a
ADG774
REV. C
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reliable. However, no responsibility is assumed by Analog Devices for its
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may result from its use. No license is granted by implication or otherwise
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registered trademarks are the property of their respective owners.
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Tel: 781/329-4700 www.analog.com
Fax: 781/326-8703 © 2004 Analog Devices, Inc. All rights reserved.
CMOS 3 V/5 V,
Wide Bandwidth Quad 2:1 Mux
FUNCTIONAL BLOCK DIAGRAM
1 OF 2
DECODER
ADG774
EN IN
S1A
S1B
S2A
S2B
S3A
S3B
S4A
S4B
D1
D2
D3
D4
FEATURES
Low Insertion Loss and On Resistance: 2.2 Typical
On Resistance Flatness 0.5 Typical
Automotive Temperature Range
–40C to +125C
–3 dB Bandwidth = 240 MHz
Single 3 V/5 V Supply Operation
Rail-to-Rail Operation
Very Low Distortion: 0.5%
Low Quiescent Supply Current (1 nA Typical)
Fast Switching Times
tON 7 ns
tOFF 4 ns
TTL/CMOS Compatible
APPLICATIONS
USB 1.1 Signal Switching Circuits
Cell Phones
PDAs
Battery-Powered Systems
Communications Systems
Data Acquisition Systems
Token Ring 4 Mbps/16 Mbps
Audio and Video Switching
Relay Replacement
GENERAL DESCRIPTION
The ADG774 is a monolithic CMOS device comprising four
2:1 multiplexer/demultiplexers with high impedance outputs.
The CMOS process provides low power dissipation yet gives
high switching speed and low on resistance. The on resistance
variation is typically less than 0.5 Ω with an input signal ranging
from 0 V to 5 V.
The bandwidth of the ADG774 is greater than 200 MHz; this,
coupled with low distortion (typically 0.5%), makes the part
suitable for switching USB 1.1 data signals and fast Ethernet
signals.
The on resistance profile is very flat over the full analog input
range ensuring excellent linearity and low distortion when
switching audio signals. Fast switching speed, coupled with high
signal bandwidth, also makes the parts suitable for video signal
switching. CMOS construction ensures ultralow power dissipa-
tion, making the parts ideally suited for portable and battery-
powered instruments.
The ADG774 operates from a single 3.3 V/5 V supply and is
TTL logic compatible. The control logic for each switch is shown
in the Truth Table.
These switches conduct equally well in both directions when ON,
and have an input signal range that extends to the supplies. In
the OFF condition, signal levels up to the supplies are blocked.
The ADG774 switches exhibit break-before-make switching
action.
PRODUCT HIGHLIGHTS
1. Wide –3 dB Bandwidth, 240 MHz.
2. Ultralow Power Dissipation.
3. Extended Signal Range.
The ADG774 is fabricated on a CMOS process giving an
increased signal range that fully extends to the supply rails.
4. Low Leakage Over Temperature.
5. Break-Before-Make Switching.
This prevents channel shorting when the switches are config-
ured as a multiplexer.
