LMC6572,LMC6574
LMC6572/LMC6574 Dual and Quad Low Voltage (2.7V and 3V) Operational
Amplifier
Literature Number: SNOS707C
LMC6572/LMC6574 Dual and Quad
Low Voltage (2.7V and 3V) Operational Amplifier
General Description
Low voltage operation and low power dissipation make the
LMC6574/2 ideal for battery-powered systems.
3V amplifier performance is backed by 2.7V guarantees to
ensure operation throughout battery lifetime. These guaran-
tees also enable analog circuits to operate from the same
3.3V supply used for digital logic.
Battery life is maximized because each amplifier dissipates
only micro-watts of power.
The LMC6574/2 does not sacrifice functionality for low volt-
age operation. The LMC6574/2 generates 120 dB of open-
loop gain just like a conventional amplifier, but the
LMC6574/2 can do this from a 2.7V supply.
These amplifiers are designed with features that optimize
low voltage operation. The output voltage swings rail-to-rail
to maximize signal-to-noise ratio and dynamic signal range.
The common-mode input voltage range extends from
800 mV below the positive supply to 100 mV below ground.
This device is built with National’s advanced Double-Poly
Silicon-Gate CMOS process.
LMC6572 is also available in MSOP package which is al-
most half the size of a SO-8 device.
Features
(Typical unless otherwise noted)
nGuaranteed 2.7V and 3V Performance
nRail-to-Rail Output Swing (within 5 mV of supply rail,
100 kload)
nUltra-Low Supply Current: 40 µA/Amplifier
nLow Cost
nUltra-Low Input Current: 20 fA
nHigh Voltage Gain @V
S
=2.7V, R
L
=100 k: 120 dB
nSpecified for 100 kand 5 kloads
nAvailable in MSOP Package
Applications
nTransducer Amplifier
nPortable or Remote Equipment
nBattery-Operated Instruments
nData Acquisition Systems
nMedical Instrumentation
nImproved Replacement for TLV2322 and TLV2324
Connection Diagrams
8-Pin DIP/SO/MSOP 14-Pin DIP/SO
01193401
Order Number LMC6572AIN, LMC6572BIN,
LMC6572AIM, LMC6572AIMX, LMC6572BIM,
LMC6572BIMX, LMC6572BIMM or LMC6572BIMMX
See NS Package Number N08E, M08A or MUA08A
01193402
Order Number LMC6574AIN, LMC6574BIN,
LMC6574AIM, LMC6574AIMX, LMC6574BIM or
LMC6574BIMX
See NS Package Number N14A or M14A
August 2000
LMC6572/LMC6574 Dual and Quad Low Voltage (2.7V and 3V) Operational Amplifier
© 2004 National Semiconductor Corporation DS011934 www.national.com
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
ESD Tolerance (Note 2) 2000V
Differential Input Voltage ±Supply Voltage
Voltage at Input/Output Pin (V
+
) +0.3V,
(V
) −0.3V
Supply Voltage (V
+
−V
) 12V
Current at Input Pin ±5mA
Current at Output Pin (Note 3) ±10 mA
Current at Power Supply Pin 35 mA
Lead Temperature
(Soldering, 10 Seconds) 260˚C
Storage Temperature Range −65˚C to +150˚C
Junction Temperature (Note 4) 150˚C
Operating Ratings (Note 1)
Supply Voltage 2.7V V
+
11V
Junction Temperature Range
LMC6572AI, LMC6572BI −40˚C T
J
+85˚C
LMC6574AI, LMC6574BI −40˚C T
J
+85˚C
Thermal Resistance (θ
JA
)
N Package, 8-Pin Molded DIP 115˚C/W
M Package, 8-Pin Surface Mount 193˚C/W
MSOP Package, 8-Pin Mini SO 217˚C/W
N Package, 14-Pin Molded DIP 81˚C/W
M Package, 14-Pin Surface Mount 126˚C/W
2.7V DC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for T
J
= 25˚C. V
+
= 2.7V, V
= 0V, V
CM
=V
O
=V
+
/2 and R
L
>1M.Bold-
face limits apply at the temperature extremes.
