Data Sheet
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© 2016 ROHM Co., Ltd. All rights reserved.
Schottky Barrier Diode
RB715WM
lApplication lDimensions (Unit : mm) lLand Size Figure (Unit : mm)
High speed switching
lFeatures
1) Ultra small mold type
(EMD3F)
2) High reliability
lStructure
3)
Super low VF
lConstruction lTaping Dimensions (Unit : mm)
Silicon epitaxial planar type
lAbsolute Maximum Ratings (Tc= 25°C)
Symbol Unit
Repetitive peak reverse voltage
VRM V
Reverse voltage
VRV
Operating Junction Temperature
Tj°C
Storage temperature
Tstg °C
lElectrical Characteristics (Tj= 25°C)
Symbol Min. Typ. Max. Unit
VF- - 0.37 V
Reverse current
IR- - 1.0 mA
Capacitance between terminals
Ct- 2 - pF
Forward voltage
Parameter
125
-55 to +125
IFSM
Non-repetitive forward current surge peak
0.2
IF=1mA
Conditions
40
Duty≦0.5
Parameter
Limits
Conditions
A
Average forward rectified current
IO
Glass epoxy board mounted, 60Hz half sin wave,
30
mA
resistive load, per diode
1cycle, per diode
Direct reverse voltage
40
f=1MHz, VR=1V
-
-
60Hz half sin wave,non-repetitive at Ta=25ºC,
VR=10V
JEDEC : SOT-416FL
JEITA : SC-89
1/4
2016.07 - Rev.A
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
Data Sheet
RB715WM
lElectrical Characteristic Curves
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0 5 10 15 20 25 30 35 40
D = 1/2
DC
Sin(θ=180)
Tj = 125°C
0
0.01
0.02
0.03
0.04
0.05
010 20 30 40 50
D = 1/2
DC
Sin(θ=180)
Tj = 125°C
FORWARD CURRENT : IF (mA)
FORWARD VOLTAGE : VF(mV)
VF-IF CHARACTERISTICS
REVERSE CURRENT : IR (mA)
REVERSE VOLTAGE : VR(V)
VR-IR CHARACTERISTICS
AVERAGE RECTIFIED
FORWARD CURRENT : Io (mA)
Io-PF CHARACTERISTICS
FORWARD POWER
DISSIPATION : PF (W)
REVERSE VOLTAGE : VR (V)
VR-PR CHARACTERISTICS
REVERSE POWER
DISSIPATION : PR (mW)
0.0001
0.001
0.01
0.1
1
10
100
1000
010 20 30 40
Tj = 25°C
Tj = -25°C
Tj = 75°C
Tj = 125°C
0.01
0.1
1
10
100
0 200 400 600 800 1000 1200
Tj = 75°C
Tj = 25°C
Tj = -25°C
Tj = 125°C
200
2/4
2016.07 - Rev.A
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
Data Sheet
RB715WM
lElectrical Characteristic Curves
0
10
20
30
40
50
60
70
025 50 75 100 125
D = 1/2
DC
Sin(θ=180)
0
10
20
30
40
50
60
70
025 50 75 100 125
D = 1/2
DC
Sin(θ=180)
0.1
1
10
0 5 10 15 20 25 30
Tj = 25°C
f = 1MHz
10
100
1000
0.001 0.01 0.1 1 10 100 1000
Rth(j-c)
Rth(j-a)
AVERAGE RECTIFIED
FORWARD CURRENT : Io (mA)
AMBIENT TEMPERATURE : Ta (°C)
DERATING CURVE (Io-Ta)
Tj=125°C
D=t/T
VR=VRM/2
T
t
0A
0V
IO
VR
Glass epoxy board mounted
AVERAGE RECTIFIED
FORWARD CURRENT : Io (mA)
CASE TEMPERATURE : Tc (°C)
DERATING CURVE (Io-Tc)
Tj=125°C
D=t/T
VR=VRM/2
T
t
0A
0V
IO
VR
Glass epoxy board mounted
CAPACITANCE BETWEEN
TERMINALS : Ct (pF)
REVERSE VOLTAGE : VR(V)
VR-Ct CHARACTERISTICS
TRANSIENT
THERMAL IMPEDANCE : Rth (°C/W)
TIME : t (s)
Rth-t CHARACTERISTICS
1ms
IM=1mA IF=100mA
300ms
time
Glass epoxy board mounted
3/4
2016.07 - Rev.A
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved.
Data Sheet
RB715WM
lElectrical Characteristic Curves
1
10
110 100
1
10
110 100
PEAK SURGE
FORWARD CURRENT : IFSM (A)
NUMBER OF CYCLES
IFSM-CYCLE CHARACTERISTICS
PEAK SURGE
FORWARD CURRENT : IFSM (A)
TIME : t (ms)
IFSM-t CHARACTERISTICS
IFSM time
Ta=25°C
1cyc
8.3
IFSM
1cyc
ms 8.3
ms
Ta=25°C
4/4
2016.07 - Rev.A
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
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serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
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(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢCLASSⅢCLASSⅡbCLASSⅢ
CLASSⅣ CLASSⅢ
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[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
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H2S, NH3, SO2, and NO2
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[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
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Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
2016
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
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Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
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1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
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2016
Datasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
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ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
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2016