6. Crosstalk Typically –70 dB @ 30 MHz.
7. Off Isolation Typically –60 dB @ 10 MHz.
–2– REV. C
ADG774–SPECIFICATIONS
B Version
1
–40C to –40C to
Parameter +25C+85C+125CUnit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to V
DD
V
On Resistance (R
ON
)2.2 Ω typ V
D
= 0 V to V
DD
, I
S
= –10 mA
57 Ω max
On Resistance Match between
Channels (R
ON
)0.15 Ω typ V
D
= 0 V to V
DD
, I
S
= –10 mA
0.5 0.5 Ω max
On Resistance Flatness (R
FLAT(ON)
)0.5 Ω typ V
D
= 0 V to V
DD
, I
S
= –1 mA
11 Ω max
LEAKAGE CURRENTS
Source OFF Leakage I
S
(OFF) ±0.01 nA typ V
D
= 4.5 V, V
S
= 1 V; V
D
= 1 V, V
S
= 4.5 V;
±0.5 ±1±1.5 nA max Test Circuit 2
Drain OFF Leakage I
D
(OFF) ±0.01 nA typ V
D
= 4.5 V, V
S
= 1 V; V
D
= 1 V, V
S
= 4.5 V;
±0.5 ±1±1.5 nA max Test Circuit 2
Channel ON Leakage I
D
, I
S
(ON) ±0.01 nA typ V
D
= V
S
= 4.5 V; V
D
= V
S
= 1 V; Test Circuit 3
±0.5 ±1±1.5 nA max
DIGITAL INPUTS
Input High Voltage, V
INH
2.0 V min
Input Low Voltage, V
INL
0.8 V max
Input Current
I
INL
or I
INH
0.001 µA typ V
IN
= V
INL
or V
INH
±0.5 µA max
DYNAMIC CHARACTERISTICS
2
t
ON
7ns typ R
L
= 100 Ω, C
L
= 35 pF,
15 20 ns max V
S
= +3 V; Test Circuit 4
t
OFF
4ns typ R
L
= 100 Ω, C
L
= 35 pF,
89 ns max V
S
= +3 V; Test Circuit 4
Break-Before-Make Time Delay, t
D
5ns typ R
L
= 100 Ω, C
L
= 35 pF,
1ns min V
S1
= V
S2
= +5 V; Test Circuit 5
Off Isolation –65 dB typ R
L
= 100 Ω, f = 10 MHz; Test Circuit 7
Channel-to-Channel Crosstalk –75 dB typ R
L
= 100 Ω, f = 10 MHz; Test Circuit 8
Bandwidth –3 dB 240 MHz typ R
L
= 100 Ω; Test Circuit 6
Distortion 0.5 % typ R
L
= 100 Ω
Charge Injection 10 pC typ C
L
= 1 nF; Test Circuit 9
C
S
(OFF) 10 pF typ f = 1 kHz
C
D
(OFF) 20 pF typ f = 1 kHz
C
D
, C
S
(ON) 30 pF typ f = 1 MHz
POWER REQUIREMENTS V
DD
= +5.5 V
Digital Inputs = 0 V or V
DD
I
DD
11 µA max
0.001 µA typ
I
IN
11 µA typ V
IN
= +5 V
I
O
100 mA max V
S
/V
D
= 0 V
NOTES
1
Temperature range: B Version, –40°C to +125°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
(VDD = 5 V 10%, GND = 0 V. All specifications TMIN to TMAX unless otherwise noted.)
SINGLE SUPPLY
–3–
REV. C
ADG774
B Version
1
–40C to –40C to
Parameter +25C+85C+125CUnit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 V to V
DD
V
On Resistance (R
ON
)4 Ω typ V
D
= 0 V to V
DD
, I
S
= –10 mA
89 Ω max
On Resistance Match between
Channels (R
ON
)0.15 Ω typ V
D
= 0 V to V
DD
, I
S
= –10 mA
0.5 0.5 Ω max
On Resistance Flatness (R
FLAT(ON)
)2 Ω typ V
D
= 0 V to V
DD
, I
S
= –10 mA
44 Ω max
LEAKAGE CURRENTS
Source OFF Leakage I
S
(OFF) ±0.01 nA typ V
D
= 3 V, V
S
= 1 V; V
D
= 1 V, V
S
= 3 V;
±0.5 ±1±1.5 nA max Test Circuit 2
Drain OFF Leakage I
D
(OFF) ±0.01 nA typ V
D
= 3 V, V
S
= 1 V; V
D
= 1 V, V
S
= 3 V;
±0.5 ±1±1.5 nA max Test Circuit 2
Channel ON Leakage I
D
, I
S
(ON) ±0.01 nA typ V
D
= V
S
= 3 V; V
D
= V
S
= 1 V; Test Circuit 3
±0.5 ±1±1.5 nA max
DIGITAL INPUTS
Input High Voltage, V
INH
2.0 V min
Input Low Voltage, V
INL
0.8 V max
Input Current
I
INL
or I
INH
0.001 µA typ V
IN
= V
INL
or V
INH
±0.5 µA max
DYNAMIC CHARACTERISTICS