Symbol Parameter Conditions Typ
(Note 5)
LMC6574AI LMC6574BI Units
LMC6572AI LMC6572BI
Limit Limit
(Note 6) (Note 6)
V
OS
Input Offset Voltage V
+
= 2.7V and 3V 0.5 3 7 mV
3.5 7.5 Max
TCV
OS
Input Offset Voltage 1.5 µV/˚C
Average Drift
I
B
Input Current 0.02 pA
10 10 Max
I
OS
Input Offset Current 0.01 pA
66Max
R
IN
Input Resistance >1 Tera
C
IN
Common-Mode 3 pF
Input Capacitance
CMRR Common Mode 0V V
CM
3.5V 75 63 60 dB
Rejection Ratio V
+
=5V 60 57 Min
+PSRR Positive Power Supply 2.7V V
+
5V, 75 67 60 dB
Rejection Ratio V
=0V 65 58 Min
−PSRR Negative Power Supply −2.7V V
−5V, 83 75 67 dB
Rejection Ratio V
+
=0V 73 65 Min
V
CM
Input Common-Mode V
+
= 2.7V and 3V −0.1 −0.05 −0.05 V
Voltage Range for CMRR 50 dB 00Max
V
+
0.8 V
+
1.0 V
+
1.0 V
V
+
1.3 V
+
1.3 Min
A
V
Large Signal R
L
= 100 kSourcing 1000 V/mV
Voltage Gain (Note 7)
Sinking 500 V/mV
LMC6572/LMC6574
www.national.com 2
2.7V DC Electrical Characteristics (Continued)
Unless otherwise specified, all limits guaranteed for T
J
= 25˚C. V
+
= 2.7V, V
= 0V, V
CM
=V
O
=V
+
/2 and R
L
>1M.Bold-
face limits apply at the temperature extremes.
Symbol Parameter Conditions Typ
(Note 5)
LMC6574AI LMC6574BI Units
LMC6572AI LMC6572BI
Limit Limit
(Note 6) (Note 6)
V
O
Output Swing V
+
= 2.7V 2.695 2.68 2.65 V
R
L
= 100 kto V
+
/2 2.66 2.62 Min
0.005 0.03 0.06 V
0.05 0.09 Max
V
+
= 2.7V 2.66 2.55 2.45 V
R
L
=5kto V
+
/2 2.45 2.35 Min
0.04 0.15 0.25 V
0.25 0.35 Max
V
+
= 3V 2.995 2.98 2.95 V
R
L
= 100 kto V
+
/2 2.96 2.93 Min
0.005 0.03 0.06 V
0.05 0.09 Max
V
+
= 3V 2.96 2.85 2.75 V
R
L
=5kto V
+
/2 2.75 2.65 Min
0.04 0.15 0.25 V
0.25 0.35 Max
I
SC
Output Short Sourcing, V
O
= 0V 6.0 4.0 3.0 mA
Circuit Current 3.0 2.0 Min
Sinking, V
O
= 2.7V 4.0 3.0 2.5 mA
2.0 1.5 Min
I
S
Supply Current Quad Package 160 240 240 µA
V
+
= +2.7V, V
O
=V
+
/2 280 280 Max
Quad Package 160 240 240 µA
V
+
= +3V, V
O
=V
+
/2 280 280 Max
Dual Package 80 120 120 µA
V
+
= +2.7V, V
O
=V
+
/2 140 140 Max
Dual Package 80 120 120 µA
V
+
= +3V, V
O
=V
+
/2 140 140 Max
2.7V AC Electrical Characteristics
Unless otherwise specified, all limits guaranteed for T
J
= 25˚C, V
+
= 2.7V, V
= 0V, V
CM
=V
O
=V
+
/2 and R
L
>1M.Bold-
face limits apply at the temperature extremes.
Symbol Parameter Conditions Typ
(Note 5)
LMC6574AI LMC6574BI Units
LMC6572AI LMC6572BI
Limit Limit
(Note 6) (Note 6)
SR Slew Rate V
+
= 2.7V and 3V 90 30 30 V/ms
(Note 8) 10 10 Min
GBW Gain-Bandwidth Product V
+
= 3V 0.22 MHz
φ
m
Phase Margin 60 Deg
G
m
Gain Margin 12 dB
Amp-to-Amp Isolation (Note 9) 120 dB
e
n
Input-Referred F = 1 kHz 45 nV/Hz
Voltage Noise V
CM
=1V
i
n
Input-Referred F = 1 kHz 0.002 pA/Hz
LMC6572/LMC6574
www.national.com3
2.7V AC Electrical Characteristics (Continued)
Unless otherwise specified, all limits guaranteed for T
J
= 25˚C, V
+
= 2.7V, V
= 0V, V
CM
=V
O
=V
+
/2 and R
L
>1M.Bold-
face limits apply at the temperature extremes.
