TP3057WM - Texas Instruments

TP3054. TP3057

Enhanced Serial Interface CODEC/Filter COMBO Family

Literature Number: SNAS569

TL/H/5510

TP3054, TP3057 ‘‘Enhanced’’ Serial Interface CODEC/Filter COMBO Family

August 1994

TP3054, TP3057

‘‘Enhanced’’ Serial Interface

CODEC/Filter COMBOÉFamily

General Description

The TP3054, TP3057 family consists of m-law and A-law

monolithic PCM CODEC/filters utilizing the A/D and D/A

conversion architecture shown in

Figure 1

, and a serial PCM

interface. The devices are fabricated using National’s ad-

vanced double-poly CMOS process (microCMOS).

The encode portion of each device consists of an input gain

adjust amplifier, an active RC pre-filter which eliminates very

high frequency noise prior to entering a switched-capacitor

band-pass filter that rejects signals below 200 Hz and above

3400 Hz. Also included are auto-zero circuitry and a com-

panding coder which samples the filtered signal and en-

codes it in the companded m-law or A-law PCM format. The

decode portion of each device consists of an expanding

decoder, which reconstructs the analog signal from the

companded m-law or A-law code, a low-pass filter which

corrects for the sin x/x response of the decoder output and

rejects signals above 3400 Hz followed by a single-ended

power amplifier capable of driving low impedance loads.

The devices require two 1.536 MHz, 1.544 MHz or 2.048

MHz transmit and receive master clocks, which may be

asynchronous; transmit and receive bit clocks, which may

vary from 64 kHz to 2.048 MHz; and transmit and receive

frame sync pulses. The timing of the frame sync pulses and

PCM data is compatible with both industry standard formats.

Features

YComplete CODEC and filtering system (COMBO)

including:

Ð Transmit high-pass and low-pass filtering

Ð Receive low-pass filter with sin x/x correction

Ð Active RC noise filters

Ðm-law or A-law compatible COder and DECoder

Ð Internal precision voltage reference

Ð Serial I/O interface

Ð Internal auto-zero circuitry

Ym-law, 16-pinÐTP3054

YA-law, 16-pinÐTP3057

YDesigned for D3/D4 and CCITT applications

Yg5V operation

YLow operating powerÐtypically 50 mW

YPower-down standby modeÐtypically 3 mW

YAutomatic power-down

YTTL or CMOS compatible digital interfaces

YMaximizes line interface card circuit density

YDual-In-Line or surface mount packages

YSee also AN-370, ‘‘Techniques for Designing with

CODEC/Filter COMBO Circuits’’

Connection Diagrams

Dual-In-Line Package

TL/H/5510–1

Top View

Order Number TP3054J or TP3057J

See NS Package Number J16A

Order Number TP3054N or TP3057N

See NS Package Number N16A

Order Number TP3054WM or TP3057WM

See NS Package Number M16B

Plastic Chip Carriers

TL/H/5510–10

Top View

Order Number TP3057V

See NS Package Number V20A

COMBOÉand TRI-STATEÉare registered trademarks of National Semiconductor Corporation.

C1995 National Semiconductor Corporation RRD-B30M125/Printed in U. S. A.

Block Diagram

FIGURE 1 TL/H/5510–2

Pin Description

Symbol Function

VBB Negative power supply pin.

VBB eb

5V g5%.

GNDA Analog ground. All signals are referenced

to this pin.

VFRO Analog output of the receive power ampli-

fier.

VCC Positive power supply pin.

VCC ea

5V g5%.

FSRReceive frame sync pulse which enables

BCLKRto shift PCM data into DR.FS

Ris

an 8 kHz pulse train. See

Figures 2

and

for timing details.

DRReceive data input. PCM data is shifted

into DRfollowing the FSRleading edge.

BCLKR/CLKSEL The bit clock which shifts data into DRaf-

ter the FSRleading edge. May vary from

64 kHz to 2.048 MHz. Alternatively, may

be a logic input which selects either

1.536 MHz/1.544 MHz or 2.048 MHz for

master clock in synchronous mode and

BCLKXis used for both transmit and re-

ceive directions (see Table I).

MCLKR/PDN Receive master clock. Must be

1.536 MHz, 1.544 MHz or 2.048 MHz.

May be asynchronous with MCLKX, but

Symbol Function

should be synchronous with MCLKXfor best per-

formance. When MCLKRis connected continu-

ously low, MCLKXis selected for all internal tim-

ing. When MCLKRis connected continuously

high, the device is powered down.