2
t
ON
8ns typ R
L
= 100 Ω, C
L
= 35 pF,
16 21 ns max V
S
= +1.5 V; Test Circuit 4
t
OFF
5ns typ R
L
= 100 Ω, C
L
= 35 pF,
10 11 ns max V
S
= +1.5 V; Test Circuit 4
Break-Before-Make Time Delay, t
D
5ns typ R
L
= 100 Ω, C
L
= 35 pF,
1ns min V
S1
= V
S2
= 3 V; Test Circuit 5
Off Isolation –65 dB typ R
L
= 50 Ω, f = 10 MHz; Test Circuit 7
Channel-to-Channel Crosstalk –75 dB typ R
L
= 50 Ω, f = 10 MHz; Test Circuit 8
Bandwidth –3 dB 240 MHz typ R
L
= 50 Ω; Test Circuit 6
Distortion 2 % typ R
L
= 50 Ω
Charge Injection 3 pC typ C
L
= 1 nF; Test Circuit 9
C
S
(OFF) 10 pF typ f = 1 kHz
C
D
(OFF) 20 pF typ f = 1 kHz
C
D
, C
S
(ON) 30 pF typ f = 1 MHz
POWER REQUIREMENTS V
DD
= +3.3 V
Digital Inputs = 0 V or V
DD
I
DD
11 µA max
0.001 µA typ
I
IN
11 µA typ V
IN
= +3 V
I
O
100 mA max V
S
/V
D
= 0 V
NOTES
1
Temperature range: B Version, –40°C to +125°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
(VDD = 3 V 10%, GND = 0 V. All specifications TMIN to TMAX unless otherwise noted.)
SINGLE SUPPLY
Table I. Truth Table
EN IN D1 D2 D3 D4 Function
1XHi-Z Hi-Z Hi-Z Hi-Z DISABLE
00S1A S2A S3A S4A IN = 0
01S1B S2B S3B S4B IN = 1
ADG774
–4– REV. C
ORDERING GUIDE
Model Temperature Range Package Descriptions Package Options
ADG774BR –40°C to +125°CStandard Small Outline Package (SOIC) R-16
ADG774BR-REEL –40°C to +125°CStandard Small Outline Package (SOIC) R-16
ADG774BR-REEL7 –40°C to +125°CStandard Small Outline Package (SOIC) R-16
ADG774BRZ*–40°C to +125°CStandard Small Outline Package (SOIC) R-16
ADG774BRZ-REEL*–40°C to +125°CStandard Small Outline Package (SOIC) R-16
ADG774BRZ-REEL7*–40°C to +125°CStandard Small Outline Package (SOIC) R-16
ADG774BRQ –40°C to +125°CShrink Small Outline Package (QSOP) RQ-16
ADG774BRQ-REEL –40°C to +125°CShrink Small Outline Package (QSOP) RQ-16
ADG774BRQ-REEL7 –40°C to +125°CShrink Small Outline Package (QSOP) RQ-16
ADG774BRQZ*–40°C to +125°CShrink Small Outline Package (QSOP) RQ-16
ADG774BRQZ-REEL*–40°C to +125°CShrink Small Outline Package (QSOP) RQ-16
ADG774BRQZ-REEL7*–40°C to +125°CShrink Small Outline Package (QSOP) RQ-16
*Z = Pb-free part.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG774 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= 25°C unless otherwise noted.)
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
Analog, Digital Inputs
2
. . . . . . . . . . –0.3 V to V
DD
+ 0.3 V or
30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 100 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 300 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 100°C/W
QSOP Package, Power Dissipation . . . . . . . . . . . . . . . 566 mW
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . 149.97°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300°C
I R Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
ADG774
–5–
REV. C
PIN CONFIGURATION
(SOIC/QSOP)
TOP VIEW
(Not to Scale)
1
3
2
4
5
6
7
8
IN
S1A
S1B
D1
S2A
S2B
D2
GND
V
DD
EN
S4A
S4B
D4
S3A
S3B
D3
ADG774
16
14
15
13
12
11
10
9
TERMINOLOGY
V
DD
Most Positive Power Supply Potential.
