HCPL-0700-560 - Avago Technologies

Features

•High current transfer ratio – 2000% typical (4500%

typical for HCNW139/138)

•Low input current requirements – 0.5 mA

•TTL compatible output – 0.1 V VOL typical

•Performance guaranteed over temperature 0°C to 70°C

•Base access allows gain bandwidth adjustment

•High output current – 60 mA

•Safety approval

UL recognized – 3750 V rms for 1 minute and 5000 V rms*

for 1 minute per UL 1577

CSA approved

IEC/EN/DIN EN 60747-5-2 approved with VIORM = 1414

V peak for HCNW139 and HCNW138

•Available in 8-Pin DIP or SOIC-8 footprint or widebody

package

•MIL-PRF-38534 hermetic version available

(HCPL-5700/1)

Applications

•Ground isolate most logic families – TTL/TTL, CMOS/

TTL, CMOS/CMOS, LSTTL/TTL, CMOS/LSTTL

•Low input current line receiver

•High voltage insulation (HCNW139/138)

•EIA RS-232C line receiver

•Telephone ring detector

•117 V ac line voltage status indicator – low input power

dissipation

•Low power systems – ground isolation

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to

prevent damage and/or degradation which may be induced by ESD.

*5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only.

A 0.1 µF bypass capacitor connected between pins 8 and 5 is recommended.

Functional Diagram

ANODE

CATHODE

GND

TRUTH TABLE

LED

OFF

LOW

HIGH

6N139, 6N138, HCPL-0701, HCPL-0700,

HCNW139, HCNW-138

Low Input Curr ent, High Gain Optocouplers

Data Sheet

Description

These high gain series couplers use a Light Emitting

Diode and an integrated high gain photodetector to

provide extremely high current transfer ratio between

input and output. Separate pins for the photodiode

and output stage result in TTL compatible saturation

voltages and high speed operation. Where desired the

VCC and VO terminals may be tied together to achieve

conventional photodarlington operation. A base access

terminal allows a gain bandwidth adjustment to be

made.

The 6N139, HCPL-0701, and CNW139 are for use in

CMOS, LSTTL or other low power applications. A 400%

minimum current transfer ratio is guaranteed over 0 to

70°C operating range for only 0.5 mA of LED current.

The 6N138, HCPL-0700, and HCNW138 are designed

for use mainly in TTL applications. Current Transfer

Ratio (CTR) is 300% minimum over 0 to 70°C for an LED

current of 1.6 mA (1 TTL Unit load ). A 300% minimum

CTR enables operation with 1 TTL Load using a 2.2 kΩ

pull-up resistor.

Selection for lower input current

down to 250 µA is available upon

request.

The HCPL-0701 and HCPL-0700

are surface mount devices

packaged in an industry standard

SOIC-8 footprint.

The SOIC-8 does not require

“through holes” in a PCB. This

package occupies approximately

one-third the footprint area of the

standard dual-in-line package.

The lead profile is designed to be

compatible with standard surface

mount processes.

The HCNW139 and HCNW138

are packaged in a widebody

encapsulation that provides creep-

age and clearance dimensions

suitable for safety approval by

regulatory agencies worldwide.

Selection Guide

Widebody

8-Pin DIP Package Hermetic

(300 Mil) Small Outline SO-8 (400 mil) Single and

Dual Single Dual Minimum Absolute Dual

Single Channel Channel Channel Single Input ON Maxi- Channel

Channel Package Package Package Channel Current Minimum mum Packages

Package HCPL- HCPL- HCPL- Package (IF)CTR VCC HCPL-

6N139 2731[1] 0701 0731 HCNW139 0.5 mA 400% 18 V

6N138 2730[1] 0700 0730 HCNW138 1.6 mA 300% 7 V

HCPL-4701[1] 4731[1] 070A[1] 073A[1] 40 µA800% 18 V

0.5 mA 300% 20 V 5701[1]

5700[1]

5731[1]

5730[1]

Note:

1. Technical data are on separate Avago publications.

Ordering Information

6N138, 6N139, HCPL-0700 and HCPL-0701 are UL Recognized with 3750 Vrms for 1 minute per UL1577

and are approved under CSA Component Acceptance Notice #5, File CA 88324.

