MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Low Supply Voltage Range 2.5 V – 5.5 V
D
Ultra Low-Power Consumption
D
Low Operation Current, 400 µA at 1 MHz,
3V
D
Five Power Saving Modes: (Standby Mode:
1.3 µA, RAM Retention/Off Mode: 0.1 µA)
D
Wakeup From Standby Mode in 6 µs
Maximum
D
16-Bit RISC Architecture, 300 ns Instruction
Cycle Time
D
Single Common 32 kHz Crystal, Internal
System Clock up to 3.3 MHz
D
Integrated LCD Driver for up to 64 or 92
Segments
D
Slope A/D Converter With External
Components
D
Serial Onboard Programming
D
Program Code Protection by Security Fuse
D
Family Members Include:
MSP430C311S: 2k Byte ROM,128 Byte RAM
MSP430C312: 4k Byte ROM, 256 Byte RAM
MSP430C313: 8k Byte ROM, 256 Byte RAM
MSP430C314: 12k Byte ROM, 512 Byte RAM
MSP430C315: 16k Byte ROM, 512 Byte RAM
MSP430P313: 8k Byte OTP, 256 Byte RAM†
MSP430P315: 16k Byte OTP, 512 Byte RAM
MSP430P315S: 16k Byte OTP, 512 ByteRAM
D
EPROM Version Available for Prototyping :
PMS430E313FZ†, PMS430E315FZ
D
Available in:
56-Pin Plastic Small-Outline Package
(SSOP),
48-Pin SSOP (MSP430C311S,
MSP430P315S),
68-Pin J-Leaded Ceramic Chip Carrier
(JLCC) Package (EPROM Only)
description
The MSP430 is an ultralow-power mixed signal microcontroller family consisting of several devices that feature
different sets of modules targeted to various applications. The microcontroller is designed to be battery operated
for an extended application lifetime. With 16-bit RISC architecture, 16-bit integrated registers on the CPU, and
a constant generator, the MSP430 achieves maximum code efficiency. The digitally-controlled oscillator,
together with the frequency-locked-loop (FLL), provides a wakeup from a low-power mode to active mode in
less than 6
m
s.
†MSP430P313/E313 not recommended for new designs – replaced by MSP430P315/E315.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
NC – No internal connection
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
TDO/TDI
TDI/VPP
TMS
TCK
RST/NMI
XBUF
VSS
VCC
R23
R13
Xin
Xout/TCLK
P0.0
P0.1/RXD
P0.2/TXD
P0.3
P0.4
P0.5
P0.6
P0.7
TP0.0
TP0.1
TP0.2
TP0.3
TP0.4
TP0.5
CIN
NC
NC
COM3
COM2
COM1
COM0
S27/O27/CMPI
S26/O26
S23/O23
S22/O22
S18/O18
S17/O17
S16/O16
S15/O15
S14/O14
S13/O13
S12/O12
S11/O11
S10/O10
S9/O9
S8/O8
S7/O7
S6/O6
S5/O5
S4/O4
S3/O3
S2/O2
S1
S0
DL PACKAGE
(56-PIN TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
TDI/VPP
TMS
TCK
RST/NMI
XBUF
VSS
VCC
R23
R13
Xin
Xout/TCLK
P0.1/RXD
P0.2/TXD
P0.3
P0.4
P0.5
P0.6
NC
TP0.0
TP0.1
TP0.2
TP0.3
TP0.5
CIN
TDO/TDI
COM3
COM2
COM1
COM0
S27/O27/CMPI
NC
VSS
NC
S16/O16
S15/O15
S14/O14
S13/O13
S12/O12
S11/O11
S10/O10
S9/O9
S8/O8
S7/O7
S6/O6
S5/O5
S4/O4
S3/O3
S2/O2
DL PACKAGE
(48-PIN TOP VIEW)
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
description (continued)
T ypical applications include sensor systems that capture analog signals, converting them to digital values, and
then processes the data and displays them or transmits them to a host system. The timer/port module provides
single-slope A/D conversion capability for resistive sensors.
AVAILABLE OPTIONS
PACKAGED DEVICES
TASSOP
48-Pin
(DL)
SSOP
56-Pin
(DL)
JLCC
68-Pin
(FZ)
40
°
Cto85
°
C
MSP430C311SIDL
MSP430C312IDL
MSP430C313IDL
MSP430C314IDL
–
40°C
to
85°C
MSP430P315SIDL MSP430C315IDL
MSP430P313IDL†
MSP430P315IDL
25
°
C
PMS430E313FZ
†
25°C
— — PMS430E315FZ
†MSP430P313/E313 not recommended for new designs – replaced by MSP430P315/E315.
functional block diagram
MSP430C312,313,314,315 and MSP430P313†,315 and PMS430E313,315
Oscillator
FLL
System Clock
ACLK
MCLK
4/8/12/16 kB
ROM
8/16 kB
C: ROM
256/512 B
RAM Power-On-
Reset 8-Bit Timer/
Counter
Serial Protocol
I/O Port
8 I/O’s, All With
Interr. Cap.
3 Int. Vectors
CPU
Incl. 16 Reg. Test
JTAG
Bus
Conv
Timer/Port
Applications:
Timer, O/P
Basic LCD
92 Segments
1, 2, 3, 4 MUX
Timer1
Watchdog
Timer
15/16 Bit
MAB, 16 Bit
MDB, 16 Bit
MAB, 4 Bit
MDB, 8 Bit
MCB
5
LCD
f
CMPI
TP0.0–4CIN
XIN Xout XBUF RST/NMI P0.0–7
Com0–3
S0–18,22,23,26/
S27/O27/CMPI
R13 R23
TDI/VPP
TDO/TDI
TMS
TCK
TXD
P: OTP
A/D Conv.
Support RXD
OPT or EPROM
E: EPROM
8
TP0.5
O2–18,22,23,26
VCC VSS
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Terminal Functions
MSP430C312, MSP430C313†, MSP430C314, MSP430C315, MSP430P313†, MSP430P315
56-pin SSOP package
TERMINAL
I/O
DESCRIPTION
NAME NO.
I/O
DESCRIPTION
CIN 27 ICounter enable. CIN input enables counter (TPCNT1) (timer/port).
COM0–COM3 52–55 OCommon output pins. COM0–COM3 are used for LCD back planes.
P0.0 13 I/O General-purpose digital I/O pin
P0.1/RXD 14 I/O General-purpose digital I/O pin, receive data input port – 8-bit (timer/counter)
P0.2/TXD 15 I/O General-purpose digital I/O pin, transmit data output port – 8-bit (timer/counter)
P0.3–P0.7 16–20 I/O Five general-purpose digital I/O pins, bit 3–7
R23 9 I Input of second positive analog LCD level (V2) (LCD)
R13 10 IInput of third positive analog LCD level (V3 of V4) (LCD)
RST/NMI 5 I Reset input or nonmaskable interrupt input
S0 29 OSegment line S0 (LCD)
S1 30 OSegment line S1 (LCD)
S2/O2–S5/O5 31–34 OSegment lines (S2 to S5) or digital output port O2 to O5, group 1 (LCD)
S6/O6–S9/O9 35–38 OSegment lines (S6 to S9) or digital output port O6 to O9, group 2 (LCD)
S10/O10–S13/O13 39–42 OSegment lines (S10 to S13) or digital output port O10 to O13, group 3 (LCD)
S14/O14–S17/O17 43–46 OSegment lines (S14 to S17) or digital output port O14 to O17, group 4 (LCD)
S18/O18 47 OSegment line (S18) or digital output port O18 , group 5 (LCD)
S22/O22–S23/O23 48,49 OSegment lines (S22 to S23) or digital output port O22 to O23, group 6 (LCD)
S26/O26 50 OSegment line (S26) or digital output port O26, group 7 (LCD)
S27/O27/CMPI 51 I/O Segment line (S27) or digital output port O27 group 7, can be used as a comparator input port CMPI
(timer/port)
TCK 4 I Test clock. TCK is a clock input terminal for device programming and test.
