QL12X16B
pASIC® 1 Family
Very-High-Speed CMOS FPGA
4-13
Very High Speed – ViaLink metal-to-metal programmable–via
antifuse technology, allows counter speeds over 150 MHz and logic
cell delays of under 2 ns.
High Usable Density – A 12-by-16 array of 192 logic cells
provides 2,000 usable ASIC gates (4,000 PLD gates) in 68-pin and
84-pin PLCC, 84-pin CPGA and 100-pin TQFP packages.
Low-Power, High-Output Drive – Standby current typically 2
mA. A 16-bit counter operating at 100 MHz consumes less than 50
mA. Minimum IOL of 12 mA and IOH of 8 mA
Low-Cost, Easy-to-Use Design Tools – Designs entered and
simulated using QuickLogic's new QuickWorks development
environment, or with third-party CAE tools including Viewlogic,
Synopsys, Mentor, Cadence and Veribest. Fast, fully automatic place
and route on PC and workstation platforms using QuickLogic
software.
=
Up to 80 prog. I/O cells, 6 Input high-drive cells, 2 Input/Clk (high-drive) cells
pASIC 1
4
pASIC
HIGHLIGHTS
QL12x16B
Block Diagram
Rev C
…2,000
usable ASIC gates,
88 I/O pins
192 Logic Cells
QL12x16B
4-14
The QL12x16B is a member of the pASIC 1 Family of very-high-speed
CMOS user-programmable ASIC devices. The 192 logic cell field-
programmable gate array (FPGA) offers 2,000 usable ASIC gates (4,000
usable PLD gates) of high-performance general-purpose logic in a wide
variety of package configurations.
Low-impedance, metal-to-metal, ViaLink interconnect technology
provides nonvolatile custom logic capable of operating above 150 MHz.
Logic cell delays under 2 ns, combined with input delays of under 1.5 ns
and output delays under 3 ns, permit high-density programmable devices
to be used with today’s fastest microprocessors and DSPs.
Designs can be entered using QuickLogic’s QuickWorks Toolkit or most
populart third-party CAE tools. QuickWorks combines Verilog/VHDL
design entry and simulation tools with device-specific place & route and
programming software. Ample on-chip routing channels allow fast, fully
automatic place and route of designs using up to 100% of the logic and
I/O cells, while maintaining fixed pin-outs.
Total of 88 I/O pins
– 80 Bidirectional Input/Output pins
– 6 Dedicated Input/High-Drive pins
– 2 Clock/Dedicated input pins with fanout-independent, low-skew
clock networks
Input + logic cell + output delays under 6 ns
Chip-to-chip operating frequencies up to 110 MHz
Internal state machine frequencies up to 150 MHz
Clock skew < 0.5 ns
Input hysteresis provides high noise immunity
Built-in scan path permits 100% factory testing of logic and I/O cells
and functional testing with Automatic Test Vector Generation
(ATVG) software after programming
Available in 68-pin and 84-pin PLCC, 84-pin CPGA and 100-pin
TQFP packages
68-pin PLCC compatible with QL8x12B
84-pin PLCC compatible with QL16x24B
100-pin TQFP compatible with QL8x12B and QL16x24B
0.65µ CMOS process with ViaLink programming technology
PRODUCT
SUMMARY
FEATURES
QL12x16B
4-15
Pins identified I/SCLK, SM, SO and SI are used during scan path testing operation.