Option

Part RoHS non RoHS Surface Gull Tape UL 5000 Vrms/ IEC/EN/DIN

Number Compliant Compliant Package Mount Wing & Reel 1 Minute rating EN 60747-5-2 Quantity

-000E no option 300 mil DIP-8 50 per tube

-300E #300 300 mil DIP-8 X X 50 per tube

-500E #500 300 mil DIP-8 X X X 1000 per reel

6N138 -020E #020 300 mil DIP-8 X 50 per tube

6N139 -320E #320 300 mil DIP-8 X X X 50 per tube

-520E #520 300 mil DIP-8 X X X X 1000 per reel

-060E #060 300 mil DIP-8 X 50 per tube

-360E #360 300 mil DIP-8 X X X 50 per tube

-560E #560 300 mil DIP-8 X X X X 1000 per reel

-000E no option SO-8 100 per tube

HCPL-0700

-500E #500 SO-8 X X X 1500 per reel

HCPL-0701

-060E #060 SO-8 X 100 per tube

-560E #560 SO-8 X X X X 1500 per reel

HCNW138

-000E no option 400 mil 42 per tube

HCNW139

-300E #300 Widebody X X 42 per tube

-500E #500 DIP-8 X X X 750 per reel

To order, choose a part number from the part number column and combine with the desired option from

the option column to form an order entry.

Example 1:

6N138-560E to order product of 300 mil DIP Gull Wing Surface Mount package in Tape and Reel

packaging with IEC/EN/DIN EN 60747-5-2 Safety Approval and RoHS compliant.

Example 2:

HCPL-0700 to order product of 300 mil DIP package in Tube packaging and non RoHS compliant.

ANODE

CATHODE

–

5GND

SHIELD

Schematic

Option datasheets are available. Contact your

Avago sales representative or authorized

distributor for information.

Remarks: The notation ‘#XXX’ is used for

existing products, while (new) products launched

since July 15, 2001 and RoHS compliant will use

‘–XXXE.’

Package Outline Drawings

8-Pin DIP Package (6N139/6N138)**

8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138)

**JEDEC Registered Data.

1.080 ± 0.320

(0.043 ± 0.013) 2.54 ± 0.25

(0.100 ± 0.010)

0.51 (0.020) MIN.

0.65 (0.025) MAX.

4.70 (0.185) MAX.

2.92 (0.115) MIN.

5° TYP. 0.254 + 0.076

- 0.051

(0.010+ 0.003)

- 0.002)

7.62 ± 0.25

(0.300 ± 0.010)

6.35 ± 0.25

(0.250 ± 0.010)

9.65 ± 0.25

(0.380 ± 0.010)

1.78 (0.070) MAX.

1.19 (0.047) MAX.

A XXXXZ

YYWW

DATE CODE

DIMENSIONS IN MILLIMETERS AND (INCHES).

5678

4321

OPTION CODE*

RECOGNITION

TYPE NUMBER

* MARKING CODE LETTER FOR OPTION NUMBERS

"L" = OPTION 020

OPTION NUMBERS 300 AND 500 NOT MARKED.

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

3.56 ± 0.13

(0.140 ± 0.005)

0.635 ± 0.25

(0.025 ± 0.010) 12° NOM.

9.65 ± 0.25

(0.380 ± 0.010)

0.635 ± 0.130

(0.025 ± 0.005)

7.62 ± 0.25

(0.300 ± 0.010)

9.65 ± 0.25

(0.380 ± 0.010)

6.350 ± 0.25

(0.250 ± 0.010)

1.016 (0.040)

1.27 (0.050)

10.9 (0.430)

2.0 (0.080)

LAND PATTERN RECOMMENDATION

1.080 ± 0.320

(0.043 ± 0.013)

3.56 ± 0.13

(0.140 ± 0.005)

1.780

(0.070)

MAX.

1.19

(0.047)

MAX.

