SN74LVC07A
www.ti.com
SCAS595T –OCTOBER 1997–REVISED FEBRUARY 2011
HEX BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
Check for Samples: SN74LVC07A
1FEATURES
•Operates From 1.65 V to 5 V •Max tpd of 2.6 ns at 5 V
•Inputs and Open-Drain Outputs Accept •Latch-Up Performance Exceeds 250 mA Per
Voltages up to 5.5 V JESD 17
DESCRIPTION/ORDERING INFORMATION
This hex buffer/driver is designed for 1.65-V to 5.5-V VCC operation.
The outputs of the SN74LVC07A device are open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 24 mA.
Inputs can be driven from 1.8-V, 2.5-V, 3.3-V (LVTTL), or 5-V (CMOS) devices. This feature allows the use of
this device as translators in a mixed-system environment.
ORDERING INFORMATION
TAPACKAGE(1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING
QFN –RGY Reel of 1000 SN74LVC07ARGYR LC07A
Tube of 50 SN74LVC07AD
SOIC –D Reel of 2500 SN74LVC07ADRG3 LVC07A
Reel of 250 SN74LVC07ADT
SOP –NS Reel of 2000 SN74LVC07ANSR LVC07A
–40°C to 85°CSSOP –DB Reel of 2000 SN74LVC07ADBR LC07A
Tube of 90 SN74LVC07APW
TSSOP –PW Reel of 2000 SN74LVC07APWRG3 LC07A
Reel of 250 SN74LVC07APWT
TVSOP –DGV Reel of 2000 SN74LVC07ADGVR LC07A
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. ©1997–2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
A Y
SN74LVC07A
SCAS595T –OCTOBER 1997–REVISED FEBRUARY 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
FUNCTION TABLE
(EACH BUFFER/DRIVER)
INPUT OUTPUT
A Y
H H
L L
LOGIC DIAGRAM, EACH BUFFER/DRIVER (POSITIVE LOGIC)
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC Supply voltage range –0.5 6.5 V
VIInput voltage range(2) –0.5 6.5 V
VOOutput voltage range –0.5 6.5 V
IIK Input clamp current VI<0–50 mA
IOK Output clamp current VO<0–50 mA
IOContinuous output current ±50 mA
Continuous current through VCC or GND ±100 mA
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions"is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
THERMAL INFORMATION SN74LVC07A
THERMAL METRIC(1) (14) PINS UNITS
D DB DGV NS PW RGY
θJA Junction-to-ambient thermal resistance 120.8 135.1 157.7 120.3 151.5 79.4
θJCtop Junction-to-case (top) thermal resistance 79.7 86.7 78.3 76.3 77.6 95.7
θJB Junction-to-board thermal resistance 75.1 82.4 90.8 79 92.3 55.4 °C/W
ψJT Junction-to-top characterization parameter 37.2 43.7 21 36.2 21 16.4
ψJB Junction-to-board characterization parameter 74.8 81.9 90.1 78.7 92.7 55.6
θJCbot Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a n/a 34.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2Submit Documentation Feedback ©1997–2011, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC07A
SN74LVC07A
www.ti.com
SCAS595T –OCTOBER 1997–REVISED FEBRUARY 2011
RECOMMENDED OPERATING CONDITIONS(1)
MIN MAX UNIT
VCC Supply voltage 1.65 5.5 V
VCC = 1.65 V to 1.95 V 0.65 ×VCC
VCC = 2.3 V to 2.7 V 1.7
VIH High-level input voltage V
VCC = 2.7 V to 3.6 V 2
VCC = 4.5 V to 5.5 V 0.7 ×VCC
VCC = 1.65 V to 1.95 V 0.35 ×VCC
VCC = 2.3 V to 2.7 V 0.7
VIL Low-level input voltage V
VCC = 2.7 V to 3.6 V 0.8
VCC = 4.5 V to 5.5 V 0.3 ×VCC
VIInput voltage 0 5.5 V
VOOutput voltage 0 5.5 V
VCC = 1.65 V 4
VCC = 2.3 V 12
IOL Low-level output current VCC = 2.7 V 12 mA
VCC = 3 V 24
VCC = 4.5 V 24
TAOperating free-air temperature –40 85 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP(1) MAX UNIT
IOL = 100 μA 1.65 V to 5.5 V 0.2
IOL = 4 mA 1.65 V 0.45
VOL 2.3 V 0.7 V
IOL = 12 mA 2.7 V 0.4
IOL = 24 mA 3 V 0.55
IIVI= 5.5 V or GND 3.6 V ±5μA
Ioff VIor VO= 5.5 V 0 V ±10 μA
ICC VI= VCC or GND, IO= 0 3.6 V 10 μA
ΔICC One input at VCC –0.6 V, Other inputs at VCC or GND 2.7 V to 3.6 V 500 μA
CiVI= VCC or GND 3.3 V 5 pF
(1) All typical values are at VCC = 3.3 V, TA= 25°C.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 through Figure 4)
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V
