHz(2)
PIC16LF818/819 26.562 — 35.938 kHz -40°C to +85°C VDD = 2.7-3.3V
PIC16F818/819(4) 26.562 —35.938 kHz -40°C to +85°C VDD = 4.5-5.5V
PIC16LF818/819 TSL 26.562 — 35.938 kHz -40°C to +85°C VDD = 2.7-3.3V
PIC16F818/819 TSL(5) 26.562 —35.938 kHz -40°C to +85°C VDD = 4.5-5.5V
Legend: Shading of rows is to assist in readability of the table.
Note 1: Frequency calibrated at 25°C. OSCTUNE register can be used to compensate for temperature drift.
2: INTRC frequency after calibration.
3: The only specification diff erence between a non-TSL device and a TSL device is the internal RC oscillator specifications
listed above. All other specifications are maintained.
4: Example part number for the specifications listed above: PIC16F818-I/SS (PIC16F818 device, Industrial temperature,
SSOP package).
5: Example part number for the specifications listed above: PIC16F818-I/SSTSL (PIC16F818 device, Industrial
temperature, SSOP package).
PIC16F818/819
DS39598F-page 126 2001-2013 Microchip Technology Inc.
15.4 DC Characteristics: PIC16F818/819 (Industrial, Extended)
PIC16LF818/819 (Industrial)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Operating voltage VDD range as described in Sec tion 15.1 “DC
Characteristics: Supply Voltage”.
Param
No. Sym Characteristic Min Typ† Max Units Conditions
VIL Input Low Voltage
I/O ports:
D030 with TTL buffer VSS — 0.15 VDD V For entire VDD range
D030A VSS —0.8V V4.5V VDD 5.5V
D031 with Schmitt Trigger buffer VSS —0.2 VDD V
D032 MCLR, OSC1 (in RC mode) VSS —0.2 VDD V(Note 1)
D033 OSC1 (in XT and LP mode) VSS —0.3V V
OSC1 (in HS mode) VSS —0.3 VDD V
Ports RB1 and RB4:
D034 with Schmitt Trigger buffer VSS —0.3 VDD V For entire VDD rang e
VIH Input High Voltage
I/O ports:
D040 with TTL buf fer 2.0 — VDD V4.5V VDD 5.5V
D040A 0.25 VDD + 0.8V — VDD V For entire VDD range
D041 with Schmitt Trigger buffer 0.8 VDD —VDD V For entire VDD range
D042 MCLR 0.8 VDD —VDD V
D042A OSC1 (in XT and LP mode) 1.6V — VDD V
OSC1 (in HS mode) 0. 7 VDD —VDD V
D043 OSC1 (in R C mode) 0.9 VDD —VDD V(Note 1)
Ports RB1 and RB4:
D044 with Schmitt Trigger buffer 0.7 VDD —VDD V For entire VDD range
D070 IPURB PORTB Weak Pull-up Current 50 250 400 AVDD = 5V, VPIN = VSS
IIL Input Leak age Current (Notes 2, 3)
D060 I/ O ports — — ±1 AVss VPIN VDD, pin at
high-impedance
D061 MCLR ——±5AVss VPIN VDD
D063 OSC1 — — ±5 AVss VPIN VDD, XT, HS
and LP oscillator
configuration
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
Note 1: In RC oscil lator confi guration, the OSC1/CLKI pi n is a Schmitt T r igger inpu t. It is not reco mmended t hat the
PIC16F818/819 be driven with external clock in RC mode.
2: The leakage current on the M CLR pin is strongly dependent on the applied voltage lev el. The specified leve ls
represent normal operating condi tions. Higher leaka ge current may be meas ured at dif ferent input v olt ages .
3: Negative current is defined as current sourced by the pin.
2001-2013 Microchip Technology Inc. DS39598F-page 127
PIC16F818/819
VOL Output Low Voltage
D080 I/O ports — — 0.6 V IOL = 8.5 mA, VDD = 4.5V,
-40C to +125C
D083 OSC2/CLKO
(RC oscillator config) ——0.6VI
OL = 1.6 mA, VDD = 4.5V,
-40C to +125C
VOH Output High Voltage
D090 I/ O ports (Note 3) VDD – 0.7 — — V IOH = -3.0 mA, VDD = 4.5V,
-40C to +125C
D092 OSC2/CLKO
(RC oscillator config) VDD – 0.7 — — V IOH = -1.3 mA, VDD = 4.5V,
-40C to +125C
Capacitive Loading Specs on Output Pins
D100 COSC2 OSC2 pin — — 15 pF In XT, HS and LP modes
when ex tern al c loc k is us ed
to drive OSC1
D101 CIO All I/O pins and OSC2
(in RC mode) — — 50 pF
D102 CBSCL, SDA in I2C™ mode ——400pF
Data EEPROM Memory
D120 EDEndurance 100K
10K 1M
100K —
—E/W
E/W -40°C to +85°C
+85°C to +125°C
D121 VDRW VDD for read/write VMIN — 5.5 V Using EECON to read/write,
VMIN = min. operating
voltage
D122 TDEW Erase/write cy cle time — 4 8 ms
Program Flash Memory
D130 EPEndurance 10K
1K 100K
10K —
—E/W
E/W -40°C to +85°C
+85°C to +125°C
D131 VPR VDD for read VMIN —5.5 V
D132A VDD for erase/write VMIN — 5.5 V Using EECON to read/write,
VMIN = min. operating
voltage
D133 TPE Erase cy cle time — 2 4 ms
D134 TPW Write cycle time — 2 4 ms
15.4 DC Characteristics: PIC16F818/819 (Industrial, Extended)
PIC16LF818/819 (Industrial) (Continued)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Operating voltage VDD range as described in Sec tion 15.1 “DC
Characteristics: Supply Voltage”.
Param
No. Sym Characteristic Min Typ† Max Units Conditions
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
Note 1: In RC oscil lator confi guration, the OSC1/CLKI pi n is a Schmitt T r igger inpu t. It is not reco mmended t hat the
PIC16F818/819 be driven with external clock in RC mode.
2: The leakage current on the M CLR pin is strongly dependent on the applied voltage lev el. The specified leve ls
represent normal operating condi tions. Higher leaka ge current may be measu red at dif f erent input voltages.
3: Negative current is defined as current sourced by the pin.
PIC16F818/819
DS39598F-page 128 2001-2013 Microchip Technology Inc.
15.5 Timing Parameter Symbology
The timing parameter symbols have been created
using one of the following formats:
FIGURE 15-3: LOAD CONDITIONS
1. TppS2ppS 3. TCC:ST (I2C specifications only)
2. TppS 4. Ts (I2C specifications only)
TF Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKO rd RD
cs CS rw RD or WR
di SDI sc SCK
do SDO ss SS
dt Data in t0 T0CKI
io I/O port t1 T1CKI
mc MCLR wr WR
Uppe rcase letters and their meanings:
SFFall PPeriod
HHigh RRise
I Invalid (High-impedance) V Valid
L Low Z High-impedance
I2C only
AA output ac cess High High
BUF Bus free Low Low
TCC:ST (I2C specifications only)
CC
HD Hold SU Setup
ST
DAT DATA input hold STO Stop condition
STA Start condition
VDD/2
CL
RL
Pin Pin
VSS VSS
CL
RL= 464
CL= 50 pF for all pins except OSC2, but including PORTD and PORTE outputs as ports
15 pF for OSC2 output
Load Condition 1 Load Condition 2
2001-2013 Microchip Technology Inc. DS39598F-page 129
PIC16F818/819
FIGURE 15-4: EXTER NAL CLOCK TIMING
OSC1
CLKO
Q4 Q1 Q2 Q3 Q4 Q1
1
23344
TABLE 15-1: EXTERNAL CLOCK TIMING REQUIREMENTS
Param
No. Sym Characteristic Min Typ† Max Units Conditions
FOSC External CLKI Frequ ency (Note 1) DC — 1 MHz XT and RC Oscillator mode
DC — 2 0 MHz HS Oscillator mode
DC — 32 k Hz LP Oscil lat or mode
Oscillator Frequency (Note 1) DC — 4 MHz RC Oscillator mode
0.1 — 4 MHz XT Osci ll ator mode
4
5—
—20
200 MHz
kHz HS Oscillator mode
LP Oscillator mode
1T
OSC External CLKI Perio d (Note 1) 1000 — — ns XT and RC Oscillator mode
50 — — ns HS Oscillator mode
5 — — ms LP Oscillator mode
Oscillator Period (Note 1) 250 — — ns RC Oscillator mode
250 — 10,000 ns XT Oscillator mode
50 — 250 ns HS Oscillator mode
5 — — ms LP Oscillator mode
2T
CY Instruction Cycle Time (Note 1) 200 TCY DC ns TCY = 4/FOSC
3TOSL,
TOSHExtern al Cloc k in (OSC1 ) High
or Low Time 500 — — ns XT Oscillator
2.5 — — ms LP Oscillator
15 — — ns HS Oscillator
4T
OSR,
TOSFExtern al Cloc k in (OSC1 ) Rise or
Fall Time — — 25 ns XT Oscillator
— — 50 ns LP Oscillator
— — 15 ns HS Oscillator
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values
are based on characterization data for that particular oscillator type, under standard operating conditions,
with the device executing code. Exceeding these specified limits may result in an unstable oscillator
operation and/or higher than expected current consumption. All devices are tested to operate at “min.”
values with an external clock applied to the OSC1/CLKI pin. When an external clock input is used, the
“max.” cycle time limit is “DC” (no clock) for all devices.