TDI/VPP 2 I Test data input port. TDI/VPP is used as a data input terminal or an input for programming voltage.
TDO/TDI 1 I/O Test data output port. TDO/TDI is used as a data output terminal or as a data input during
programming.
TMS 3 I Test mode select. TMS is an input terminal for device programming and test.
TP0.0 21 O/Z General-purpose 3-state digital output port, bit 0 (timer/port)
TP0.1 22 O/Z General-purpose 3-state digital output port, bit 1 (timer/port)
TP0.2 23 O/Z General-purpose 3-state digital output port, bit 2 (timer/port)
TP0.3 24 O/Z General-purpose 3-state digital output port, bit 3( timer/port)
TP0.4 25 O/Z General-purpose 3-state digital output port, bit 4 (timer/port)
TP0.5 26 I/O/Z General-purpose 3-state digital I/O pin, bit 5 (timer/port)
VCC 8Supply voltage
VSS 7Ground reference
XBUF 6 O Clock signal output of system clock (MCLK) or crystal clock (ACLK)
Xin 11 IInput terminal of crystal oscillator
Xout/TCLK 12 I/O Output terminal of crystal oscillator or test clock input
†MSP430P313/E313 not recommended for new designs – replaced by MSP430P315/E315.
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
functional block diagram
MSP430C311S and MSP430P315S
P0.1–6
6
Oscillator
FLL
System Clock
ACLK
MCLK
2 kB
ROM
16 kB
C: ROM
128/512B
RAM Power-On-
Reset 8-bit Timer/
Counter
Serial Protocol
I/O Port
6 I/O’s, All With
Interr. Cap.
2 Int. Vectors
CPU
Incl. 16 Reg. Test
JTAG
Bus
Conv
Timer/Port
Applications:
Timer, O/P
Basic LCD
64 Segments
1, 2, 3, 4 MUX
Timer1
Watchdog
Timer
15/16 Bit
MAB, 16 Bit
MDB, 16 Bit
MAB, 4 Bit
MDB, 8 Bit
MCB
4
LCD
f
CMPI
TP0.0–3 CIN
XIN Xout XBUF RST/NMI
COM0–3
S2–16/O2–16
S27/O27/CMPI
R13 R23
TDI/VPP
TDO/TDI
TMS
TCK
TXD
P: OTP
A/D Conv.
Support RXD
OTP
TP0.5
VCC VSS
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Terminal Functions
MSP430C311S, MSP430P315S
48-pin SSOP package
TERMINAL
I/O
DESCRIPTION
NAME NO.
I/O
DESCRIPTION
CIN 24 ICounter enable. CIN input enables counter (TPCNT1) (timer/port).
COM0–COM3 44–47 OCommon output pins, COM0–COM3 are used for LCD back planes.
P0.1/RXD 12 I/O General-purpose digital I/O pin, receive data input port – 8-Bit (timer/counter)
P0.2/TXD 13 I/O General-purpose digital I/O pin, transmit data output port – 8-Bit (timer/counter)
P0.3 14 I/O General-purpose digital I/O pins, bit 3
P0.4 15 I/O General-purpose digital I/O pins, bit 4
P0.5 16 I/O General-purpose digital I/O pins, bit 5
P0.6 17 I/O General-purpose digital I/O pins, bit 6
R23 8 I Input of second positive analog LCD level (V2) (LCD)
R13 9 I Input of third positive analog LCD level (V3 of V4) (LCD)
RST/NMI 4 I Reset input or nonmaskable interrupt input
S2/O2–S5/O5 25–28 OSegment lines (S2 to S5) or digital output port O2 to O5, group 1 (LCD)
S6/O6–S9/O9 29–32 OSegment lines (S6 to S9) or digital output port O6 to O9, group 2 (LCD)
S10/O10–S13/O13 33–36 OSegment lines (S10 to S13) or digital output port O10 to O13, group 3 (LCD)
S14/O14–S16/O16 37–39 OSegment lines (S14 to S17) or digital output port O14 to O17, group 4 (LCD)
S27/O27/CMPI 43 I/O Segment line (S27) or digital output port O27 group 7, can be used as a comparator input port CMPI
(timer/port)
TCK 3 I Test clock. TCK is a clock input terminal for device programming and test.
TDI/VPP 1 I Test data input port. TDI/VPP is used as a data input terminal or an input for programming voltage.
TDO/TDI 48 I/O Test data output port. TDO/TDI is used as a data output terminal or as a data input during
programming.
TMS 2 I Test mode select. TMS is an input terminal for device programming and test.
TP0.0 19 O/Z General-purpose 3-state digital output port, bit 0 (timer/port)
TP0.1 20 O/Z General-purpose 3-state digital output port, bit 1 (timer/port)
TP0.2 21 O/Z General-purpose 3-state digital output port, bit 2 (timer/port)
TP0.3 22 O/Z General-purpose 3-state digital output port, bit 3 (timer/port)
TP0.5 23 I/O/Z General-purpose 3-state digital I/O pin, bit 5 (timer/port)
VCC 7Supply voltage
VSS 6, 41 Ground references
XBUF 5 O Clock signal output of system clock (MCLK) or crystal clock (ACLK)
Xin 10 IInput terminal of crystal oscillator
Xout/TCLK 11 I/O Output terminal of crystal oscillator or test clock input
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
short-form description
processing unit
The processing unit is based on a consistent and orthogonal designed CPU and instruction set. This design
structure results in a RISC-like architecture, highly transparent to the application development and
distinguishable by the ease of programming. All operations other than program-flow instructions are
consequently performed as register operations in conjunction with seven addressing modes for source and four
modes for destination operand.
CPU
Sixteen registers located inside the CPU provide
reduced instruction execution time. This reduces
a register-register operation execution time to one
cycle of the processor frequency.
Four registers are reserved for special use as a
program counter, a stack pointer, a status register,
and a constant generator. The remaining ones are
available as general-purpose registers.
Peripherals connected to the CPU using a data
address and control bus can be handled easily
with all instructions for memory manipulation.
instruction set
The instruction set for this register-register
architecture provides a powerful and easy-to-use
assembly language. The instruction set consists of 51 instructions with three formats and seven addressing
modes. Table 1 provides a summation and example of the three types of instruction formats; the addressing
modes are listed in Table 2.
Table 1. Instruction Word Formats
Dual operands, source-destination e.g. ADD R4, R5 R4 + R5 → R5
Single operands, destination only e.g. CALL R8 PC → (TOS), R8 → PC
Relative jump, un-/conditional e.g. JNE Jump-on equal bit = 0
Each instruction that operates on word and byte data is identified by the suffix B.
Examples: Instructions for word operation Instructions for byte operation
MOV EDE,TONI MOV.B EDE,TONI
ADD #235h,&MEM ADD.B #35h,&MEM
PUSH R5 PUSH.B R5
SWPB R5 —
Program Counter
General-Purpose Register
PC/R0
Stack Pointer SP/R1
Status Register SR/CG1/R2
Constant Generator CG2/R3
R4
General-Purpose Register R5
General-Purpose Register R14
General-Purpose Register R15
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Table 2. Address Mode Descriptions
ADDRESS MODE s d SYNTAX EXAMPLE OPERATION
Register √ √ MOV Rs, Rd MOV R10, R11 R10 → R11
Indexed √ √ MOV X(Rn), Y(Rm) MOV 2(R5), 6(R6) M(2 + R5) → M(6 + R6)
Symbolic (PC relative) √ √ MOV EDE, TONI M(EDE) → M(TONI)
Absolute √ √ MOV &MEM, &TCDAT M(MEM) → M(TCDAT)
Indirect √MOV @Rn, Y(Rm) MOV @R10, Tab(R6) M(R10) → M(Tab + R6)
Indirect autoincrement √MOV @Rn+, RM MOV @R10+, R11 M(R10) →R11, R10 + 2 → R10
Immediate √MOV #X, TONI MOV #45, TONI #45 → M(TONI)
NOTE: s = source d = destination
Computed branches (BR) and subroutine call (CALL) instructions use the same addressing modes as the other
instructions. These addressing modes provide
indirect
addressing, ideally suited for computed branches and
calls. The full use of this programming capability permits a program structure different from conventional 8- and
16-bit controllers. For example, numerous routines can easily be designed to deal with pointers and stacks
instead of using flag type programs for flow control.
operation modes and interrupts
The MSP430 operating modes support various advanced requirements for ultra low-power and ultra-low energy
consumption. This is achieved by the management of the operations during the different module operation
modes and CPU states. The requirements are fully supported during interrupt event handling. An interrupt event
awakens the system from each of the various operating modes and returns with the RETI instruction to the mode
that was selected before the interrupt event. The clocks used are ACLK and MCLK. ACLK is the crystal
frequency and MCLK , a multiple of ACLK, is used as the system clock.