GND Ground (0 V) Reference.
SSource Terminal. May be an input or output.
DDrain Terminal. May be an input or output.
IN Logic Control Input.
EN Logic Control Input.
R
ON
Ohmic Resistance between D and S.
R
ON
On Resistance Match between any Two Channels, i.e., R
ON
max – R
ON
min.
R
FLAT(ON)
Flatness is defined as the difference between the maximum and minimum value of on resistance as measured over
the specified analog signal range.
I
S
(OFF) Source Leakage Current with the Switch OFF.
I
D
(OFF) Drain Leakage Current with the Switch OFF.
I
D
, I
S
(ON) Channel Leakage Current with the Switch ON.
V
D
(V
S
)Analog Voltage on Terminals D, S.
C
S
(OFF) OFF Switch Source Capacitance.
C
D
(OFF) OFF Switch Drain Capacitance.
C
D
, C
S
(ON) ON Switch Capacitance.
t
ON
Delay between Applying the Digital Control Input and the Output Switching on. See Test Circuit 4.
t
OFF
Delay between Applying the Digital Control Input and the Output Switching Off.
t
D
OFF Time or ON Time Measured between the 90% Points of Both Switches, When Switching from One Address
State to Another. See Test Circuit 5.
Crosstalk A Measure of Unwanted Signal that is Coupled through from One Channel to Another as a Result of Parasitic
Capacitance.
Off Isolation A Measure of Unwanted Signal Coupling through an OFF Switch.
Bandwidth Frequency Response of the Switch in the ON State Measured at 3 dB Down.
Distortion R
FLAT(ON)
/R
L
ADG774
–6– REV. C
T
A
= 25C
V
S
OR V
D
DRAIN OR SOURCE VOLTAGE – V
1.3 2.5 3.7 4.9
5.0
4.5
0
R
ON
–
2.0
1.5
1.0
0.5
3.0
2.5
3.5
4.0
V
DD
= 2.7V
V
DD
= 3.0V
V
DD
= 4.5V
V
DD
= 5.0V
TPC 1. On Resistance as a Function of V
D
(V
S
) for
Various Single Supplies
V
DD
= 5V
3.0
0
R
ON
–
1.5
1.0
0.5
2.0
2.5
V
S
OR V
O
DRAIN OR SOURCE VOLTAGE – V
1.3 2.5 3.7 4.9
+85C
+25C
–40C
TPC 2. On Resistance as a Function of V
D
(V
S
) for
Different Temperatures with 5 V Single Supplies
+25C
–40C
4.5
0
RON –
2.0
1.5
1.0
3.0
2.5
3.5
4.0
0.5
VDD = 3V
VS OR VD DRAIN OR SOURCE VOLTAGE – V
0.6 1.1 1.6 2.1 2.6
+85C
TPC 3. On Resistance as a Function of V
D
(V
S
) for
Different Temperatures with 3 V Single Supplies
–Typical Performance Characteristics
VDD = 5V
FREQUENCY – Hz
0
10M10k
ON RESPONSE – dB
–4
–2
100k 1M 100M
–6
TPC 4. On Response vs. Frequency
FREQUENCY – Hz
0
–10
–100
100k 1G1M 10M 100M
–40
–70
–80
–90
–20
–30
–60
–50
ATTENUATION – dB
VDD = 5V
RL = 100
TPC 5. Off Isolation vs. Frequency
FREQUENCY – Hz
0
–10
–100
100k 1G1M 10M 100M
–40
–70
–80
–90
–20
–30
–60
–50
ATTENUATION – dB
V
DD
= 5V
R
L
= 100
V
P-P
= 0.316V
TPC 6. Crosstalk vs. Frequency
ADG774
–7–
REV. C
SOURCE VOLTAGE – V
20
5
–10
15
10
0
–5
0 5.00.5 1.0 1.5 2.0 2.5
3.0
3.5 4.0 4.5
CHARGE INJECTION – pC
VDD = 5V
TA = 25 C
TPC 7. Charge Injection vs. Source Voltage
TX1
RX1
Figure 1. Loop Back
120100
Figure 2. Line Termination
Figure 3. Line Clamp
ADG774
–8– REV. C
I
DS
V1
SD
V
S
R