MCLKXTransmit master clock. Must be 1.536 MHz,

1.544 MHz or 2.048 MHz. May be asynchronous

with MCLKR. Best performance is realized from

synchronous operation.

FSXTransmit frame sync pulse input which enables

BCLKXto shift out the PCM data on DX.FS

Xis

an 8 kHz pulse train, see

Figures 2

and

for

timing details.

BCLKXThe bit clock which shifts out the PCM data on

DX. May vary from 64 kHz to 2.048 MHz, but

must be synchronous with MCLKX.

DXThe TRI-STATEÉPCM data output which is en-

abled by FSX.

TSXOpen drain output which pulses low during the

encoder time slot.

GSXAnalog output of the transmit input amplifier.

Used to externally set gain.

VFXIbInverting input of the transmit input amplifier.

VFXIaNon-inverting input of the transmit input amplifi-

er.

Functional Description

POWER-UP

When power is first applied, power-on reset circuitry initializ-

es the COMBO and places it into a power-down state. All

non-essential circuits are deactivated and the DXand VFRO

outputs are put in high impedance states. To power-up the

device, a logical low level or clock must be applied to the

MCLKR/PDN pin

and

FSXand/or FSRpulses must be pres-

ent. Thus, 2 power-down control modes are available. The

first is to pull the MCLKR/PDN pin high; the alternative is to

hold both FSXand FSRinputs continuously lowÐthe device

will power-down approximately 1 ms after the last FSXor

FSRpulse. Power-up will occur on the first FSXor FSR

pulse. The TRI-STATE PCM data output, DX, will remain in

the high impedance state until the second FSXpulse.

SYNCHRONOUS OPERATION

For synchronous operation, the same master clock and bit

clock should be used for both the transmit and receive di-

rections. In this mode, a clock must be applied to MCLKX

and the MCLKR/PDN pin can be used as a power-down

control. A low level on MCLKR/PDN powers up the device

and a high level powers down the device. In either case,

MCLKXwill be selected as the master clock for both the

transmit and receive circuits. A bit clock must also be ap-

plied to BCLKXand the BCLKR/CLKSEL can be used to

select the proper internal divider for a master clock of 1.536

MHz, 1.544 MHz or 2.048 MHz. For 1.544 MHz operation,

the device automatically compensates for the 193rd clock

pulse each frame.

With a fixed level on the BCLKR/CLKSEL pin, BCLKXwill be

selected as the bit clock for both the transmit and receive

directions. Table 1 indicates the frequencies of operation

which can be selected, depending on the state of BCLKR/

CLKSEL. In this synchronous mode, the bit clock, BCLKX,

may be from 64 kHz to 2.048 MHz, but must be synchro-

nous with MCLKX.

Each FSXpulse begins the encoding cycle and the PCM

data from the previous encode cycle is shifted out of the

enabled DXoutput on the positive edge of BCLKX. After 8

bit clock periods, the TRI-STATE DXoutput is returned to a

high impedance state. With an FSRpulse, PCM data is

latched via the DRinput on the negative edge of BCLKX(or

BCLKRif running). FSXand FSRmust be synchronous with

MCLKX/R.

TABLE I. Selection of Master Clock Frequencies

BCLKR/CLKSEL

Master Clock

Frequency Selected

TP3057 TP3054

Clocked 2.048 MHz 1.536 MHz or

1.544 MHz

0 1.536 MHz or 2.048 MHz

1.544 MHz

1 2.048 MHz 1.536 MHz or

1.544 MHz

ASYNCHRONOUS OPERATION

For asynchronous operation, separate transmit and receive

clocks may be applied. MCLKXand MCLKRmust be

2.048 MHz for the TP3057, or 1.536 MHz, 1.544 MHz for the

TP3054, and need not be synchronous. For best transmis-

sion performance, however, MCLKRshould be synchronous

with MCLKX, which is easily achieved by applying only static

logic levels to the MCLKR/PDN pin. This will automatically

connect MCLKXto all internal MCLKRfunctions (see Pin

Description). For 1.544 MHz operation, the device automati-

cally compensates for the 193rd clock pulse each frame.

FSXstarts each encoding cycle and must be synchronous

with MCLKXand BCLKX.FS

Rstarts each decoding cycle

and must be synchronous with BCLKR. BCLKRmust be a

clock, the logic levels shown in Table 1 are not valid in

asynchronous mode. BCLKXand BCLKRmay operate from

64 kHz to 2.048 MHz.