The software can configure five operating modes:
D
Active mode (AM). The CPU is enabled with different combinations of active peripheral modules.
D
Low-power mode 0 (LPM0). The CPU is disabled, peripheral operation continues, ACLK and MCLK signals
are active, and loop control for MCLK is active.
D
Low-power mode 1 (LPM1). The CPU is disabled, peripheral operation continues, ACLK and MCLK signals
are active, and loop control for MCLK is inactive.
D
Low-power mode 2 (LPM2). The CPU is disabled, peripheral operation continues, ACLK signal is active,
and MCLK and loop control for MCLK are inactive.
D
Low-power mode 3 (LPM3). The CPU is disabled, peripheral operation continues, ACLK signal is active,
MCLK and loop control for MCLK are inactive, and the dc generator for the digital controlled oscillator (DCO)
(
³
MCLK generator) is switched off.
D
Low-power mode 4 (LPM4). The CPU is disabled, peripheral operation continues, ACLK signal is inactive
(crystal oscillator stopped), MCLK and loop control for MCLK are inactive, and the dc generator for the DCO
is switched off.
The special function registers (SFR) include module-enable bits that stop or enable the operation of the specific
peripheral module. All registers of the peripherals may be accessed if the operational function is stopped or
enabled. However, some peripheral current-saving functions are accessed through the state of local register
bits. An example is the enable/disable of the analog voltage generator in the LCD peripheral, which is turned
on or off using one register bit.
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
8POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
operation modes and interrupts (continued)
The most general bits that influence current consumption and support fast turn-on from low power operating
modes are located in the status register (SR). Four of these bits control the CPU and the system clock generator:
SCG1, SCG0, OscOff, and CPUOff.
Reserved For Future
Enhancements
15 9 8 7 0
V SCG1 SCG0 OscOff CPUOff GIE N Z C
rw-0 rw-0 rw-0 rw-0 rw-0 rw-0 rw-0 rw-0 rw-0 rw-0
interrupt vector addresses
The interrupt vectors and the power-up starting address are located in the ROM with an address range of
0FFFFh-0FFE0h. The vector contains the 16-bit address of the appropriate interrupt handler instruction
sequence.
INTERRUPT SOURCE INTERRUPT FLAG SYSTEM INTERRUPT WORD ADDRESS PRIORITY
Power-up, external reset, watchdog WDTIFG (see Note 1) Reset 0FFFEh 15, highest
NMI, oscillator fault NMIIFG (see Notes 1 and 3)
OFIFG (see Notes 1 and 4) Nonmaskable,
(Non)maskable 0FFFCh 14
Dedicated I/O P0.0 P0.0IFG Maskable 0FFFAh 13
Dedicated I/O P0.1
P0 1IFG
Maskable
0FFF8h
12
8-Bit T imer/Counter
P0
.
1IFG
Maskable
0FFF8h
12
0FFF6h 11
W atchdog Timer WDTIFG Maskable 0FFF4h 10
0FFF2h 9
0FFF0h 8
0FFEEh 7
0FFECh 6
Timer/Port RC1FG, RC2FG, EN1FG
(see Note 2) Maskable 0FFEAh 5
0FFE8h 4
0FFE6h 3
0FFE4h 2
Basic Timer1 BTIFG Maskable 0FFE2h 1
I/O Port 0.2–7 P0.27IFG (see Note 1) Maskable 0FFE0h 0, lowest
NOTES: 1. Multiple source flags
2. T imer/port interrupt flags are located in the timer/port registers
3. Non maskable: neither the individual nor the general interrupt enable bit will disable an interrupt event.
4. (Non) maskable: the individual interrupt enable bit can disable an interrupt event, but the general interrupt enable bit cannot.
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
special function registers
Most interrupt and module enable bits are collected into the lowest address space. Special function register bits
that are not allocated to a functional purpose are not physically present in the device. Simple software access
is provided with this arrangement.
interrupt enable 1 and 2
7654 0
P0IE.1 OFIE WDTIE
321
P0IE.0
rw-0 rw-0 rw-0 rw-0
Address
0h
WDTIE: Watchdog Timer enable signal
OFIE: Oscillator fault enable signal
P0IE.0: Dedicated I/O P0.0
P0IE.1: P0.1 or 8-Bit Timer/Counter, RXD
7654 0
TPIE
rw-0
321
rw-0
Address
01h BTIE
TPIE: Timer/Port enable signal
BTIE: Basic Timer1 enable signal
interrupt flag register 1 and 2
7654 0
P0IFG.1 OFIFG WDTIFG
321
rw-0 rw-1 rw-0
Address
02h NMIIFG P0IFG.0
rw-0 rw-0
WDTIFG: Set on overflow or security key violation
OR
Reset on VCC power-on or reset condition at RST/NMI-pin
OFIFG: Flag set on oscillator fault
P0.0IFG: Dedicated I/O P0.0
P0.1IFG: P0.1 or 8-Bit Timer/Counter, RXD
NMIIFG: Signal at RST/NMI-pin
7654 0
rw
321
Address
03h BTIFG
BTIFG: Basic Timer1 flag
module enable register 1 and 2
7654 0321
Address
04h
7654 0321
Address
05h
Legend rw:
rw-0: Bit can be read and written.
Bit can be read and written. It is reset by PUC
SFR bit is not present in device.
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
memory organization
Int. Vector
2 kB ROM
128B RAM
16b Per .
8b Per.
SFR
FFFFh
FFE0h
FFDFh
F800h
027Fh
0200h
01FFh
0100h
00FFh
0010h
000Fh
0000h
MSP430C311S
Int. Vector
12 kB ROM
512B RAM
16b Per .
8b Per.
SFR
FFFFh
FFE0h
FFDFh
D000h
03FFh
0200h
01FFh
0100h
00FFh
0010h
000Fh
0000h
MSP430C314
Int. Vector
8 kB ROM
256B RAM
16b Per .
8b Per.
SFR
FFFFh
FFE0h
FFDFh
E000h
02FFh
0200h
01FFh
0100h
00FFh
0010h
000Fh
0000h
MSP430C313
Int. Vector
8 kB OTP
or
EPROM
256B RAM
16b Per .
8b Per.
SFR
FFFFh
FFE0h
FFDFh
E000h
02FFh
0200h
01FFh
0100h
00FFh
0010h
000Fh
0000h
MSP430P313†
PMS430E313†
Int. Vector
16 kB ROM
512B RAM
16b Per .
8b Per.
SFR
FFFFh
FFE0h
FFDFh
C000h
03FFh
0200h
01FFh
0100h
00FFh
0010h
000Fh
0000h
MSP430C315
Int. Vector
4 kB ROM
256B RAM
16b Per .
8b Per.
SFR
FFFFh
FFE0h
FFDFh
F000h
02FFh
0200h
01FFh
0100h
00FFh
0010h
000Fh
0000h
MSP430C312
Int. Vector
16 kB
OTP
or
EPROM
512B RAM
16b Per .
