INTEGRATED CIRCUITS DIVISION
LBA127L
Dual Single-Pole, Combination
OptoMOS® Relay
www.ixysic.com
DS-LBA127L-R08 1
Part # Description
LBA127L 8-Pin DIP (50/Tube)
LBA127LS 8-Pin Surface Mount (50/Tube)
LBA127LSTR 8-Pin Surface Mount (1,000/Reel)
Parameter Ratings Units
Blocking Voltage 250 VP
Load Current 150 mArms / mADC
On-Resistance (max) 15
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
• Current Limited 1-Form-A Relay
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• High Reliability
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 8-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount, Tape & Reel Version Available
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
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Pb
Switching Characteristics of
Normally Closed
(Form B) Devices
Form-B
I
F
10%
90%
I
LOAD
ton
toff
Form-A
I
F
I
LOAD
10%
90%
t
on
t
off
Switching Characteristics of
Normally Open
(Form A) Devices
1
2
3
4
+ Control - Normally Closed
– Control - Normally Closed
+ Control - Normally Open
– Control - Normally Open
8
Normally Closed Pole
Normally Open Pole
7
6
5
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
LBA127L comprises two independent solid state
relays (one current-limited, single-pole, normally
open (1-Form-A) relay and one single-pole, normally
closed (1-Form-B) relay), in an 8-pin package that
employs optically coupled MOSFET technology to
provide 3750Vrms of input to output isolation.
The optically coupled relay outputs, which use the
patented OptoMOS architecture, are controlled by a
highly efficient GaAIAs infrared LED.
LBA127L is designed to provide an ideal solution
where a complementary Form-A/Form-B relay pair is
required in a space-saving single package.
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R08
LBA127L
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1-I
L- - 150 mArms / mADC
Peak (Form-B Only) t = 10ms ILPK - - ±400 mAP
Load Current Limiting (Form-A Only) IF=5mA, VL=8V ICL ±190 ±200 ±280 mA
On-Resistance 2IL=150mA RON - 6.8 15
Off-State Leakage Current VL=250VPILEAK --1 A
Switching Speeds
Turn-On IF=5mA, VL=10V ton --5 ms
Turn-Off toff --5
Output Capacitance VL=50V, f=1MHz COUT - 110 - pF
Input Characteristics
Input Control Current to Activate IL=150mA IF--5 mA
Input Control Current to Deactivate - - 0.4 0.7 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10 A
Common Characteristics
Input to Output Capacitance - CI/O -3- pF
1 If both poles operate, then the load current must be derated so as not to exceed the package power dissipation value.
2 Measurement taken within 1 second of on-time.
Parameter Ratings Units
Blocking Voltage 250 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / °C
2 Derate linearly 6.67 mW / °C
Absolute Maximum Ratings @ 25°C
Electrical Characteristics @ 25°C
INTEGRATED CIRCUITS DIVISION
LBA127L
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R08
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
35
30
25
20
15
10
5
0
1.18 1.20 1.22 1.24 1.26
LED Forward Voltage Drop (V)
Device Count (N)
Typical IF for Switch Operation
(N=50, IL=150mADC)
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
0.35 0.45 0.550.40 0.50 0.60
Typical Blocking Voltage Distribution
(Form-A: IF=0mA, Form-B: IF=5mA)
(N=50)
25
20
15
10
5
0
332 334 336 340338 342
Blocking Voltage (VP)
Device Count (N)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage Drop (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=5mA
IF=10mA
IF=20mA
IF=50mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current (mA)
0.40
0.45
0.50
0.55
0.60
0.65
Typical IF for Switch Operation
vs. Temperature
(IL=75mADC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
0
50
100
150
200
250
Load Current vs. Load Temperature
(Form-A: IF=5mA, Form-B: IF=0mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
315
320
325
330
335
340
345
350
355
Typical Blocking Voltage
vs. Temperature
(Form-A: IF=0mA, Form-B: IF=5mA)
Form-A/Form-B PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R08
LBA127L
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
Form-A RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Form-A
Typical Turn-On Time
(N=50, IF=5mA, IL=150mADC)
0.33 0.39 0.450.30 0.36 0.42