SHORT FRAME SYNC OPERATION

The COMBO can utilize either a short frame sync pulse or a

long frame sync pulse. Upon power initialization, the device

assumes a short frame mode. In this mode, both frame sync

pulses, FSXand FSR, must be one bit clock period long,

with timing relationships specified in

Figure 2

. With FSXhigh

during a falling edge of BCLKX, the next rising edge of

BCLKXenables the DXTRI-STATE output buffer, which will

output the sign bit. The following seven rising edges clock

out the remaining seven bits, and the next falling edge dis-

ables the DXoutput. With FSRhigh during a falling edge of

BCLKR(BCLKXin synchronous mode), the next falling edge

of BCLKRlatches in the sign bit. The following seven falling

edges latch in the seven remaining bits. All four devices

may utilize the short frame sync pulse in synchronous or

asynchronous operating mode.

LONG FRAME SYNC OPERATION

To use the long frame mode, both the frame sync pulses,

FSXand FSR, must be three or more bit clock periods long,

with timing relationships specified in

Figure 3

. Based on the

transmit frame sync, FSX, the COMBO will sense whether

short or long frame sync pulses are being used. For 64 kHz

operation, the frame sync pulse must be kept low for a mini-

mum of 160 ns. The DXTRI-STATE output buffer is enabled

with the rising edge of FSXor the rising edge of BCLKX,

whichever comes later, and the first bit clocked out is the

sign bit. The following seven BCLKXrising edges clock out

the remaining seven bits. The DXoutput is disabled by the

falling BCLKXedge following the eighth rising edge, or by

FSXgoing low, whichever comes later. A rising edge on the

receive frame sync pulse, FSR, will cause the PCM data at

DRto be latched in on the next eight falling edges of BCLKR

(BCLKXin synchronous mode). All four devices may utilize

the long frame sync pulse in synchronous or asynchronous

mode.

In applications where the LSB bit is used for signalling with

FSRtwo bit clock periods long, the decoder will interpret the

lost LSB as ‘‘(/2’’ to minimize noise and distortion.

Functional Description (Continued)

TRANSMIT SECTION

The transmit section input is an operational amplifier with

provision for gain adjustment using two external resistors,

see

Figure 4

. The low noise and wide bandwidth allow gains

in excess of 20 dB across the audio passband to be real-

ized. The op amp drives a unity-gain filter consisting of RC

active pre-filter, followed by an eighth order switched-ca-

pacitor bandpass filter clocked at 256 kHz. The output of

this filter directly drives the encoder sample-and-hold circuit.

The A/D is of companding type according to m-law

(TP3054) or A-law (TP3057) coding conventions. A preci-

sion voltage reference is trimmed in manufacturing to pro-

vide an input overload (tMAX) of nominally 2.5V peak (see

table of Transmission Characteristics). The FSXframe sync

pulse controls the sampling of the filter output, and then the

successive-approximation encoding cycle begins. The 8-bit

code is then loaded into a buffer and shifted out through DX

at the next FSXpulse. The total encoding delay will be ap-

proximately 165 ms (due to the transmit filter) plus 125 ms

(due to encoding delay), which totals 290 ms. Any offset

voltage due to the filters or comparator is cancelled by sign

bit integration.

RECEIVE SECTION

The receive section consists of an expanding DAC which

drives a fifth order switched-capacitor low pass filter

clocked at 256 kHz. The decoder is A-law (TP3057) or

m-law (TP3054) and the 5th order low pass filter corrects for

the sin x/x attenuation due to the 8 kHz sample/hold. The

filter is then followed by a 2nd order RC active post-filter/

power amplifer capable of driving a 600Xload to a level of

7.2 dBm. The receive section is unity-gain. Upon the occur-

rence of FSR, the data at the DRinput is clocked in on the

falling edge of the next eight BCLKR(BCLKX) periods. At

the end of the decoder time slot, the decoding cycle begins,

and 10 ms later the decoder DAC output is updated. The

total decoder delay is E10 ms (decoder update) plus

110 ms (filter delay) plus 62.5 ms((/2 frame), which gives

approximately 180 ms.

Absolute Maximum Ratings

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales

Office/Distributors for availability and specifications.