8b Per.
SFR
FFFFh
FFE0h
FFDFh
C000h
03FFh
0200h
01FFh
0100h
00FFh
0010h
000Fh
0000h
MSP430P315
MSP430P315S
PMS430E315
†MSP430P313/E313 not recommended for new designs – replaced by MSP430P315/E315.
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
11
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
peripherals
Peripherals connected to the CPU through a data, address, and control busses can be handled easily with
instructions for memory manipulation.
oscillator and system clock
Two clocks are used in the system: the system (master) clock (MCLK) and the auxiliary clock (ACLK). The MCLK
is a multiple of the ACLK. The ACLK runs with the crystal oscillator frequency. The special design of the oscillator
supports the feature of low current consumption and the use of a 32 768 Hz crystal. The crystal is connected
across two terminals without requiring any other external components.
The oscillator starts after applying VCC, due to a reset of the control bit (OscOff) in the status register (SR). It
can be stopped by setting the OscOff bit to a 1. The enabled clock signals ACLK, ACLK/2, ACLK/4, or MCLK
are accessible for use by external devices at output terminal XBUF.
The controller system clock has to operate with different requirements according to the application and system
conditions. Requirements include:
•High frequency in order to react quickly to system hardware requests or events
•Low frequency in order to minimize current consumption, EMI, etc.
•Stable frequency for timer applications e.g. real-time clock (RTC)
•Enable start-stop operation with a minimum delay
These requirements cannot all be met with fast frequency high-Q crystals or with RC-type low-Q oscillators. The
compromise selected for the MSP430 uses a low-crystal frequency, which is multiplied to achieve the desired
nominal operating range:
f(system) = (N+1) × f(crystal)
The crystal frequency multiplication is achieved with a frequency locked loop (FLL) technique. The factor N is
set to 31 after a power-up clear condition. The FLL technique, in combination with a digital controlled oscillator
(DCO), provides immediate start-up capability together with long-term crystal stability . The frequency variation
of the DCO with the FLL inactive is typically 330 ppm, which means that with a cycle time of 1 µs, the maximum
possible variation is 0.33 ns. For more precise timing, the FLL can be used. This forces longer cycle times if
the previous cycle time was shorter than the selected one. This switching of cycle times makes it possible to
meet the chosen system frequency over a long period of time.
The start-up operation of the system clock depends on the previous machine state. During a power-up clear
(PUC), the DCO is reset to its lowest possible frequency. The control logic starts operation immediately after
removal of the PUC condition. Correct operation of the FLL control logic requires the presence of a stable crystal
oscillator.
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
12 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
peripherals (continued)
digital I/O
There is one eight-bit I/O port, Port0, that is implemented (MSP430C311S and MSP430P315S have six bits
available on external pins). Six control registers give maximum digital input/output flexibility to the application:
•All individual I/O bits are programmable independently.
•Any combination of input, output, and interrupt conditions is possible.
•Interrupt processing of external events is fully implemented for all eight bits of port P0.
•Provides read/write access to all registers with all instructions
The six registers are:
•Input register 8 bits contains information at the pins
•Output register 8 bits contains output information
•Direction register 8 bits controls direction
•Interrupt flags 6 bits indicates if interrupt(s) are pending
•Interrupt edge select 8 bits contains input signal change necessary for interrupt
•Interrupt enable 6 bits contains interrupt enable bits
All these registers contain eight bits except for the interrupt flag register and the interrupt enable register. The
two least significant bits (LSBs) of the interrupt flag and interrupt enable registers are located in the special
functions register (SFR). Three interrupt vectors are implemented, one for Port0.0, one for Port0.1, and one
commonly used for any interrupt event on Port0.2 to Port0.7. The Port0.1 and Port0.2 pin function is shared with
the 8-bit timer/counter.
LCD drive
Liquid crystal displays (LCDs) for static, 2-, 3-, and 4-MUX operations can be driven directly . The controller LCD
logic operation is defined by software using memory-bit manipulation. LCD memory is part of the LCD module
and not part of the data memory. Eight mode and control bits define the operation and current consumption of
the LCD drive. The information for the individual digits can be easily obtained using table programming
techniques combined with the correct addressing mode. The segment information is stored in LCD memory
using instructions for memory manipulation.
The drive capability is mainly defined by the external resistor divider that supports the analog levels for 2-, 3-,
and 4-MUX operation. Groups of the LCD segment lines can be selected for digital output signals. The
MSP430x31x has four common signals and 23 segment lines. The MSP430C311S and MSP430P315S have
four common lines and 16 segment lines.
Timer/Port
The T imer/Port module has two 8-bit counters, an input that triggers one counter, and six digital outputs in the
MSP430x31x (MSP430C311S, MSP430C315S have five digital outputs available on external pins) with
high-impedance state capability. Both counters have an independent clock-selector for selecting an external
signal or one of the internal clocks (ACLK or MCLK). One counter has an extended control capability to halt,
count continuously, or gate the counter by selecting one of two external signals. This gate signal sets the
interrupt flag, if an external signal is selected, and the gate stops the counter.
Both timers can be read from and written to by software. The two 8-bit counters can be cascaded to a 16-bit
counter . A common interrupt vector is implemented. The interrupt flag can be set from three events in the 8-bit
counter mode (gate signal, overflow from the counters) or from two events in the 16-bit counter mode (gate
signal, overflow from the MSB of the cascaded counter).
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
13
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
peripherals (continued)
slope A/D conversion
Slope A/D conversion is accomplished with the timer/port module using external resistor(s) for reference (Rref),
external resistor(s) to the measured (Rmeas), and an external capacitor. The external components are driven
by software in such a way that the internal counter measures the time that is needed to charge or discharge
the capacitor. The reference resistor’s (Rref) charge or discharge time is represented by Nref counts. The
unknown resistors (Rmeas) charge or discharge time is represented by Nmeas counts. The unknown resistor’s
value (Rmeas) is the value of Rref multiplied by the relative number of counts (Nmeas/Nref). This value determines
resistive sensor values that correspond to the physical data, for example temperature, when an NTC or PTC
resistor is used.
Basic Timer1
The Basic T imer1 (BT1) divides the frequency of MCLK or ACLK, as selected with the SSEL bit, to provide low
frequency control signals. This is done within the system by one central divider , the basic timer1, to support low
current applications. The BTCTL control register contains the flags which controls or selects the different
operational functions. When the supply voltage is applied or when a reset of the device (RST/NMI pin), a
watchdog overflow, or a watchdog security key violation occurs, all bits in the register hold undefined or
unchanged status. The user software usually configures the operational conditions on the BT1 during
initialization.
The Basic Timer1 has two 8 bit timers which can be cascaded to a 16 bit timer. Both timers can be read and
written by software. Two bits in the SFR address range handle the system control interaction according to the
function implemented in the Basic T imer1. These two bits are the Basic Timer1 interrupt flag (BTIFG) and the
basic timer interrupt enable (BTIE) bit.
Watchdog Timer
The primary function of the Watchdog Timer (WDT) module is to perform a controlled system restart after a
software problem has occurred. If the selected time interval expires, a system reset is generated. If this
watchdog function is not needed in an application, the module can work as an interval timer, which generates
an interrupt after the selected time interval.
The Watchdog Timer counter (WDTCNT) is a 15/16-bit up-counter which is not directly accessible by software.
The WDTCNT is controlled using the W atchdog T imer control register (WDTCTL), which is a 16-bit read/write
register . Writing to WDTCTL, in both operating modes (watchdog or timer) is only possible by using the correct
password in the high-byte. The low-byte stores data written to the WDTCTL. The high-byte password is 05Ah.
If any value other than 05Ah is written to the high-byte of the WDTCTL, a system reset PUC is generated. When
the password is read its value is 069h. This minimizes accidental write operations to the WDTCTL register. In
addition to the Watchdog Timer control bits, there are two bits included in the WDTCTL which configure the NMI
pin.