PIC16F818/819
DS39598F-page 130 2001-2013 Microchip Technology Inc.
FIGURE 15-5: CLKO AND I/O TIMING
TABLE 15-2: CLKO AND I/O TIMING REQUIREMENTS
Note: Refer to Figure 15-3 for load conditions.
OSC1
CLKO
I/O pin
(Input)
I/O pin
(Output)
Q4 Q1 Q2 Q3
10
13 14
17
20, 21
19 18
15
11
12 16
Old Value New Value
Param
No. Symbol Characteristic Min Typ† Max Units Conditions
10* TOSH2CKLOSC1 to CLKO — 75 200 ns (Note 1)
11* TOSH2CKHOSC1 to C LKO — 75 200 ns (Note 1)
12* TCKR CLKO Rise Time — 35 100 ns (Note 1)
13* TCKF CLKO Fall Time — 35 100 ns (Note 1)
14* TCKL2IOVCLKO to Por t Out Valid — — 0.5 TCY + 20 ns (Note 1)
15* TIOV2CKH Port In Valid before CLKO TOSC + 200 — — ns (Note 1)
16* TCKH2IOI Port In Hold after CLKO 0——ns(Note 1)
17* TOSH2IOVOSC1 (Q 1 cycle) to Port Out Valid — 100 255 ns
18* TOSH2IOIOSC1 (Q2 cycle) to Por t
Input Invalid (I/O in hold time) PIC16F818/819 100 — — ns
PIC16LF818/819 200 — — ns
19* TIOV2OSH Port Input Valid to OSC1 (I /O in setup time) 0 — — ns
20* TIOR Port Output Rise Time PIC16F818/819 — 10 40 ns
PIC16LF818/819 — — 145 ns
21* TIOF Port Output Fall Time PIC16F818/819 — 10 40 ns
PIC16LF818/819 — — 145 ns
22††* TINP INT pin High or Low Time TCY ——ns
23††* TRBP RB7:RB4 Change INT High or Low Time TCY ——ns
* These parameters are characterized but not tested.
† Data in “T yp” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
†† These parameters are asynchronous events, not related to any internal clock edges.
Note 1: Measurements are taken in RC mode, where CLKO output is 4 x TOSC.
2001-2013 Microchip Technology Inc. DS39598F-page 131
PIC16F818/819
FIGURE 15-6: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND
POWER-UP TIMER TIMING
FIGURE 15-7: BROWN-OUT RESET TIMING
TABLE 15-3: RESET, WATCHDOG TIMER, OSCILLATOR ST ART-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET REQUIREMENTS
VDD
MCLR
Internal
POR
PWRT
Time-out
Oscillator
Time-out
Internal
Reset
Watchdog
Timer
Reset
33
32
30
31
34
I/O pins
34
Note: Refer to Figure 15-3 for load conditions.
VDD VBOR
35
Param
No. Symbol Characteristic Min Typ† Max Units Conditions
30 TMCLMCLR Pulse Width (Low) 2 — — sVDD = 5V, -40°C to +85°C
31* TWDT Watchdog Timer Time-out Period
(no prescaler) 13.6 16 18.4 ms VDD = 5V, -40°C to +85°C
32 TOST Oscillation Start-up Timer Period — 1024 TOSC ——TOSC = OSC1 period
33* TPWRT Power-up Timer Period 61.2 72 82.8 ms VDD = 5V, -40°C to +85°C
34 TIOZ I/O High-Impedance from MCLR
Low or Watchdog Timer Reset ——2.1s
35 TBOR Bro wn-out Rese t Pulse Width 100 — — sVDD VBOR (D005)
* These parameters are characterized but not tested.
† Data in “T yp” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
PIC16F818/819
DS39598F-page 132 2001-2013 Microchip Technology Inc.
FIGURE 15-8: TIMER0 AND TIMER1 EXTERNAL CLOC K TIMINGS
TABLE 15-4: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Param
No. Symbol Characteristic Min Typ† Max Units Conditions
40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 — — ns Mus t also meet
parameter 42
With Prescaler 10 — — ns
41* TT0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 — — ns Must also meet
parameter 42
With Prescaler 10 — — ns
42* TT0P T0CK I Period No Prescaler TCY + 40 ——ns
With Prescaler Greater of:
20 or TCY + 40
N
— — ns N = prescale value
(2, 4, ..., 256)
45* TT1H T1CKI High
Time Synchronous, Pres caler = 1 0.5 TCY + 20 — — ns Must also meet
parameter 47
Synchronous,
Prescaler = 2,4,8 PIC16F818/819 15 — — ns
PIC16LF818/819 25 — — ns
Asynchronous PIC16F818/819 30 — — ns
PIC16LF818/819 50 — — ns
46* TT1L T1CKI Low Time Synchronous, Prescaler = 1 0.5 TCY + 20 — — ns Must also meet
parameter 47
Synchronous,
Prescaler = 2,4,8 PIC16F818/819 15 — — ns
PIC16LF818/819 25 — — ns
Asynchronous PIC16F818/819 30 — — ns
PIC16LF818/819 50 — — ns
47* TT1P T1CK I Input
Period Synchronous PIC16F818/819 Greater of:
30 or TCY + 40
N
— — ns N = prescale
value (1, 2, 4, 8)
PIC16LF81 8/819 Greater of:
50 or TCY + 40
N
N = prescale
value (1, 2, 4, 8)
Asynchronous PIC16F818/819 60 — — ns
PIC16LF818/819 100 — — ns
FT1 Timer1 Oscillator Input Frequency Range
(Oscillator enabled by setting bit T1OSCEN) DC — 32.768 kHz
48 TCKEZTMR1 Delay from External Clock Edge to Timer Increment 2 TOSC —7 TOSC —
* Thes e parameters are charact erized but not tested.
† Data in “T yp” column is at 5V , 25°C unless otherwise stated. These parameters are for design guidance only and are not tested.
Note: Refer to Figure 15-3 for load conditions.
46
47
45
48
41
42
40
RA4/T0CKI
RB6/T1OSO/T1CKI
TMR0 or TMR1
2001-2013 Microchip Technology Inc. DS39598F-page 133
PIC16F818/819
FIGURE 15-9: CAPTURE/ COMPARE/PWM TIMINGS (CCP1)
TABLE 15-5: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP1)
Note: Ref er to Figure 15-3 fo r load conditions.
CCP1
(Capture Mode)
50 51
52
53 54
CCP1
(Compare or PWM Mode)
Param
No. Symbol Characteristic Min Typ† Max Units Conditions
50* TCCL CCP1
Input Low Time No Prescaler 0.5 TCY + 20 — — ns
PIC16F818/819 10 — — ns
With Prescaler PIC16LF818/819 20 — — ns
51* TCCH CCP1
Input High
Time
No Prescaler 0.5 TCY + 20 — — ns
PIC16F818/819 10 — — ns
With Prescaler PIC16LF818/819 20 — — ns
52* TCCP CCP1 Input Period 3 TCY + 40
N— — ns N = prescale
value (1 ,4 o r 16)
53* TCCR CCP1 Output Rise Time PIC16F818/819 — 10 25 ns
PIC16LF818/819 — 25 50 ns
54* TCCF CCP1 Output Fall Time PIC16F818/819 — 10 25 ns
PIC16LF818/819 — 25 45 ns
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested .
PIC16F818/819
DS39598F-page 134 2001-2013 Microchip Technology Inc.
FIGURE 15-10 : SPI MAST E R MODE TIMING (CKE = 0, SMP = 0)
FIGURE 15-11: SPI MASTER MODE TIMING (CKE = 1, SMP = 1)
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73 74
75, 76
78
79
80
79
78
MSb LSb
Bit 6 - - - - - -1
LSb In
Bit 6 - - - -1
Note: Refer to Figure 15-3 for load conditions.