VCC to GNDA 7V

VBB to GNDA b7V

Voltage at any Analog Input

or Output VCCa0.3V to VBBb0.3V

Voltage at any Digital Input or

Output VCCa0.3V to GNDAb0.3V

Operating Temperature Range b25§Ctoa125§C

Storage Temperature Range b65§Ctoa

150§C

Lead Temperature (Soldering, 10 seconds) 300§C

ESD (Human Body Model) 2000V

Latch-Up Immunity e100 mA on any Pin

Electrical Characteristics Unless otherwise noted, limits printed in BOLD characters are guaranteed for VCC

e5.0V g5%, VBB eb

5.0V g5%; TAe0§Cto70

C by correlation with 100% electrical testing at TAe25§C. All other limits

are assured by correlation with other production tests and/or product design and characterization. All signals referenced to

GNDA. Typicals specified at VCC e5.0V, VBB eb

5.0V, TAe25§C.

Symbol Parameter Conditions Min Typ Max Units

DIGITAL INTERFACE

VIL Input Low Voltage 0.6 V

VIH Input High Voltage 2.2 V

VOL Output Low Voltage DX,I

3.2 mA 0.4 V

SIGR,I

1.0 mA 0.4 V

TSX,I

3.2 mA, Open Drain 0.4 V

VOH Output High Voltage DX,I

eb3.2 mA 2.4 V

SIGR,I

eb1.0 mA 2.4 V

IIL Input Low Current GNDAsVINsVIL, All Digital Inputs b10 10 mA

IIH Input High Current VIHsVINsVCC b10 10 mA

IOZ Output Current in High Impedance DX, GNDAsVOsVCC b10 10 mA

State (TRI-STATE)

ANALOG INTERFACE WITH TRANSMIT INPUT AMPLIFIER (ALL DEVICES)

IIXA Input Leakage Current b2.5VsVsa2.5V, VFXIaor VFXIbb200 200 nA

RIXA Input Resistance b2.5VsVsa2.5V, VFXIaor VFXIb10 MX

ROXA Output Resistance Closed Loop, Unity Gain 1 3 X

RLXA Load Resistance GSX10 kX

CLXA Load Capacitance GSX50 pF

VOXA Output Dynamic Range GSX,R

10 kXb2.8 2.8 V

AVXA Voltage Gain VFXIato GSX5000 V/V

FUXA Unity Gain Bandwidth 1 2 MHz

VOSXA Offset Voltage b20 20 mV

VCMXA Common-Mode Voltage CMRRXA l60 dB b2.5 2.5 V

CMRRXA Common-Mode Rejection Ratio DC Test 60 dB

PSRRXA Power Supply Rejection Ratio DC Test 60 dB

ANALOG INTERFACE WITH RECEIVE FILTER (ALL DEVICES)

RORF Output Resistance Pin VFRO13X

RF Load Resistance VFROeg2.5V 600 X

CLRF Load Capacitance 500 pF

VOSRO Output DC Offset Voltage b200 200 mV

POWER DISSIPATION (ALL DEVICES)

ICC0 Power-Down Current No Load (Note) 0.5 1.5 mA

IBB0 Power-Down Current No Load (Note) 0.05 0.3 mA

ICC1 Power-Up Active Current No Load 5.0 9.0 mA

IBB1 Power-Up Active Current No Load 5.0 9.0 mA

Note: ICC0 and IBB0 are measured after first achieving a power-up state.

Timing Specifications Unless otherwise noted, limits printed in BOLD characters are guaranteed for VCC e

5.0V g5%, VBB eb

5.0V g5%; TAe0§Cto70

C by correlation with 100% electrical testing at TAe25§C. All other limits are

assured by correlation with other production tests and/or product design and characterization. All signals referenced to GNDA.

Typicals specified at VCC e5.0V, VBB eb

5.0V, TAe25§C. All timing parameters are measured at VOH e2.0V and VOL e

0.7V. See Definitions and Timing Conventions section for test methods information.