8-Bit Timer/Counter
The 8-bit interval timer supports three major functions for the application:
•Serial communication or data exchange
•Pulse counting or pulse accumulation
•Timer
The 8-bit Timer/Counter peripheral includes the following major blocks: an 8-bit up-counter with
preload-register, an 8-bit control register , an input clock selector, an edge detection (e.g. start bit detection for
asynchronous protocols), and an input and output data latch, triggered by the carry-out-signal from the 8-bit
counter.
The 8-bit counter counts up with an input clock, which is selected by two control bits from the control register.
The four possible clock sources are MCLK, ACLK, the external signal from terminal P0.1, and the signal from
the logical AND of MCLK and terminal P0.1.
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
14 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
8-Bit Timer/Counter (continued)
Two counter inputs (load, enable) control the counter operation. The load input controls load operations. A
write-access to the counter results in loading the content of the preload-register into the counter . The software
writes or reads the preload-register with all instructions. The preload-register acts as a buffer and can be written
immediately after the load of the counter is completed. The enable input enables the count operation. When
the enable signal is set to high, the counter will count up each time a positive clock edge is applied to the clock
input of the counter.
Serial protocols, like UART protocol, need start-bit edge-detection to determine, at the receiver, the start of a
data transmission. When this function is activated, the counter starts counting after start-bit condition is
detected. The first signal level is sampled into the RXD input data-latch after completing the first timing interval,
which is programmed into the counter . T wo latches used for input and output data (RXD_FF and TXD_FF) are
clocked by the counter after the programmed timing interval has elapsed.
UART
The serial communication is realized by using software and the 8-bit timer/counter hardware. The hardware
supports the output of the serial data stream, bit-by-bit, with the timing determined by the counter. The
software/hardware interface connects the mixed signal controller to external devices, systems, or networks.
peripheral file map
PERIPHERALS WITH WORD ACCESS
Watchdog Watchdog Timer control WDTCTL 0120h
PERIPHERALS WITH BYTE ACCESS
EPROM EPROM control EPCTL 054h
Crystal buffer Crystal buffer control CBCTL 053h
System clock SCG frequency control
SCG frequency integrator
SCG frequency integrator
SCFQCTL
SCFI1
SCFI0
052h
051h
050h
Timer /Port T imer/Port enable
T imer/Port data
T imer/Port counter2
T imer/Port counter1
T imer/Port control
TPE
TPD
TPCNT2
TPCNT1
TPCTL
04Fh
04Eh
04Dh
04Ch
04Bh
8-Bit Timer/Counter 8-Bit T imer/Counter data
8-Bit T imer/Counter preload
8-Bit T imer/Counter control
TCDAT
TCPLD
TCCTL
044h
043h
042h
Basic Timer1 Basic T imer/Counter2
Basic Timer/Counter1
Basic Timer control
BTCNT2
BTCNT1
BTCTL
047h
046h
040h
LCD LCD memory 15
:
LCD memory1
LCD control & mode
LCDM15
LCDM1
LCDCTL
03Fh
031h
030h
Port P0 Port P0 interrupt enable
Port P0 interrupt edge select
Port P0 interrupt flag
Port P0 direction
Port P0 output
Port P0 input
P0IE
P0IES
P0IFG
P0DIR
P0OUT
P0IN
015h
014h
013h
012h
011h
010h
Special function SFR interrupt flag2
SFR interrupt flag1
SFR interrupt enable2
SFR interrupt enable1
IFG2
IFG1
IE2
IE1
003h
002h
001h
000h
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
15
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings†
Voltage applied at VCC to VSS –0.3 V to 6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage applied to any pin (referenced to VSS) –0.3 V to VCC +0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Diode current at any device terminal ±2 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, Tstg (unprogrammed device) –55°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, Tstg (programmed device) –40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTE: All voltages referenced to VSS.
recommended operating conditions
MIN NOM MAX UNIT
MSP430Cxxx 2.5 5.5
Supply voltage, VCC MSP430P313‡, PMS430E313‡2.7 5.5 V
MSP430P315, PMS430E315 2.7 5.5
pp
p
MSP430P313 2.7 5.5 V
u
y v
u
,
CC MSP430P315 4.5 5.5 V
Supply voltage, VSS 0 V
MSP430C31x
40
85
Operating free-air temperature range, TAMSP430P31x –
40
85
°C
PMS430E31x 25
XTAL frequency, f(XTAL) 32 768 Hz
VCC = 3 V DC 2.2
MHz
u
y
(system)
system VCC = 5 V DC 3.3
MH
z
Low-level input voltage, VIL (excluding Xin, Xout) VSS VSS+0.8
V
High-level input voltage, VIH (excluding Xin, Xout)
VCC = 3 V/5 V
0.7×VCC VCC
V
Low-level input voltage, VIL(Xin, Xout)
V
CC =
3
V/5
V
VSS 0.2×VCC
V
High-level input voltage, VIH(Xin, Xout) 0.8×VCC VCC
V
‡MSP430P313/E313 not recommended for new designs – replaced by MSP430P315/E315.
VCC – Supply Voltage – V
f(system) – Maximum Processor
Frequency – MHz
NOTE: Minimum processor frequency is defined by system clock.
2.5 3 5 5.5
f(MHz)
3.3
2.2
VCC (V)
Minimum
Figure 1. Processor Frequency vs Supply Voltage, C Versions
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
16 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
3 5 5.5
f(MHz)
3.3
2.2
1.5
VCC (V)
VCC – Supply Voltage – V
f(system) – Maximum Processor
Frequency – MHz
Minimum
NOTE: Minimum processor frequency is defined by system clock.
2.7
Figure 2. Processor Frequency vs Supply Voltage, P/E Versions
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
supply current (into VCC) excluding external current (f(system) = 1 MHz)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
C31x
TA=40
°
C+85
°
C
VCC = 3 V 400 500
C31
x
T
A = –
40°C
+
85°C
VCC = 5 V 730 850
I(AM)
Active mode
P313†
TA=40
°
C+85
°
C
VCC = 3 V 2100 2700
µA
I
(AM)
Acti
v
e
mode
P313†
T
A = –
40°C
+
85°C
VCC = 5 V 7000 8600 µ
A
P315(S)
TA=40
°
C+85
°
C
VCC = 3 V 490 550
P315(S)
T
A = –
40°C
+
85°C
VCC = 5 V 960 1050
C31x
TA=40
°
C+85
°
C
VCC = 3 V 50 70
C31
x
T
A = –
40°C
+
85°C
VCC = 5 V 100 130
I(CPUOff)
Low
p
ower mode (LPM0 1)
P313†
TA=40
°
C+85
°
C
VCC = 3 V 70 85
µA
I
(CPUOff)
Lo
w-
po
w
er
mode
,
(LPM0
,
1)
P313†
T
A = –
40°C
+
85°C
VCC = 5 V 150 170 µ
A
P315(S)
TA=40
°
C+85
°
C
VCC = 3 V 50 70
P315(S)
T
A = –
40°C
+
85°C
VCC = 5 V 100 130
I(LPM2)
Low
p
ower mode (LPM2)
TA=40
°
C+85
°
C
VCC = 3 V 6 12
µA
I
(LPM2)
Lo
w-
po
w
er
mode
,
(LPM2)
T
A = –
40°C
+
85°C
VCC = 5 V 13 25 µ
A
TA = –40°C 1.5 2.4
TA = 25°CVCC = 3 V 1.3 2
I(LPM3)
Low
p
ower mode (LPM3)
TA = 85°C 1.6 2.8
µA
I
(LPM3)
Lo
w-
po
w
er
mode
,
(LPM3)
TA = –40°C 5.2 7 µ
A
TA = 25°CVCC = 5 V 4.2 6
TA = 85°C 4.8 5.4
TA = –40°C 0.1 0.8
I(LPM4) Low-power mode, (LPM4) TA = 25°CVCC = 3 V/5 V 0.1 0.8 µA
()
TA = 85°C 0.4 1.3
†MSP430P313/E313 not recommended for new designs – replaced by MSP430P315/E315.
