ASMT-QxBB-Nxxxx
Super 0.5W Power PLCC-4
Surface Mount LED Indicator
Data Sheet
CAUTION: ASMT-QxBB-Nxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precau-
tions during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Description
The Super 0.5W Power PLCC-4 SMT LED is Blue & Green
mid-Power PLCC-4 SMT LEDs using InGaN chip technol-
ogy. The package can be driven at high current due to its
superior package design. The product is able to dissipate
the heat more efficiently compared to the Power PLCC-4
SMT LEDs. These LEDs produce higher light output with
better flux performance compared to the Power PLCC-4
SMT LED.
The Super 0.5W Power PLCC-4 SMT LEDs are designed for
higher reliability, better performance, and operate under
a wide range of environmental conditions. The perfor-
mance characteristics of these new mid-power LEDs make
them uniquely suitable for use in harsh conditions such as
in automotive applications, and in electronics signs and
signals.
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel is
shipped in single intensity and color bin, to provide close
uniformity.
Features
• Industry Standard PLCC 4 platform (3.2x2.8x1.9mm)
• High reliability package with enhanced silicone resin
encapsulation
• High brightness with optimum flux performance using
InGaN chip technologies
• Available in Blue and Green color
• Available in 8mm carrier tape & 7 inch reel
• Low Thermal Resistance 40°C/W
• Super wide viewing angle at 120 degree
• JEDEC MSL 2
Applications
• Electronic signs and signals
a. Decorative/Advertising Lighting
b. Channel Lettering
c. Signs Luminaire
d. RGB Backlighting
2
Package Drawing
Note:
1. All Dimensions in millimeters.
2. Lead Polarity as shown in Figure 13.
3. Terminal Finish: Ag plating.
4. Encapsulation material: Silicone resin.
Figure 1. Package Drawing
Table 1. Device Selection Guide (TJ = 25 °C)
Color Part Number
Luminous Flux, ΦV[1] (lm)
Dice Technology
Min. Flux
(lm)
Typ. Flux
(lm)
Max. Flux
(lm)
Test Current
(mA)
Blue ASMT-QBBB-NACxE 4.3 7.0 9.0 150 InGaN
Green ASMT-QGBB-NFHxE 15.0 23.5 33.0 150 InGaN
Notes:
1. ΦV is the total luminous flux output as measured with an integrating sphere at mono pulse conditions.
2. Tolerance = ±12%
Part Numbering System
3.6 ± 0.2
0.7
3.2 ± 0.2
2.8 ± 0.2
2.2 ± 0.2 1.9 ± 0.2 0.6 ± 0.3
CC
A A
0.79 ± 0.3
CATHODE
MARKING
φ 2.4
1.15 ± 0.2
0.41 (TYP.)
0.56 (TYP.)
0.97
Packaging Option
Colour Bin Selection
Max. Flux Bin Selection
Min. Flux Bin Selection
Color
B - Blue
G - Green
A S M T – Q X1 B B – N X 2 X3 X4 X5
3
Table 2. Absolute Maximum Ratings (TA = 25°C)
Parameters ASMT-QxBB-Nxxxx
DC Forward Current [1] 150 mA
Peak Forward Current [2] 300 mA
Power Dissipation 615 mW
Reverse Voltage Not Recommended
Junction Temperature 125°C
Operating Temperature -40°C to +110°C
Storage Temperature -40°C to +110°C
Notes:
1. Derate Linearly as shown in Figure 6.
2. Duty Factor = 10%, Frequency = 1kHz
Table 3. Optical Characteristics (TJ = 25°C)
Color Part Number
Dice
Technology
Peak
Wavelength
λPEAK (nm)
Dominant
Wavelength
λD (nm)
Viewing
Angle 2θ½[1]
(Degrees)
Luminous
Efficiency
ηe (lm/W)
Total Flux /
Luminous
Intensity
ΦV (lm) /
IV (cd)
Typ. Typ. Typ. Typ. Typ.