Symbol Parameter Conditions Min Typ Max Units

1/tPM Frequency of Master Clocks Depends on the Device Used and the 1.536 MHz

BCLKR/CLKSEL Pin. 1.544 MHz

MCLKXand MCLKR2.048 MHz

tRM Rise Time of Master Clock MCLKXand MCLKR50 ns

tFM Fall Time of Master Clock MCLKXand MCLKR50 ns

tPB Period of Bit Clock 485 488 15725 ns

tRB Rise Time of Bit Clock BCLKXand BCLKR50 ns

tFB Fall Time of Bit Clock BCLKXand BCLKR50 ns

tWMH Width of Master Clock High MCLKXand MCLKR160 ns

tWML Width of Master Clock Low MCLKXand MCLKR160 ns

tSBFM Set-Up Time from BCLKXHigh First Bit Clock after the Leading 100 ns

to MCLKXFalling Edge Edge of FSX

tSFFM Set-Up Time from FSXHigh Long Frame Only 100 ns

to MCLKXFalling Edge

tWBH Width of Bit Clock High VIHe2.2V 160 ns

tWBL Width of Bit Clock Low VILe0.6V 160 ns

tHBFL Holding Time from Bit Clock Long Frame Only 0ns

Low to Frame Sync

tHBFS Holding Time from Bit Clock Short Frame Only 0ns

High to Frame Sync

tSFB Set-Up Time from Frame Sync Long Frame Only 80 ns

to Bit Clock Low

tDBD Delay Time from BCLKXHigh Loade150 pF plus 2 LSTTL Loads 0 140 ns

to Data Valid

tDBTS Delay Time to TSXLow Loade150 pF plus 2 LSTTL Loads 140 ns

tDZC Delay Time from BCLKXLow to CLe0 pF to 150 pF 50 165 ns

Data Output Disabled

tDZF Delay Time to Valid Data from CLe0 pF to 150 pF 20 165 ns

FSXor BCLKX, Whichever

Comes Later

tSDB Set-Up Time from DRValid to 50 ns

BCLKR/X Low

tHBD Hold Time from BCLKR/X Low to 50 ns

DRInvalid

tSF Set-Up Time from FSX/R to Short Frame Sync Pulse (1 Bit Clock 50 ns

BCLKX/RLow Period Long)

tHF Hold Time from BCLKX/R Low Short Frame Sync Pulse (1 Bit Clock 100 ns

to FSX/R Low Period Long)

tHBFl Hold Time from 3rd Period of Long Frame Sync Pulse (from 3 to 8 Bit 100 ns

Bit Clock Low to Frame Sync Clock Periods Long)

(FSXor FSR)

tWFL Minimum Width of the Frame 64k Bit/s Operating Mode 160 ns

Sync Pulse (Low Level)

Timing Diagrams

TL/H/5510–3

FIGURE 2. Short Frame Sync Timing

Timing Diagrams (Continued)

TL/H/5510–4

FIGURE 3. Long Frame Sync Timing

Transmission Characteristics Unless otherwise noted, limits printed in BOLD characters are guaranteed for

VCC e5.0V g5%, VBB eb

5.0V g5%; TAe0§Cto70

C by correlation with 100% electrical testing at TAe25§C. All other

limits are assured by correlation with other production tests and/or product design and characterization. GNDA e0V, f e

1.02 kHz, VIN e0 dBm0, transmit input amplifier connected for unity gain non-inverting. Typicals specified at VCC e5.0V, VBB

5.0V, TAe25§C.

Symbol Parameter Conditions Min Typ Max Units

AMPLITUDE RESPONSE

Absolute Levels Nominal 0 dBm0 Level is 4 dBm

(Definition of Nominal Gain) (600X)

