INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1009N-R05 1
CPC1009N
Single-Pole, Normally Open
4-Lead SOP OptoMOS® Relay
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Pb
Part # Description
CPC1009N 4-Lead SOP (100/tube)
CPC1009NTR 4-Lead SOP (2000/reel)
Parameter Ratings Units
Load Voltage 100 VP
Load Current 150 mArms / mADC
On-Resistance (max) 8
Output Leakage, Off-State 20 nA
Applications
Features
Description
Ordering Information
Pin Configuration
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security Systems
• Aerospace
• Industrial Controls
• Extremely Low Output Leakage: 20nA
• 1500Vrms Input/Output Isolation
• Small 4-Lead SOP Package
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
• Tape & Reel Version Available
CPC1009N is a miniature low voltage, low
on-resistance, low off-state leakage, normally open
(1-Form-A) solid state relay in a 4-lead SOP package.
The MOSFET switches and photovoltaic die use IXYS
Integrated Circuits Division’s patented OptoMOS®
architecture to provide 1500 Vrms of input-to-output
isolation. The optically coupled output is controlled by
a highly efficient GaAIAs infrared LED.
The CPC1009N uses IXYS Integrated Circuits
Division’s state of the art double-molded vertical
construction to produce one of the world’s smallest
4-lead relays, which offers board space savings of
20% over the competitor’s larger 4-lead SOP relay.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Switching Characteristics
of Normally Open Devices
1
23
4
+ Control
– Control
Load
Load
Form-A
IF
ILOAD
10%
90%
ton toff
INTEGRATED CIRCUITS DIVISION
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2R05
CPC1009N
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 100 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 70 mW
Total PowerDissipation 1400 mW
Isolation voltage, Input to Output 1500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 3.33 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1-I
L- - 150 mArms / mADC
Peak t=10ms ILPK - - ±350 mAP
On-Resistance 2IL=150mA RON -58
Off-State Leakage Current VL=100VP , T=115ºC ILEAK - - 20 nA
Switching Speeds
Turn-On IF=5mA, VL=10V ton --2
ms
Turn-Off toff - - 0.5
Output Capacitance VL=50V, f=1MHz COUT -25-pF
Input Characteristics
Input Control Current to Activate IL=150mA IF- 0.87 2 mA
Input Control Current to Deactivate - IF0.3 0.86 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10A
Input/Output Characteristics
Capacitance, Input to Output - - - 1 - pF
1 Load current derates linearly from 150mA @ 25oC to120mA @85oC.
2 Measurement taken within 1 second of on-time.
Electrical Characteristics @ 25ºC (Unless Otherwise Noted)
INTEGRATED CIRCUITS DIVISION
CPC1009N
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R05
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
0.25 0.35 0.45 0.550.30 0.40 0.50
Turn-On (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IF=5mA, IL=150mA, TA=25ºC)
0.21 0.23 0.25 0.270.260.240.22
Turn-Off (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=150mA, TA=25ºC)
35
30
25
20
15
10
5
0
4.40 4.80 5.20 5.604.60 5.00 5.40
Device Count (N)
Typical On-Resistance Distribution
(N=50, IL=150mA, TA=25ºC)
On-Resistance (:)
25
20
15
10
5
0
0.80 0.90 1.000.75 0.85 0.95 1.05
LED Current (mA)
Device Count (N)
Typical IF for Switch Operation
(N=50, IL=100mA, TA=25ºC)
25
20
15
10
5
0
0.75 0.85 0.950.70 0.80 0.90 1.00
LED Current (mA)
Device Count (N)
Typical IF for Switch Dropout
(N=50, IL=100mA, TA=25ºC)
35
30
25
20
15
10
5
0
106 112 118 124109 115 121
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
Typical Turn-On
vs. LED Forward Current
(IL=120mA, TA=25ºC)
LED Forward Current (mA)
Turn-On (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
Typical Turn-Off
vs. LED Forward Current
(IL=120mA, TA=25ºC)
0
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
5 101520253035404550
LED Forward Current (mA)
Turn-On (ms)
LED Forward Voltage Drop (V)
Temperature (ºC)
Typical LED Forward Voltage Drop
vs. Temperature
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
IF=50mA
IF=30mA
IF=20mA
IF=10mA
IF=5mA
Turn-On (ms)
-40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical Turn-On vs. Temperature
(IL=100mA)
Temperature (ºC)
IF=5mA
IF=10mA
Turn-Off (ms)
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
Typical Turn-Off vs. Temperature
(IL=100mA)
Temperature (ºC)
IF=10mA
IF=5mA
INTEGRATED CIRCUITS DIVISION
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4R05
CPC1009N
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
Typical IF for Switch Operation
vs. Temperature
(IL=100mA)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical IF for Switch Dropout
vs. Temperature
(IL=100mA)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical On-Resistance vs. Temperature
(IL=150mA)
-40 -20 0 20406080100
12
10
8
6
4
2
0
IF=10mA
IF=5mA
Instantaneous
IF=5mA
Steady State
Temperature (ºC)
On-Resistance (:)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-1.5 -1.0 -0.5 0 0.5 1.0 1.5
Typical Load Current vs. Load Voltage
(IF=5mA, TA=25ºC)
Load Current (mA)
190
180
170
160
150
140
130
120
110
100
Temperature (ºC)
-40 -20 0 20 40 60 80 120100
Typical Maximum Load Current
vs. Temperature
IF=10mA
IF=5mA
Blocking Voltage (VP)
-40
122
121
120
119
118
117
116
115
-20 0 20 40 60 80 100
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
-20
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0 20 40 60 80 100 120
Leakage (nA)
Temperature (ºC)
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(VL=100VP)
Energy Rating Curve
(TA=25ºC)
Time
Load Current (A)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms 100ms 1s10ms 10s 100s
10Ps 100Ps
INTEGRATED CIRCUITS DIVISION
CPC1009N
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Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1009N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC1009N 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
For additional information please visit our website at: www.ixysic.com
CPC1009N
6
Specification: DS-CPC1009N-R05
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/13/2012
MECHANICAL DIMENSIONS
Recommended PCB Land Pattern
2.54
(0.10)
5.60
(0.2205)
1.30
(0.0512)
0.60
(0.0217)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.203
(0.161 ± 0.008)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.076
(0.150 ± 0.003) 0.432 ± 0.127
(0.017 ± 0.005)
0.200 ± 0.025
(0.008 ± 0.001)
1.02 ± 0.025
(0.040 ± 0.001)
2.184 Max
(0.086 Max)
0.381 TYP.
(0.015 TYP.)
Lead to package standoff:
0.0637 ± 0.0383
(0.0025 ± 0.0015)
0.762 ± 0.102
(0.030 ± 0.004)
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
U
ser Direction of Feed
User Direction of Feed
K0=2.70
(0.106)
K1=2.30
(0.091)
B0=4.70
(0.185)
W=12.00
(0.472)
P=8.00
(0.315)
A0=6.50
(0.256)
CPC1009N
CPC1009NTR Tape & Reel
