PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-9558001QJA ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-9558001QJ
A
SNJ54150J
5962-9558001QKA ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9558001QK
A
SNJ54150W
5962-9558001QKA ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9558001QK
A
SNJ54150W
5962-9751601QCA OBSOLETE CDIP J 14 TBD Call TI Call TI -55 to 125
76010012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76010012A
SNJ54LS
151FK
76010012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76010012A
SNJ54LS
151FK
7601001EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601001EA
SNJ54LS151J
7601001EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601001EA
SNJ54LS151J
7601001FA NRND CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601001FA
SNJ54LS151W
7601001FA NRND CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601001FA
SNJ54LS151W
JM38510/01401BKA ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
01401BKA
JM38510/01401BKA ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
01401BKA
JM38510/07901BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07901BEA
JM38510/07901BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07901BFA
JM38510/30901B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30901B2A
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
JM38510/30901B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30901B2A
JM38510/30901BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30901BEA
JM38510/30901BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30901BEA
JM38510/30901BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30901BFA
JM38510/30901BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30901BFA
M38510/01401BKA ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
01401BKA
M38510/01401BKA ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
01401BKA
M38510/07901BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07901BEA
M38510/07901BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07901BFA
M38510/30901B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30901B2A
M38510/30901B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30901B2A
M38510/30901BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30901BEA
M38510/30901BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30901BEA
M38510/30901BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30901BFA
M38510/30901BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30901BFA
SN54150J ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 SN54150J
SN54150J ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 SN54150J
SN54LS151J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS151J
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN54LS151J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS151J
SN54S151J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S151J
SN54S15J OBSOLETE CDIP J 14 TBD Call TI Call TI -55 to 125
SN74150N ACTIVE PDIP N 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74150N
SN74150N ACTIVE PDIP N 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74150N
SN74150NE4 ACTIVE PDIP N 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74150N
SN74150NE4 ACTIVE PDIP N 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74150N
SN74151AN OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70
SN74151AN OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70
SN74LS151D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS151
SN74LS151D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS151
SN74LS151DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS151
SN74LS151DE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS151
SN74LS151DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS151
SN74LS151DG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS151
SN74LS151DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS151
SN74LS151DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS151
SN74LS151DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS151
SN74LS151DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS151
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 4
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74LS151DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS151
SN74LS151DRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS151
SN74LS151J OBSOLETE CDIP J 16 TBD Call TI Call TI 0 to 70
SN74LS151J OBSOLETE CDIP J 16 TBD Call TI Call TI 0 to 70
SN74LS151N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS151N
SN74LS151N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS151N
SN74LS151N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70
SN74LS151N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70
SN74LS151NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS151N
SN74LS151NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS151N
SN74LS151NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS151
SN74LS151NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS151