2.54

(0.100)

BSC

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

0.254 + 0.076

- 0.051

(0.010+ 0.003)

- 0.002)

Small Outline SO-8 Package (HCPL-0701/HCPL-0700)

8-Pin Widebody DIP Package (HCNW139/HCNW138)

XXX

YWW

8765

4321

5.994 ± 0.203

(0.236 ± 0.008)

3.937 ± 0.127

(0.155 ± 0.005)

0.406 ± 0.076

(0.016 ± 0.003) 1.270

(0.050)BSC

5.080 ± 0.127

(0.200 ± 0.005)

3.175 ± 0.127

(0.125 ± 0.005) 1.524

(0.060)

45° X 0.432

(0.017)

0.228 ± 0.025

(0.009 ± 0.001)

TYPE NUMBER

(LAST 3 DIGITS)

DATE CODE

0.305

(0.012)MIN.

TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)

5.207 ± 0.254 (0.205 ± 0.010)

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.

NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.

0.203 ± 0.102

(0.008 ± 0.004)

7°

PIN ONE

0 ~ 7°

7.49 (0.295)

1.9 (0.075)

0.64 (0.025)

LAND PATTERN RECOMMENDATION

11.15 ± 0.15

(0.442 ± 0.006)

1.78 ± 0.15

(0.070 ± 0.006)

5.10

(0.201)MAX.

1.55

(0.061)

MAX.

2.54 (0.100)

TYP.

DIMENSIONS IN MILLIMETERS (INCHES).

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

7° TYP. 0.254 + 0.076

- 0.0051

(0.010+ 0.003)

- 0.002)

11.00

(0.433)

9.00 ± 0.15

(0.354 ± 0.006)

MAX.

10.16 (0.400)

TYP.

HCNWXXXX

YYWW

DATE CODE

TYPE NUMBER

0.51 (0.021) MIN.

0.40 (0.016)

0.56 (0.022)

3.10 (0.122)

3.90 (0.154)

8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)

Solder Reflow Temperature Profile

TIME (SECONDS)

TEMPERATURE (°C)

200

100

50 150100 200 250

300

SEC.

50 SEC.

SEC.

160°C

140°C

150°C

PEAK

TEMP.

245°C

PEAK

TEMP.

240°C PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

PREHEATING TIME

150°C, 90 + 30 SEC.

2.5°C ± 0.5°C/SEC.

3°C + 1°C/–0.5°C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.

1.00 ± 0.15

(0.039 ± 0.006)

7° NOM.

12.30 ± 0.30

(0.484 ± 0.012)

0.75 ± 0.25

(0.030 ± 0.010)

11.00

(0.433)

11.15 ± 0.15

(0.442 ± 0.006)

9.00 ± 0.15

(0.354 ± 0.006)

1.3

(0.051)

13.56

(0.534)

2.29

(0.09)

LAND PATTERN RECOMMENDATION

1.78 ± 0.15

(0.070 ± 0.006)

4.00

(0.158)MAX.

1.55

(0.061)

MAX.

2.54

(0.100)

BSC

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

0.254 + 0.076

- 0.0051

(0.010+ 0.003)

- 0.002)

MAX.

Note: Non-halide flux should be used.

Regulatory Information

The 6N139/138, HCNW139/138,

and HCPL-0701/0700 have been

approved by the following

organizations:

Recognized under UL 1577,

Component Recognition Program,

File E55361.

CSA

Approved under CSA Component

Acceptance Notice #5, File CA

88324.

Recommended Pb-Free IR Profile

IEC/EN/DIN EN 60747-5-2

Approved under

IEC 60747-5-2:1997 + A1:2002

EN 60747-5-2:2001 + A1:2002

DIN EN 60747-5-2 (VDE 0884

Teil 2):2003-01

(HCNW139/138 only)

217 °C

RAMP-DOWN

6 °C/SEC. MAX.

RAMP-UP

3 °C/SEC. MAX.

150 - 200 °C

260 +0/-5 °C

t 25 °C to PEAK

60 to 150 SEC.