VCC = 2.7 V
FROM TO ±0.15 V ±0.2 V ±0.3 V ±0.5 V
PARAMETER UNIT
(INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX MIN MAX
tpd A Y 1 5.6 1 3.4 3.3 1 3.6 1 2.6 ns
OPERATING CHARACTERISTICS
TA= 25°CVCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V
TEST
PARAMETER UNIT
CONDITIONS TYP TYP TYP TYP
Power dissipation capacitance
Cpd f = 10 MHz 1.8 2 2.5 3.78 pF
per buffer/driver
©1997–2011, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): SN74LVC07A
tPZL (see Note F)
tPLZ (see Note G)
tPHZ/tPZH
2 × VCC
2 × VCC
2 × VCC
TEST S1
VCC/2
VCC/2
VCC/2VCC/2
VCC/2VCC/2
VCC/2
VCC/2
VCC
VOL
th
tsu
From Output
Under Test
CL = 30 pF
(see Note A)
LOAD CIRCUIT
S1 Open
GND
1 kΩ
1 kΩ
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
Output
Waveform 2
S1 at 2 × VCC
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
0 V
VOL + 0.15 V
VCC − 0.15 V
0 V
VCC
0 V
0 V
tw
VCC VCC
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Timing
Input
Data
Input
Input
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at VCC/2.
G. tPLZ is measured at VOL + 0.15 V.
H. All parameters and waveforms are not applicable to all devices.
0 V
VCC
VCC/2
tPHL
VCC/2 VCC/2 VCC
0 V
VCC
VOL
Input
Output
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VCC/2 VCC/2
tPLH
2 × VCC
VCC
SN74LVC07A
SCAS595T –OCTOBER 1997–REVISED FEBRUARY 2011
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC = 1.8 V ±0.15 V
Figure 1. Load Circuit and Voltage Waveforms
4Submit Documentation Feedback ©1997–2011, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC07A
tPZL (see Note F)
tPLZ (see Note G)
tPHZ/tPZH
2 × VCC
2 × VCC
2 × VCC
TEST S1
VCC/2
VCC/2
VCC/2VCC/2
VCC/2VCC/2
VCC/2
VCC/2
VCC
VOL
th
tsu
From Output
Under Test
CL = 30 pF
(see Note A)
LOAD CIRCUIT
S1 Open
GND
500 Ω
500 Ω
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
Output
Waveform 2
S1 at 2 × VCC
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
0 V
VOL + 0.15 V
VCC − 0.15 V
0 V
VCC
0 V
0 V
tw
VCC VCC
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Timing
Input
Data
Input
Input
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at VCC/2.
G. tPLZ is measured at VOL + 0.15 V.
H. All parameters and waveforms are not applicable to all devices.
0 V
VCC
VCC/2
tPHL
VCC/2 VCC/2 VCC
0 V
VCC
VOL
Input
Output
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VCC/2 VCC/2
tPLH
2 × VCC
VCC
SN74LVC07A
www.ti.com
SCAS595T –OCTOBER 1997–REVISED FEBRUARY 2011
PARAMETER MEASUREMENT INFORMATION
VCC = 2.5 V ±0.2 V
Figure 2. Load Circuit and Voltage Waveforms
©1997–2011, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): SN74LVC07A
1.5 V
1.5 V
1.5 V1.5 V
1.5 V1.5 V
1.5 V
1.5 V
3 V
VOL
th
tsu
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1 Open
GND
500 Ω
500 Ω
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 6 V
(see Note B)
Output
Waveform 2
S1 at 6 V
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
0 V
VOL + 0.3 V
2.7 V
0 V
2.7 V
0 V
0 V
tw
2.7 V 2.7 V
3 V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Timing
Input
Data
Input
Input
tPZL (see Note F)
tPLZ (see Note G)
tPHZ/tPZH
6 V
6 V
6 V
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd.
F. tPZL is measured at 1.5 V.
G. tPLZ is measured at VOL + 0.3 V.
H. All parameters and waveforms are not applicable to all devices.
6 V
0 V
2.7 V
1.5 V
tPHL
1.5 V 1.5 V 2.7 V
0 V
3 V
VOL
Input
Output
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
1.5 V 1.5 V
tPLH
SN74LVC07A
SCAS595T –OCTOBER 1997–REVISED FEBRUARY 2011
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC = 2.7 and 3.3 V ±0.3 V
Figure 3. Load Circuit and Voltage Waveforms
6Submit Documentation Feedback ©1997–2011, Texas Instruments Incorporated
Product Folder Link(s): SN74LVC07A
500 Ω
500 Ω
2xVCC
NOTES: A. CLincludesprobeandjigcapacitance.
