TPCF8108
1
MOSFETs Silicon P-Channel MOS (U-MOS)
TPCF8108
TPCF8108
TPCF8108
TPCF8108
1.
1.
1.
1. Applications
Applications
Applications
Applications
• Lithium-Ion Secondary Batteries
• Power Management Switches
• Notebook PCs
2.
2.
2.
2. Features
Features
Features
Features
(1) Small footprint due to a small and thin package
(2) Low drain-source on-resistance: RDS(ON) = 21 mΩ (typ.) (VGS = -4.5 V)
(3) Low leakage current: IDSS = -10 µA (max) (VDS = -20 V)
(4) Enhancement mode: Vth = -0.5 to -1.2 V (VDS = -10 V, ID = -0.5 mA)
3.
3.
3.
3. Packaging and Internal Circuit
Packaging and Internal Circuit
Packaging and Internal Circuit
Packaging and Internal Circuit
5: Source
4: Gate
1, 2, 3, 6, 7, 8: Drain
VS-8
4.
4.
4.
4. Absolute Maximum Ratings (Note) (T
Absolute Maximum Ratings (Note) (T
Absolute Maximum Ratings (Note) (T
Absolute Maximum Ratings (Note) (Ta
a
a
a = 25
= 25
= 25
= 25
unless otherwise specified)
unless otherwise specified)
unless otherwise specified)
unless otherwise specified)
Characteristics
Drain-source voltage
Gate-source voltage
Drain current (DC)
Drain current (pulsed)
Power dissipation
Power dissipation
Single-pulse avalanche energy
Avalanche current
Channel temperature
Storage temperature
(t = 5 s)
(t = 5 s)
(Note 1)
(Note 1)
(Note 2)
(Note 3)
(Note 4)
Symbol
VDSS
VGSS
ID
IDP
PD
PD
EAS
IAR
Tch
Tstg
Rating
-20
±12
-7
-28
2.5
0.7
31.8
-7
150
-55 to 150
Unit
V
A
W
W
mJ
A
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
2010-08-23
Rev.2.0
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TPCF8108
2
5.
5.
5.
5. Thermal Characteristics
Thermal Characteristics
Thermal Characteristics
Thermal Characteristics
Characteristics
Channel-to-ambient thermal resistance
Channel-to-ambient thermal resistance
(t = 5 s)
(t = 5 s)
(Note 2)
(Note 3)
Symbol
Rth(ch-a)
Rth(ch-a)
Max
50.0
178.5
Unit
/W
/W
Note 1: Ensure that the channel temperature does not exceed 150.
Note 2: Device mounted on a glass-epoxy board (a), Figure 5.1
Note 3: Device mounted on a glass-epoxy board (b), Figure 5.2
Note 4: VDD = -16 V, Tch = 25 (initial), L = 0.5 mH, RG = 25 Ω, IAR = -7 A
Fig.
Fig.
Fig.
Fig. 5.1
5.1
5.1
5.1 Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
Board (a)
Board (a)
Board (a)
Board (a)
Fig.
Fig.
Fig.
Fig. 5.2
5.2
5.2
5.2 Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
Device Mounted on a Glass-Epoxy
Board (b)
Board (b)
Board (b)
Board (b)
Note: This transistor is sensitive to electrostatic discharge and should be handled with care.
2010-08-23
Rev.2.0
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TPCF8108
3
6.
6.
6.
6. Electrical Characteristics (T
Electrical Characteristics (T
Electrical Characteristics (T
Electrical Characteristics (Ta
a
a
a = 25
= 25
= 25
= 25
unless otherwise specified)
unless otherwise specified)
unless otherwise specified)
unless otherwise specified)
6.1.
6.1.
6.1.
6.1. Static Characteristics
Static Characteristics
Static Characteristics
Static Characteristics
Characteristics
Gate leakage current
Drain cut-off current
Drain-source breakdown voltage
Drain-source breakdown voltage
Gate threshold voltage
Drain-source on-resistance
(Note 5)
Symbol
IGSS
IDSS
V(BR)DSS
V(BR)DSX
Vth
RDS(ON)
Test Condition
VGS = ±12 V, VDS = 0 V
VDS = -20 V, VGS = 0 V
ID = -10 mA, VGS = 0 V
ID = -10 mA, VGS = 8 V
VDS = -10 V, ID = -0.5 mA
VGS = -1.8 V, ID = -1 A
VGS = -2.5 V, ID = -3.5 A
VGS = -4.5 V, ID = -3.5 A
Min
-20
-12
-0.5
Typ.
45
29
21
Max
±0.1
-10
-1.2
95
37
26
Unit
µA
V
mΩ
Note 5: If a forward bias is applied between gate and source, this device enters V(BR)DSX mode. Note that the drain-
source breakdown voltage is lowered in this mode.
6.2.
6.2.
6.2.
6.2. Dynamic Characteristics
Dynamic Characteristics
Dynamic Characteristics
Dynamic Characteristics
Characteristics
Input capacitance
Reverse transfer capacitance
Output capacitance
Switching time (rise time)
Switching time (turn-on time)
Switching time (fall time)
Switching time (turn-off time)
Symbol
Ciss
Crss
Coss
tr
ton
tf
toff
Test Condition
VDS = -10 V, VGS = 0 V, f = 1 MHz
See Figure 6.2.1.