20-40 SEC.

TIME WITHIN 5 °C of A CTUAL

PEAK TEMPERA TURE

PREHEAT

60 to 180 SEC.

Tsmax

Tsmin

TIME

TEMPERATURE

NOTES:

THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.

Tsmax = 200 °C, Tsmin = 150 °C

Insulation and Safety Related Specifications

8-Pin DIP Widebody

(300 Mil) SO-8 (400 Mil)

Parameter Symbol Value Value Value Units Conditions

Minimum External L(101) 7.1 4.9 9.6 mm Measured from input terminals

Air Gap (External to output terminals, shortest

Clearance) distance through air.

Minimum External L(102) 7.4 4.8 10.0 mm Measured from input terminals

Tracking (External to output terminals, shortest

Creepage) distance path along body.

Minimum Internal 0.08 0.08 1.0 mm Through insulation distance,

Plastic Gap conductor to conductor, usually

(Internal Clearance) the direct distance between the

photoemitter and photodetector

inside the optocoupler cavity.

Minimum Internal NA NA 4.0 mm Measured from input terminals

Tracking (Internal to output terminals, along

Creepage) internal cavity.

Tracking Resistance CTI 200 200 200 Volts DIN IEC 1 12/VDE 0303 Part 1

(Comparative

Tracking Index)

Isolation Group IIIa IIIa IIIa Material Group

(DIN VDE 01 10, 1/89, Table 1)

Option 300 - surface mount classification is Class A in accordance with CECC 00802.

Note: Non-halide flux should be used.

IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCNW139 and HCNW138)

Description Symbol Characteristic Units

Installation Classification per DIN VDE 0110/1.89, Table 1

for rated mains voltage ≤600 V rms I-IV

for rated mains voltage ≤1000 V rms I-III

Climatic Classification 55/100/21

Pollution Degree (DIN VDE 0110/1.89) 2

Maximum Working Insulation Voltage VIORM 1414 V peak

Input to Output Test Voltage, Method b*

VPR = 1.875 x VIORM, 100% Production Test with tP = 1 sec, VPR 2652 V peak

Partial Discharge < 5 pC

Input to Output Test Voltage, Method a*

VPR = 1.5 x VIORM, Type and Sample Test, VPR 2121 V peak

tP = 60 sec, Partial Discharge < 5 pC

Highest Allowable Overvoltage*

(Transient Overvoltage, tini = 10 sec) VIOTM 8000 V peak

Safety Limiting Values

(Maximum values allowed in the event of a failure,

also see Figure 11, Thermal Derating curve.)

Case Temperature TS175 °C

Current (Input Current IF, PS = 0) IS,INPUT 400 mA

Output Power PS,OUTPUT 700 mW

Insulation Resistance at TS, VIO = 500 V RS> 109Ω

*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 60747-5-2, for a

detailed description.

Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in application.

Recommended Operating Conditions

Parameter Symbol Min. Max. Units

Power Supply Voltage VCC 4.5 18 V

Forward Input Current (ON) IF(ON) 0.5 12.0 mA

Forward Input Voltage (OFF) VF(OFF) 00.8 V

Operating Temperature TA070°C

Absolute Maximum Ratings* (No Derating Required up to 85°C)

Parameter Symbol Min. Max. Units

Storage Temperature TS-55 125 °C

Operating Temperature** TA-40 85 °C

Average Forward Input Current IF(AVG) 20 mA

Peak Forward Input Current IFPK 40 mA

(50% Duty Cycle, 1 ms Pulse Width)

Peak Transient Input Current IF(TRAN) 1.0 A

(<1 µs Pulse Width, 300 pps)

Reverse Input Voltage VR5V

HCNW139/138 3 V

Input Power Dissipation PI35 mW

Output Current (Pin 6) IO60 mA

Emitter Base Reverse Voltage (Pin 5-7) VEB 0.5 V

Supply Voltage and Output Voltage VCC -0.5 18 V

(6N139, HCPL-0701, HCNW139)

Supply Voltage and Output Voltage VCC -0.5 7 V

(6N138, HCPL-0700, HCNW138)

Output Power Dissipation PO100 mW

Total Power Dissipation PT135 mW

Lead Solder Temperature (for Through Hole Devices) 260°C for 10 sec., 1.6 mm below seating plane

HCNW139/138 260°C for 10 sec., up to seating plane

Reflow Temperature Profile See Package Outline Drawings section

(for SOIC-8 and Option #300)

*JEDEC Registered Data for 6N139 and 6N138.