SN74LS151NSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS151
SN74LS151NSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS151
SN74LS151NSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS151
SN74LS151NSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS151
SN74S151N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S151N
SN74S151N ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S151N
SN74S151N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70
SN74S151N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 5
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74S151NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S151N
SN74S151NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S151N
SNJ54150J ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-9558001QJ
A
SNJ54150J
SNJ54150J ACTIVE CDIP J 24 1 TBD Call TI N / A for Pkg Type -55 to 125 5962-9558001QJ
A
SNJ54150J
SNJ54150W ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9558001QK
A
SNJ54150W
SNJ54150W ACTIVE CFP W 24 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9558001QK
A
SNJ54150W
SNJ54LS151FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76010012A
SNJ54LS
151FK
SNJ54LS151FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76010012A
SNJ54LS
151FK
SNJ54LS151J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601001EA
SNJ54LS151J
SNJ54LS151J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601001EA
SNJ54LS151J
SNJ54LS151W NRND CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601001FA
SNJ54LS151W
SNJ54LS151W NRND CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7601001FA
SNJ54LS151W
SNJ54S151FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S
151FK
SNJ54S151J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S151J
SNJ54S151W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S151W
SNJ54S15FK OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125
PACKAGE OPTION ADDENDUM
www.ti.com 25-Sep-2013
Addendum-Page 6
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SNJ54S15J OBSOLETE CDIP J 14 TBD Call TI Call TI -55 to 125
SNJ54S15W OBSOLETE CFP W 14 TBD Call TI Call TI -55 to 125
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54150, SN54LS151, SN54S15, SN54S151, SN74150, SN74LS151, SN74S151 :
•Catalog: SN74150, SN74LS151, SN74S15, SN74S151
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS151DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74LS151NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS151DR SOIC D 16 2500 333.2 345.9 28.6
SN74LS151NSR SO NS 16 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
J (R-GDIP-T**) CERAMIC DUAL-IN-LINE PACKAGE
24 PINS SHOWN
A
C
0.018 (0,46) MIN
Seating Plane
0.010 (0.25) MAX
Lens Protrusion (Lens Optional)
WIDENARRWIDE
32
NARRWIDE
0.125 (3,18) MIN
0.514(13,06) 0.571(14,50)
0.541(13,74) 0.598(15,19)
1.668(42,37) 1.668(42,37)
1.632(41,45) 1.632(41,45)
0.590(14,99) 0.590(14,99)
0.624(15,85) 0.624(15,85)
4040084/C 10/97
0.012 (0,30)
0.008 (0,20)
40
0.624(15,85) 0.624(15,85)
0.590(14,99) 0.590(14,99)
2.032(51,61) 2.032(51,61)
2.068(52,53) 2.068(52,53)
0.541(13,74) 0.598(15,19)
0.514(13,06) 0.571(14,50)
B
13
12
0.090 (2,29)
0.060 (1,53)
0.045 (1,14)
0.065 (1,65)
24
1
28
0.022 (0,56)
0.014 (0,36)
NARR
24
NARR WIDE
0.624(15,85) 0.624(15,85)
0.590(14,99) 0.590(14,99)
1.235(31,37) 1.235(31,37)
1.265(32,13) 1.265(32,13)
0.541(13,74) 0.598(15,19)
0.514(13,06) 0.571(14,50)
”A”
DIM
”B”
”C”
PINS **
MAX
MIN
MIN
MAX
MAX
MIN 0.514(13,06) 0.571(14,50)
0.541(13,74) 0.598(15,19)
1.465(37,21) 1.465(37,21)
1.435(36,45) 1.435(36,45)
0.590(14,99) 0.590(14,99)
0.624(15,85) 0.624(15,85)
0.175 (4,45)
0.140 (3,56)
0.100 (2,54)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin).
D. This package can be hermetically sealed with a ceramic lid using glass frit.
E. Index point is provided on cap for terminal identification.
MECHANICAL DATA
MCFP007 – OCTOBER 1994
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
W (R-GDFP-F24) CERAMIC DUAL FLATPACK
4040180-5/B 03/95
1.115 (28,32)
0.090 (2,29)
0.375 (9,53)
0.019 (0,48)
0.030 (0,76)
0.045 (1,14)
0.006 (0,15)
0.045 (1,14)
0.015 (0,38)
0.015 (0,38)
0.026 (0,66)
0.004 (0,10)
0.340 (8,64)
0.840 (21,34)
124
0.360 (9,14)
0.240 (6,10)
1312
Base and Seating Plane
30° TYP
0.360 (9,14)
0.240 (6,10)
0.395 (10,03)
0.360 (9,14)
0.640 (16,26)
0.490 (12,45)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Falls within MIL-STD-1835 GDFP2-F24 and JEDEC MO-070AD
E. Index point is provided on cap for terminal identification only.
MECHANICAL DATA
MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
N (R–PDIP–T24) PLASTIC DUAL–IN–LINE
0.020 (0,51) MIN
0.021 (0,53)
0.015 (0,38)
0.100 (2,54)
1
24
0.070 (1,78) MAX 12
13
1.222 (31,04) MAX
0.125 (3,18) MIN
0’–15’
0.010 (0,25) NOM
0.425 (10,80) MAX
Seating Plane
0.200 (5,08) MAX
0.360 (9,14) MAX
0.010 (0,25)
4040051–3/D 09/01
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS–010
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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