INTEGRATED CIRCUITS DIVISION
DS-CPC1986-R07 www.ixysic.com 1
e
3
Characteristics
Features
•1.6Arms Load Current with 5°C/W Heat Sink
•Low 3 On-Resistance
•1000VP Blocking Voltage
•2500Vrms Input/Output Isolation
•Low Thermal Resistance (0.35 °C/W)
•Electrically Non-conductive Thermal Pad for Heat
Sink Applications
•Low Drive Power Requirements
•Arc-Free With No Snubbing Circuits
•No EMI/RFI Generation
•Machine Insertable, Wave Solderable
Applications
•Industrial Controls / Motor Control
•Robotics
•Medical Equipment—Patient/Equipment Isolation
•Instrumentation
•Multiplexers
•Data Acquisition
•Electronic Switching
•I/O Subsystems
•Meters (Watt-Hour, Water, Gas)
•Transportation Equipment
•Aerospace/Defense
Approvals
•UL 508 Certified Component: File E69938
Pin Configuration
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability,
and compact size to a new family of high-power Solid
State Relays.
As part of this family, the CPC1986 single-pole,
normally open (1-Form-A) Solid State Power Relay is
rated for up to 1.6Arms continuous load current with a
5°C/W heat sink.
The CPC1986 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled by a
highly efficient GaAIAs infrared LED. The combination
of low on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique i4-PAC package pioneered by IXYS
enables Solid State Relays to achieve the highest load
current and power ratings. This package features a
unique IXYS process in which the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500Vrms isolation
but also very low thermal resistance (0.35 °C/W).
Ordering Information
Switching Characteristics
Parameter Rating Units
Blocking Voltage 1000 VP
Load Current, TA=25°C:
With 5°C/W Heat Sink 1.6 Arms
No Heat Sink 0.65
On-Resistance (max) 3
RJC 0.35 °C/W
3
-
24
+
1
Part Description
CPC1986J i4-PAC Package (25 per tube)
Form-A
I
F
I
LOAD
10%
90%
ton toff
CPC1986
i4-PAC™ Power Relay
INTEGRATED CIRCUITS DIVISION
R07 www.ixysic.com 2
CPC1986
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
1.2 Electrical Characteristics @ 25°C
1 Higher load currents possible with proper heat sinking.
2 Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (TC > 60ºC) a LED drive current of 20mA is recommended.
Symbol Ratings Units
Blocking Voltage 1000 VP
Reverse Input Voltage 5 V
Input Control Current 100 mA
Peak (10ms) 1 A
Input Power Dissipation 150 mW
Isolation Voltage, Input to Output 2500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
Parameter Conditions Symbol Minimum Typical Maximum Units
Output Characteristics
Load Current 1
Peak t10ms
IL--
10 AP
Continuous No Heat Sink 0.65
Continuous TC=25°C 6.5 Arms
Continuous TC=99°C IL(99) 0.75
On-Resistance 2IF=10mA, IL=1A RON -2.43
Off-State Leakage Current VL=1000VPILEAK --1A
Switching Speeds
Tu r n - O n IF=20mA, VL=10V ton --20
ms
Tu r n - O f f toff --5
Output Capacitance VL=25V, f=1MHz Cout -330-pF
Input Characteristics
Input Control Current to Activate 3IL=120mA IF--10mA
Input Control Current to Deactivate - IF0.6 - - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10A
Input/Output Characteristics
Capacitance, Input-to-Output - CI/O -1-pF
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CPC1986
2 Thermal Characteristics
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Parameter Conditions Symbol Minimum Typical Maximum Units
Thermal Resistance (Junction to Case) - RJC - - 0.35 °C/W
Thermal Resistance (Junction to Ambient) Free Air RJA -33-°C/W
Junction Temperature (Operating) - TJ-40 - 100 °C
RθCA = - RθJC
(TJ - TA) IL(99)
2
IL
2 • PD(99)
TJ = Junction Temperature (°C), TJ ≤ 100°C *
TA = Ambient Temperature (°C)
IL(99) = Load Current with Case Temperature @ 99°C (ADC)
IL = Desired Operating Load Current (ADC), IL ≤ IL(MAX)
RθJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
RθCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
PD(99) = Maximum power dissipation with case temperature held at 99ºC = 2.86W
* Elevated junction temperature reduces semiconductor lifetime.