Symbol Parameter Conditions Typ
(Note 5)
LMC6574AI LMC6574BI Units
LMC6572AI LMC6572BI
Limit Limit
(Note 6) (Note 6)
Current Noise
T.H.D. Total Harmonic Distortion F = 10 kHz, A
V
= −2 0.05 %
R
L
=10k,V
O
= 1.0 V
PP
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.
Note 2: Human body model, 1.5 kin series with 100 pF.
Note 3: Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the
maximum allowed junction temperature of 150˚C.
Note 4: The maximum power dissipation is a function of TJ(Max),θJA, and TA. The maximum allowable power dissipation at any ambient temperature is
PD=(T
J(Max) −T
A)/θJA. All numbers apply for packages soldered directly into a PC board.
Note 5: Typical values represent the most likely parametric norm.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: V+=3V,V
CM = 1.5V and RLconnected to 1.5V. For Sourcing tests, 1.5V VO2.5V. For Sinking tests, 0.5V VO1.5V.
Note 8: Connected as Voltage Follower with 1.0V step input. Number specified is the slower of the positive and negative slew rates.
Note 9: Input referred, V+= 3V and RL= 100 kconnected to 1.5V. Each amp excited in turn with 1 KHz to produce VO=2V
PP.
Typical Performance Characteristics
V
S
= +3V, T
A
= 25˚C, Unless otherwise specified
Supply Current vs
Supply Voltage (Dual Package)
Input Current vs
Temperature
01193418 01193419
Sourcing Current vs
Output Voltage
Sinking Current vs
Output Voltage
01193420 01193421
LMC6572/LMC6574
www.national.com 4
Typical Performance Characteristics V
S
= +3V, T
A
= 25˚C, Unless otherwise specified (Continued)
Output Voltage Swing vs
Supply Voltage
Input Voltage Noise vs
Frequency
01193422
01193423
Crosstalk Rejection vs
Frequency
Positive PSRR vs
Frequency
01193424 01193425
Negative PSRR vs
Frequency CMRR vs Frequency
01193426 01193427
LMC6572/LMC6574
www.national.com5
Typical Performance Characteristics V
S
= +3V, T
A
= 25˚C, Unless otherwise specified (Continued)
Input Voltage vs
Output Voltage (V
S
=±1.5)
Open Loop Frequency
Response
01193428 01193429
Open Loop Frequency
Response vs Temperature
Maximum Output Swing
vs Frequency
01193430 01193431
Z
OUT
vs Frequency
Slew Rate
vs Supply Voltage
01193432 01193433
LMC6572/LMC6574
www.national.com 6
Typical Performance Characteristics V
S
= +3V, T
A
= 25˚C, Unless otherwise specified (Continued)
Non-Inverting Large Signal
Pulse Response
Non-Inverting Small Signal
Pulse Response
01193434 01193435
Inverting Large Signal
Pulse Response
Inverting Small Signal
Pulse Response
01193436 01193437
Stability
vs Capacitive Load
Stability
vs Capacitive Load
01193438 01193439
LMC6572/LMC6574
www.national.com7
Typical Performance Characteristics V
S
= +3V, T
A
= 25˚C, Unless otherwise specified (Continued)
Stability
vs Capacitive Load
Stability
vs Capacitive Load
01193440 01193441
Bandwidth vs
Capacitive Load
Capacitive Load
vs Phase Margin
01193444 01193445
Capacitive Load
vs Gain Margin
01193446
Applications Hints
1.0 LOW VOLTAGE AMPLIFIER TOPOLOGY
The LMC6574/2 incorporates a novel op-amp design topol-
ogy that enables it to maintain rail-to-rail output swing even
when driving a large load. Instead of relying on a push-pull
unity gain output buffer stage, the output stage is taken
directly from the internal integrator, which provides both low
output impedance and large gain. Special feed-forward com-
pensation design techniques are incorporated to maintain
stability over a wider range of operating conditions than
traditional micropower op-amps. These features make the
LMC6574/2 both easier to design with, and provide higher
speed than products typically found in this ultra-low power
class.