NOTE: All inputs are tied to 0 V or VCC. Outputs do not source or sink any current. The current consumption in LPM2 and LPM3 are measured
with active basic timer (ACLK selected) and LCD module. (fLCD = 1024 Hz, 4 mux)
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
17
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
current consumption of active mode versus system frequency, C versions only
IAM = IAM[1 MHz] × fsystem [MHz]
current consumption of active mode versus supply voltage, C versions only
IAM = IAM[3 V] + 200 µA/V × (VCC–3 V)
schmitt-trigger inputs port 0, Timer/Port, CIN, TP0.5
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
VIT
Positive going in
p
ut threshold voltage
VCC = 3 V 1.2 2.1
V
V
IT+
Positi
v
e
-
going
inp
u
t
threshold
v
oltage
VCC = 5 V 2.3 3.4
V
VIT
Negative going in
p
ut threshold voltage
VCC = 3 V 0.5 1.35
V
V
IT–
Negati
v
e
-
going
inp
u
t
threshold
v
oltage
VCC = 5 V 1.4 2.3
V
Vh
In
p
ut hysteresis (VIT VIT )
VCC = 3 V 0.3 1
V
V
hys
Inp
u
t
h
y
steresis
(V
IT+–
V
IT–
)
VCC = 5 V 0.6 1.4
V
standard inputs TCK, TMS, TDI, RST/NMI
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
VIL Low-level input voltage
VCC = 3 V/5 V
VSS VSS+0.8
V
VIH High-level input voltage
V
CC =
3
V/5
V
0.7VCC VCC
V
outputs port 0, P0.x, Timer/Port, TP0.0 – 5, LCD: S2/O2 to S26/O26 XBUF:XBUF, JTAG:TDO
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
IOH = –1.2 mA, VCC = 3 V, See Note 5 VCC–0.4 VCC
VOH
High level out
p
ut voltage
IOH = –3.5 mA, VCC = 3 V, See Note 6 VCC–1 VCC
V
V
OH
High
-
le
v
el
o
u
tp
u
t
v
oltage
IOH = –1.5 mA, VCC = 5 V, See Note 5 VCC–0.4 VCC
V
IOH = –4.5 mA, VCC = 5 V, See Note 6 VCC–1 VCC
IOL = 1.2 mA, VCC = 3 V, See Note 5 VSS VSS+0.4
VOL
Low-level out
p
ut voltage
IOL = 3.5 mA, VCC = 3 V, See Note 6 VSS VSS+1
V
VOL
Low
-
level
out ut
voltage
IOL = 1.5 mA, VCC = 5 V, See Note 5 VSS VSS+0.4
V
IOL = 4.5 mA, VCC = 5 V, See Note 6 VSS VSS+1
NOTES: 5. The maximum total current, IOHmax and IOLmax, for all outputs combined, should not exceed ±9.6 mA to hold the maximum voltage
drop specified.
6. The maximum total current, IOHmax and IOLmax, for all outputs combined, should not exceed ±20 mA to hold the maximum voltage
drop specified.
leakage current (see Note 7)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
Ilkg(TP) High-impedance leakage current, timer/port Timer/port:VTP0.x,
VCC = 3 V/5 V, CIN = VSS, VCC,
(see Note 8) ±50 nA
Ilkg(S27) High-impedance leakage current, S27 VS27 = VSS to VCC, VCC = 3 V/5 V ±50 nA
Ilkg(P0x) Leakage current, port 0 Port P0: P0.x, 0 ≤×≤ 7,
(see Note 9) VCC = 3 V/5 V, ±50 nA
NOTES: 7. The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted.
8. All timer/port pins TP0.0 to TP0.5 are Hi-Z. Pins CIN and TP .0 to TP0.5 are connected together during leakage current measurement.
In the leakage measurement the input CIN is included. The input voltage is VSS or VCC.
9. The port pin must be selected for input and there must be no optional pullup or pulldown resistor.
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
18 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
optional resistors, individually programmable with ROM code, P0.x, (see Note 10)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
R(opt1) VCC = 3 V/5 V 2.1 4.1 6.2 kΩ
R(opt2) VCC = 3 V/5 V 3.1 6.2 9.3 kΩ
R(opt3) VCC = 3 V/5 V 6 12 18 kΩ
R(opt4) VCC = 3 V/5 V 10 19 29 kΩ
R(opt5) Resistors, individually programmable with ROM code, all port pins, VCC = 3 V/5 V 19 37 56 kΩ
R(opt6)
yg
values applicable for pulldown and pullup VCC = 3 V/5 V 38 75 113 kΩ
R(opt7) VCC = 3 V/5 V 56 112 168 kΩ
R(opt8) VCC = 3 V/5 V 94 187 281 kΩ
R(opt9) VCC = 3 V/5 V 131 261 392 kΩ
R(opt10) VCC = 3 V/5 V 167 337 506 kΩ
NOTE 10: Optional resistors Roptx for pull-down or pull-up are not programmed in standard OTP/EPROM devices P/E313 (MSP430P313/E313
not recommended for new designs – replaced by MSP430P315/E315) and P/E315(s)
inputs P0.x, CIN, TP.5; output XBUF
PARAMETER TEST CONDITIONS VCC MIN NOM MAX UNIT
t(int) External interrupt timing Port P0
External trigger signal for the
interrupt flag, (see Notes 11 and 12) 3 V/5 V 1.5 cycle
f(IN) Input frequency 3 V/5 V DC f
(system)
MHz
(system)
t(H) or t(L)
High level or low level time
P0.x, CIN, TP.5 3 V 225 ns
t(H) or t(L)
High
level
or
low
level
time
5 V 150 ns
f(XBUF) Clock output frequency XBUF, CL = 20 pF 3 V/5 V f(system) MHz
XBUF, CL = 20 pF,
t(Xd )
Duty cycle of clock out
p
ut frequency
f(MCLK)= 1.1 MHz 3V/5V 40%
t
(Xdc)
D
u
t
y
c
y
cle
of
clock
o
u
tp
u
t
freq
u
enc
yf(XBUF) = f(ACLK) 3V/5V 35% 60%
f(XBUF) = f(ACLK/n) 3V/5V 50% 65%
NOTES: 11. The external signal sets the interrupt flag every time tint is met. It may be set even with trigger signals shorter than tint. The conditions
to set the flag must be met independently from this timing constraint. T int is defined in MCLK cycles.