Heat Sink Rating
INTEGRATED CIRCUITS DIVISION
R07 www.ixysic.com 4
CPC1986
3 Performance Data
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
LED Forward Voltage Drop (V)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
Typical LED Forward Voltage Drop
vs. Temperature
Temperature (ºC)
IF=50mA
IF=20mA
IF=10mA
05 1015202530354045
18
16
14
12
10
8
6
4
2
1
0
50
LED Forward Current (mA)
Turn-On (ms)
Typical Turn-On
vs. LED Forward Current
(I
L
=0.4A
DC
, T
A
=25ºC)
LED Current (mA)
-40
9.0
7.0
5.0
3.0
1.0
-20 0 20 40 60 80 100
Typical IF for Switch Operation
vs. Temperature
(IL=0.4ADC)
Temperature (ºC)
-40
10
9
8
7
6
5
4
3
2
1
0
-20 0 20 40 60 80 100
Turn-On (ms)
Typical Turn-On vs. Temperature
(IF=10mA, IL=0.4ADC)
Temperature (ºC)
-40
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
-20 0 20 40 60 80 100
Turn-Off (ms)
Typical Turn-Off vs. Temperature
(IF=10mA, IL=0.4ADC)
Temperature (ºC)
25
20
15
10
5
0
1.3250 1.3275 1.3300 1.3325 1.3350
LED Forward Voltage (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=10mA, TA=25ºC)
7.5 12.5 17.55.0 10.0 15.0
Device Count (N)
30
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IF=10mA, IL=1ADC, TA=25ºC)
Turn-On (ms)
0.085 0.095 0.1050.080 0.090 0.100
20
15
10
5
0
Turn-Off (ms)
Device Count (N)
Typical Turn-Off Time
(N=50, IF=10mA, IL=1ADC, TA=25ºC)
25
20
15
10
5
0
2.76 2.782.802.842.822.86
On-Resistance (Ω)
Typical On-Resistance Distribution
(N=50, IF=10mA, IL=1ADC, TA=25ºC)
Device Count (N)
35
30
25
20
15
10
5
0
1070 1080 1090 1100 1110 1120
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
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CPC1986
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
-2.0 -1.33 -0.66 0.66 1.33
02.0
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
Typical Load Current vs. Load Voltage
(IF=10mA, TA=25ºC)
Load Voltage (V)
Load Current (A)
Temperature (ºC)
020406080 100
Load Current (A
rms
)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
1ºC/W
5ºC/W
10ºC/W
Free Air
Maximum Load Current
vs. Temperature with Heat Sink
(IF=20mA)
-40
1180
1160
1140
1120
1100
1080
1060
1040
1020
1000 -20 0 20 40 60 80 100
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (VP)
-40
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 1&2
(VL=1000VP)
Temperature (ºC)
Leakage (μA)
12
10
8
6
4
2
0
1ms10µs 100µs 100ms 10s10ms 1s 100s
Time
Load Current (A
P
)
Energy Rating Curve
Free Air, No Heat Sink
-40
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
-20 0 20 40 60 80 100
On-Resistance (Ω)
Temperature (ºC)
Typical On-Resistance
vs. Temperature
(IF=20mA, IL=0.4A)
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CPC1986
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Device Moisture Sensitivity Level (MSL) Rating
CPC1986J MSL 1
Device Maximum Temperature x Time
CPC1986J 245°C for 30 seconds
e3
Pb
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CPC1986
4.5 Mechanical Dimensions
Isolated Heat Sink
1.270 TYP
(0.050 TYP)
NOTE: Back-side heat sink meets 2500V
rms
isolation to the pins.
20.879 ± 0.254
(0.822 ± 0.010)
20.396 ± 0.508
(0.803 ± 0.020)
15.240 ± 0.508
(0.600 ± 0.020)
3.810 ± 0.254
(0.150 ± 0.010)
2.362 ± 0.381
(0.093 ± 0.015)
19.914 ± 0.254
(0.784 ± 0.010)
5.029 ± 0.127
(0.198 ± 0.005) 1.181 ± 0.076
(0.047 ± 0.003)
15.317 ± 0.254
(0.603 ± 0.010)
1.930 ± 0.381
(0.076 ± 0.015)
17.221 ± 0.254
(0.678 ± 0.010)
DIMENSIONS
mm
(inches)
0.635 ± 0.076
(0.025 ± 0.003)
2.794 ± 0.127
(0.110 ± 0.005)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1986-R07
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/17/2012