0 dBm0 1.2276 Vrms

tMAX Virtual Decision Valve Defined Max Overload Level

Per CCITT Rec. G711 TP3054 (3.17 dBm0) 2.501 VPK

TP3057 (3.14 dBm0) 2.492 VPK

GXA Transmit Gain, Absolute TAe25§C, VCCe5V, VBBeb5V

Input at GSXe0 dBm0 at 1020 Hz

TP3054/57 b0.15 0.15 dB

GXR Transmit Gain, Relative to GXA fe16 Hz b40 dB

fe50 Hz b30 dB

fe60 Hz b26 dB

fe200 Hz b1.8 b0.1 dB

fe300 Hzb3000 Hz b0.15 0.15 dB

fe3300 Hz b0.35 0.05 dB

fe3400 Hz b0.7 0 dB

fe4000 Hz b14 dB

fe4600 Hz and Up, Measure b32 dB

Response from 0 Hz to 4000 Hz

GXAT Absolute Transmit Gain Variation Relative to GXA b0.1 0.1 dB

with Temperature

GXAV Absolute Transmit Gain Variation Relative to GXA b0.05 0.05 dB

with Supply Voltage

GXRL Transmit Gain Variations with Sinusoidal Test Method

Level Reference Leveleb10 dBm0

VFXIaeb40 dBm0 to a3 dBm0 b0.2 0.2 dB

VFXIaeb50 dBm0 to b40 dBm0 b0.4 0.4 dB

VFXIaeb55 dBm0 to b50 dBm0 b1.2 1.2 dB

GRA Receive Gain, Absolute TAe25§C, VCCe5V, VBBeb5V

InputeDigital Code Sequence for

0 dBm0 Signal at 1020 Hz

TP3054/57 b0.15 0.15 dB

GRR Receive Gain, Relative to GRA fe0 Hz to 3000 Hz b0.15 0.15 dB

fe3300 Hz b0.35 0.05 dB

fe3400 Hz b0.7 0 dB

fe4000 Hz b14 dB

GRAT Absolute Receive Gain Variation Relative to GRA b0.1 0.1 dB

with Temperature

GRAV Absolute Receive Gain Variation Relative to GRA b0.05 0.05 dB

with Supply Voltage

GRRL Receive Gain Variations with Sinusoidal Test Method; Reference

Level Input PCM Code Corresponds to an

Ideally Encoded PCM Level

eb40 dBm0 to a3 dBm0 b0.2 0.2 dB

eb50 dBm0 to b40 dBm0 b0.4 0.4 dB

eb55 dBm0 to b50 dBm0 b1.2 1.2 dB

VRO Receive Output Drive Level RLe600Xb2.5 2.5 V

Transmission Characteristics (Continued) Unless otherwise noted, limits printed in BOLD characters are

guaranteed for VCC e5.0V g5%, VBB eb

5.0V g5%; TAe0§Cto70

C by correlation with 100% electrical testing at TAe

25§C. All other limits are assured by correlation with other production tests and/or product design and characterization. GNDA

e0V, f e1.02 kHz, VIN e0 dBm0, transmit input amplifier connected for unity gain non-inverting. Typicals specified at VCC e

5.0V, VBB eb

5.0V, TAe25§C.

Symbol Parameter Conditions Min Typ Max Units

ENVELOPE DELAY DISTORTION WITH FREQUENCY

DXA Transmit Delay, Absolute fe1600 Hz 290 315 ms

DXR Transmit Delay, Relative to DXA fe500 Hz– 600 Hz 195 220 ms

fe600 Hz– 800 Hz 120 145 ms

fe800 Hz– 1000 Hz 50 75 ms

fe1000 Hz– 1600 Hz 20 40 ms

fe1600 Hz– 2600 Hz 55 75 ms

fe2600 Hz– 2800 Hz 80 105 ms

fe2800 Hz– 3000 Hz 130 155 ms

DRA Receive Delay, Absolute fe1600 Hz 180 200 ms

DRR Receive Delay, Relative to DRA fe500 Hz– 1000 Hz b40 b25 ms

fe1000 Hz– 1600 Hz b30 b20 ms

fe1600 Hz– 2600 Hz 70 90 ms

fe2600 Hz– 2800 Hz 100 125 ms

fe2800 Hz– 3000 Hz 145 175 ms

NOISE

NXC Transmit Noise, C Message TP3054 12 15 dBrnC0

Weighted

NXP Transmit Noise, P Message TP3057 b74 b67 dBm0p

Weighted

NRC Receive Noise, C Message PCM Code is Alternating Positive

Weighted and Negative Zero Ð TP3054 8 11 dBrnC0

NRP Receive Noise, P Message PCM Code Equals Positive

Weighted Zero Ð TP3057 b82 b79 dBm0p

NRS Noise, Single Frequency fe0 kHz to 100 kHz, Loop Around b53 dBm0

Measurement, VFXIae0 Vrms

PPSRXPositive Power Supply Rejection, VFXIaeb

50 dBm0

Transmit VCCe5.0 VDCa100 mVrms

fe0 kHz– 50 kHz (Note 2) 40 dBC

NPSRXNegative Power Supply Rejection, VFXIaeb

50 dBm0

Transmit VBBeb5.0 VDCa100 mVrms

fe0 kHz– 50 kHz (Note 2) 40 dBC

PPSRRPositive Power Supply Rejection, PCM Code Equals Positive Zero

Receive VCCe5.0 VDCa100 mVrms

Measure VFR0

fe0 Hz– 4000 Hz 40 dBC

fe4 kHz– 25 kHz 40 dB

fe25 kHz– 50 kHz 36 dB

NPSRRNegative Power Supply Rejection, PCM Code Equals Positive Zero

Receive VBBeb5.0 VDCa100 mVrms

Measure VFR0

fe0 Hz– 4000 Hz 40 dBC

fe4 kHz– 25 kHz 40 dB

fe25 kHz– 50 kHz 36 dB

Transmission Characteristics (Continued) Unless otherwise noted, limits printed in BOLD characters are

guaranteed for VCC e5.0V g5%, VBB eb

5.0V g5%; TAe0§Cto70

C by correlation with 100% electrical testing at TAe

25§C. All other limits are assured by correlation with other production tests and/or product design and characterization. GNDA

e0V, f e1.02 kHz, VIN e0 dBm0, transmit input amplifier connected for unity gain non-inverting. Typicals specified at VCC e

5.0V, VBB eb

5.0V, TAe25§C.