MSb In
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
81
71 72
74
75, 76
78
80
MSb
79
73
MSb In
Bit 6 - - - - - -1
LSb In
Bit 6 - - - -1
LSb
Note: Refer to Figure 15-3 for load conditions.
2001-2013 Microchip Technology Inc. DS39598F-page 135
PIC16F818/819
FIGURE 15-12 : SPI SLAVE MODE TIMING (CKE = 0)
FIGURE 15-13 : SPI SLAVE MODE TIMING (CKE = 1)
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
73 74
75, 76 77
78
79
80
79
78
MSb LSb
Bit 6 - - - - - -1
Bit 6 - - - -1 LS b In
83
Note: Refer to Figure 15-3 for load conditions.
MSb In
SS
SCK
(CKP = 0)
SCK
(CKP = 1)
SDO
SDI
70
71 72
82
SDI
74
75, 76
MSb Bit 6 - - - - - -1 LSb
77
Bit 6 - - - -1 LSb In
80
83
Note: Refer to Figure 15-3 for load conditions.
MSb In
PIC16F818/819
DS39598F-page 136 2001-2013 Microchip Technology Inc.
TABLE 15-6: SPI MODE REQUIREMENTS
FIGURE 15-14 : I2C™ BUS STAR T/ STOP BITS TIMING
Param
No. Symbol Characteristic Min Typ† Max Units Conditions
70* TSSL2SCH,
TSSL2SCLSS to SCK or SCK Input TCY ——ns
71* TSCH SCK Input High Time (Slave mode) TCY + 20 — — ns
72* TSCL SCK Input Low Time (Slave mode) TCY + 20 — — ns
73* TDIV2SCH,
TDIV2SCLSetup Time of SDI Data Input to SCK Edge 100 — — ns
74* TSCH2DIL,
TSCL2DILHold Ti me of SDI Data Input to SCK Edge 100 — — ns
75* TDOR SDO Data Output Rise Time P IC16F818/819
PIC16LF818/819 —
—10
25 25
50 ns
ns
76* TDOF SDO Data Output Fall Time — 10 25 ns
77* TSSH2DOZSS to SDO Output High-Impedance 10 — 50 ns
78* TSCR SCK Output Rise Time
(Master mode) PIC16F818/819
PIC16LF818/819 —
—10
25 25
50 ns
ns
79* TSCF SCK Output Fall Time (Master mode) — 10 25 ns
80* TSCH2DOV,
TSCL2DOVSDO Data Output Valid after SCK
Edge PIC16F818/819
PIC16LF818/819 —
——
—50
145 ns
ns
81* TDOV2SCH,
TDOV2SCLSDO Data Output Setup to SCK Edge TCY ——ns
82* TSSL2DOV SDO Data Output Valid after SS Edge — — 50 ns
83* TSCH2SSH,
TSCL2SSHSS after SCK Edge 1.5 TCY + 40 — — ns
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note: Refer to Figure 15-3 for load conditions.
91
92
93
SCL
SDA
Start
Condition Stop
Condition
90
2001-2013 Microchip Technology Inc. DS39598F-page 137
PIC16F818/819
TABLE 15-7: I2C™ BUS START/ STOP BITS REQUIREM ENTS
FIGURE 15-15 : I2C™ BUS DATA TIM ING
Param
No. Symbol Characteristic Min Typ Max Units Conditions
90* TSU:STA Start Condition 100 kHz mode 4700 — — ns Only relevant for Repeated
Start condition
Setu p Time 400 kHz mode 600 — —
91* THD:STA Start Condition 100 kHz mode 4000 — — ns After this period, the first clock
pulse is generated
Hold Time 400 kHz mode 6 00 — —
92* TSU:STO Stop Condition 100 kHz mode 4700 — — ns
Setu p Time 400 kHz mode 600 — —
93 THD:STO Stop Condition 100 kHz mode 4000 — — ns
Hold Time 400 kHz mode 6 00 — —
* These parameters are characterized but not tested.
Note: Refer to Figure 15-3 for load conditions.
90
91 92
100 101
103
106 107
109 109 110
102
SCL
SDA
In
SDA
Out
PIC16F818/819
DS39598F-page 138 2001-2013 Microchip Technology Inc.
TABLE 15-8: I2C™ BUS DATA REQUIREM ENTS
Param.
No. Symbol Characteristic Min Max Units Conditions
100* THIGH Clock High Time 100 kHz mode 4.0 — s
400 kHz mode 0.6 — s
SSP Module 1.5 TCY —
101* TLOW Clock Low Time 100 kHz mode 4.7 — s
400 kHz mode 1.3 — s
SSP Module 1.5 TCY —
102* TRSDA and SCL Rise
Time 100 kHz mode — 1000 ns
400 kHz mode 20 + 0.1 CB300 ns CB is specified to be from
10-400 pF
103* TFSDA and SCL Fall
Time 100 kHz mode — 300 ns
400 kHz mode 20 + 0.1 CB300 ns CB is specified to be from
10-400 pF
90* TSU:STA Start Condition
Setup Time 100 kHz mode 4.7 — s Only r eleva nt for Repea ted
Start condition
400 kHz mode 0.6 — s
91* THD:STA Start Condition Hold
Time 100 kHz mode 4.0 — s Af ter thi s period, the firs t
clo ck pul s e is generated
400 kHz mode 0.6 — s
106* THD:DAT Data Input Hold
Time 100 kHz mode 0 — ns
400 kHz mode 0 0.9 s
107* TSU:DAT Data Input Setup
Time 100 kHz mode 250 — ns (Note 2)
400 kHz mode 100 — ns
92* TSU:STO St op Condition
Setup Time 100 kHz mode 4.7 — s
400 kHz mode 0.6 — s
109* TAA Output Valid from
Clock 100 kHz mode — 3500 ns (Note 1)
400 kHz mode — — ns
110* TBUF Bus Free Time 100 kHz mode 4.7 — s Time the bus must be free
before a new transmission
can start
400 kHz mode 1.3 — s
CBBus Capacitive Loading — 400 pF
* These parameters are characterized but not tested.
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region
(min. 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
2: A Fast mode (400 kHz) I2C™ bus device can be used in a Standard mode (100 kHz) I2C bus system but
the requireme nt, TSU:DAT 250 ns , must then b e met. Thi s will autom atical ly be the ca se if the device doe s
not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL
signal, it must output the next data bit to the SDA line, TR max. + TSU:DAT = 1000 + 250 = 1250 ns
(according to the Standard mode I2C bus specification), before the SCL line is released.
2001-2013 Microchip Technology Inc. DS39598F-page 139
PIC16F818/819
TABLE 15-9: A/D CONVERTER CHARACTERISTICS: PIC16F818/819 (INDUSTRIAL, EXTENDED)
PIC16LF818/819 (INDUSTRIAL)
Param
No. Sym Characteristic Min Typ† Max Units Conditions
A01 NRResolution — — 10-bits bit VREF = VDD = 5.12V,
VSS VAIN VREF
A03 EIL Integral Linearity Error — — <±1 LSb VREF = VDD = 5.12V,
VSS VAIN VREF
A04 EDL Diff erentia l Linearity Error — — <±1 LSb VREF = VDD = 5.12V,
VSS VAIN VREF
A06 EOFF Offset Error — — <±2 LSb VREF = VDD = 5.12V,
VSS VAIN VREF
A07 EGN Gain Error — — <±1 LSb VREF = VDD = 5.12V,
VSS VAIN VREF
A10 — Monotonicity — guaranteed(3) ——VSS VAIN VREF
A20 VREF Reference Voltage (VREF+ – VREF-) 2.0 — VDD + 0.3 V
A21 VREF+ Reference Voltage High AVDD – 2.5V AVDD + 0.3V V
A22 VREF- Reference Voltage Low AVSS – 0.3V VREF+ – 2. 0V V
A25 VAIN Analog Input Voltage VSS – 0.3V — VREF + 0.3V V
A30 ZAIN Recommended Impedance of
Analog V oltage Source ——2.5k(Note 4)
A40 IAD A/D Conversion
Current (VDD)PIC16F818/819 — 220 — A Average current
consumption when A/D is on
(Not e 1)
PIC16LF818/819 — 90 — A
A50 IREF VREF Input Current (Note 2) —
—
—
—
5
150
A
A
During VAIN acquisition.
Based on differential of VHOLD
to VAIN to charge CHOLD,
see Section 11.1 “A/D
Acquisition Requirements”.
During A/D conversion cycle
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are
no t te sted.