12. The external interrupt signal cannot exceed the maximum inut frequency (f(in)).
crystal oscillator, Xin, Xout
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
C(Xin) Integrated capacitance at input VCC = 3 V/5 V 12 pF
C(Xout) Integrated capacitance at output VCC = 3 V/5 V 12 pF
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
19
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended and operating free-air temperature range (unless
otherwise noted) (continued)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
f(NOM) DCO NDCO = 1A0h FN_4=FN_3=FN_2=0 VCC = 3 V/5 V 1 MHz
fDCO3
NDCO = 00 0110 0000 FN 4=FN 3=FN 2=0
VCC = 3 V 0.15 0.6
f(NOM)
f
DCO3
N
DCO =
00
0110
0000
FN
_
4
=
FN
_
3
=
FN
_
2
=
0
VCC = 5 V 0.18 0.62
MHz
f
(NOM)
fDCO26
NDCO = 11 0100 0000 FN 4=FN 3=FN 2=0
VCC = 3 V 1.25 4.7
MH
z
f
DCO26
N
DCO =
11
0100
0000
FN
_
4
=
FN
_
3
=
FN
_
2
=
0
VCC = 5 V 1.45 5.5
fDCO3
NDCO = 00 0110 0000 FN 4=FN 3=0 FN 2=1
VCC = 3 V 0.36 1.05
2xf(NOM)
f
DCO3
N
DCO =
00
0110
0000
FN
_
4
=
FN
_
3
=
0
,
FN
_
2
=
1
VCC = 5 V 0.39 1.2
MHz
2xf(NOM)
fDC26
NDCO = 11 0100 0000 FN 4=FN 3=0 FN 2=1
VCC = 3 V 2.5 8.1
MHz
f
DC26
N
DCO =
11
0100
0000
FN
_
4
=
FN
_
3
=
0
,
FN
_
2
=
1
VCC = 5 V 3 9.9
fDCO3
NDCO = 00 0110 0000 FN 4=0 FN 3= 1 FN 2=X
VCC = 3 V 0.5 1.5
3xf(NOM)
f
DCO3
N
DCO =
00
0110
0000
FN
_
4
=
0
,
FN
_
3
=
1
,
FN
_
2
=
X
VCC = 5 V 0.6 1.8
MHz
3xf(NOM)
fDCO26
NDCO = 11 0100 0000 FN 4= 0 FN 3=1 FN 2=X
VCC = 3 V 3.7 11
MHz
f
DCO26
N
DCO =
11
0100
0000
FN
_
4
=
0
,
FN
_
3
=
1
,
FN
_
2
=
X
VCC = 5 V 4.5 13.8
fDCO3
NDCO = 00 0110 0000 FN 4 =1 FN 3=FN 2=X
VCC = 3 V 0.7 1.85
4xf(NOM)
f
DCO3
N
DCO =
00
0110
0000
FN
_
4
=
1
,
FN
_
3
=
FN
_
2
=
X
VCC = 5 V 0.8 2.4
MHz
4xf(NOM)
fDCO26
NDCO = 11 0100 0000 FN 4=1 FN 3=FN 2=X
VCC = 3 V 4.8 13.3
MHz
f
DCO26
N
DCO =
11
0100
0000
FN
_
4
=
1
,
FN
_
3
=
FN
_
2
=
X
VCC = 5 V 6 17.7
NDCO fMCLK = fNOM FN_4=FN_3=FN_2=0 VCC = 3 V/5 V A0h 1A0h 340h
S fNDCO+1 = S × fNDCO VCC = 3 V/5 V 1.07 1.13
Legend
Tolerance at Tap 26
DCO Frequency
Adjusted by Bits
2∧9–2∧5 in SCFI1
Tolerance at Tap 3
4xfNOM
3xfNOM
2xfNOM
fNOM
f(DCO26)
f(DCO3)
f(DCO26)
f(DCO3)
f(DCO26)
f(DCO3)
f(DCO26)
f(DCO3)
FN_2 = 0
FN_3 = 0
FN_4 = 0
FN_2 = 1
FN_3 = 0
FN_4 = 0
FN_2 = X
FN_3 = 1
FN_4 = 0
FN_2 = X
FN_3 = X
FN_4 = 1
Figure 3
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
20 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
LCD
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
V23
Analog voltage
Voltage at R23 VCC = 3 V/5 V (VCC–VSS)×
2/3+VSS V
V13
Analog
v
oltage
Voltage at R13 VCC = 3 V/5 V (VCC–VSS) ×
1/3+VSS V
VO(HLCD) Output 1 (HLCD) I(HLCD) <= 10 nA VCC–0.125 VCC
V
VO(LLCD) Output 0 (LLCD) I(LLCD) <= 10 nA
VCC = 3 V/5 V
VSS VSS+0.125
V
II(R13) Input leakage R13 = VCC/3
V
CC =
3
V/5
V
±20
nA
II(R23)
g
(see Note 13) R23 = 2 VCC/3
±20
nA
ro(R13) to S(XX)
Out
p
ut (SXX)
I(SXX) =3µA
VCC = 3 V/5 V
33
kΩ
ro(R23) to S(XX)
O
u
tp
u
t
(SXX)
I
(SXX) = –
3
µ
A
,
V
CC =
3
V/5
V
33
kΩ
NOTE 13: I(IRxx) is measured with no load on the segment or common LCD I/O pins.
comparator (Timer/Port)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
I()
Com
p
arator (timer/
p
ort)
CPON = 1
VCC = 3 V 250 350
µA
I
(com)
Comparator
(timer/port)
CPON
=
1
VCC = 5 V 450 600 µ
A
Vref(com) Internal reference voltage at (–) terminal CPON = 1 VCC = 3 V/5 V 0.230×VCC 0.25×VCC 0.260×VCC V
Vhys(com)
In
p
ut hysteresis (com
p
arator)
CPON = 1
VCC = 3 V 5 37
mV
Vh
ys
(
com
)
In ut
hysteresis
(com arator)
CPON
=
1
VCC = 5 V 10 42
mV
RAM
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
VRAMh CPU halted (see Note 14) 1.8 V
NOTE 14: This parameter defines the minimum supply voltage when the data in the program memory RAM remains unchanged. No program
execution should happen during this supply voltage condition.
PUC/POR
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
t(POR_delay) 150 250 µs
TA = –40°C 1.5 2.4 V
V(POR) POR TA = 25°C
VCC = 3 V/5 V
1.2 2.1 V
()
TA = 85°C
V
CC =
3
V/5
V
0.9 1.8 V
V(min) 0 0.4 V
t(reset) PUC/POR Reset is accepted internally 2µs
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
21
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
VCC
POR
V
t
V
(POR)
V
(min) POR
No POR
Figure 4. Power-On Reset (POR) vs Supply Voltage
1.8
2.1
2.4
0.9
1.2
1.5
0
0.5
1
1.5
2
2.5
3
–40 –20 0 20 40 60 80
Temperature [°C]
25°C
V POR [V]
Figure 5. V(POR) vs Temperature
wakeup from LPM3
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
f=1MHz
VCC = 3 V
6
f
=
1
MH
zVCC = 5 V
6
t(LPM3) Delay time
f=2MHz
VCC = 3 V
6
µs
()
f
=
2
MH
zVCC = 5 V
6
f = 3 MHz VCC = 5 V 6
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
22 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
JTAG, program memory
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
f(TCK)
TCK frequency
VCC = 3 V DC 5
MHz
f
(TCK)
JTAG/Test
TCK
freq
u
enc
yVCC = 5 V DC 10
MH
z
R(TEST)
JTAG/Test
Pullup resistors on TMS, TCK, TDI
(see Note 15) VCC = 3 V/ 5 V 25 60 90 kΩ
Fuse blow voltage, C versions (see Note 15) VCC = 3 V/ 5 V 5.5 6
V(FB) JTAG/Fuse (see Note 16) Fuse blow voltage, E/P versions
(see Note 17) VCC = 3 V/ 5 V 11 12 V
I(FB)
()
Supply current on TDI/VPP to blow fuse 100 mA
t(FB) T ime to blow the fuse 1 ms
V(PP)
P313, E313 Programming voltage, applied to TDI/VPP 11 11.5 13 V
V
(PP) P315(S), E315 Programming voltage, applied to TDI/VPP 12 12.5 13 V
I(PP) Current from programming voltage source 70 mA
t(pps) EPROM (E) and OTP(P) –
versions only
Programming time, single pulse 5 ms
t(ppf) vers
i
ons on
l
y
(see
Not
e
1
8)
Programming time, fast algorithm 100 µs
Pn
(see
Note
18)
Pulses for successful programming 4 100 Pulses
t(erase)
EPROM (E)
Erase time wave length 2537 Å at 15 Ws/cm2
(UV lamp of 12 mW/ cm2)30 min
EPROM
(E)
Write/erase cycles 1000 cycles
Data retention TJ < 55°C 10 years
NOTES: 15. The TMS and TCK pullup resistors are implemented in all ROM(C) and EPROM(E) versions.