Blue ASMT-QBBB-Nxxxx InGaN 459.0 465.0 120 10 2.90
Green ASMT-QGBB-Nxxxx InGaN 520.0 527.0 120 43 2.90
Notes:
1. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
Table 4. Electrical Characteristics (TJ = 25°C)
Part Number
Forward Voltage VF (Volts)
@ IF = 150 mA Thermal Resistance
RθJ-P (°C/W)Typ. Max.
ASMT-QBBB-NxxxE 3.5 4.1 40
ASMT-QGBB-NxxxE 3.6 4.1 40
4
Figure 4. Relative Flux vs. Forward Current Figure 5. Relative Flux Vs. Temperature
Figure 6a. Maximum Forward Current Vs. Ambient Temperature.
Derated Based on TJMAX = 125°C, RθJ-A=110°C/W & 90°C/W.
Figure 6b. Maximum Forward Current Vs. Solder Point Temperature.
Derated Based on TJMAX = 125°C, RθJ-P=40°C/W.
0.0
0.2
0.4
0.6
0.8
1.0
0 25 50 75 100 125 150
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS FLUX
(NORMALIZED AT 150 mA)
0.80
0.85
0.90
0.95
1.00
1.05
1.10
-50 -25 0 25 50 75 100
T
J
- JUNCTION TEMPERATURE - °C
NORMALIZED LUMINOUS FLUX
(NORMALIZED AT 25°C)
0
20
40
60
80
100
120
140
160
0 20 40 60 80 100 120
TEMPERATURE (°C)
CURRENT - mA
RθJA = 90°C/W
RθJA = 110°C/W
0
20
40
60
80
100
120
140
160
0 20 40 60 80 100 120
TEMPERATURE (°C)
CURRENT - mA
RθJP = 40°C/W
Figure 2. Relative Intensity Vs. Wavelength Figure 3. Forward Current Vs. Forward Voltage.
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
WAVELENGTH - nm
RELATIVE INTENSITY
InGaN Blue InGaN Green
0
50
100
150
200
250
300
0 1 2 3 4 5
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
InGaN Green
InGaN Blue
5
-0.25
-0.20
-0.15
-0.10
-0.05
0.00
0.05
0.10
0.15
0.20
0.25
-50 -25 0 25 50 75 100
TJ - JUNCTION TEMPERATURE - °C
FORWARD VOLTAGE SHIFT - V
460
470
480
490
500
510
520
530
540
0 30 60 90 120 150
FORWARD CURRENT - mA
DOMINANT WAVELENGTH - nm
InGaN Green
InGaN Blue
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSTY
Figure 10. Radiation Pattern
Figure 9. Forward Voltage Shift Vs. Temperature.Figure 8. Dominant wavelength Vs. forward current.
Figure 7a. Maximum Pulse Current Vs. Ambient Temperature.
Derated Based on TA = 25°C.
Figure 7b. Maximum Pulse Current Vs. Ambient Temperature.
Derated Based on TA = 85°C.
CURRENT - A
0.00
0.10
0.20
0.30
0.40
1.00E-05 1.00E-03 1.00E-01 1.00E+01
tp - Time - (s)
D = tp
T
tp
IF
T
1.00E-05 1.00E-03 1.00E-01 1.00E+01
tp - Time - (s)
0.00
0.10
0.20
0.30
0.40
D = tp
T
tp
IF
T
CURRENT - A
Figure 13. Recommended Soldering Pad Pattern
Figure 11. Recommended Pick and Place Nozzle Size Figure 12. Recommended Pb-free Reflow Soldering Profile
Note: For detail information on reflow soldering of Avago surface mount
LEDs, do refer to Avago Application Note AN 1060 Surface Mounting
SMT LED Indicator Components.
Note: Diameter "D" should be smaller than 2.2mm
D
217°C
200°C
60 - 120 SEC.
6°C/SEC. MAX.
3°C/SEC. MAX.
150°C
255 - 260°C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
(Acc. to J-STD-020C)
3°C/SEC. MAX.