**0°C to 70°C on JEDEC Registration.

Electrical Specifications

0°C ≤ TA ≤ 70°C, 4.5 V ≤ VCC ≤ 18 V, 0.5 mA ≤ IF(ON) ≤ 12 mA, 0 V ≤ VF(OFF) ≤ 0.8 V, unless otherwise specified.

All Typicals at TA = 25°C. See Note 7.

Parameter Sym. Device Min. Typ.** Max. Units Test Conditions Fig. Note

Current Transfer CTR 6N139 400* 2000 5000 % IF = 0.5 mA VCC = 4.5 2, 3 1, 2,

Ratio HCPL-0701 VO = 0.4 V 4

HCNW139 400 4500

6N139 500* 1600 2600 IF = 1.6 mA

HCPL-0701

HCNW139 500 3000

300 1600 IF = 5.0 mA

200 850 IF = 12 mA

6N138 300* 1600 2600 IF = 1.6 mA

HCPL-0700

HCNW138 1500

Logic Low Output VOL 6N139 0.1 0.4 V IF = 0.5 mA, VCC = 4.5 1 2

Voltage HCPL-0701 IO = 2 mA

HCNW139 IF = 1.6 mA,

IO = 8 mA

IF = 5.0 mA,

IO = 15 mA

0.2 IF = 12 mA,

IO = 24 mA

6N138 0.1 IF = 1.6 mA,

HCPL-0700 IO = 4.8 mA

HCNW138

Logic High IOH 6N139 0.05 100 µAV

O = V CC = 18 V IF = 0 mA 2

Output Current HCPL-0701

HCNW139

6N138 0.1 250 VO = V CC = 7 V

HCPL-0700

HCNW138

Logic Low Supply ICCL 6N138/139 0.4 1.5 mA IF = 1.6 mA, VO = Open, 10 2

Current HCPL-0701/ VCC = 18 V

0700

HCNW139 0.5 2

HCNW138

Logic High ICCH 6N138/139 0.01 10 µAI

F = 0 mA, VO = Open, 2

Supply Current HCPL-0701/ VCC = 18 V

0700

HCNW139 1

HCNW138

Input Forward VF6N138 1.25 1.40 1.7* V TA = 25°C IF = 1.6 mA 4, 8

Voltage 6N139

HCPL-0701 1.75

HCPL-0700

HCNW139 1.0 1.45 1.85 TA = 25°C

HCNW138 0.95 1.95

Input Reverse BVR 5.0* V IR = 10 µA, TA = 25°C

HCNW139 3.0 IR = 100 µA, TA = 25°C

HCNW138

Temperature ∆VF-1.8 mV/°CI

F = 1.6 mA 8

Coefficient of ∆TA

Forward Voltage

Input CIN 60 pF f = 1 MHz, VF = 0 V

Capacitance HCNW139 90

HCNW138

*JEDEC Registered Data for 6N139 and 6N138.

**All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.

Breakdown

Voltage

Switching Specifications (AC)

Over recommended operating conditions (TA = 0 to 70°C), VCC = 5 V, unless otherwise specified.