16. Once the JTAG fuse is blown no further access to the MSP430 JTAG/test feature is possible.
17. The voltage supply to blow the JTAG fuse is applied to TDI/VPP pin when fuse blowing is desired.
18. Refer to the Recommended Operating Conditions for the correct VCC during programing.
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
23
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
JTAG fuse check mode
MSP430 devices that have the fuse on the TDI/VPP terminal have a fuse check mode that tests the continuity
of the fuse the first time the JT AG port is accessed after a power-on reset (POR). When activated, a fuse check
current, ITF, of 1 mA at 3 V, 2.5 mA at 5 V can flow from the TDI/VPP pin to ground if the fuse is not burned.
Care must be taken to avoid accidentally activating the fuse check mode and increasing overall system power
consumption.
Activation of the fuse check mode occurs with the first negative edge on the TMS pin, after power up, or if the
TMS is being held low after power-up. The second positive edge on the TMS pin deactivates the fuse check
mode. After deactivation, the fuse check mode remains inactive until another POR occurs. After each POR the
fuse check mode has the potential to be activated.
Time TMS Goes Low After POR
TMS
ITF
ITDI
Figure 6. Fuse Check Mode Current, MSP430P/E313,P/E315,C31x
Care must be taken to avoid accidentally activating the fuse check mode, including guarding against EMI/ESD
spikes that could cause signal edges on the TMS pin.
Configuration of TMS, TCK, TDI/VPP and TDO/TDI pins in applications.
C3xx P/E3xx
TDI Open 68k, pulldown
TDO Open 68k, pulldown
TMS Open Open
TCK Open Open
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
24 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 7
DIGITAL CONTROLLED OSCILLATOR FREQUENCY
vs
OPERATING FREE-AIR TEMPERATURE
T – Operating Free-Air Temperature – °C
0.9
0.6
0.3
0
1.2
1.5
1.8
f(DCO)/f(DCO@ 25 )
C
°
–40 –20 0 20 40 9060 80
Figure 8
VCC – Supply Voltage – V
0.6
0.4
0.2
002
0.8
1
1.2
46
DIGITAL CONTROLLED OSCILLATOR FREQUENCY
vs
SUPPLY VOLTAGE
f(DCO)/f(DCO@ 3 V)
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
25
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
typical input/output schematics
CMOS INPUT (RST/NMI)
I/O WITH SCHMITT-TRIGGER INPUT (P0.x,
TP0.5) CMOS 3-STATE OUTPUT
(TP0.0–4, XBUF)
VCC
(see Note A)
(see Note A)
GND
VCC
(see Note A)
(see Note A)
GND
VCC
(see Note A)
(see Note A)
GND
VCC
60 k TYP
MSP430C31x: TMS, TCK
MSP430P/E31x: TMS, TCK
NOTES: A. Optional selection of pull-up or pull-down resistors with ROM (masked) versions.
B. Fuses for the optional pull-up and pull-down resistors can only be programmed at the factory.
CMOS SCHMITT-TRIGGER INPUT (CIN)
MSP430C31x: TDO/TDI
MSP430P/E31x: TDO/TDI
(see Note B)
(see Note B)
(see Note B)
(see Note B)
(see Note B)
(see Note B)
TDO_Internal
TDO_Control
TDI_Control
TDI_Internal
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
26 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
typical input/output schematics
COM0–3
VC
VD
Control COM0–3
VA
VB
Segment control
VA
VB
Segment control
LCDCTL (LCDM5,6,7)
Data (LCD RAM bits 0–3
or bits 4–7)
S0, S1
S2/O2–Sn/On
LCD OUTPUT (COM0–4, Sn, Sn/On)
NOTE: The signals VA, VB, VC, and VD come from the LCD module analog voltage generator .
JTAG Fuse
Blow
Control
TDI/VPP
TDO/TDI
TMS
JTAG
Fuse
VPP_ Internal
TDI_ Internal
TDO/TDI_Control
TDO_ Internal
From/To JTAG_CBT_SIG_REG
NOTES: A. During programming activity and when blowing the JTAG enable fuse, the TDI/VPP terminal is used to apply the correct voltage
source. The TDO/TDI terminal is used to apply the test input data for JTAG circuitry.
B. The TDI/VPP terminal of the ’P31x and ’E31x does not have an internal pullup resistor. An external pulldown resistor is
recommended to avoid a floating node, which could increase the current consumption of the device.
C. The TDO/TDI terminal is in a high-impedance state after POR. The ’P31x and ’E31x need a pullup or a pulldown resistor to avoid
floating a node, which could increase the current consumption of the device.
Figure 9. MSP430P313/E313/P315(S)/E315: TDI/VPP, TDO/TDI
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
27
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
56
0.730
(18,54)
0.720
(18,29)
4828
0.370
(9,40)
(9,65)
0.380
DIM
A MIN
A MAX
PINS **
0.630
(16,00)
(15,75)
0.620
4040048/D 08/97
48-PIN SHOWN
Gage Plane
0.420 (10,67)
0.395 (10,03)
0.006 (0,15) NOM
0.010 (0,25)
Seating Plane
0.020 (0,51)
0.040 (1,02)
25
24
0.008 (0,203)
0.012 (0,305)
48
1
0.008 (0,20) MIN
A
0.110 (2,79) MAX
0.299 (7,59)
0.291 (7,39)
0.004 (0,10)
M
0.005 (0,13)
0.025 (0,635)
0°–8°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
28 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PMS430E313†, PMS430E315 (FZ package)
28 29
NC
S23/O23
S22/O22
S18/O18
S17/O17
S16/O16
S15/O15
S14/O14
S13/O13
S12/O12
S11/O11
S10/O10
S9/O9
S8/O8
S7/O7
NC
NC
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
30
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
NC
NC
VCC
R23
R13
Xin
Xout/TCLK
P0.0
P0.1/RXD
P0.2/TXD
P0.3
P0.4
P0.5
P0.6
P0.7
TP0.0
NC 31 32 33 34
FZ PACKAGE
(TOP VIEW)
COM3
COM2
87 65493
XBUF
RST/NMI
TCK
TMS
TDI/VPP
TDO/TDI
S1
S2/O2
S3/O3
S4/O4
TP0.1
TP0.2
TP0.3
TP0.4
TP0.5
Cin
S0
168672
35 36 37 38 39
66 65
27
NC
NC
COM1
COM0
64 63 62 61
40 41 42 43
S5/O5
S6/O6
NC
NC
S27/O27/CMPI
S26/O26
NC
NC
NC
NC
NC – No internal connection
VSS
†MSP430P313/E313 not recommended for new designs – replaced by MSP430P315/E315.
MSP430x31x
MIXED SIGNAL MICROCONTROLLERS
SLAS165D – FEBRUARY 1998 – REVISED APRIL 2000
29
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
FZ (S-CQCC-J**) J-LEADED CERAMIC CHIP CARRIER
4040219/B 03/95
0.180 (4,57)
0.140 (3,55)
C
0.020 (0,51)
0.032 (0,81)
A B
A
B
0.025 (0,64) R TYP
0.026 (0,66)
0.120 (3,05)
0.155 (3,94)
0.014 (0,36)
0.120 (3,05)
0.040 (1,02) MIN
0.090 (2,29)
0.040 (1,02)
45°
A
MIN MAX
0.485
(12,32) (12,57)
0.495 0.455
(11,56)(10,92)
0.430
MAXMIN
BC
MIN MAX
0.410
(10,41) (10,92)
0.430
0.6300.6100.630 0.6550.6950.685 (16,00)(15,49)(16,00) (16,64)(17,65)(17,40)
0.7400.6800.730 0.7650.7950.785 (18,79)(17,28)(18,54) (19,43)(20,19)(19,94)
PINS**
28
44
52
NO. OFJEDEC
MO-087AC
MO-087AB
MO-087AA
OUTLINE
28 LEAD SHOWN
Seating Plane
(at Seating
Plane)
1426
25
19
18
12
11
50.050 (1,27)
0.9300.9100.930 0.9550.9950.985 (23,62)(23,11)(23,62) (24,26)(25,27)(25,02)
68MO-087AD
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 2000, Texas Instruments Incorporated