ASMT-QxBB-Nxxxx Super 0.5W Power PLCC-4 Surface Mount LED Indicator Data Sheet Description Features The Super 0.5W Power PLCC-4 SMT LED is Blue & Green mid-Power PLCC-4 SMT LEDs using InGaN chip technology. The package can be driven at high current due to its superior package design. The product is able to dissipate the heat more efficiently compared to the Power PLCC-4 SMT LEDs. These LEDs produce higher light output with better flux performance compared to the Power PLCC-4 SMT LED. * Industry Standard PLCC 4 platform (3.2x2.8x1.9mm) The Super 0.5W Power PLCC-4 SMT LEDs are designed for higher reliability, better performance, and operate under a wide range of environmental conditions. The performance characteristics of these new mid-power LEDs make them uniquely suitable for use in harsh conditions such as in automotive applications, and in electronics signs and signals. * Low Thermal Resistance 40C/W To facilitate easy pick and place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel is shipped in single intensity and color bin, to provide close uniformity. * High reliability package with enhanced silicone resin encapsulation * High brightness with optimum flux performance using InGaN chip technologies * Available in Blue and Green color * Available in 8mm carrier tape & 7 inch reel * Super wide viewing angle at 120 degree * JEDEC MSL 2 Applications * Electronic signs and signals a. Decorative/Advertising Lighting b. Channel Lettering c. Signs Luminaire d. RGB Backlighting CAUTION: ASMT-QxBB-Nxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. Package Drawing 1.9 0.2 2.2 0.2 A C C 1.15 0.2 0.97 0.56 (TYP.) 2.4 3.2 0.2 3.6 0.2 0.41 (TYP.) A 0.6 0.3 0.79 0.3 2.8 0.2 0.7 CATHODE MARKING Note: 1. All Dimensions in millimeters. 2. Lead Polarity as shown in Figure 13. 3. Terminal Finish: Ag plating. 4. Encapsulation material: Silicone resin. Figure 1. Package Drawing Table 1. Device Selection Guide (TJ = 25 C) Luminous Flux, V[1] (lm) Color Part Number Min. Flux (lm) Typ. Flux (lm) Max. Flux (lm) Test Current (mA) Dice Technology Blue ASMT-QBBB-NACxE 4.3 7.0 9.0 150 InGaN Green ASMT-QGBB-NFHxE 15.0 23.5 33.0 150 InGaN Notes: 1. V is the total luminous flux output as measured with an integrating sphere at mono pulse conditions. 2. Tolerance = 12% Part Numbering System A S M T - Q X1 B B - N X2 X 3 X 4 X 5 Packaging Option Colour Bin Selection Max. Flux Bin Selection Min. Flux Bin Selection Color B - Blue G - Green 2 Table 2. Absolute Maximum Ratings (TA = 25C) Parameters ASMT-QxBB-Nxxxx DC Forward Current [1] 150 mA Peak Forward Current [2] 300 mA Power Dissipation 615 mW Reverse Voltage Not Recommended Junction Temperature 125C Operating Temperature -40C to +110C Storage Temperature -40C to +110C Notes: 1. Derate Linearly as shown in Figure 6. 2. Duty Factor = 10%, Frequency = 1kHz Table 3. Optical Characteristics (TJ = 25C) Peak Wavelength PEAK (nm) Dominant Wavelength D (nm) Viewing Angle 21/2[1] (Degrees) Luminous Efficiency e (lm/W) Total Flux / Luminous Intensity V (lm) / IV (cd) Typ. Typ. Typ. Typ. Typ. Color Part Number Dice Technology Blue ASMT-QBBB-Nxxxx InGaN 459.0 465.0 120 10 2.90 Green ASMT-QGBB-Nxxxx InGaN 520.0 527.0 120 43 2.90 Notes: 1. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Table 4. Electrical Characteristics (TJ = 25C) Forward Voltage VF (Volts) @ IF = 150 mA Part Number Typ. Max. Thermal Resistance RJ-P (C/W) ASMT-QBBB-NxxxE 3.5 4.1 40 ASMT-QGBB-NxxxE 3.6 4.1 40 3 300 250 FORWARD CURRENT - mA RELATIVE INTENSITY 1.0 0.9 0.8 0.7 InGaN Blue 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 430 480 InGaN Green 530 580 630 680 WAVELENGTH - nm 730 150 50 0 NORMALIZED LUMINOUS FLUX (NORMALIZED AT 25C) RELATIVE LUMINOUS FLUX (NORMALIZED AT 150 mA) 0.6 0.4 0.2 0 25 50 75 100 DC FORWARD CURRENT - mA 125 4 5 1.00 0.95 0.90 0.85 -25 0 25 50 T J - JUNCTION TEMPERATURE - C 75 100 100 120 Figure 5. Relative Flux Vs. Temperature 160 160 140 140 RJA = 90C/W 100 RJA = 110C/W 80 60 100 80 60 40 40 20 20 0 20 40 60 80 TEMPERATURE (C) R JP = 40C/W 120 CURRENT - mA 120 CURRENT - mA 2 3 FORWARD VOLTAGE - V 1.05 0.80 -50 150 Figure 4. Relative Flux vs. Forward Current 100 Figure 6a. Maximum Forward Current Vs. Ambient Temperature. Derated Based on TJMAX = 125C, RJ-A=110C/W & 90C/W. 4 1 1.10 0.8 0 0 Figure 3. Forward Current Vs. Forward Voltage. 