B. Waveform1isforanoutputwithinternalconnectionssuchthattheoutputislow,exceptwhendisabledbytheoutputcontrol.
Waveform2isforanoutputwithinternalconnectionssuchthattheoutputishigh,exceptwhendisabledbytheoutputcontrol.
C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR 10MHz,Z =50 ,t 2.5ns,t
t t t
t V
t V
≤Ω≤ ≤ 2.5ns.
D. Theoutputsaremeasuredoneatatime,withonetransitionpermeasurement.
E. Sincethisdevicehasopen-drainoutputs, and arethesameas .
F. ismeasuredat /2.
G. ismeasuredat +0.3V.
H.Allparametersandwaveformsarenotapplicabletoalldevices.
O r f
PLZ PZL pd
PZL CC
PLZ OL
Output
Waveform2
S1at2xVCC
(seeNoteB)
Output
Waveform1
S1at2xVCC
(seeNoteB)
2xVCC
2xVCC
2xVCC
0.3V
SN74LVC07A
www.ti.com
SCAS595T –OCTOBER 1997–REVISED FEBRUARY 2011
PARAMETER MEASUREMENT INFORMATION
VCC = 5 V ±0.5 V
Figure 4. Load Circuit and Voltage Waveforms
©1997–2011, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): SN74LVC07A
PACKAGE OPTION ADDENDUM
www.ti.com 20-Jan-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74LVC07AD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
SN74LVC07ADBR ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
SN74LVC07ADBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
SN74LVC07ADE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
SN74LVC07ADG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
SN74LVC07ADGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
SN74LVC07ADGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
SN74LVC07ADGVRG4 ACTIVE TVSOP DGV 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
SN74LVC07ADR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
SN74LVC07ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
SN74LVC07ADRG3 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM Request Free Samples
SN74LVC07ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
SN74LVC07ADT ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
SN74LVC07ADTE4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
SN74LVC07ADTG4 ACTIVE SOIC D 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
SN74LVC07ANSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
SN74LVC07ANSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
PACKAGE OPTION ADDENDUM
www.ti.com 20-Jan-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74LVC07ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
SN74LVC07APW ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
SN74LVC07APWE4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
SN74LVC07APWG4 ACTIVE TSSOP PW 14 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
SN74LVC07APWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI Samples Not Available
SN74LVC07APWR ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
SN74LVC07APWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
SN74LVC07APWRG3 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM Request Free Samples
SN74LVC07APWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor
or Sales Office
SN74LVC07APWT ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
SN74LVC07APWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
SN74LVC07APWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Purchase Samples
SN74LVC07ARGYR ACTIVE VQFN RGY 14 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples
SN74LVC07ARGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Request Free Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
PACKAGE OPTION ADDENDUM
www.ti.com 20-Jan-2011
Addendum-Page 3
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC07A :
•Automotive: SN74LVC07A-Q1
•Enhanced Product: SN74LVC07A-EP
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LVC07ADBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74LVC07ADGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
SN74LVC07ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LVC07ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LVC07ADRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LVC07ADRG4 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LVC07ADT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LVC07ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74LVC07APWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74LVC07APWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
SN74LVC07APWRG3 TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
SN74LVC07APWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74LVC07APWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74LVC07ARGYR VQFN RGY 14 3000 330.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC07ADBR SSOP DB 14 2000 367.0 367.0 38.0
SN74LVC07ADGVR TVSOP DGV 14 2000 367.0 367.0 35.0
SN74LVC07ADR SOIC D 14 2500 367.0 367.0 38.0
SN74LVC07ADR SOIC D 14 2500 333.2 345.9 28.6
SN74LVC07ADRG4 SOIC D 14 2500 333.2 345.9 28.6
SN74LVC07ADRG4 SOIC D 14 2500 367.0 367.0 38.0
SN74LVC07ADT SOIC D 14 250 367.0 367.0 38.0
SN74LVC07ANSR SO NS 14 2000 367.0 367.0 38.0
SN74LVC07APWR TSSOP PW 14 2000 367.0 367.0 35.0
SN74LVC07APWR TSSOP PW 14 2000 364.0 364.0 27.0
SN74LVC07APWRG3 TSSOP PW 14 2000 364.0 364.0 27.0
SN74LVC07APWRG4 TSSOP PW 14 2000 367.0 367.0 35.0
SN74LVC07APWT TSSOP PW 14 250 367.0 367.0 35.0
SN74LVC07ARGYR VQFN RGY 14 3000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated