Application Information
GENERAL FEATURES
Mute Function
The muting function of the LM2876 allows the user to mute
the music going into the amplifier by drawing less than 0.5
mA out of pin 8 of the device. This is accomplished as shown
in the Typical Application Circuit where the resistor R
M
is
chosen with reference to your negative supply voltage and is
used in conjuction with a switch. The switch (when opened)
cuts off the current flow from pin 8 to V
−
, thus placing the
LM2876 into mute mode. Refer to the Mute Attenuation vs
Mute Current curves in the Typical Performance Charac-
teristics section for values of attenuation per current out of
pin 8. The resistance R
M
is calculated by the following
equation:
R
M
(|V
EE
| − 2.6V)/I8
where I8 ≥0.5 mA.
Under-Voltage Protection
Upon system power-up the under-voltage protection circuitry
allows the power supplies and their corresponding caps to
come up close to their full values before turning on the
LM2876 such that no DC output spikes occur. Upon turn-off,
the output of the LM2876 is brought to ground before the
power supplies such that no transients occur at power-down.
Over-Voltage Protection
The LM2876 contains overvoltage protection circuitry that
limits the output current to approximately 4Apeak while also
providing voltage clamping, though not through internal
clamping diodes. The clamping effect is quite the same,
however, the output transistors are designed to work alter-
nately by sinking large current spikes.
SPiKe Protection
The LM2876 is protected from instantaneous peak-
temperature stressing by the power transistor array. The
Safe Operating Area graph in the Typical Performance
Characteristics section shows the area of device operation
where the SPiKe Protection Circuitry is not enabled. The
waveform to the right of the SOA graph exemplifies how the
dynamic protection will cause waveform distortion when en-
abled.
Thermal Protection
The LM2876 has a sophisticated thermal protection scheme
to prevent long-term thermal stress to the device. When the
temperature on the die reaches 165˚C, the LM2876 shuts
down. It starts operating again when the die temperature
drops to about 155˚C, but if the temperature again begins to
rise, shutdown will occur again at 165˚C. Therefore the
device is allowed to heat up to a relatively high temperature
if the fault condition is temporary, but a sustained fault will
cause the device to cycle in a Schmitt Trigger fashion be-
tween the thermal shutdown temperature limits of 165˚C and
155˚C. This greatly reduces the stress imposed on the IC by
thermal cycling, which in turn improves its reliability under
sustained fault conditions.
Since the die temperature is directly dependent upon the
heat sink, the heat sink should be chosen as discussed in
the Thermal Considerations section, such that thermal
shutdown will not be reached during normal operation. Using
the best heat sink possible within the cost and space con-
straints of the system will improve the long-term reliability of
any power semiconductor device.
THERMAL CONSIDERATIONS
Heat Sinking
The choice of a heat sink for a high-power audio amplifier is
made entirely to keep the die temperature at a level such
that the thermal protection circuitry does not operate under
normal circumstances. The heat sink should be chosen to
dissipate the maximum IC power for a given supply voltage
and rated load.
With high-power pulses of longer duration than 100 ms, the
case temperature will heat up drastically without the use of a
heat sink. Therefore the case temperature, as measured at
the center of the package bottom, is entirely dependent on
heat sink design and the mounting of the IC to the heat sink.
For the design of a heat sink for your audio amplifier appli-
cation refer to the Determining The Correct Heat Sink
section.
Since a semiconductor manufacturer has no control over
which heat sink is used in a particular amplifier design, we
can only inform the system designer of the parameters and
the method needed in the determination of a heat sink. With
this in mind, the system designer must choose his supply
voltages, a rated load, a desired output power level, and
know the ambient temperature surrounding the device.
These parameters are in addition to knowing the maximum
junction temperature and the thermal resistance of the IC,
both of which are provided by National Semiconductor.
As a benefit to the system designer we have provided Maxi-
mum Power Dissipation vs Supply Voltages curves for vari-
ous loads in the Typical Performance Characteristics sec-
tion, giving an accurate figure for the maximum thermal
resistance required for a particular amplifier design. This
data was based on θ
JC
= 1˚C/W and θ
CS
= 0.2˚C/W. We also
provide a section regarding heat sink determination for any
audio amplifier design where θ
CS
may be a different value. It
should be noted that the idea behind dissipating the maxi-
mum power within the IC is to provide the device with a low
resistance to convection heat transfer such as a heat sink.
Therefore, it is necessary for the system designer to be
conservative in his heat sink calculations. As a rule, the
lower the thermal resistance of the heat sink the higher the
amount of power that may be dissipated. This is of course
guided by the cost and size requirements of the system.
Convection cooling heat sinks are available commercially,
and their manufacturers should be consulted for ratings.
Proper mounting of the IC is required to minimize the thermal
drop between the package and the heat sink. The heat sink
must also have enough metal under the package to conduct
heat from the center of the package bottom to the fins
without excessive temperature drop.
A thermal grease such as Wakefield type 120 or Thermalloy
Thermacote should be used when mounting the package to
the heat sink. Without this compound, thermal resistance will
be no better than 0.5˚C/W, and probably much worse. With
the compound, thermal resistance will be 0.2˚C/W or less,
assuming under 0.005 inch combined flatness runout for the
package and heat sink. Proper torquing of the mounting
bolts is important and can be determined from heat sink
manufacturer’s specification sheets.
Should it be necessary to isolate V
−
from the heat sink, an
insulating washer is required. Hard washers like beryluum
oxide, anodized aluminum and mica require the use of ther-
LM2876
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