Parameter Sym. Device Min. Typ.** Max. Units Test Conditions Fig. Note

TA =25°C

Propagation tPHL 6N139 5 25* 30 µsI

F = 0.5 mA, 5, 6, 2, 4

Delay Time HCPL-0701 Rl = 4.7 kΩ7, 9,

to Logic Low HCNW139 12

6N139 0.2 1* 2 µsI

F = 12 mA,

HCPL-0701 Rl = 270 Ω

HCNW139 11

6N138 1.6 10* 15 µsI

F = 1.6 mA,

HCPL-0700 Rl = 2.2 kΩ

HCNW138 11

Propagation tPLH 6N139 18 60* 90 µsI

F = 0.5 mA, 5, 6, 2, 4

Delay Time HCPL-0701 Rl = 4.7 kΩ7, 9,

to Logic High HCNW139 115 12

6N139 2 7* 10 µsI

F = 12 mA,

HCPL-0701 Rl = 270 Ω

HCNW139 11

6N138 10 35* 50 µsI

F = 1.6 mA,

HCPL-0700 Rl = 2.2 kΩ

HCNW138 70

Common Mode |CMH|1000 10000 V/µsI

F = 0 mA, 13 5, 6

Transient TA = 25°C

Immunity at Rl = 2.2 kΩ

Logic High |VCM| = 10

Output Vp-p

Common Mode |CML|1000 10000 V/µsI

F = 1.6 mA, 13 5, 6

Transient TA = 25°C

Immunity at Rl = 2.2 kΩ

Logic Low |VCM| = 10

Output Vp-p

*JEDEC Registered Data for 6N139 and 6N138.

**All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.

at Output

Notes:

1. DC CURRENT TRANSFER RATI0 (CTR) is

defined as the ratio of output collector

current, IO, to the forward LED input current,

IF, times 100%.

2. Pin 7 Open.

3. Device considered a two-terminal device.

Pins 1, 2, 3, and 4 shorted together and Pins

5, 6, 7, and 8 shorted together.

4. Use of a resistor between pin 5 and 7 will

decrease gain and delay time. Significant

reduction in overall gain can occur when

using resistor values below 47 kΩ. For more

information, please contact your local HP

Components representative.

5. Common mode transient immunity in a Logic

High level is the maximum tolerable

(positive) dVCM/dt of the common mode

pulse, VCM, to assure that the output will

remain in a Logic High state (i.e., VO > 2.0 V).

Common mode transient immunity in a Logic

Low level is the maximum tolerable

(negative) dVCM/dt of the common mode

pulse, VCM, to assure that the output will

remain in a Logic Low state (i.e., VO<0.8 V).

6. In applications where dV/dt may exceed

50,000 V/µs (such as static discharge) a

series resistor, RCC, should be included to

protect the detector IC from destructively

high surge currents. The recommended value

is RCC = 220 Ω.

7. Use of a 0.1 µF bypass capacitor connected

between pins 8 and 5 adjacent to the device

is recommended.

8. In accordance with UL 1577, each

optocoupler is proof tested by applying an

insulation test voltage 4500 V rms for 1

second (leakage detection current limit,

II-O < 5 µA). This test is performed before the

100% production test shown in the IEC/EN/

DIN EN 60747-5-2 Insulation Related

Characteristics Table, if applicable.

9. In accordance with UL 1577, each

optocoupler is proof tested by applying an

insulation test voltage > 6000 V rms for 1

second (leakage detection current limit,

II-O < 5 µA). This test is performed before the

100% production test for partial discharge

(method b) shown in the IEC/EN/DIN EN

60747-5-2 Insulation Related Characteristics

Table, if applicable.

Package Characteristics

Parameter Sym. Min. Typ.** Max. Units Test Conditions Fig. Note

Input-Output Momentary VISO 3750 V rms RH < 50%, t = 1 min., 3, 8

Withstand Voltage† TA = 25°C

Option 020 5000 3, 9

HCNW139

HCNW138

Resistance (Input-Output) RI-O 1012 ΩVI-O = 500 Vdc 3

RH < 45%

Capacitance (Input-Output) CI-O 0.6 pF f = 1 MHz 3

**All typicals at TA = 25°C, unless otherwise noted.

†The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage

rating. For the continuous voltage rating refer to the IEC/EN/DIN EN60747-5-2 Insulation Characteristics Table (if applicable), your equipment level

safety specification or Avago Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.”

