CREAT BY ART
- Glass passivated chip junction
- Ideal for automated placement
- Ultrafast recovery time for high efficiency
- Low forward voltage, low power loss
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
V
RRM
50 100 150 200 400 600 V
V
RMS
35 70 105 140 280 420 V
V
DC
50 100 150 200 400 600 V
I
F(AV)
A
Trr ns
R
θjL O
C/W
T
JO
C
T
STG O
C
Document Number: DS_D1405061 Version: H14
MUR105S thru MUR160S
Taiwan Semiconductor
Surface Mount Ultrafast Power Rectifiers
FEATURES
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MUR
120S
MECHANICAL DATA
Case: DO-214AA (SMB) DO-214AA (SMB)
Polarity: Indicated by cathode band
Weight: 0.09 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25 unless otherwise noted)
MUR
140S
MUR
160S Unit
Maximum repetitive peak reverse voltage
Maximum RMS voltage
PARAMETER SYMBOL MUR
105S
MUR
110S
MUR
115S
I
R
μA
Maximum DC blocking voltage
Maximum average forward rectified current 1
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Maximum reverse recovery time (Note 2)
Typical thermal resistance 17
50
A
Maximum instantaneous forward voltage (Note 1)
@ 1 A, T
J
=25
@ 1 A, T
J
=150
V
F
V
Maximum reverse current @ rated VR T
J
=25
T
J
=150
25
Operating junction temperature range - 55 to +175
Storage temperature range - 55 to +175
Note 1: Pulse test with PW=300μs, 1% duty cycle
40 35
0.875
0.710
1.25
1.05
2
50
5
150
PART NO.
PART NO.
MUR160S
MUR160S
MUR160S
(TA=25 unless otherwise noted)
Document Number: DS_D1405061 Version: H14
MUR105S thru MUR160S
Taiwan Semiconductor
ORDERING INFORMATION
AEC-Q101
QUALIFIED
PACKING COD E GREEN COMPOUND
CODE
PACKAGE PACKING
MUR1xxS
(Note 1) Suffix "G"
SMB 850 / 7" Plastic reel
R4 SMB 3,000 / 13" Paper reel
M4 SMB 3,000 / 13" Plastic reel
Note 1: "xx" defines voltage from 50V (MUR105S) to 600V (MUR160S)
EXAMPLE
PREFERRED P/N AEC-Q101
QUALIFIED PACKING CODE GREEN COMPOUND
CODE DESCRIPTION
Prefix "H"
R5
MUR160S R5 R5
MUR160S R5G R5 G Green compound
MUR160SHR5 H R5 AEC-Q101 qualified
RATINGS AND CHARACTERISTICS CURVES
0
0.5
1
1.5
0 25 50 75 100 125 150 175
AVERAGE FORWARD CURRENT (A)
LEAD TEMPERATURE (oC)
FIG.1 MAXIMUM FORWARD CURRENT DERATING
CURVE
0
10
20
30
40
50
1 10 100
PEAK FORWARD SURGE CURRENT
(A)
NUMBER OF CYCLES AT 60 Hz
FIG. 2 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
0.1
1
10
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
INSTANTANEOUS FORWARD
CURRENT(A)
FORWARD VOLTAGE (V)
FIG. 3 TYPICAL FORWARD CHARACTERISTICS
MUR105S-120S
TJ=150
TJ=25
0.1
1
10
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
INSTANTANEOUS FORWARD
CURRENT(A)
FORWARD VOLTAGE (V)
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
MUR140S-160S
TJ=150
TJ=25
Min Max Min Max
A 1.95 2.10 0.077 0.083
B 4.25 4.75 0.167 0.187
C 3.48 3.73 0.137 0.147
D 1.99 2.61 0.078 0.103
E 0.90 1.41 0.035 0.056
F 5.10 5.30 0.201 0.209
G 0.10 0.20 0.004 0.008
H 0.15 0.31 0.006 0.012
Document Number: DS_D1405061 Version: H14
MUR105S thru MUR160S
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
0
10
20
30
40
50
60
70
0 4 8 12 16 20 24
CAPACITANCE (pF)
REVERSE VOLTAGE (V)
FIG. 7 TYPICAL JUNCTION CAPACITANCE
MUR105S-120S
MUR140S-160S
0.001
0.01
0.1
1
10
100
1000
10 20 30 40 50 60 70 80 90 100
INSTANTANEOUS REVERSE CURRENT
(μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE.(%)
FIG. 5 TYPICAL REVERSE CHARACTERISTICS
TJ=25
TJ=150
MUR105S-120S
0.001
0.01
0.1
1
10
100
1000
10 20 30 40 50 60 70 80 90 100
INSTANTANEOUS REVERSE CURRENT
(μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE.(%)
FIG. 6 TYPICAL REVERSE CHARACTERISTICS
TJ=25
TJ=150
MUR140S-160S
P/N = Specific Device Code
G = Green Compound
YW = Date Code
F = Factory Code
Document Number: DS_D1405061 Version: H14
MUR105S thru MUR160S
Taiwan Semiconductor
SUGG ESTED PAD LAYO UT
Symbol Unit (mm) Unit (inch)
A 2.3 0.091
B 2.5 0.098
C 4.3 0.169
MARKING DIAGRAM
D 1.8 0.071
E 6.8 0.268
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1405061 Version: H14
MUR105S thru MUR160S
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,