Note 1: When A/D is off, it will not consume any current other than minor leakage current. The power-down current spec includes
any such leakage from the A/D module.
2: VREF current is from RA3 pin or VDD pin, whichever is selected as reference input.
3: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes.
4: Maximum allowed impedance for analog voltage source is 10 kThis requires higher acquisition time.
PIC16F818/819
DS39598F-page 140 2001-2013 Microchip Technology Inc.
FIGURE 15-16: A/D CONVERSION TIMING
TABLE 15-10: A/D CONVERSION REQUIREMENTS
131
130
132
BSF ADCON0, GO
Q4
A/D CLK
A/D DATA
ADRES
ADIF
GO
SAMPLE
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
(TOSC/2)(1)
987 210
Note: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock st arts. This allows the SLEEP
instruction to be executed.
1 TCY
Param
No. Symbol Characteristic Min Typ† Max Units Conditions
130 TAD A /D Clock Period PIC16F818/819 1.6 — — sTOSC based, VREF 3.0V
PIC16LF818/819 3.0 — — sT
OSC based, VREF 2.0V
PIC16F818/819 2.0 4.0 6.0 s A/D RC mode
PIC16LF818/819 3.0 6.0 9.0 s A/D RC mode
131 TCNV Conversion Time (not including S/H time)
(Note 1) —12TAD
132 TACQ Acquisition Time (Note 2)
10*
40
—
—
—
s
s The minimum time is the
amplifier settling time. This may
be used if the “new” input
voltage has not changed by
more than 1 LSb (i.e., 5.0 mV @
5.12V) from the last sampled
voltage (as stated on CHOLD).
134 TGO Q4 to A/D Clock Start — TOSC/2 § — — If the A/D clock source is
selected as RC, a time of TCY is
added before the A/D clock
starts . This allows the SLEEP
instruction to be executed.
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance only and are
no t te sted.
§ This specification ensured by design.
Note 1: ADRES register may be read on the following TCY cycle.
2: See Section 1 1.1 “A/D Acquisition Requirements” for minimum conditions.
2001-2013 Microchip Technology Inc. DS39598F-page 141
PIC16F818/819
16.0 DC AND AC CHARACTERISTICS GRAPHS AND TABLES
“T ypical” represents the mean of the distribution at 25C. “Maximum” or “minimum” represents (mean + 3) or (mean – 3)
respectively, where is a st anda rd deviation, ov er the whol e temperature range .
FIGURE 16-1: TYPICAL IDD vs. FOSC OVER VDD (HS MODE)
FIGURE 16-2: MAXIMUM IDD vs. FOSC OVER VDD (HS MODE)
Note: The g r ap hs and t ables provided followin g th is no te a r e a s t ati sti ca l s um ma ry based on a lim ite d n um ber of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.
0
1
2
3
4
5
6
7
4 6 8 10 12 14 16 18 20
FOSC (MHz)
IDD (mA)
2.0V
2.5V
3.0V
3.5V
4.0V
4.5V
5.0V
5.5V
Typical: statistical mean @ 25°C
Maximum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
0
1
2
3
4
5
6
7
8
4 6 8 10 12 14 16 18 20
FOSC (MHz)
IDD (mA)
2.0V
2.5V
3.0V
3.5V
4.0V
4.5V
5.0V
5.5V
Typical: statistical mean @ 25°C
Maximum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
PIC16F818/819
DS39598F-page 142 2001-2013 Microchip Technology Inc.
FIGURE 16-3: TYPICAL IDD vs. FOSC OVER VDD (XT MODE)
FIGURE 16-4: MAXIMUM IDD vs. FOSC OVER VDD (XT MODE)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0 500 1000 1500 2000 2500 3000 3500 4000
FOSC (MHz)
IDD (mA)
2.0V
2.5V
3.0V
3.5V
4.0V
4.5V
5.0V
5.5V
Typical: statistical mean @ 25°C
Maximum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
0.0
0.5
1.0
1.5
2.0
2.5
0 500 1000 1500 2000 2500 3000 3500 4000
FOSC (MHz)
IDD (mA)
2.0V
2.5V
3.0V
3.5V
4.0V
4.5V
5.0V
5.5V
Typical: statistical mean @ 25°C
Maximum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
2001-2013 Microchip Technology Inc. DS39598F-page 143
PIC16F818/819
FIGURE 16-5: TYPICAL IDD vs. FOSC OVER VDD (LP MODE)
FIGURE 16-6: MAXIMUM IDD vs. FOSC OVER VDD (LP MODE)
0
10
20
30
40
50
60
70
20 30 40 50 60 70 80 90 100
FOSC (kHz)
IDD (uA)
2.0V
2.5V
3.0V
3.5V
4.0V
4.5V
5.0V
5.5V
Typical: statistical mean @ 25°C
Maximum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
0
20
40
60
80
100
120
20 30 40 50 60 70 80 90 100
FOSC (kHz)
IDD (uA)
2.0V
2.5V
3.0V
3.5V
4.0V
4.5V
5.0V
5.5V
Typical: statistical mean @ 25°C
Maximum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
PIC16F818/819
DS39598F-page 144 2001-2013 Microchip Technology Inc.
FIGURE 16-7: TYPICAL IDD vs. VDD, -40C TO +125C, 1 MHz TO 8 MHz
(RC_RUN MODE, ALL PERIPHERALS DISABLED)
FIGURE 16-8: MAXIMUM IDD vs. VDD, -40C TO +125C, 1 MHz TO 8 MHz
(RC_RUN MODE, ALL PERIPHERALS DISABLED)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.02.03.04.05.06.07.08.0
FOSC (MHz)
IDD (mA)
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
2.0V
Typical: statistical mean @ 25°C
Maximum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
1.02.03.04.05.06.07.08.0
FOSC (MHz)
IDD (mA)
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
2.0V
Typical: statistical mean @ 25°C
Maximum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
2001-2013 Microchip Technology Inc. DS39598F-page 145
PIC16F818/819
FIGURE 16-9: IPD vs. VDD, -40C TO +125C (SLEEP MODE, ALL PERIPHERALS DISABLED)
FIGURE 16 -10: AVERAGE F OSC vs. VDD FOR V ARIOUS V ALUES OF R (RC MODE, C = 20 pF, +25C)
0.001
0.01
0.1
1
10
100
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (uA)
Typ (25°C)
Max ( 85°C)
Max (125°C)
Typical: statistical mean @ 25°C
Maximum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Freq (MHz)
100 k O hm
10 kOhm
5.1 kO hm
Oper ation above 4 MHz is not r ecommend ed
PIC16F818/819
DS39598F-page 146 2001-2013 Microchip Technology Inc.
FIGURE 16-11: AVERAGE FOSC vs. VDD FOR VARIOUS VALUES OF R
(RC MODE, C = 100 pF, +25C)
FIGURE 16-12: AVERAGE FOSC vs. VDD FOR VARIOUS VALUES OF R
(RC MODE, C = 300 pF, +25C)
0.0
0.5
1.0
1.5
2.0
2.5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Freq (MHz)
100 k O hm
10 kOhm
5.1 kOhm
3.3 kOhm
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
Freq (MHz)
100 kOhm
10 kOhm
5.1 kOhm
3.3 kOhm
2001-2013 Microchip Technology Inc. DS39598F-page 147
PIC16F818/819
FIGURE 16-13 : IPD TIMER1 OSCILLATOR, -10°C TO +70°C (SLEEP MODE,
TMR1 COUNTER DISABLED)
FIGURE 16-14 : IPD WDT, -40°C TO +125°C (SLEEP MODE, ALL PERIPHERALS DISABLED)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
2.02.53.03.54.04.55.05.5
VDD (V)
IPD (A)
Typ (+25°C)
Max (-10°C to +70°C)
Typical: statistical mean @ 25°C
Maximum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
0
2
4
6
8
10
12
14
16
18
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IWDT (A)
Max
(
-40°C to +125°C
)
Max (-40°C to +85 ° C)
Typ (2 5° C )
Typical: statistical mean @ 25°C
Maximum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
PIC16F818/819
DS39598F-page 148 2001-2013 Microchip Technology Inc.
FIGURE 16-15 : IPD BOR vs. VDD, -40° C TO +125°C (S L E E P M O D E,
BOR ENABLED AT 2.00V-2.16V)
FIGURE 16-16 : IPD A/D, -40C TO +125C, SLEEP MODE, A/D ENABLED (NOT CONVERTING)
10
100
1,000
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IDD (A)
Device in
Reset
Device in
Sleep
Indeterminant
State
Max (125°C)
Typ (25°C)
Max (125°C)
Typ (25°C)
Typical: statistical mean @ 25°C
Maxi mum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
Note: Device current in Reset
depends on oscillator mode,
frequency and circuit.
