INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC2017N-R03 1
CPC2017N
Dual Normally Open
8-Pin SOIC OptoMOS® Relay
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Part # Description
CPC2017N 8-Pin SOIC (50/tube)
CPC2017NTR 8-Pin SOIC (2000/reel)
Parameter Rating Units
Blocking Voltage 60 VP
Load Current 120 mArms / mADC
On-Resistance (max) 16
LED Current to operate 1 mA
Applications
Features
Description
Ordering Information
Pin Configuration
• Security
• Passive Infrared Detectors (PIR)
• Data Signalling
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
• Industrial Controls
• Designed for use in Security Systems Complying
with EN50130-4
• 1500Vrms Input/Output Isolation
• TTL/CMOS Compatible Input
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Immune to Radiated EM Fields
• SMD Pick & Place, Wave Solderable
• Tape & Reel Version Available
• Small 8-Pin SOIC Package
The CPC2017N is a miniature device with two
independent 1-Form-A solid state relays in an
8-Pin SOIC package that employs optically coupled
MOSFET technology to provide 1500Vrms of
input/output isolation.
Optically coupled outputs that use the patented
OptoMOS architecture are controlled by a highly
efficient GaAIAs infrared LED.
The CPC2017N uses IXYS Integrated Circuits
Division’s state of the art, double-molded, vertical
construction packaging to produce one of the world’s
smallest relays. The CPC2017N offers substantial
board space savings over the competitor’s larger 8-Pin
SOIC relay.
Switching Characteristics
of Normally Open (Form A) Devices
Approvals
• UL Certified Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
Form-A
IF
ILOAD
10%
90%
ton toff
+ Control
– Control
Load
Load
1
2
3
4
7
8
5
6
+ Control
– Control
Load
Load
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2R03
CPC2017N
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25°C
Parameter Ratings Units
Blocking Voltage 60 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Total Power Dissipation 1600 mW
Isolation Voltage, Input to Output 1500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 5mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1IF=1mA IL- - 120 mArms / mADC
Peak t =10ms ILPK - - ±350 mAP
On-Resistance 2IL=120mA RON - 7.1 16
Off-State Leakage Current VL=60VPILEAK --1 µA
Switching Speeds
Turn-On IF=5mA, VL=10V ton - 1.25 3 ms
Turn-Off toff - 0.45 3
Output Capacitance VL=50V, f=1MHz COUT -25 - pF
Capacitance Input to Output - --1 - pF
Input Characteristics
Input Control Current to Activate 3IL=120mA IF- 0.40 1 mA
Input Control Current to Deactivate - IF0.1 0.35 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR- - 10 µA
1 Load current derates linearly from 120mA @ 25oC to 60mA @80oC, and must be derated for both poles operating simultaneously.
2 Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (greater than 60oC) a LED drive current of 3mA is recommended.
Electrical Characteristics @ 25°C
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CPC2017N
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R03
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
1.0 1.2 1.4 1.61.1 1.3 1.5
Turn-On (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IF=5mA, IL=120mA, TA=25ºC)
0.26 0.30 0.34 0.380.360.320.28
Turn-Off (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mA, TA=25ºC)
0.35 0.45 0.550.30 0.40 0.50 0.60
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Operation
(N=50, IL=120mA, TA=25ºC)
25
20
15
10
5
0
0.35 0.45 0.550.30 0.40 0.50 0.60
LED Current (mA)
Device Count (N)
Typical IF for Switch Dropout
(N=50, IL=120mA, TA=25ºC)
35
30
25
20
15
10
5
0
On-Resistance (:)
Device Count (N)
6.8 6.9 7.17.0 7.47.2 7.3
Typical On-Resistance Distribution
(N=50, IF=1mA, IL=120mA, TA=25ºC)
35
30
25
20
15
10
5
0
80 84 88 9282 86 90
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage Drop (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=1mA
IF=2mA
IF=5mA
IF=10mA
IF=20mA
IF=50mA
LED Forward Current (mA)
Turn-On (ms)
05 1015202530354045
3.0
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0
50
Typical Turn-On
vs. LED Forward Current
(IL=120mA)
LED Forward Current (mA)
Turn-Off (ms)
05 1015202530354045
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
Typical Turn-Off
vs. LED Forward Current
(IL=120mA)
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4R03
CPC2017N
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
Typical IF for Switch Operation
vs. Temperature
(IL=60mA)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC) Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On (ms)
1.0
1.5
2.0
2.5
3.0
3.5
Typical Turn-On vs. Temperature
(IL=50mA)
IF=2mA
IF=5mA
Turn-Off (ms)
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100
Typical Turn-Off vs. Temperature
(IL=50mA)
Temperature (ºC)
I
F
=5mA
I
F
=2mA
-40
14
12
10
8
6
4
-20 0 20 40 60 80 100
2
Steady State
Instantaneous
IF=5mA
IF=5mA
IF=2mA
Temperature (ºC)
On-Resistance (:)
Typical On-Resistance vs. Temperature
(IL=60mA)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-1.5 -1.0 -0.5 0 0.5 1.0 1.5
Typical Load Current vs. Load Voltage
(IF=1mA, TA=25ºC)
Blocking Voltage (VP)
-40
91
89
87
85
83
81
79
77
-20 0 20 40 60 80 100
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Leakage (PA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
(Measured Across Pins 3 & 4)
(VL=60V)
Temperature (ºC) Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (A)
0.0
0.2
0.4
0.6
0.8
1.0
Energy Rating Curve
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
60
70
80
90
100
110
120
130
Maximum Load Current vs. Temperature
(IF=2mA)
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CPC2017N
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R03
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC2017N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC2017N 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC2017N-R03
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/17/2012
For additional information please visit our website at: www.ixysic.com
6
CPC2017N
MECHANICAL DIMENSIONS
CPC2017N
CPC2017N Tape & Reel
Dimensions
mm
(inches)
PCB Land Pattern
2.184 MAX
(0.086 MAX)
0.838 ± 0.102
(0.033 ± 0.004) 0.381 ± 0.051
(0.015 ± 0.002)
Lead to Package Standoff
MIN 0.0254 (0.001)
(MAX 0.102 (0.004)
0.432 ± 0.127
(0.017 ± 0.005)
0.203 ± 0.025
(0.008 ± 0.001)
1.016 ± 0.025
(0.040 ± 0.001)
5.60
(0.22)
1.30
(0.051)
0.55
(0.022)
2.54
(0.100)
9.347 ± 0.203
(0.368 ± 0.008)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.051
(0.150 ± 0.002)
2.540 TYP
(0.100 TYP)
Pin 1
NOTES:
1. All dimensions in millimeters
2. 10 sprocket hole pitch cumulative tolerance ± 0.20.
3. Carrier camber is within 1mm in 250mm.
4. Tape material : Black Conductive Polystyrene Alloy.
5. All dimensions meet EIA-481-C requirements.
6. Thickness : 0.30 ± 0.05mm.
7. Component load per 13” reel : 2000 pcs.
7.50 ± 0.10
16.00 ± 0.30
1.75 ± 0.10 8.00 ± 0.104.00 ± 0.10
2.00 ± 0.10
9.65 ± 0.106.50
1.20
2.85 ± 0.10
2.35 ± 0.10
6.55 ± 0.10
3.50
Ø1.50
+0.1, -0
Ø1.50 MIN
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
Mouser Electronics
Authorized Distributor
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CPC2017NTR