– LOAD RESISTANCE – kΩ

100

0.1 1.0

TIME – µs

– ADJUSTED FOR V

= 2 V

= 25° C t

Figure 1. 6N138/6N139 DC transfer

characteristics.

Figure 6. Propagation delay vs. temperature.Figure 5. Propagation delay vs. temperature.

Figure 2. Current transfer ratio vs. forward

current 6N138/6N139. Figure 3. 6N138/6N139 output current vs.

input diode forward current.

Figure 4. Input diode forward current vs.

forward voltage.

Figure 7. Propagation delay vs. temperature. Figure 8. Forward voltage vs. temperature. Figure 9. Nonsaturated rise and fall times vs.

load resistance.

0 1.0 2.0

– OUTPUT VOLTAGE – V

– OUTPUT CURRENT – mA

5.0 mA

= 25° C

= 5 V

4.5 mA

4.0 mA

3.5 mA

3.0 mA

2.5 mA

2.0 mA

1.5 mA

1.0 mA

0.5 mA

– FORWARD CURRENT – mA

2000

1600

800

400

0.1 1.0

CTR – CURRENT TRANSFER RATIO – %

1200

= 5 V

= 0.4 V

85°C

70°C

25°C

70°C

-40°C

– INPUT DIODE FORWARD CURRENT – mA

0.01

0.01 0.1 10

– OUTPUT CURRENT – mA

0.1

1.0

100

= 25° C

= 0° C

= 70° C

= 85° C

= -40° C

1.6

1.5

1.4

1.3

-60 -20 20 40 100

– FORWARD VOLTAGE – V

– TEMPERATURE – °C

60 80

-40

1.2

= 1.6 mA

– FORWARD VOLTAGE – V

100

0.1

0.01

1.1 1.2 1.3 1.4

– FORWARD CURRENT – mA

1.61.5

1.0

0.001

1000

–

= 25°C

= 0°C

= 85°C

= 70°C

= -40°C

-60 -20 20 40 100

– PROPAGATION DELAY – µs

– TEMPERATURE – °C

60 80

-40

= 0.5 mA

= 4.7 kΩ

1/f = 50 µs

PLH

PHL

-60 -20 20 40 100

– PROPAGATION DELAY – µs

– TEMPERATURE – °C

60 80

-40

= 1.6 mA

= 2.2 kΩ

1/f = 50 µs

PLH

PHL

-60 -20 20 40 100

– PROPAGATION DELAY – µs

– TEMPERATURE – °C

60 80

-40

= 12 mA

= 270 kΩ

1/f = 50 µs t

PLH

PHL

PULSE

GEN.

Z = 50 Ω

t = 5 ns

I MONITOR

0.1 µF

= 15 pF*

PHL

PLH

1.5 V 1.5 V

5 V

+5 V

10% DUTY CYCLE

I/f < 100 µs

(SATURATED

RESPONSE)

(NON-SATURATED

RESPONSE)

5 V

90%

10%

90%

10%

* INCLUDES PROBE AND

FIXTURE CAPACITANCE

Figure 12. Switching test circuit.

Figure 11. Thermal derating curve, dependence of safety limiting

value with case temperature per IEC/EN/DIN EN 60747-5-2.

Figure 10. Logic low supply current vs. forward current.

0.8

0.6

0.4

0.2

04 810 16

CCL

– LOGIC LOW SUPPLY CURRENT – mA

– FORWARD CURRENT

12 14

= 18 V

0.1

0.3

0.5

0.7

= 5 V

OUTPUT POWER – P

, INPUT CURRENT – I

– CASE TEMPERATURE – °C

175

1000

400

12525 75 100 150

600

800

200

100

300

500

700

900 P

(mW)

(mA)

WIDEBODY

Figure 13. Test circuit for transient immunity and typical waveforms.

PULSE GEN.

VCM

VFF

0 V 10% 90% 90% 10%

SWITCH AT A: I = 0 mA

SWITCH AT B: I = 1.6 mA

trtf

5 V

+5 V

–

8RCC (SEE NOTE 6)

10 V tr, tf = 16 ns

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AV01-0543EN June 23, 2007