AO4800B/L
Symbol Min Typ Max Units
BVDSS 30 V
0.002 1
TJ=55°C 5
IGSS 100 nA
VGS(th) 0.7 1 1.5 V
ID(ON) 40 A
20 27
TJ=125°C 25 40
23 32 m
34 50 m
gFS 10 26 S
VSD 0.71 1 V
IS4.5 A
Ciss 900 1100 pF
Coss 88 pF
Crss 65 pF
Rg0.95 1.5 Ω
Qg10 12 nC
Qgs 1.8 nC
Qgd 3.75 nC
tD(on) 3.2 ns
tr3.5 ns
tD(off) 21.5 ns
tf2.7 ns
trr 16.8 20 ns
Qrr 812nC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge IF=5A, dI/dt=100A/µs
Drain-Source Breakdown Voltage
On state drain current
ID=250µA, VGS=0V
VGS=2.5V, ID=5A
VGS=4.5V, VDS=5V
VGS=10V, ID=6.9A
Reverse Transfer Capacitance
Electrical Characteristics (TJ=25°C unless otherwise noted)
STATIC PARAMETERS Parameter Conditions
IDSS µA
Gate Threshold Voltage VDS=VGS ID=250µA
VDS=24V, VGS=0V
VDS=0V, VGS= ±12V
Zero Gate Voltage Drain Current
Gate-Body leakage current
RDS(ON) Static Drain-Source On-Resistance
Forward Transconductance
Diode Forward Voltage
IF=5A, dI/dt=100A/µs
VGS=0V, VDS=15V, f=1MHz
SWITCHING PARAMETERS
Total Gate Charge
VGS=4.5V, VDS=15V, ID=8.5A
Gate Source Charge
Gate Drain Charge
Turn-On Rise Time
Turn-Off DelayTime
VGS=10V, VDS=15V, RL=1.8Ω,
RGEN=6Ω
Turn-Off Fall Time
Maximum Body-Diode Continuous Current
Input Capacitance
Output Capacitance
Turn-On DelayTime
DYNAMIC PARAMETERS
Gate resistance VGS=0V, VDS=0V, f=1MHz
mΩ
VGS=4.5V, ID=6A
IS=1A,VGS=0V
VDS=5V, ID=5A
A: The value of R
θJA is measured with the device mounted on 1in
2 FR-4 board with 2oz. Copper, in a still air environment with T
A=25°C. The value in
any given application depends on the user's specific board design. The current rating is based on the t ≤ 10s thermal resistance rating.
B: Repetitive rating, pulse width limited by junction temperature.
C. The R θJA is the sum of the thermal impedence from junction to lead R
θJL and lead to ambient.
D. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
E. These tests are performed with the device mounted on 1 in
2 FR-4 board with 2oz. Copper, in a still air environment with T
A=25°C. The SOA curve
provides a single pulse rating.
Rev 1 : Dec 2007
Alpha & Omega Semiconductor, Ltd. www.aosmd.com