LMC6572/LMC6574
www.national.com 8
Applications Hints (Continued)
2.0 COMPENSATING FOR INPUT CAPACITANCE
It is quite common to use large values of feedback resis-
tance for amplifiers with ultra-low input current, like the
LMC6574/2.
Although the LMC6574/2 is highly stable over a wide range
of operating conditions, a large feedback resistor will react
even with small values of capacitance at the input of the
op-amp to reduce phase margin. The capacitance at the
input of the op-amp comes from transducers, photodiodes
and circuit board parasitics.
The effect of input capacitance can be compensated for by
adding a capacitor, C
f
, around the feedback resistors (as in
Figure 1) such that:
or
R
1
C
IN
R
2
C
f
Since it is often difficult to know the exact value of C
IN
,C
f
can
be experimentally adjusted so that the desired pulse re-
sponse is achieved. Refer to the LMC660 and LMC662 for a
more detailed discussion on compensating for input capaci-
tance.
When high input impedances are demanded, guarding of the
LMC6574/2 is suggested. Guarding input lines will not only
reduce leakage, but lowers stray input capacitance as well.
(See Printed-Circuit-Board Layout for High Impedance
Work).
3.0 CAPACITIVE LOAD TOLERANCE
Direct capacitive loading will reduce the phase margin of
many op-amps. A pole in the feedback loop is created by the
combination of the op-amp’s output impedance and the ca-
pacitive load. This pole induces phase lag at the unity-gain
crossover frequency of the amplifier resulting in either an
oscillatory or underdamped pulse response. With a few ex-
ternal components, op amps can easily indirectly drive ca-
pacitive loads, as shown in Figure 2.
In the circuit of Figure 2, R1 and C1 serve to counteract the
loss of phase margin by feeding the high frequency compo-
nent of the output signal back to the amplifier’s inverting
input, thereby preserving phase margin in the overall feed-
back loop.
4.0 PRINTED-CIRCUIT-BOARD LAYOUT
FOR HIGH-IMPEDANCE WORK
It is generally recognized that any circuit which must operate
with less than 1000 pA of leakage current requires special
layout of the PC board. When one wishes to take advantage
of the ultra-low bias current of the LMC6574/2, typically less
than 20 fA, it is essential to have an excellent layout. Fortu-
nately, the techniques of obtaining low leakages are quite
simple. First, the user must not ignore the surface leakage of
the PC board, even though it may sometimes appear accept-
ably low, because under conditions of high humidity or dust
or contamination, the surface leakage will be appreciable.
To minimize the effect of any surface leakage, lay out a ring
of foil completely surrounding the LMC6574/2’s inputs and
the terminals of capacitors, diodes, conductors, resistors,
relay terminals, etc. connected to the op-amp’s inputs, as in
Figure 3. To have a significant effect, guard rings should be
placed on both the top and bottom of the PC board. This PC
foil must then be connected to a voltage which is at the same
voltage as the amplifier inputs, since no leakage current can
flow between two points at the same potential. For example,
a PC board trace-to-pad resistance of 10
12
, which is nor-
mally considered a very large resistance, could leak 5 pA if
the trace were a 5V bus adjacent to the pad of the input. This
would cause a 250 times degradation from the LMC6574/2’s
actual performance. However, if a guard ring is held within
5 mV of the inputs, then even a resistance of 10
11
would
cause only 0.05 pA of leakage current. See Figure 4 for
typical connections of guard rings for standard op-amp con-
figurations.
01193406
FIGURE 1. Cancelling the Effect of Input Capacitance
01193407
FIGURE 2. LMC6574/2 Noninverting Gain of 10
Amplifier, Compensated to Handle Capacitive Loads
LMC6572/LMC6574
www.national.com9
Applications Hints (Continued)
The designer should be aware that when it is inappropriate
to lay out a PC board for the sake of just a few circuits, there
is another technique which is even better than a guard ring
on a PC board: Don’t insert the amplifier’s input pin into the
board at all, but bend it up in the air and use only air as an
insulator. Air is an excellent insulator. In this case you may
have to forego some of the advantages of PC board con-
struction, but the advantages are sometimes well worth the
effort of using point-to-point up-in-the-air wiring. See Figure
5.