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
Form-A
Typical Turn-Off Time
(N=50, IF=5mA, IL=150mADC)
0.13 0.150.14 0.16
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
0.170.12
Form-A
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=150mADC)
25
20
15
10
5
0
6.70 6.80 6.906.75 6.85 6.95
On-Resistance (:)
Device Count (N)
LED Forward Current (mA)
0 1020304050
Turn-On Time (ms)
0
0.50
1.00
Form-A
Typical Turn-On Time
vs. LED Forward Current
(IL=75mADC)
0.25
0.75
LED Forward Current (mA)
0 1020304050
Turn-Off Time (ms)
0.150
0.155
0.160
0.165
Form-A
Typical Turn-Off Time
vs. LED Forward Current
(IL=75mADC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
Form-A
Typical On-Resistance vs. Temperature
(IF=5mA, IL=75mADC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (ms)
0
0.2
0.4
0.6
0.8
1.0
1.2
Form-A
Typical Turn-On Time
vs. Temperature
(IF=5mA, IL=75mADC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (ms)
0.08
0.10
0.12
0.14
0.16
0.18
0.20
Form-A
Typical Turn-Off Time
vs. Temperature
(IF=5mA, IL=75mADC)
Load Voltage (V)
-1.5 -1.0 -0.5 0.0 0.5 1.0 1.5
Load Current (A)
-0.20
-0.15
-0.10
-0.05
0.00
0.05
0.10
0.15
0.20
Form-A
Typical Load Current vs. Load Voltage
(IF=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage (PA)
0.000
0.005
0.010
0.015
0.020
0.025
Form-A
Typical Leakage vs.Temperature
(Measured Across Pins 5 & 6)
(VL=250V)
Form-A
Typical Current Limiting vs. Temperature
(IF=5mA)
Temperature (ºC)
Current (mA)
400
350
300
250
200
150
100
50
0
-40 -20 0 20 40 60 80 120100
INTEGRATED CIRCUITS DIVISION
LBA127L
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R08
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
Form-B RELAY PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
Form-B
Typical Turn-On Time
(N=50, IF=5mA, IL=150mADC)
Turn-On Time (ms)
Device Count (N)
25
20
15
10
5
0
0.03 0.07 0.110.05 0.09 0.13
Form-B
Typical Turn-Off Time
(N=50, IF=5mA, IL=150mADC)
Turn-Off Time (ms)
Device Count (N)
25
20
15
10
5
0
0.75 1.75 2.751.25 2.25 3.25
Form-B
Typical On-Resistance Distribution
(N=50, IF=0mA, IL=150mADC)
On-Resistance (:)
Device Count (N)
25
20
15
10
5
0
4.05 4.65 5.254.35 4.95 5.55
Form-B
Typical Turn-On Time
vs. LED Forward Current
(IL=75mADC)
LED Forward Current (mA)
Turn-On Time (Ps)
78.5
78.0
77.5
77.0
76.5
76.0
010205 15 25303540 45 50
Form-B
Typical Turn-Off Time
vs. LED Forward Current
(IL=75mADC)
LED Forward Current (mA)
Turn-Off Time (ms)
2.5
2.0
1.5
1.0
0.5
0
010205 15 25303540 45 50
Form-B
Typical On-Resistance vs. Temperature
(IF=0mA, IL=75mADC)
Temperature (ºC)
On-Resistance (:)
9
8
7
6
5
4
3
2
1
0-40 0 40-20 20 60 80 100
Form-B
Typical Turn-On Time
vs. Temperature
(IF=5mA, IL=75mADC)
Temperature (ºC)
Turn-On Time (ms)
0.20
0.15
0.10
0.05
0
-40 0 40-20 20 60 80 100
Form-B
Typical Turn-Off Time
vs. Temperature
(IL=75mADC)
Temperature (ºC)
Turn-Off Time (ms)
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40 0 40-20 20 60 80 100
IF=5mA
IF=10mA
IF=20mA
Form-B
Typical Load Current vs. Load Voltage
(IF=0mA)
Load Voltage (V)
Load Current (mA)
200
150
100
50
0
-50
-100
-150
-200-1 -0.6 -0.2-0.8 -0.4 0 0.2 0.4 0.6 0.8 1
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage (PA)
0
0.01
0.02
0.03
0.04
0.05
0.06
Typical Leakage vs. Temperature
Measured Across Pins 7&8
(IF=5mA) Energy Rating Curve
Time
Load Current (A)
1.2
1.0
0.8
0.6
0.4
0.2
0
10Ps 100Ps1ms 10ms 100ms 1s 10s 100s
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
6R08
LBA127L
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
LBA127L / LBA127LS MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
LBA127L / LBA127LS 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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Pb
INTEGRATED CIRCUITS DIVISION
LBA127L
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R08
MECHANICAL DIMENSIONS
LBA127L
LBA127LS
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
INTEGRATED CIRCUITS DIVISION
For additional information please visit our website at: www.ixysic.com
8
LBA127L
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-LBA127L-R08
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012
MECHANICAL DIMENSIONS
LBA127LSTR Tape & Reel
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