1.0 0.0 InGaN Green 100 780 Figure 2. Relative Intensity Vs. Wavelength InGaN Blue 200 120 0 0 20 40 60 80 TEMPERATURE (C) Figure 6b. Maximum Forward Current Vs. Solder Point Temperature. Derated Based on TJMAX = 125C, RJ-P=40C/W. 0.40 t D= p T T IF 0.20 0.10 1.00E-03 1.00E-01 tp - Time - (s) FORWARD VOLTAGE SHIFT - V DOMINANT WAVELENGTH - nm 530 InGaN Green 520 510 500 490 480 470 InGaN Blue 0 30 60 90 FORWARD CURRENT - mA 120 150 Figure 8. Dominant wavelength Vs. forward current. NORMALIZED INTENSTY T IF -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES Figure 10. Radiation Pattern 1.00E-03 1.00E-01 tp - Time - (s) 0.25 0.20 0.15 0.10 0.05 0.00 -0.05 -0.10 -0.15 -0.20 -0.25 -50 -25 0 25 50 TJ - JUNCTION TEMPERATURE - C Figure 9. Forward Voltage Shift Vs. Temperature. 60 1.00E+01 Figure 7b. Maximum Pulse Current Vs. Ambient Temperature. Derated Based on TA = 85C. 540 5 tp 0.20 0.00 1.00E-05 1.00E+01 Figure 7a. Maximum Pulse Current Vs. Ambient Temperature. Derated Based on TA = 25C. 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 tp T 0.10 0.00 1.00E-05 460 D= 0.30 CURRENT - A CURRENT - A 0.30 0.40 tp 90 75 100 TEMPERATURE 10 to 30 SEC. D 217C 200C 255 - 260C 3C/SEC. MAX. 6C/SEC. MAX. 150C 3C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME (Acc. to J-STD-020C) Note: Diameter "D" should be smaller than 2.2mm Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. Figure 11. Recommended Pick and Place Nozzle Size Figure 12. Recommended Pb-free Reflow Soldering Profile 2.4 0.6 0.9 X 6 1.3 x 6 A A A 0.4 A 1.1 C C C 4.6 C C CATHODE MARKING C 0.3 SOLDER MASK A ANODE C CATHODE Figure 13. Recommended Soldering Pad Pattern CATHODE MARKING MINIMUM 55 mm2 OF CATHODE PAD FOR IMPROVED HEAT DISSIPATION TRAILER COMPONENT LEADER 200 mm MIN. FOR O180 REEL. 200 mm MIN. FOR O330 REEL. 480 mm MIN. FOR O180 REEL. 960 mm MIN. FOR O330 REEL. C A USER FEED DIRECTION Figure 14. Tape Leader and Trailer Dimensions O1.5 4 0.1 4 0.1 +0.1 -0 2 0.05 1.75 0.1 2.29 0.1 C C A A 3.5 0.05 8 +0.3 -0.1 3.05 0.1 +0.1 O1 -0 0.229 0.01 8 ALL DIMENSIONS IN mm. Figure 15. Tape Dimensions USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 16. Reeling Orientation 7 3.8 0.1 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2 per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30C/60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 1 year. C. Control for unfinished reel - For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 1 year. E. Baking is required if: - "60%" HIC indicator is NOT blue. - The LEDs are exposed to condition of >30C/60%RH at any time. - The LEDs floor life exceeded 1 year. Recommended baking condition: 605C for 20 hours. 8 Device Color (X1) B Blue G Green Flux Bin Select (X2X3) Individual reel will contain parts from one bin only X2 Min Flux Bin X3 Max Flux Bin Flux Bin Limits Bin ID Min. (lm) Max. (lm) 0 3.40 4.30 A 4.30 5.50 B 5.50 7.00 C 7.00 9.00 D 9.00 11.50 E 11.50 15.00 F 15.00 19.50 G 19.50 25.50 H 25.50 33.00 J 33.00 43.00 K 43.00 56.00 L 56.00 73.00 Tolerance of each bin limit = 12% Color Bin Select (X4) Individual reel will contain parts from one sub bin only. X4 0 Full Distribution A 1 and 2 only B 2 and 3 only C 3 and 4 only G 1, 2 and 3 only H 2, 3 and 4 only Z Special binning Color Bin Limits VF Bin Limits Blue Min. (nm) Max. (nm) Bin ID Min. Max. 1 460.0 465.0 S5 3.20 3.50 2 465.0 470.0 S6 3.50 3.80 3 470.0 475.0 S7 3.80 4.10 4 475.0 480.0 Tolerance of each bin limit = 0.1V Packaging Option (X5) Green Min. (nm) Max. (nm) Option Test Current Package Type Reel Size 1 515.0 520.0 E 150mA Top Mount 7 Inch 2 520.0 525.0 3 525.0 530.0 4 530.0 535.0 Tolerance of each bin limit = 1 nm For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2009 Avago Technologies. All rights reserved. AV02-1375EN - September 28, 2009