0
2
4
6
8
10
12
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
IPD (A)
Max
(-40°C t o +125° C )
Max
(-40°C to + 85°C)
Typ (+25°C)
Typical: statistical mean @ 25°C
Maximum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
2001-2013 Microchip Technology Inc. DS39598F-page 149
PIC16F818/819
FIGURE 16-17: TYPICAL, MINIMUM AND MAXIMUM VOH vs. IOH (VDD = 5V, -40C TO +125C)
FIGURE 16-18: TYPICAL, MINIMUM AND MAXIMUM VOH vs. IOH (VDD = 3V, -40C TO +125C)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
0 5 10 15 20 25
IOH (-mA)
VOH (V)
Max
Ty p ( 25 °C)
Min
Typical: statistical mean @ 25°C
Maximum: mean + 3 (-4 0° C to +125 °C)
Minimum: mean – 3 (-40°C to +125°C)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
0 5 10 15 20 25
IOH (-mA)
VOH (V)
Max
Typ (25°C )
Min
Typical: statistical mean @ 25°C
Maximu m: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
PIC16F818/819
DS39598F-page 150 2001-2013 Microchip Technology Inc.
FIGURE 16-19: TYPICAL, MINIMUM AND MAXIMUM VOL vs. IOL (VDD = 5V, -40C TO +125C)
FIGURE 16-20: TYPICAL, MINIMUM AND MAXIMUM VOL vs. IOL (VDD = 3V, -40C TO +125C)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0 5 10 15 20 25
IOL (-mA)
VOL (V)
Max (125°C)
Max ( 85°C)
Ty p ( 25 °C)
Min (-40°C)
Typical: statistical mean @ 25°C
Maxi mum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 5 10 15 20 25
IOL (-mA)
VOL (V)
Max (125°C)
Max (85°C)
Typ (25°C )
Min (-40°C)
Typical: statistical mean @ 25°C
Maximum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
2001-2013 Microchip Technology Inc. DS39598F-page 151
PIC16F818/819
FIGURE 16-21: MINIMUM AND MAXIMUM VIN vs. VDD (TTL INPUT, -40C TO +125C)
FIGURE 16-22: MINIMUM AND MAXIMUM VIN vs. VDD (ST INPUT, -40C TO +125C)
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
VIN (V)
VTH Max (-40°C)
VTH Min (125°C)
VTH Typ (25°C)
Typical: statistical mean @ 25°C
Maximum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
VIN (V)
VIH Max (125°C)
VIH Min (-40°C)
VIL Max (-40°C)
VIL Min (125°C)
Typical: statistical mean @ 25°C
Maximu m: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
PIC16F818/819
DS39598F-page 152 2001-2013 Microchip Technology Inc.
FIGURE 16-23: MINIMUM AND MAXIMUM VIN vs. VDD (I2C™ INPUT, -40C TO +125C)
FIGURE 16-24: A/D NONLINEARITY vs. VREFH (VDD = VREFH, -40C TO +125C)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V)
VIN (V)
VIH Max
VIH Min
VILMax
VIL Min
Typical: statistical mean @ 25°C
Maximum: mean + 3 (-40°C to +125°C)
Minimum: mean – 3 (-40°C to +125°C)
VIL Max
0
0.5
1
1.5
2
2.5
3
3.5
4
22.533.544.555.5
VDD and VREFH (V)
Differential or Integral Nonlinearity (LSB)
-40C
25C
85C
125C
-40°C
+25°C
+85°C
+125°C
2001-2013 Microchip Technology Inc. DS39598F-page 153
PIC16F818/819
FIGURE 16-25: A/D NONLINEARITY vs. VREFH (VDD = 5V, -40C TO +125C)
0
0.5
1
1.5
2
2.5
3
22.533.544.555.5
VREFH (V)
Differential or Integral Nonlinearilty (LSB)
Max (-40C to 125C)
Typ (25C)
Typ (+25°C)
Max (-40°C to +125°C)
PIC16F818/819
DS39598F-page 154 2001-2013 Microchip Technology Inc.
NOTES:
2001-2013 Microchip Technology Inc. DS39598F-page 155
PIC16F818/819
17.0 PACKAGING INFORMATION
17.1 Package Marking Information
18-Lead SOIC
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the e vent the full Microc hip p art num ber cannot be marked on one lin e, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
18-Lead PDIP (300 mil) Example
18-Lead SOIC (7.50 mm) Example
20-Lead SSOP (5.30 mm ) Example
28-Lead QFN (6x6 mm) Example
XXXXXXXX
XXXXXXXX
YYWWNNN
PIN 1 PIN 1
PIC16F818-I/P
0410017
PIC16F818-04
/SO
0410017
PIC16F818-
20/SS
0410017
16F818-
I/ML
0410017
3
e
3
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3
e
3
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PIC16F818/819
DS39598F-page 156 2001-2013 Microchip Technology Inc.
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PIC16F818/819
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIC16F818/819
DS39598F-page 158 2001-2013 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2001-2013 Microchip Technology Inc. DS39598F-page 159
PIC16F818/819
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIC16F818/819
DS39598F-page 160 2001-2013 Microchip Technology Inc.
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2001-2013 Microchip Technology Inc. DS39598F-page 161
PIC16F818/819
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
PIC16F818/819
DS39598F-page 162 2001-2013 Microchip Technology Inc.
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2001-2013 Microchip Technology Inc. DS39598F-page 163
PIC16F818/819
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DS39598F-page 164 2001-2013 Microchip Technology Inc.
NOTES:
2001-2013 Microchip Technology Inc. DS39598F-page 165
PIC16F818/819
APPENDIX A: REVISION HISTORY
Revision A (May 2002)
Original version of this data sheet.
Revision B (August 2002)
Added INTRC section. PWRT and BOR are indepen-
dent of each other. Revised program memory text and
code routine. Added QFN package. Modified PORTB
diagrams.
Revision C (November 2002)
Added various new feature descriptions. Added inter-
nal RC oscillator specifications. Added low-power
Timer1 specifications and RTC application example.
Revision D (November 2003)
Updated IRCF bit modification information and changed
the INTOSC stabilization delay from 1 ms to 4 ms in
Section 4.0 “Oscillator Configurations”. Updated
Section 12.17 “In-Circuit Serial Programming” to
clarify LVP programming. In Section 15.0 “Electrical
Characteristics”, the DC Characteristics (Section 15.2
and Section 15.3) have been updated to include the
Typ, Min and Max values and Table 15-1 “External
Clock Timing Requirements” has been updated.
Revision E (September 2004)
This revision includes the DC and AC Characteristics
Graphs and Tables. The Electrical Specifications in
Section 16.0 “DC and AC Characteristics Graphs
and Tables” have been updated and there have been
minor corrections to the data sheet text.
Revision F (November 2011)
This rev ision up dated Sectio n 17.0 “Packag ing Infor-
mation”.
APPENDIX B: DEVICE DIFFERENCES
The differences between the devices in this data sheet are listed in Table B-1.
TABLE B-1: DIFFERENCES BETWEEN THE PIC16F818 AND PIC16F819
Features PIC16F818 PIC16F819
Flash Program Memory (14-bit words) 1K 2K
Data Memory (bytes) 128 256
EEPROM Data Memory (bytes) 128 256
PIC16F818/819
DS39598F-page 166 2001-2013 Microchip Technology Inc.