pASIC 1
4
Pinout
Diagram
68-pin PLCC
Pinout
Diagram
84-pin PLCC
QL12x16B
4-16
CPGA 84 Function/Connector Pin Table
PIN FUNC PIN FUNC PIN FUNC PIN FUNC
B10 IO B2 IO K2 IO K10 IO
B9 IO C2 IO K3 IO J10 IO
A10 IO B1 IO L2 IO K11 IO
A9 IO C1 IO L3 IO J11 IO
B8 IO D2 IO K4 IO H10 IO
A8 IO D1 IO L4 IO H11 IO
A7 IO E1 IO L5 IO G11 IO
C7 GND E3 GND J5 GND G9 GND
A6 IO E2 IO L6 IO G10 IO
B7 I/(SCLK) F1 IO K5 I/(SI) F11 IO
C6 I/CLK/(SM) F2 IO J6 I/CLK F10 IO
B6 I(P) F3 IO K6 I F9 IO
B5 I G1 IO K7 I/(SO) E11 IO
C5 VCC G3 VCC J7 VCC E9 VCC
A5 IO G2 IO L7 IO E10 IO
A4 IO H1 IO L8 IO D11 IO
B4 IO H2 IO K8 IO D10 IO
A3 IO J1 IO L9 IO C11 IO
A2 IO K1 IO L10 IO B11 IO
B3 IO J2 IO K9 IO C10 IO
A1 IO L1 IO L11 IO A11 IO
M
Pinout Diagram
84-pin CPGA
QL12x16B
4-17
pASIC 1
4
Pinout Diagram
100-pin TQFP
QL12x16B
4-18
ABSOLUTE MAXIMUM RATINGS
Supply Voltage................................. –0.5 to 7.0V Storage Temperature.......–65°C to + 150°C
Input Voltage....................... –0.5 to VCC +0.5V Lead Temperature...................................300°C
ESD Pad Protection.................................. ±2000V
DC Input Current...................................... ±20 mA
Latch-up Immunity................................. ±200 mA
OPERATING RANGE
Symbol Parameter Military Industrial Commercial Unit
Min Max Min Max Min Max
VCC Supply Voltage 4.5 5.5 4.5 5.5 4.75 5.25 V
TA Ambient Temperature -55 -40 85 0 70 °C
TC Case Temperature 125 °C
-X Speed Grade 0.4 2.75 0.46 2.55
K Delay Factor -0 Speed Grade 0.39 1.82 0.4 1.67 0.46 1.55
-1 Speed Grade 0.39 1.56 0.4 1.43 0.46 1.33
-2 Speed Grade 0.4 1.35 0.46 1.25
DC CHARACTERISTICS over operating range
Symbol Parameter Conditions Min Max Unit
VIH Input HIGH Voltage 2.0 V
VIL Input LOW Voltage 0.8 V
IOH = -4 mA 3.7 V
VOH Output HIGH Voltage IOH = -8 mA 2.4 V
IOH = -10 µAVCC-0.1 V
VOL Output LOW Voltage IOL = 12 mA* 0.4 V
IOL = 10 µA0.1 V
II Input Leakage Current VI = VCC or GND -10 10 µA
IOZ 3-State Output Leakage Current VI = VCC or GND -10 10 µA
CI Input Capacitance [1] 10 pF
IOS Output Short Circuit Current [2] VO = GND -10 -80 mA
VO = VCC 30 140 mA
ICC D.C. Supply Current [3] VI, VIO = VCC or GND 10 mA
*IOL = 12 mA for commercial range only. IOL = 8 mA for the industrial and military ranges.
Notes:
[1] Capacitance is sample tested only. CI = 20 pF max on I/(SI).
[2] Only one output at a time. Duration should not exceed 30 seconds.
[3] Commercial temperature grade only. Maximum Icc for industrial grade is 15mA and for military grade is
20 mA. For AC conditions use the formula described in the Section 9 — Power vs Operating Frequency.
[4] Stated timing for worst case Propagation Delay over process variation at VCC = 5.0V and TA = 25°C.
Multiply by the appropriate Delay Factor, K, for speed grade, voltage and temperature settings as specified
in the Operating Range.
[5] These limits are derived from a representative selection of the slowest paths through the pASIC logic cell
including net delays. Worst case delay values for specific paths should be determined from timing analysis
of your particular design.