Min
Typ.
1320
180
210
8.6
17
42
152
Max
Unit
pF
ns
Fig.
Fig.
Fig.
Fig. 6.2.1
6.2.1
6.2.1
6.2.1 Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
6.3.
6.3.
6.3.
6.3. Gate Charge Characteristics
Gate Charge Characteristics
Gate Charge Characteristics
Gate Charge Characteristics
Characteristics
Total gate charge
(gate-source plus gate-drain)
Gate-source charge 1
Gate-drain charge
Symbol
Qg
Qgs1
Qgd
Test Condition
VDD ≈ -16 V, VGS = -5 V, ID = -7 A
Min
Typ.
19
2.5
5.2
Max
Unit
nC
6.4.
6.4.
6.4.
6.4. Source-Drain Characteristics
Source-Drain Characteristics
Source-Drain Characteristics
Source-Drain Characteristics
Characteristics
Pulsed reverse drain current
Diode forward voltage
(Note 6)
Symbol
IDRP
VDSF
Test Condition
IDR = -7 A, VGS = 0 V
Min
Typ.
Max
-28
1.2
Unit
A
V
Note 6: Ensure that the channel temperature does not exceed 150.
2010-08-23
Rev.2.0
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TPCF8108
4
7.
7.
7.
7. Marking
Marking
Marking
Marking
Fig.
Fig.
Fig.
Fig. 7.1
7.1
7.1
7.1 Marking
Marking
Marking
Marking
2010-08-23
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TPCF8108
5
8.
8.
8.
8. Characteristics Curves (Note)
Characteristics Curves (Note)
Characteristics Curves (Note)
Characteristics Curves (Note)
Fig.
Fig.
Fig.
Fig. 8.1
8.1
8.1
8.1 I
I
I
ID
D
D
D - V
- V
- V
- VDS
DS
DS
DS Fig.
Fig.
Fig.
Fig. 8.2
8.2
8.2
8.2 I
I
I
ID
D
D
D - V
- V
- V
- VDS
DS
DS
DS
Fig.
Fig.
Fig.
Fig. 8.3
8.3
8.3
8.3 I
I
I
ID
D
D
D - V
- V
- V
- VGS
GS
GS
GS Fig.
Fig.
Fig.
Fig. 8.4
8.4
8.4
8.4 V
V
V
VDS
DS
DS
DS - V
- V
- V
- VGS
GS
GS
GS
Fig.
Fig.
Fig.
Fig. 8.5
8.5
8.5
8.5 R
R
R
RDS(ON)
DS(ON)
DS(ON)
DS(ON) - I
- I
- I
- ID
D
D
DFig.
Fig.
Fig.
Fig. 8.6
8.6
8.6
8.6 R
R
R
RDS(ON)
DS(ON)
DS(ON)
DS(ON) - T
- T
- T
- Ta
a
a
a
2010-08-23
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TPCF8108
6
Fig.
Fig.
Fig.
Fig. 8.7
8.7
8.7
8.7 I
I
I
IDR
DR
DR
DR - V
- V
- V
- VDS
DS
DS
DS Fig.
Fig.
Fig.
Fig. 8.8
8.8
8.8
8.8 Capacitance - V
Capacitance - V
Capacitance - V
Capacitance - VDS
DS
DS
DS
Fig.
Fig.
Fig.
Fig. 8.9
8.9
8.9
8.9 V
V
V
Vth
th
th
th - T
- T
- T
- Ta
a
a
aFig.
Fig.
Fig.
Fig. 8.10
8.10
8.10
8.10 Dynamic Input/Output Characteristics
Dynamic Input/Output Characteristics
Dynamic Input/Output Characteristics
Dynamic Input/Output Characteristics
Fig.
Fig.
Fig.
Fig. 8.11
8.11
8.11
8.11 P
P
P
PD
D
D
D - T
- T
- T
- Ta
a
a
a
(Guaranteed Maximum)
(Guaranteed Maximum)
(Guaranteed Maximum)
(Guaranteed Maximum)
2010-08-23
Rev.2.0
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TPCF8108
7
Fig.
Fig.
Fig.
Fig. 8.12
8.12
8.12
8.12 r
r
r
rth
th
th
th - t
- t
- t
- tw
w
w
w
(Guaranteed Maximum)
(Guaranteed Maximum)
(Guaranteed Maximum)
(Guaranteed Maximum)
Fig.
Fig.
Fig.
Fig. 8.13
8.13
8.13
8.13 Safe Operating Area
Safe Operating Area
Safe Operating Area
Safe Operating Area
(Guaranteed Maximum)
(Guaranteed Maximum)
(Guaranteed Maximum)
(Guaranteed Maximum)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
2010-08-23
Rev.2.0
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TPCF8108
8
Package Dimensions
Package Dimensions
Package Dimensions
Package Dimensions Unit: mm
Weight: 0.011 g (typ.)
Package Name(s)
TOSHIBA: 2-3U1S
Nickname: VS-8
2010-08-23
Rev.2.0
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TPCF8108
9
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively "Product") without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's
written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible
for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which
minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage
to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate
the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA
information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the
precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application
with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,
including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating
and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample
application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product
is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/
or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact
("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace
industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment,
equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and
equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any
intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
(2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT,
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products
(mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange
and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology
are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
2010-08-23
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