ON
= V1/I
DS
Test Circuit 1. On Resistance
SD
VS
A A
VD
IS (OFF) ID (OFF)
Test Circuit 2. Off Leakage
SD
V
S
A
V
D
I
D
(ON)
Test Circuit 3. On Leakage
Test Circuits
0.1F
5V
VS
IN
SD
VDD
GND
RL
100
CL
35pF
VOUT
EN
3V
50% 50%
90% 90%
VIN
VOUT
tON tOFF
Test Circuit 4. Switching Times
0.1F
5V
VS
EN
S1A
D1
VDD
GND
RL
100
CL
35pF
VOUT
S1B
DECODER
VS50% 50%
VIN
VOUT
tDtD
50% 50%
3V
0V
VS
Test Circuit 5. Break-Before-Make Time Delay
ADG774
–9–
REV. C
0.1F
5V
V
S
IN
D1
V
DD
GND
R
L
100
V
OUT
V
IN
EN
Test Circuit 6. Bandwidth
0.1F
5V
VS
IN
D1
VDD
GND
RL
100
VOUT
VIN
EN
S1A
S1B
Test Circuit 8. Off Isolation
0.1F
5V
V
S
D1
V
DD
GND
EN
S1A
S2A
100
V
IN
D2
NC V
OUT
R
L
100
CHANNEL-TO-CHANNEL
CROSSTALK = 20 LOG |V
S
/V
OUT
|
Test Circuit 7. Channel-to-Channel Crosstalk
5V
EN
S1A
V
DD
C
L
1nF
S1B
V
IN
V
OUT
3V
V
OUT
Q
INJ
= C
L
V
OUT
C
L
1nF
C
L
1nF
C
L
1nF
D1 V
OUT
D2 V
OUT
D3 V
OUT
D4 V
OUT
ADG774
1 OF 2
DECODER
IN
S2A
S2B
S3A
S3B
S4A
S4B
V
S
R
S
Test Circuit 9. Charge Injection
ADG774
–10– REV. C
OUTLINE DIMENSIONS
16-Lead Standard Small Outline Package [SOIC]
Narrow Body
(R-16)
Dimensions shown in millimeters and (inches)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-012AC
16 9
8
1
4.00 (0.1575)
3.80 (0.1496)
10.00 (0.3937)
9.80 (0.3858)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2283)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
8
0
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
COPLANARITY
0.10
45
0.25 (0.0098)
0.17 (0.0067)
16-Lead Shrink Small Outline Package [QSOP]
(RQ-16)
Dimensions shown in inches
16 9
8
1
PIN 1
SEATING
PLANE
0.010
0.004 0.012
0.008
0.025
BSC 0.010
0.006
0.050
0.016
8
0
COPLANARITY
0.004
0.065
0.049
0.069
0.053
0.154
BSC
0.236
BSC
COMPLIANT TO JEDEC STANDARDS MO-137AB
0.193
BSC
ADG774
–11–
REV. C
Revision History
Location Page
3/04—Data Sheet changed from REV. B to REV. C.
Added APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Changes to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
10/03—Data Sheet changed from REV. A to REV. B.
Updated formatting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Universal
Renumbered TPCs amd Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Universal
Changes to FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Changes to APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Changes to PRODUCT HIGHLIGHTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Changes to SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Changes to ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Updated ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Delete Figure 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4/03—Data Sheet changed from REV. 0 to REV. A.
Renumbered TPCs and Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Universal
Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
–12–
C00049–0–3/04(C)