Symbol Parameter Conditions Min Typ Max Units

SOS Spurious Out-of-Band Signals Loop Around Measurement, 0 dBm0, b30 dB

at the Channel Output 300 Hz to 3400 Hz Input PCM Code Applied

at DR.

4600 Hz– 7600 Hz b30 dB

7600 Hz– 8400 Hz b40 dB

8400 Hz– 100,000 Hz b30 dB

DISTORTION

STDXSignal to Total Distortion Sinusoidal Test Method (Note 3)

STDRTransmit or Receive e3.0 dBm0Level 33 dBC

Half-Channel e0 dBm0 to b30 dBm0 36 dBC

XMT

eb40 dBm0 29 dBC

RCV 30 dBC

XMT

eb55 dBm0 14 dBC

RCV 15 dBC

SFDXSingle Frequency Distortion, b46 dB

Transmit

SFDRSingle Frequency Distortion, b46 dB

Receive

IMD Intermodulation Distortion Loop Around Measurement, b41 dB

VFXaeb4 dBm0 to b21 dBm0, Two

Frequencies in the Range

300 Hz– 3400 Hz

CROSSTALK

CTX-R Transmit to Receive Crosstalk, fe300 Hz–3400 Hz

0 dBm0 Transmit Level DReQuiet PCM Code b90 b75 dB

CTR-X Receive to Transmit Crosstalk, fe300 Hz–3400 Hz, VFXIeMultitone b90 b70 dB

0 dBm0 Receive Level (Note 2)

ENCODING FORMAT AT DXOUTPUT

TP3054 TP3057

m-Law A-Law

(Includes Even Bit Inversion)

VIN (at GSX)eaFull-Scale 10000000 10101010

IN (at GSX)e0V 11111111 11010101

Ð01111111 01010101

IN (at GSX)ebFull-Scale 00000000 00101010

Note 1: Measured by extrapolation from the distortion test result at b50 dBm0.

Note 2: PPSRX, NPSRX, and CTR-X are measured with a b50 dBm0 activation signal applied to VFXIa.

Note 3: Devices are measured using C message weighted filter for m-Law and psophometric weighted filter for A-Law.

Applications Information

POWER SUPPLIES

While the pins of the TP305X family are well protected

against electrical misuse, it is recommended that the stan-

dard CMOS practice be followed, ensuring that ground is

connected to the device before any other connections are

made. In applications where the printed circuit board may be

plugged into a ‘‘hot’’ socket with power and clocks already

present, an extra long ground pin in the connector should

be used.

All ground connections to each device should meet at a

common point as close as possible to the GNDA pin. This

minimizes the interaction of ground return currents flowing

through a common bus impedance. 0.1 mF supply decou-

pling capacitors should be connected from this common

ground point to VCC and VBB, as close to the device as

possible.

For best performance, the ground point of each CODEC/

FILTER on a card should be connected to a common card

ground in star formation, rather than via a ground bus.

This common ground point should be decoupled to VCC and

VBB with 10 mF capacitors.

RECEIVE GAIN ADJUSTMENT

For applications where a TP305X family CODEC/filter re-

ceive output must drive a 600Xload, but a peak swing lower

than g2.5V is required, the receive gain can be easily ad-

justed by inserting a matched T-pad or q-pad at the output.

Table II lists the required resistor values for 600Xtermina-

tions. As these are generally non-standard values, the equa-

tions can be used to compute the attenuation of the closest

practical set of resistors. It may be necessary to use un-

equal values for the R1 or R4 arms of the attenuators to

achieve a precise attenuation. Generally it is tolerable to

allow a small deviation of the input impedance from nominal

while still maintaining a good return loss. For example a 30

dB return loss against 600Xis obtained if the output imped-

ance of the attenuator is in the range 282Xto 319X(as-

suming a perfect transformer).

T-Pad Attenuator

R1 eZ1 #N2a1

N2b1Jb20Z1.Z2 #N

N2b1J

R2 e20Z1.Z2 #N

N2b1J

Where: N e0POWER IN

POWER OUT

and

Se0Z1

Also: Z e0ZSC #ZOC

Where ZSC eimpedance with short circuit termination

and ZOC eimpedance with open circuit termination

q-Pad Attenuator

TL/H/5510–5

R3 e0Z1.Z2

2#N2b1

R3 eZ1 #N2b1

N2b2NS a1J

Note: See Application Note 370 for further details.