CATHODE
MARKING
CATHODE
MARKING
A
C
A A
C C
C C
SOLDER MASK
ANODE
CATHODE
0.4
0.3
MINIMUM 55 mm2 OF CATHODE PAD
FOR IMPROVED HEAT DISSIPATION
2.4
0.6
0.9 X 6
4.6
1.1
1.3 x 6
A A
C C
7
Figure 15. Tape Dimensions
Figure 16. Reeling Orientation
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
3.8 ± 0.1
2.29 ± 0.1
0.229 ± 0.01
ALL DIMENSIONS IN mm.
2 ± 0.054 ± 0.1 4 ± 0.1
3.05 ± 0.1
3.5 ± 0.05
8+0.3
–0.1
1.75 ± 0.1
Ø1.5 +0.1
–0
8°
Ø1+0.1
–0
A A
C C
Figure 14. Tape Leader and Trailer Dimensions
200 mm MIN. FOR Ø180 REEL.
200 mm MIN. FOR Ø330 REEL.
TRAILER COMPONENT LEADER
480 mm MIN. FOR Ø180 REEL.
960 mm MIN. FOR Ø330 REEL.
C
A
USER FEED DIRECTION
8
Handling Precaution
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is
a soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly or
handling, the unit should be held on the body only. Please
refer to Avago Application Note AN 5288 for detail infor-
mation.
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2 per
Jedec J-STD-020. Precautions when handling this moisture
sensitive product is important to ensure the reliability of
the product. Do refer to Avago Application Note AN5305
Handling of Moisture Sensitive Surface Mount Devices for
details.
A. Storage before use
- Unopen moisture barrier bag (MBB) can be stored at
<40°C/90%RH for 12 months. If the actual shelf life
has exceeded 12 months and the HIC indicates that
baking is not required, then it is safe to reflow the
LEDs per the original MSL rating.
- It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
- The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
- The LEDs must be kept at <30°C/60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 1 year.
C. Control for unfinished reel
- For any unuse LEDs, they need to be stored in sealed
MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
- If the PCB soldered with the LEDs is to be subjected to
other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5%RH to ensure no LEDs have exceeded their
floor life of 1 year.
E. Baking is required if:
- “60%” HIC indicator is NOT blue.
- The LEDs are exposed to condition of >30°C/60%RH
at any time.
- The LEDs floor life exceeded 1 year.
Recommended baking condition: 60±5°C for 20 hours.
Device Color (X1)
B Blue
G Green
Flux Bin Select (X2X3)
Individual reel will contain parts from one bin only
X2Min Flux Bin
X3Max Flux Bin
Flux Bin Limits
Bin ID Min. (lm) Max. (lm)
0 3.40 4.30
A 4.30 5.50
B 5.50 7.00
C 7.00 9.00
D 9.00 11.50
E 11.50 15.00
F 15.00 19.50
G 19.50 25.50
H 25.50 33.00
J 33.00 43.00
K 43.00 56.00
L 56.00 73.00
Tolerance of each bin limit = ± 12%
Color Bin Select (X4)
Individual reel will contain parts from one sub bin only.
X4
0 Full Distribution
A 1 and 2 only
B 2 and 3 only
C 3 and 4 only
G 1, 2 and 3 only
H 2, 3 and 4 only
Z Special binning
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved.
AV02-1375EN - September 28, 2009
Color Bin Limits
Blue Min. (nm) Max. (nm)
1 460.0 465.0
2 465.0 470.0
3 470.0 475.0
4 475.0 480.0
Green Min. (nm) Max. (nm)
1 515.0 520.0
2 520.0 525.0
3 525.0 530.0
4 530.0 535.0
Tolerance of each bin limit = ±1 nm
VF Bin Limits
Bin ID Min. Max.
S5 3.20 3.50
S6 3.50 3.80
S7 3.80 4.10
Tolerance of each bin limit = ±0.1V
Packaging Option (X5)
Option Test Current Package Type Reel Size
E 150mA Top Mount 7 Inch