NOTES:
2001-2013 Microchip Technology Inc. DS39598F-page 167
PIC16F818/819
INDEX
A
A/D Acquisition Requirements ..........................................84
ADIF Bit ......................................................................83
Analog-to-Digital Converter ........................................81
Associated Registers .................................................87
Calculating Acquisition Time ......................................84
Configuring Analog Port Pins .....................................85
Configuring the Interrupt ............................................83
Configuring the Module ..............................................83
Conversion Clock .......................................................85
Conversion Requirements .......................................140
Conversions ...............................................................86
Converter Characteristics ........................................139
Delays ........................................................................84
Effects of a Reset .......................................................87
GO/DONE Bit .............................................................83
Internal Sampling Switch (Rss) Impedance ...............84
Operation During Sleep .............................................87
Result Registers .........................................................86
Source Impedance .....................................................84
Time Delays ...............................................................84
Use of the CCP Trigger ..............................................87
Absolute Maximum Ratings .............................................115
ACK ....................................................................................77
ADCON0 Register ..............................................................81
ADCON1 Register ..............................................................81
ADRESH Register ........................................................ 13, 81
ADRESH, ADRESL Register Pair ......................................83
ADRESL Register ........................................................ 14, 81
Application Notes
AN556 (Implementing a Table Read) ........................23
AN578 (Use of the SSP Module in the I2C
Multi-Master Environment) .................................71
AN607 (Power-up Trouble Shooting) .........................92
Assembler
MPASM Ass e mbler ..................................................112
B
BF Bit .................................................................................77
Block Diagrams
A/D .............................................................................83
Analog Input Model ....................................................84
Capture Mode Operation ...........................................66
Compare Mode Operation .........................................67
In-Circuit Serial Programming Connections .............101
Interrupt Logic ............................................................96
On-Chip Reset Circuit ................................................91
PIC16F818/819 ............................................................6
PWM ..........................................................................68
RA0/AN0:RA1/AN1 Pins ............................................40
RA2/AN2/Vr ef- Pin .....................................................40
RA3/AN3/Vr ef+ Pin ....................................................40
RA4/AN4/T0CKI Pin ...................................................40
RA5/MCLR/Vpp Pin ...................................................41
RA6/OSC2/CLKO Pin ................................................41
RA7/OSC1/CLKI Pin ..................................................42
RB0 Pin ......................................................................45
RB1 Pin ......................................................................46
RB2 Pin ......................................................................47
RB3 Pin ......................................................................48
RB4 Pin ......................................................................49
RB5 Pin ......................................................................50
RB6 Pin ..................................................................... 51
RB7 Pin ..................................................................... 52
Recommended MCLR Ci rcuit .................................... 92
SSP in I2C Mode ........................................................ 76
SSP in SPI Mode ....................................................... 74
System Clock ............................................................. 38
Timer0/WDT Prescaler .............................................. 53
Timer1 ....................................................................... 58
Timer2 ....................................................................... 63
Watchdog Timer (WDT) ............................................. 98
BOR. See Brown-out Reset.
Brown-out Reset (BOR) .............................. 89, 91, 92, 93, 94
C
C Compilers
MPLAB C18 ............................................................. 112
Capture/Compare/PWM (CCP) ......................................... 65
Capture Mode ............................................................ 66
CCP Prescaler ................................................... 66
Pin Configuration ............................................... 66
Softwar e In terrupt .............................................. 66
Timer1 Mode Selection ...................................... 66
Capture, Compare and Timer1
Associated Registers ......................................... 67
CCP1IF ...................................................................... 66
CCPR1 ...................................................................... 66
CCPR1H:CCPR1L ..................................................... 66
Compare Mode .......................................................... 67
Pin Configuration ............................................... 67
Software Interrupt Mode .................................... 67
Special Event Trigger ........................................ 67
Special Event Trigger Output of CCP1 .............. 67
Timer1 Mode Selection ...................................... 67
PWM and Timer2
Associated Registers ......................................... 69
PWM Mo de ................................................................ 68
Duty Cycle ......................................................... 68
Example Frequencies/Resolution s .................... 69
Period ................................................................ 68
Setup for Operation ........................................... 69
Timer Resources ....................................................... 65
CCP1M0 Bit ....................................................................... 65
CCP1M1 Bit ....................................................................... 65
CCP1M2 Bit ....................................................................... 65
CCP1M3 Bit ....................................................................... 65
CCP1X Bit .......................................................................... 65
CCP1Y Bit .......................................................................... 65
CCPR1H Register .............................................................. 65
CCPR1L Register .............................................................. 65
Code Examples
Changing Between Capture Prescalers ..................... 66
Changing Prescaler Assignment from Timer0
to WD T .............................................................. 55
Changing Prescaler Assignment from WDT
to Tim e r 0 ........................................................... 55
Clearing RAM Using Indirect Addressing .................. 23
Erasing a Flash Program Memory Row ..................... 29
Implementing a Real-Time Clock Using a
Timer1 Interrupt Service .................................... 62
Initializing PORTA ...................................................... 39
Reading a 16-Bit Free Running Timer ....................... 59
Reading Data EEPROM ............................................ 27
Reading Flash Program Memory ............................... 28
Saving Status and W Registers in RAM .................... 97
Writing a 16-Bit Free Running Timer ......................... 59
Writing to Data EEPROM .......................................... 27
PIC16F818/819
DS39598F-page 168 2001-2013 Microchip Technology Inc.
Writing to Flash Program Memory .............................31
Code Protection .........................................................89, 100
Computed GOTO ...............................................................23
Configuration Bits ...............................................................89
Crystal Oscillator and Ceramic Resonators .......................33
Customer Change Notification Service ............................173
Customer Notification Service ..........................................173
Customer Support ............................................................173
D
Data EEPRO M Memory .....................................................25
Associated Registers .................................................32
EEADR Register ........................................................25
EEADRH Register ......................................................25
EECON1 Register ......................................................25
EECON2 Register ......................................................25
EEDATA Register ......................................................25
EEDATH Register ......................................................25
Operation During Code-Protect ..................................32
Protection Against Spurious Writes ............................32
Reading ......................................................................27
Write Interrupt Enable Flag (EEIF Bit) ........................25
Writing ........................................................................27
Data Memory
Special Function Registers ........................................13
DC and AC Characteristics
Graphs and Tables ...................................................141
DC Characteristics
Internal RC Accuracy ...............................................125
PIC16F818/819, PIC16LF818/819 ...........................126
Power-Down and Supply Current .............................118
Supply Voltage .........................................................117
Development Support ......................................................111
Device Differences ...........................................................165
Device Overview ..................................................................5
Direct Addressing ...............................................................24
E
EEADR Register ................................................................25
EEADRH Register ..............................................................25
EECON1 Register ..............................................................25
EECON2 Register ..............................................................25
EEDATA Register ..............................................................25
EEDATH Register ..............................................................25
Electrical Characteristics ..................................................115
Endurance ............................................................................1
Errata ...................................................................................3
External Clock Input ...........................................................34
External Interrupt Input (RB0/INT). See Interrupt Sources.
F
Flash Program Memory ......................................................25
Associated Registers .................................................32
EEADR Register ........................................................25
EEADRH Register ......................................................25
EECON1 Register ......................................................25
EECON2 Register ......................................................25
EEDATA Register ......................................................25
EEDATH Register ......................................................25
Erasing .......................................................................28
Reading ......................................................................28
Writing ........................................................................30
FSR Register .....................................................13, 14, 15, 23
G
General Purpose Register File ...........................................10
I
I/O Por ts ............................................................................. 39
I2CAssociated Registers ................................................. 79
Master Mode Operation ............................................. 79
Mode .......................................................................... 76
Mode Selection .......................................................... 76
Multi-Master Mode Operation .................................... 79
Slave Mode ................................................................ 77
Addressing ......................................................... 77
Reception .......................................................... 77
SCL, SDA Pins .................................................. 77
Transmission ..................................................... 77
ID Locations ................................................................89, 100
In-Circuit Debugger .......................................................... 100
In-Circuit Serial Programming ............................................ 89
In-Circuit Serial Programming (ICSP) .............................. 101
INDF Register .........................................................14, 15, 23
Indirect Addressing .......................................................23, 24
Instruction Format ............................................................ 103
Instruction Set .................................................................. 103
Descriptions ............................................................. 105
Read-Modify-Write Operations ................................ 103
Summary Table ....................................................... 104
ADDLW .................................................................... 105
ADDWF .................................................................... 105
ANDLW .................................................................... 105
ANDWF .................................................................... 105
BCF .......................................................................... 105
BSF .......................................................................... 105
BTFSC ..................................................................... 106
BTFSS ..................................................................... 106
CALL ........................................................................ 106
CLRF ....................................................................... 106
CLRW ...................................................................... 106
CLRWDT ................................................................. 106
COMF ...................................................................... 107
DECF ....................................................................... 107
DECFSZ .................................................................. 107
GOTO ...................................................................... 107
INCF ........................................................................ 107
INCFSZ .................................................................... 107
IORLW ..................................................................... 108
IORWF ..................................................................... 108
MOVF ...................................................................... 108
MOVLW ................................................................... 108
MOVWF ................................................................... 108
NOP ......................................................................... 108
RETFIE .................................................................... 109
RETLW .................................................................... 109
RETURN .................................................................. 109
RLF .......................................................................... 109
RRF ......................................................................... 109
SLEEP ..................................................................... 109
SUBLW .................................................................... 110
SUBWF .................................................................... 110
SWAPF .................................................................... 110
XORLW .................................................................... 110
XORWF ................................................................... 110
INT Interrup t ( RB0 /INT). See Interrupt Sources.