Applications Information (Continued)

TABLE II. Attentuator Tables for Z1eZ2e300X

(All Values in X)

dB R1 R2 R3 R4

0.1 1.7 26k 3.5 52k

0.2 3.5 13k 6.9 26k

0.3 5.2 8.7k 10.4 17.4k

0.4 6.9 6.5k 13.8 13k

0.5 8.5 5.2k 17.3 10.5k

0.6 10.4 4.4k 21.3 8.7k

0.7 12.1 3.7k 24.2 7.5k

0.8 13.8 3.3k 27.7 6.5k

0.9 15.5 2.9k 31.1 5.8k

1.0 17.3 2.6l 34.6 5.2k

2 34.4 1.3k 70 2.6k

3 51.3 850 107 1.8k

4 68 650 144 1.3k

5 84 494 183 1.1k

6 100 402 224 900

7 115 380 269 785

8 379 284 317 698

9 143 244 370 630

10 156 211 427 527

11 168 184 490 535

12 180 161 550 500

13 190 142 635 473

14 200 125 720 450

15 210 110 816 430

16 218 98 924 413

18 233 77 1.17k 386

20 246 61 1.5k 366

Typical Synchronous Application

TL/H/5510–6

Note 1: XMIT gaine20clog #R1aR2

R2 Jwhere (R1aR2) l10 KX.

FIGURE 4

Connection Diagrams (Continued)

Plastic Chip Carrier

TL/H/5510–7

Top View

Order Number TP3057V

See NS Package Number V20A

Physical Dimensions inches (millimeters)

Cavity Dual-In-Line Package (J)

Order Number TP3054J or TP3057J

NS Package Number J16A

Molded Small Outline Package (WM)

Order Number TP3054WM or TP3057WM

NS Package Number M16B

TP3054, TP3057 ‘‘Enhanced’’ Serial Interface CODEC/Filter COMBO Family

Physical Dimensions inches (millimeters) (Continued)

Molded Dual-In-Line Package (N)

Order Number TP3054N or TP3057N

NS Package Number N16A

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL

SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or 2. A critical component is any component of a life

systems which, (a) are intended for surgical implant support device or system whose failure to perform can

into the body, or (b) support or sustain life, and whose be reasonably expected to cause the failure of the life

failure to perform, when properly used in accordance support device or system, or to affect its safety or

with instructions for use provided in the labeling, can effectiveness.

be reasonably expected to result in a significant injury

to the user.

National Semiconductor National Semiconductor National Semiconductor National Semiconductor

Corporation Europe Hong Kong Ltd. Japan Ltd.

1111 West Bardin Road Fax: (

49) 0-180-530 85 86 13th Floor, Straight Block, Tel: 81-043-299-2309

Arlington, TX 76017 Email: cnjwge

tevm2.nsc.com Ocean Centre, 5 Canton Rd. Fax: 81-043-299-2408

Tel: 1(800) 272-9959 Deutsch Tel: (

49) 0-180-530 85 85 Tsimshatsui, Kowloon

Fax: 1(800) 737-7018 English Tel: (

49) 0-180-532 78 32 Hong Kong

Fran3ais Tel: (

49) 0-180-532 93 58 Tel: (852) 2737-1600

Italiano Tel: (

49) 0-180-534 16 80 Fax: (852) 2736-9960

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are

sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where

mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and

applications using TI components. To minimize the risks associated with customer products and applications, customers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,

or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a

warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual

property of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied

by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive

business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional

restrictions.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all

express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not

responsible or liable for any such statements.

TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably

be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing

such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products

and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be

provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in

such safety-critical applications.

TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are

specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military

specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at

the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.

TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are

designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated

products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products Applications

Audio www.ti.com/audio Communications and Telecom www.ti.com/communications

Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers

Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps

DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy

DSP dsp.ti.com Industrial www.ti.com/industrial

Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical

Interface interface.ti.com Security www.ti.com/security

Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense

Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive

Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video

RFID www.ti-rfid.com

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community Home Page e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Texas Instruments:

TP3057ADW TP3057BN TP3057AN TP3057BDW TP3057ADWR TP3057BDWR TP3057N/NOPB TP3057V/63

TP3057V/63SN TP3057V/NOPB TP3057WM TP3057WM/63SN TP3057WM/NOPB TP3057WMX/NOPB