5.0 SPICE MACROMODEL
A spice macromodel is available for the LMC6574/2. This
model includes accurate simulation of:
input common-mode voltage range
frequency and transient response
GBW dependence on loading conditions
quiescent and dynamic supply current
output swing dependence on loading conditions
and many more characteristics as listed on the macromodel
disk.
Contact your local National Semiconductor sales office to
obtain an operational amplifier spice model library disk.
Typical Single-Supply Applications
01193408
FIGURE 3. Example of Guard Ring in P.C. Board
Layout
01193409
Inverting Amplifier
01193410
Non-Inverting Amplifier
01193411
Follower
FIGURE 4. Typical Connections of Guard Rings
01193412
(Input pins are lifted out of PC board and soldered directly to components.
All other pins connected to PC board).
FIGURE 5. Air Wiring
01193413
FIGURE 6. Low-Power Two-Op-Amp
Instrumentation Amplifier
01193414
FIGURE 7. Sample and Hold
LMC6572/LMC6574
www.national.com 10
Typical Single-Supply Applications
(Continued)
Ordering Information
Package Temperature Range NSC Drawing Transport
Industrial, −40˚C to +85˚C Media
8-Pin Molded DIP LMC6572AIN, LMC6572BIN N08E Rail
8-Pin Small Outline LMC6572AIM, LMC6572BIM M08A Rail
LMC6572AIMX, LMC6572BIMX Tape and Reel
8-Pin Mini SO LMC6572BIMM MUA08A Rail
LMC6572BIMMX Tape and Reel
14-Pin Molded DIP LMC6574AIN, LMC6574BIN N14A Rail
14-Pin Small Outline LMC6574AIM, LMC6574BIM M14A Rail
LMC6574AIMX, LMC6574BIMX Tape and Reel
01193415
FIGURE 8. 1 Hz Square Wave Oscillator
01193416
FIGURE 9. Adder/Subtractor Circuit
01193417
FIGURE 10. Low Pass Filter
LMC6572/LMC6574
www.national.com11
Physical Dimensions inches (millimeters) unless otherwise noted
8-Pin Small Outline Package
Order Package Number LMC6572AIM, LMC6572AIMX, LMC6572BIM or LMC6572BIMX
NS Package Number M08A
14-Pin Small Outline Package
Order Package Number LMC6574AIM, LMC6574AIMX, LMC6574BIM or LMC6574BIMX
NS Package Number M14A
LMC6572/LMC6574
www.national.com 12
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
8-Lead Mini-Small Outline Molded Package, JEDEC
Order Number LMC6572BIMM or LMC6572BIMMX
NS Package Number MUA08A
8-Pin Molded Dual-In-Line Package
Order Number LMC6572AIN or LMC6572BIN
NS Package Number N08E
LMC6572/LMC6574
www.national.com13
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Pin Molded Dual-In-Line Package
Order Number LMC6574AIN or LMC6574BIN
NS Package Number N14A
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products Stewardship
Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain no ‘‘Banned
Substances’’ as defined in CSP-9-111S2.
National Semiconductor
Americas Customer
Support Center
Email: new.feedback@nsc.com
Tel: 1-800-272-9959
National Semiconductor
Europe Customer Support Center
Fax: +49 (0) 180-530 85 86
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
National Semiconductor
Asia Pacific Customer
Support Center
Email: ap.support@nsc.com
National Semiconductor
Japan Customer Support Center
Fax: 81-3-5639-7507
Email: jpn.feedback@nsc.com
Tel: 81-3-5639-7560
www.national.com
LMC6572/LMC6574 Dual and Quad Low Voltage (2.7V and 3V) Operational Amplifier
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic."Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Communications and Telecom www.ti.com/communications
Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers
Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps
DLP®Products www.dlp.com Energy and Lighting www.ti.com/energy
DSP dsp.ti.com Industrial www.ti.com/industrial
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Security www.ti.com/security
Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright ©2011, Texas Instruments Incorporated