INTCON Register ............................................................... 15
GIE Bit ....................................................................... 18
INTE Bit ..................................................................... 18
INTF Bit ...................................................................... 18
RBIF Bit ..................................................................... 18
2001-2013 Microchip Technology Inc. DS39598F-page 169
PIC16F818/819
TMR0IE Bit .................................................................18
Internal Oscillator Block .....................................................35
INTRC Modes ............................................................35
Internet Address ...............................................................173
Interrupt Sources .......................................................... 89, 96
RB0/INT Pin, External ................................................97
TMR0 Overflow ..........................................................97
Interrupts
RB7:RB4 Port Change ...............................................43
Synchronous Serial Port Interrupt ..............................20
Interrupts, Context Saving During ......................................97
Interrupts, Enable Bits
Global Interrupt Enable (GIE Bit) ...............................96
Interrupt-on-Change (RB7:RB4) Enable
(RBIE Bit) ...........................................................97
RB0/INT Enable (INTE Bit) ........................................18
TMR0 Overflow Enable (TMR0IE Bit) ........................18
Interrupts, Enable bits
Global Interrupt Enable (GIE Bit) ...............................18
Interrupts, Flag Bits
Interrupt-on-Change (RB7:RB4) Flag
(RBIF Bit) ............................................................. 18, 97
RB0/INT Flag (INTF Bit) .............................................18
TMR0 Overflow Flag (TMR0IF Bit) .............................97
INTRC Modes
Adjustment .................................................................36
L
Loading of PC ....................................................................23
Low-Voltage ICSP Programmin g .....................................102
M
Master Clear (MCLR)
MCLR Reset, Normal Operation .....................91, 93, 94
MCLR Reset, Sleep ........................................91, 93, 94
Operation and ESD Protection ...................................92
Memory Organization ...........................................................9
Data Memory .............................................................10
Program Mem ory .........................................................9
Microchip Internet Web Site .............................................173
MPLAB ASM30 Assembler, Linker, Librarian ..................112
MPLAB Integrated Development
Environment Software ..............................................111
MPLAB PM3 Device Pro grammer ....................................114
MPLAB REAL ICE In-Circuit Emulator System ................113
MPLINK Object Linker/MPLIB Object Librarian ...............112
O
Opcode Field Descriptions ...............................................103
OPTION_REG Register .....................................................15
INTEDG Bit .......................................................... 17, 54
PS2:PS0 Bits .............................................................17
PSA Bit .......................................................................17
RBPU Bit .............................................................. 17, 54
T0CS Bit .....................................................................17
T0SE Bit .....................................................................17
Oscillator Configuration ......................................................33
ECIO ..........................................................................33
EXTCLK .....................................................................93
EXTRC .......................................................................93
HS ........................................................................33, 93
INTIO1 .......................................................................33
INTIO2 .......................................................................33
INTRC ........................................................................93
LP ......................................................................... 33, 93
RC ........................................................................ 33, 35
RCIO .......................................................................... 33
XT .........................................................................33, 93
Oscillator Control Register ................................................. 37
Modifying IRCF Bits ................................................... 37
Clock Transition Sequence ................................ 37
Oscillator Start-up Timer (OST) ....................................89, 92
Oscillator, WDT .................................................................. 98
P
Packaging Information ..................................................... 155
Marking .................................................................... 155
PCFG0 Bit .......................................................................... 82
PCFG1 Bit .......................................................................... 82
PCFG2 Bit .......................................................................... 82
PCFG3 Bit .......................................................................... 82
PCL Register ....................................................13, 14, 15, 23
PCLATH Register .............................................13, 14, 15, 23
PCON Register .................................................................. 93
POR Bit ...................................................................... 22
Pinout Descriptions
PIC16F818/819 ........................................................... 7
Pointer, FSR ...................................................................... 23
POP ................................................................................... 23
POR. See Power-on Reset.
PORTA ................................................................................ 7
Associated Register Summary .................................. 39
Functions ................................................................... 39
PORTA Register ........................................................ 39
TRISA Register .......................................................... 39
PORTA Register ................................................................ 13
PORTB ................................................................................ 8
Associated Register Summary .................................. 44
Functions ................................................................... 44
PORTB Register ........................................................ 43
Pull-up Enable (RBPU Bit) ....................................17, 54
RB0/INT Edge Select (INTEDG Bit) .....................17, 54
RB0/INT Pin, External ................................................ 97
RB7:RB4 Interrupt-on-Change .................................. 97
RB7:RB4 Interrupt-on-Change Enable
(RBIE Bit) ........................................................... 97
RB7:RB4 Interrupt-on-Change Flag
(RBIF Bit) ......................................................18, 97
TRISB Register .......................................................... 43
PORTB Register ...........................................................13, 15
Postscaler, WDT
Assignment (PSA Bit) ................................................ 17
Rate Select (PS2:PS0 Bits) ....................................... 17
Power-Down Mode. See Sleep.
Power-on Reset (POR) ............................... 89, 91, 92, 93, 94
POR Status (POR Bit) ............................................... 22
Power Control (PCON) Register ................................ 93
Power-Down (PD Bit) ................................................. 91
Time-ou t (T O Bi t) ..................................................16, 91
Power-up Timer (PW RT ) ..............................................89, 92
PR2 Register ..................................................................... 63
Prescaler, Timer0
Assignment (PSA Bit) ................................................ 17
Rate Select (PS2:PS0 Bits) ....................................... 17
Program Counter
Reset Conditions ....................................................... 93
PIC16F818/819
DS39598F-page 170 2001-2013 Microchip Technology Inc.
Program Memory
Interrupt Vector ............................................................9
Map and Stack
PIC16F818 ...........................................................9
PIC16F819 ...........................................................9
Reset Vector ................................................................9
Program Verification .........................................................100
PUSH .................................................................................23
R
R/W Bit ...............................................................................77
RA0/AN0 Pin ........................................................................7
RA1/AN1 Pin ........................................................................7
RA2/AN2/Vr ef- Pin ...............................................................7
RA3/AN3/Vr ef+ Pin ..............................................................7
RA4/AN4/T0CKI Pin .............................................................7
RA5/(MCLR/Vpp Pin ............................................................7
RA6/OSC2/CLKO Pin ..........................................................7
RA7/OSC1/CLKI Pin ............................................................7
RB0/INT Pin .........................................................................8
RB1/SDI/S DA Pi n .................................................................8
RB2/SDO/CCP1 Pin .............................................................8
RB3/CCP1/PGM Pin ............................................................8
RB4/SCK/SCL Pin ................................................................8
RB5/SS Pin ..........................................................................8
RB6/T1OSO/T1CKI/PGC Pin ...............................................8
RB7/T1OSI/ PG D Pi n ............................................................8
RBIF Bit ..............................................................................43
RCIO Oscillator Mode ........................................................35
Reader Response ............................................................174
Receive Overflow Indicator Bit, SSPOV .............................73
Register File Map
PIC16F818 .................................................................11
PIC16F819 .................................................................12
Registers
ADCON0 (A/D Control 0) ...........................................81
ADCON1 (A/D Control 1) ...........................................82
CCP1CON (Capture/Comp are/P WM Contr ol 1) ........65
Configuration Word ....................................................90
EECON1 (Data EEPROM Access Control 1) .............26
Initialization Conditions (table) ...................................94
INTCON (Interrupt Contro l) ........................................18
OPTION_REG (Option) ........................................17, 54
OSCCON (Oscillator Control) ....................................38
OSCTUNE (Oscillator Tuning) ...................................36
PCON (Power Control) ...............................................22
PIE1 (Peripheral Interrupt Enable 1) ..........................19
PIE2 (Peripheral Interrupt Enable 2) ..........................21
PIR1 (Peripheral Interrupt Request (Flag) 1) .............20
PIR2 (Peripheral Interrupt Request (Flag) 2) .............21
SSPCON (Synchronous Serial Port Control 1) ..........73
SSPSTA T (Synchronous Serial Port Status) .............72
Status .........................................................................16
T1CON (Timer1 Control) ............................................57
T2CON (Timer2 Control) ............................................64
Reset ............................................................................ 89, 91
Brown-out Reset (BOR). See Brown-out
Reset (BOR).
MCLR Reset. See MC LR.
Power-on Reset (POR). See Powe r-on
Reset (POR).
Reset Conditions for All Registers .............................94
Reset Conditions for PCON Register .........................93
Reset Conditions for Program Counter ......................93
Reset Conditions for Status Register .........................93
WDT Reset. See Watchdog Timer (WDT).