QL12x16B
4-19
AC CHARACTERISTICS at VCC = 5V, TA = 25°C (K = 1.00)
Logic Cell
Input Cells
Output Cell Propagation Delays (ns) [4]
Symbol Parameter Output Load Capacitance (pF)
30 50 75 100 150
tOUTLH Output Delay Low to High 2.7 3.4 4.2 5.0 6.7
tOUTHL Output Delay High to Low 2.8 3.7 4.7 5.6 7.6
tPZH Output Delay Tri-state to High 4.0 4.9 6.1 7.3 9.7
tPZL Output Delay Tri-state to Low 3.6 4.2 5.0 5.8 7.3
tPHZ Output Delay High to Tri-state [8] 2.9
tPLZ Output Delay Low to Tri-state [8] 3.3
Notes:
[6] See High Drive Buffer Table for more information.
[7] Clock buffer fanout refers to the maximum number of flip flops per half column. The number of half
columns used does not affect clock buffer delay.
[8] The following loads are used for tPXZ:
pASIC 1
4
Propagation Delays (ns)
Symbol Parameter Fanout
12348
tPD Combinatorial Delay [5] 1.7 2.2 2.6 3.2 5.2
tSU Setup Time [5] 2.1 2.1 2.1 2.1 2.1
tH Hold Time 0.0 0.0 0.0 0.0 0.0
tCLK Clock to Q Delay 1.0 1.5 1.9 2.5 4.6
tCWHI Clock High Time 2.0 2.0 2.0 2.0 2.0
tCWLO Clock Low Time 2.0 2.0 2.0 2.0 2.0
tSET Set Delay 1.7 2.1 2.6 3.2 5.2
tRESET Reset Delay 1.5 1.9 2.2 2.7 4.3
tSW Set Width 1.9 1.9 1.9 1.9 1.9
tRW Reset Width 1.8 1.8 1.8 1.8 1.8
Symbol Parameter Propagation Delays (ns) [4]
123468
tIN High Drive Input Delay [6] 2.4 2.5 2.6 2.7 3.0 3.3
tINI High Drive Input, Inverting Delay [6] 2.5 2.6 2.7 2.8 3.1 3.4
tIO Input Delay (bidirectional pad) 1.4 1.9 2.2 2.8 3.7 4.6
tGCK Clock Buffer Delay [7] 2.7 2.8 2.8 2.9 2.9 3.0
tGCKHI Clock Buffer Min High [7] 2.0 2.0 2.0 2.0 2.0 2.0
tGCKLO Clock Buffer Min Low [7] 2.0 2.0 2.0 2.0 2.0 2.0
5 pF
1KΩ
5 pF
1KΩ
tPHZ
tPLZ
QL12x16B
4-20
High Drive Buffer Clock Drivers Propagation Delays (ns) [4]
Symbol Parameter Wired Together Fanout
12 24 48 72 96
1 4.5 5.4
tIN High Drive Input Delay 2 3.9 5.6
3 4.5 5.3 6.3
4 4.6 5.3
1 4.7 5.6
tINI High Drive Input, 2 4.0 5.8
Inverting Delay 3 4.6 5.5 6.4
4 4.8 5.5
AC Performance
Propagation delays depend on routing, fanout, load capacitance, supply voltage, junction temperature,
and process variation. The AC Characteristics are a design guide to provide initial timing estimates at
nominal conditions. Worst case estimates are obtained when nominal propagation delays are multiplied
by the appropriate Delay Factor, K, as specified in the Delay Factor table (Operating Range). The
effects of voltage and temperature variation are illustrated in the graphs on page 4-47, K Factor versus
Voltage and Temperature. The pASIC Development Tools incorporate data sheet AC Characteristics
into the QDIF database for pre-place-and-route timing analysis. The SpDE Delay Modeler extracts
specific timing parameters for precise path analysis or simulation results following place and route.
ORDERING
INFORMATION QL 12x16B - 1 PF100 C
QuickLogic pASIC
device prefix
pASIC device part number
B = 0.65 micron CMOS
Operating Range
C = Commercial
I = Industrial
M = Military
M/883C = MIL-STD-883
Package Code
PL68 = 68-pin PLCC
PL84 = 84-pin PLCC
CG84 = 84-pin CPGA
PF100 = 100-pin TQFP
Speed Grade
X = quick
0 = fast
1 = faster
2 = fastest