Revision History ............................................................... 165
RP0 Bit ............................................................................... 10
RP1 Bit ............................................................................... 10
S
Sales and Support ........................................................... 175
SCL Clock .......................................................................... 77
Sleep .......................................................................89, 91, 99
Software Simulator (MPLAB SIM) .................................... 113
Special Event Trigger ......................................................... 87
Special Features of the CPU ............................................. 89
Special Function Register Summary .................................. 13
Special Function Registers ................................................ 13
SPI Mode
Associated Registers ................................................. 74
Serial Clock ................................................................ 71
Serial D a ta In ............................................................. 71
Serial Data Out .......................................................... 71
Slave Select ............................................................... 71
SSP ACK ........................................................................... 77
I2CI2C Operation ..................................................... 76
SSPADD Register .............................................................. 14
SSPIF ................................................................................ 20
SSPOV .............................................................................. 73
SSPOV Bit ......................................................................... 77
SSPSTAT Register ............................................................ 14
Stack .................................................................................. 23
Overflow ..................................................................... 23
Underflow ................................................................... 23
Status Register .............................................................13, 15
DC Bit ........................................................................ 16
IRP Bit ........................................................................ 16
PD Bit ......................................................................... 91
TO Bit ....................................................................16, 91
Z Bit ........................................................................... 16
Synchronous Serial Port (SSP) .......................................... 71
Overview .................................................................... 71
SPI Mode ................................................................... 71
Synchronous Serial Port Interrupt ...................................... 20
T
T1CKPS0 Bit ...................................................................... 57
T1CKPS1 Bit ...................................................................... 57
T1OSCEN Bit ..................................................................... 57
T1SYNC Bit ....................................................................... 57
T2CKPS0 Bit ...................................................................... 64
T2CKPS1 Bit ...................................................................... 64
Tad ..................................................................................... 85
Time-out Sequence ........................................................... 92
Timer0 ................................................................................ 53
Associated Registers ................................................. 55
Clock Source Edge Select (T0SE Bit ) ....................... 17
Clock Source Sele ct (T0CS Bit) ................................. 17
External Clock ............................................................ 54
Interrupt ..................................................................... 53
Operation ................................................................... 53
Overflow Enable (TMR0IE Bit) ................................... 18
Overflow Flag (TMR0IF Bit) ....................................... 97
Overflow Interrupt ...................................................... 97
Prescaler .................................................................... 54
T0CKI ......................................................................... 54
2001-2013 Microchip Technology Inc. DS39598F-page 171
PIC16F818/819
Timer1 ................................................................................57
Associated Registers .................................................62
Capacitor Selection ....................................................60
Counter Operation .....................................................58
Operation ...................................................................57
Operation in Asynchronous Counter Mode ................59
Operation in Synchronized Counter Mode .................58
Operation in Timer Mode ...........................................58
Oscillator ....................................................................60
Oscillator Layout Considerations ...............................60
Prescaler ....................................................................61
Resetting Register Pair (TMR1H, TMR1L) .................61
Resetting Using a CCP Trigger Output ......................61
TMR1H .......................................................................59
TMR1L .......................................................................59
Use as a Real-Time Clock .........................................61
Timer2 ................................................................................63
Associated Registers .................................................64
Output ........................................................................63
Postscaler ..................................................................63
Prescaler ....................................................................63
Prescaler and Postscaler ...........................................63
Timing Diagrams
A/D Conversion ........................................................140
Brown-out Reset ......................................................131
Capture/Compare/PWM (CCP1) ..............................133
CLKO and I/O ..........................................................130
External Clock ..........................................................129
I2C Bus Data ............................................................137
I2C Bus Start/Stop Bits .............................................136
I2C Reception (7-Bit Address) ....................................78
I2C Transmission (7-Bit Address) ..............................78
PWM Output ..............................................................68
Reset, Watchdog Timer, Oscillator Start-up
Timer and Power-up Timer ..............................131
Slow Rise Time (MCLR Tied to Vdd
Through RC Network) ........................................96
SPI Master Mode .......................................................75
SPI Master Mode (CKE = 0, SMP = 0) ....................134
SPI Master Mode (CKE = 1, SMP = 1) ....................134
SPI Slave Mode (CKE = 0) ................................75, 135
SPI Slave Mode (CKE = 1) ................................75, 135
Time-out Sequence on Power-up (MCLR
Tied to Vdd Through Pull-up Resistor) ...............95
Time-out Sequence on Power-up (MCLR
Tied to Vdd Through RC Network): Case 1 .......95
Time-out Sequence on Power-up (MCLR
Tied to Vdd Through RC Network): Case 2 .......95
Timer0 and Timer1 External Clock ..........................132
Timer1 Incrementing Edge .........................................58
Wake-up from Sleep through Interrupt .....................100
Timing Parameter Symbology ..........................................128
Timing Requirements
External Clock ..........................................................129
TMR0 Register ...................................................................15
TMR1CS Bit .......................................................................57
TMR1H Register ................................................................13
TMR1L Register .................................................................13
TMR1ON Bit .......................................................................57
TMR2 Register ...................................................................13
TMR2ON Bit .......................................................................64
TOUT P S 0 Bi t .....................................................................64
TOUT P S 1 Bi t .....................................................................64
TOUT P S 2 Bi t .....................................................................64
TOUT P S 3 Bi t .....................................................................64
TRISA Register .................................................................. 14
TRISB Register .............................................................14, 15
V
Vdd Pin ................................................................................ 8
Vss Pin ................................................................................. 8
W
Wake-up from Sleep .....................................................89, 99
Interrupts ..............................................................93, 94
MCLR Reset .............................................................. 94
WDT Reset ................................................................ 94
Wake-up Using Interrupts .................................................. 99
Watchdog Timer (WDT) ................................................89, 98
Associated Registers ................................................. 98
Enable (WDTEN Bit) .................................................. 98
INTRC Oscillator ........................................................ 98
Postscaler. See Postscaler, WDT .
Programming Considerations .................................... 98
Time-out Period ......................................................... 98
WDT Reset, Normal Operation .......................91, 93, 94
WDT Reset, Sleep ................................................91, 94
WDT Wake -u p ........................................................... 93
WCOL ................................................................................ 73
Write Collision Detect Bit, WCOL ...................................... 73
WWW Addre ss ................................................................ 173
WWW, On-Line Support ...................................................... 3
PIC16F818/819
DS39598F-page 172 2001-2013 Microchip Technology Inc.
NOTES:
2001-2013 Microchip Technology Inc. DS39598F-page 173
PIC16F818/819
THE MICROCHIP WEB SITE
Microc hip pro vides onl ine s upport v ia our W WW site at
www.microchip.com. This web si te i s used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
•Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
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•General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
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program member listing
•Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of semin ars and events, lis tings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specif ied produ ct family or develo pment tool of interes t.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPP ORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technic al suppo rt is avail able throug h the we b site
at: http://microchip.com/support
PIC16F818/819
DS39598F-page 174 2001-2013 Microchip Technology Inc.
READER RESP ONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO: Technical Publications Manager
RE: Reader Response Total Pages Sent ________
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Questions:
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DS39598FPIC16F818/819
1. What are the best fe atures of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
2001-2013 Microchip Technology Inc. DS39598F-page 175
PIC16F818/819
PIC16F818/819 PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX XXX
PatternPackageTemperature
Range
Device
Device PIC16F818: Standard VDD range
PIC16F818T: (Tape and Reel)
PIC16LF818: Extended VDD rang e
Temperature Range - = 0°C to +70°C
I = -40°C to +85°C (Industrial)
E = -40°C to +125°C (Extended)
Package P = PDIP
SO = SOIC
SS = SSOP
ML = QFN
Pattern QTP, SQTP, ROM Code (factory specified) or
Special Requirements. Blank for OTP and
Windowed devices.
Examples:
a) PIC16LF818-I/P = Industrial temp., PDIP
package, Extend ed VDD limits.
b) PIC16F818-I/SO = Industrial temp., SOIC
package, normal VDD limits.
Note 1: F = CMOS Flash
LF = Low-Power CMOS Flash
2: T = in tape and reel – SOIC, SSOP
packages only.
PIC16F818/819
DS39598F-page 176 2001-2013 Microchip Technology Inc.
NOTES:
2001-2013 Microchip Technology Inc. DS39598F-page 177
Information contained in this publication regarding device
applications a nd t he lik e is provided only f or your con ve nience
and may be supers ed ed by updates. I t is your res ponsibili ty to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlas h
and UNI/O are registered trademarks of Microchip T echnology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Em bedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology I nc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM ,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONIT OR, FanSense, HI-TIDE , In-Circuit Seria l
Programm ing, ICSP, Mindi, MiWi, MPAS M, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Tec hnology Germ any II GmbH & C o. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620769393
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its f amily of products is one of the most secure famili es of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCU s and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS39598F-page 178 2001-2013 Microchip Technology Inc.
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